TOSHIBA TMP91FY22F

Quality and Reliability Assurance / Handling Precautions
Quality And Reliability Assurance / Handling Precautions
In recent years, technical revolutions have become almost a daily occurrence in the
electronics industry. This is accompanied by the increasing application of semiconductors in
both the consumer and industrial sectors, and demands for higher quality and higher
reliability.
Toshiba is making every effort to improve both quality and reliability with the following
quality control system which incorporates product design, quality assurance for parts and
materials received, manufacturing process quality assurance, shipping quality and
reliability assurance, and quality after-service based on user demands and market survey
data.
1 Quality And Reliability Assurance
1.1
Quality Assurance
Trying to sense the customer’s needs, we do our best to incorporate the quality and
reliability required by the customer into the design, while considering the safety
and PL (Product Liability) of the products.
Quality and reliability evaluation are performed on the developed products
according to the Toshiba’s reliability test standard which is prepared in conformity
with JIS, EIAJ, MIL, etc., thereby certifying the design. The parts and materials
are standardized through the engineering department and the quality assurance
department. After the design is accepted, standardization is performed by the
engineering department on the parts and materials, process plan, and inspection
plan. Engineering Institution of Works (EW) is then established on the working
detail. The quality and reliability evaluation are performed on the mass-produced
products on an experimental basis.
In the mass production, the production department has control of the
manufacturing process, the environment and facility, and the quality assurance
department. Quality assurance performs incoming inspection of parts and
materials, modification control, instrument control, periodical reliability test and
line audit. The production technology divisions also participate in process
improvement, automatization, etc.
Education and training for quality and reliability, are given to new workers,
inspectors, engineers and small groups (QC/ZD movement). In shipping the
finished products, a lot quality assurance test is performed by the quality assurance
department. We then commence preparation of specifications meeting pre-arranged
quality and reliability standards and the inspection and reports on discrepant
products “quick action” as the motto. Figure 1 shows the quality assurance system
of semiconductor.
030901
QUA-1
2002-02-20
Quality and Reliability Assurance / Handling Precautions
1.2
Quality Assurance Level of Semiconductor Products
Table 1
Lot Quality Assurance (AQL display: in accordance with ANSI Z 1.4-1993)
Item
Electrical Characteristics
Appearance
030901
AQL
0.15%
Serious Defect
0.15%
Minor Defect
0.25%
QUA-2
Table 1 shows the lot quality
assurance level, which is complied
with the sampling inspection
method (AGL) of MIL-STD-105E.
2002-02-20
Quality and Reliability Assurance / Handling Precautions
Department
Step
Planning
Market /
Customers
Marketing
Application
Engineering
Manufacturing
Engineering
QA
Manufacturing
Production
Control
Subcontractors
DR/AT
Control System
Check Sheets
Meetings
Market Research
Development CS Development
Planning
Meeting
Review of
Specifications
Determine Development Plan
Development
Design
Determine Specification
Product Design
DR
Design Review, Safety and PL Check
Development CS Design Planning
Meeting
Parts and
Materials
Approval
DAT DAT Execution
Plan CS
Trial Production of Developed Product,
Evaluation of Characteristics
DAT Execution
Meeting
Q & R Evaluation of Developed Product
Design Approval
Trial Run
Production
Standardization (Parts & Materials,
Process Plan, Inspection Plan)
DAT Execution
Meeting
Qualification
Preparation
of Parts and of Engineering
Materials
Instructions
Trial Run
Production
Q & R Evaluation of Trial Run Production
QAT QAT Execution
Plan CS
QAT Execution
Meeting
QAT Review
Meeting
Transfer
Meeting
PAT PAT Execution
Plan CS
PAT Execution
Meeting
PAT Review
Meeting
Approval of Production
Quality
Transfer to Full Production
Full
Production
Full Production
*1
*2
*4
*3
Subcontracting
Control of Changes
Q & R Evaluation of
Production Product
Approval of Production
Product
QA Meeting
Confirmation
of Shipped
Quality
Delivery
Shipment
Quality, Engineering and Complaint
Service
Failure
Analysis
Complaint
Handling
Complaint
DR:
DAT:
QAT:
CS:
Design Review
Design Approval Test
Quality Approval Test
Check Sheet
*1
*2
*3
*4
Figure 1
030901
Improvement of Manufacturing Technology
Promotion of Automatization
Inspection of Incoming Parts
Line Audit
Reliability Test
Measurement Control
Quality Training & Education
Manufacturing Control
Environmental Control
Facility Control
Assurance of Quality, Cost & Delivery
Control of Delivery and Quantity
Quality Assurance (QA) System of Procedural Flow
QUA-3
2002-02-20
Quality and Reliability Assurance / Handling Precautions
1.3
Reliability of Microcontrollers
For microcontroller products, reliability can be estimated within the following
temperature range.
Tj = 0°C to 85°C
Tj (junction temperature) can be calculated using the following formula:
Tj = Ta + Q × θja
Ta: Operating environment temperature for the product [°C]
The operating environment temperature is the temperature of the
surrounding environment. The thermal effects of the operation of the
product are not taken into account.
Q: Average power consumption of the product [W]
θja: Thermal resistance of the package [°C / W]
Note 1: When operating the device outside the range Tj = 0°C to 85°C for
extended periods, please contact your nearest Toshiba office or
authorized Toshiba dealer.
Note 2: For details of the value of θja, please contact your nearest Toshiba office
or authorized Toshiba dealer.
030901
QUA-4
2002-02-20
Quality and Reliability Assurance / Handling Precautions
2 Handling Precautions for Microcontrollers
2.1
Mounting Precautions
Plastics have basically porous feature. When a chip (especially an SMD which has a thin
plastic surface) is heated in a state of moisturized and is soldered by the reflow soldering
method, moisture is vaporized as the temperature rises to cause a package expanded. Or a
borderd surface between a lead frame and a plastic material is peeled off to cause a crack.
These bring serious troubles on reliability.
In order to prevent hygroscopity or enable high heat treatment after absorbing moisture,
Toshiba uses a dampproof packing and/or a heat proof tray.
(1) Recommended Methods of Soldering for Flat Packages
• Table 2.1 lists the recommended method of soldering flat packages. If you have
any question or request, please refer to “IC PACKAGE MANUAL” or contact
your local offices.
030901
•
For overall heating method, recommended mounting methods and
conditions after opening the pack differ depending on products to be
used. See Table 2.2 and 2.3 for the details.
•
For locally heating a lead part, soldering iron method is
recommended. For other localized heating methods, refer to “IC
PACKAGE MANUAL” or contact your Toshiba local offices.
QUA-5
2002-02-20
Quality and Reliability Assurance / Handling Precautions
Table 2.1
Recommended soldering methods and precautions when mounting
Soldering method
Localized heating
method
Mounting method
Soldering iron method
Mounting precaution
The recommended soldering conditions are as follows:
EIAJ ED-4701A-133
(1) Standard:
Environment test, soldering heatresistance test (SMD)
(2) Soldering method: Soldering (lead only)
(3) Soldering condition: (a) at 350°C for up to 3 seconds.
(b) at 260°C for up to 10
seconds.
Overall heating method
Wave soldering method (1) Apply preheating for 60 to 120 seconds at a
(Solder flow)
temperature of 150°C.
(2) For lead insertion-type packages, complete
solder flow within 10 seconds with the
temperature at the stopper (or, if there is no
stopper, at a location more than 1.5 mm from the
body) which does not exceed 260°C.
surface-mount
packages,
complete
(3) For
soldering within 5 seconds at a temperature of
250°C or less in order to prevent thermal stress
in the device.
Short infrared reflow
method
Far or middle infrared
Hot air reflow
030901
For details, contact your local Toshiba dealer.
Because thermal stress is severe, as with solder dipping,
the infrared reflow method is not recommended for some
products. For details, contact your local Toshiba dealer.
The recommended conditions for SMD reflow are as
follows:
EIAJ ED-4701 A-133
(1) Standard:
Environment test
(2) Soldering method: (a) Hot air reflow
(with optional far or middle
infrared reflow process)
(b) Far or middle infrared reflow
(3) Pre-heating: 140 to 160°C, for 60 to 120 seconds.
(4) Reflow: (a) 240°C max
(b) At more than 210°C, for 30 to 50 seconds.
(5) Number of reflows: Maximum of two times within the
allowable period of use
The specified soldering temperatures are based on
the temperature of the package surface.
For a sample recommended temperature profile,
refer to Figure 2.1.
QUA-6
2002-02-20
Quality and Reliability Assurance / Handling Precautions
Package Surface Temperature
(°C)
240
210
160
150
140
100
60 to 120
seconds
30 to 50
seconds
TIME (in seconds)
Figure 2.1
Sample recommended temperature profile for infrared or hot air reflow
method
030901
QUA-7
2002-02-20
Quality and Reliability Assurance / Handling Precautions
2.1.1
Precaution for Dry Pack
Figure 2.2 shows the tray type of the dry
pack form. Precaution for handling dry pack
products are as follows.
① Do not toss or drop to avoid damaging the
devices and/or the moisture proof bag.
② Desiccant in the form of granulated silica
gel includes blue indicator beads which
become transparent when moisture is
present, such as if the bag is torn or opened.
In this case, the devices must be high
temperature baked to remove the moisture
prior to solder mounting.
③ Store the pack at 30°C / 90%RH. After
opening the pack mount it the device within
12 months of the date on the seal. If the
30% humidity indicator is entirely pink
when the device unpacked, or when the 12month duration has expired treat the
device before use at high temperature (bake
it at more than 125°C for 20h) to remove
moisture.
(a) Method
Heat-proof tray (occasionally non-heat-proof)
IC
Heat proof tray
Plastic band
Moisture proof bag
(Aluminum laminate)
Label
④ How quickly a product should be used after
the pack is opened depends of the product.
See Tables 2-2 and 2-3 for details. If the
time limit for use has expired when devices
are unpacked, they should be baked.
⑤ Devices in heat-proof trays should be baked
at 125°C for at least 20h.
Heat-proof trays bear the mold marking
“HEAT PROOF” .
Be careful not to bend the leads when
baking devices.
⑥ Binding trays using a plastic tapes
If trays are rebound with plastic tapes after
having been untied, two tapes should be
used as shown in Figure 2.2 (a). If a tape is
tied lengthwise along the trays the tray
edges may break.
Heat seal
Turn under
Corrugated
cardboard box
(b) Shipping carton
QUA-8
Sealing tape
Corrugated
cardboard box
Figure 2.2
030901
Silica gel
Indicator
SMDs Dry pack Form
2002-02-20
Quality and Reliability Assurance / Handling Precautions
Table 2.2
Usable period after opening moisture proof bags
SYMBOL
Usable period after opening moisture proof bags
A = 168h
Products sealed in moisture proof packing should be stored in temperature below
30°C and relative humidity below 60%, and should be used within 168 hours (1 week),
after opened. If the products are kept beyond 168 hours (1 week) after opened, the
products should be baked for at least 20 hours at 125°C before mounted. After baked,
the products should be stored in temperature below 30°C and relative humidity below
60%, and should be used within 192 hours.
Products sealed in moisture proof packing should be stored in temperature below
30°C and relative humidity below 60%, and should be used within 72 hours (3 days),
after opened. If the products are kept beyond 72 hours (3days) after opened, the
products should be stored in temperature below 30°C and relative humidity below
60%, and should be used within 96 hours (4 days).
Products sealed in moisture proof packing should be stored in temperature below
30°C and relative humidity below 60%, and should be used within 48 hours (2 days),
after opened. If the products are kept beyond 48 hours (2 days) after opened, the
products should be baked for at least 20 hours at 125°C before mounted. After baked,
the products should be stored in temperature below 30°C and relative humidity below
60%, and should be used within 72 hours (3 days).
Products sealed in moisture proof packing should be stored in temperature below
30°C and relative humidity below 60%, and should be used within 24 hours (1 day),
after opened. If the products are kept beyond 24 hours (1 day) after opened, the
products should be baked for at least 20 hours at 125°C before mounted. After baked,
the products should be stored in temperature below 30°C and relative humidity below
60%, and should be used within 48 hours (2 days).
Products sealed in moisture proof packing should be stored in temperature below
30°C and relative humidity below 60%, and should be used within 12 hours, after
opened. If the products are kept beyond 12 hours after opened, the products should
be baked for at least 20 hours at 125°C before mounted. After baked, the products
should be stored in temperature below 30°C and relative humidity below 60%, and
should be used within 36 hours.
For the details, contact your Toshiba local offices.
Overall heating method is not recommended for mounting ; use soldering iron method
of localized heating method.
B = 72h
C = 48h
D = 24h
E = 12h
●

030901
QUA-9
2002-02-20
Quality and Reliability Assurance / Handling Precautions
(1)
900, 900/H, 900/L, 900/H2, 900/L1 Series
Table 2.3
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (1/2)
Products
Name
Package no.
TMP96C141BF
TMP96C041BF
TMP96CM40F
TMP96PM40F
TMP96C031ZF
TMP93CM40F
TMP93CS40F
TMP93CS41F
TMP93PS40F
TMP93CS40DF
TMP93CS41DF
TMP93PS40DF
TMP93CW40DF
TMP93CW41DF
TMP93PW40DF
TMP93CS42AF
TMP93PS42AF
TMP93CW46AF
TMP93PW46AF
TMP93CS44F
TMP93CS45F
TMP93PS44F
TMP93CU44DF
TMP93CW44DF
TMP93PW44ADF
TMP93CS32F
TMP93PW32F
TMP93CS20F
TMP93PW20AF
TMP93CT76F
TMP93CU76F
TMP93CW76F
TMP93CF76F
TMP93CF77F
TMP93PW76F
TMP93PF76F
TMP93C071F
TMP95C061BF
TMP95C063F
TMP95C001F
TMP95CS64F
TMP95C265F
Note 1:
Note 2:
030901
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP64-1420-1.00A
P-QFP100-1414-0.50
P-QFP100-1414-0.50
P-QFP100-1414-0.50
P-QFP100-1414-0.50
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50D
P-QFP100-1414-0.50
P-QFP100-1414-0.50
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50D
P-LQFP80-1212-0.50A
P-LQFP80-1212-0.50A
P-LQFP80-1212-0.50A
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP64-1414-0.80A
P-QFP64-1414-0.80A
P-LQFP144-1616-0.40
P-LQFP144-1616-0.40
P-QFP100-1420-0.65A
P-QFP100-1420-0.65A
P-QFP100-1420-0.65A
P-QFP100-1420-0.65A
P-QFP-100-1420-0.65A
P-QFP100-1420-0.65A
P-QFP100-1420-0.65A
P-QFP120-2828-0.80B
P-QFP100-1414-0.50
P-QFP144-2020-0.50
P-QFP64-1414-0.80A
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50C
Air reflow
Infrared reflow
A(168h)
A(168h)
A(168h)

A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
C(48h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)

A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
C(48h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
●
●
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
As of September, 2001
Symbols A (168h), B (72h), C (48h), D (24h), E(12h), ● and  indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
QUA-10
2002-02-20
Quality and Reliability Assurance / Handling Precautions
Table 2.3
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (2/2)
Products
Name
Package no.
TMP95CW64F
TMP95CW65F
TMP95PW64F
TMP95FY64F
TMP95CS66F
TMP95CS54F
TMP95PS54F
TMP95CU54AF
TMP95CW54AF
TMP95FW54AF
TMP94C241CF
TMP94C251AF
TMP94FU81F
TMP91CW18AF
TMP91PW18AF
TMP91CW12F
TMP91PW12F
TMP91CW12AF
TMP91FY12AF
TMP91CY22F
TMP91FY22F
TMP91CU10F
TMP91PW10F
TMP91CW11F
TMP91PW11F
TMP91C219F
TMP91C219F
TMP91C829F
TMP91C829F
TMP91C815F
TMP91C016F
TMP91C025F
TMP91C824F
Note 1:
Note 2:
030901
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50D
P-QFP100-1414-0.50E
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50E
P-QFP160-2828-0.65A
P-QFP144-2020-0.50
P-LQFP100-1414-0.50C
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-LQFP100-1414-0.50C
P-LQFP100-1414-0.50C
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50E
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50E
P-LQFP100-1414-0.50C
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50C
P-LQFP100-1414-0.50C
P-LQFP100-1414-0.50B
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50B
P-LQFP100-1414-0.50D
P-TQFP128-1414-0.40
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50D
P-LQFP100-1414-0.50D
Air reflow
Infrared reflow
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
●
●
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
●
●
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
As of February, 2002
Symbols A (168h), B (72h), C (48h), D (24h), E (12h), ● and  indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
QUA-11
2002-02-20
Quality and Reliability Assurance / Handling Precautions
(2)
90 Series
Table 2.4
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (1/2)
Products
Name
Package no.
TMP90C840AF
TMP90C841AF
TMP91C640F
TMP91C641F
TMP90CM40AF
TMP90C041AF
TMP90C141F
TMP90C441F
TMP90C802AM
TMP90C803AM
TMP90CH02M
TMP90CH03M
TMP90C400F
TMP90C401F
TMP90C800F
TMP90C801F
TMP90C844AF
TMP90CH44F
TMP90C845AF
TMP90CH45F
TMP90CM36F
TMP90CM37F
TMP90CM38F
TMP90CM39F
TMP90C051F
TMP90CS36F
TMP90CS37F
TMP90CS38F
TMP90CS39F
TMP90C848F
TMP91P640F
TMP90PM40F
TMP90P802AM
TMP90PH02M
TMP90P800F
TMP90PH44F
TMP90PM36F
TMP90PM38F
TMP90PS36F
TMP90PS38F
Note 1:
Note 2:
Note 3:
030901
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-SSOP40-450-0.80
P-SSOP40-450-0.80
P-SSOP40-450-0.80
P-SSOP40-450-0.80
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP80-1414-0.65A
P-QFP80-1414-0.65A
P-QFP80-1414-0.65A
P-QFP80-1414-0.65A
P-QFP80-1420-0.80B
P-QFP80-1414-0.65A
P-QFP80-1414-0.65A
P-QFP80-1414-0.65A
P-QFP80-1414-0.65A
P-QFP80-1420-0.80B
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-SSOP40-450-0.80
P-SSOP40-450-0.80
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP80-1414-0.65A
P-QFP80-1414-0.65A
P-QFP44-1414-0.65A
P-QFP44-1414-0.65A
Air reflow
Infrared reflow
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)

A(168h)
A(168h)
A(168h)

A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)

A(168h)
A(168h)
A(168h)

A(168h)
A(168h)
A(168h)
A(168h)
As of September, 2001
Ensure that the conditions for top/bottom heating using the
long/medium infrared reflow method are strictly adhered to, even when
this method is used in combination with the air reflow method.
Symbols A (168h), B (72h), C (48h), D (24h), E(12h), ● and  indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
QUA-12
2002-02-20
Quality and Reliability Assurance / Handling Precautions
Table 2.4
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (2/2)
Products
Name
Package no.
TMP90PH48F
TMP91P642F
TMP91C642AF
TMP90PM42F
TMP90PM42DF
TMP90CH42F
TMP90CH42DF
TMP90CK42F
TMP90CK42DF
TMP90PS74DF
TMP90CM36T
TMP90CM37T
TMP90PM36T
TMP90CM38T
TMP90CM39T
TMP90PM38T
TMP90CS36T
TMP90CS37T
TMP90PS36T
TMP90CS38T
TMP90CS39T
TMP90PS38T
Note 1:
Note 2:
Note 3:
030901
P-QFP80-1420-0.80B
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP100-2222-0.80A
P-QFP100-1420-0.65A
P-QFP100-2222-0.80A
P-QFP100-1420-0.65A
P-QFP100-2222-0.80A
P-QFP100-2222-0.80A
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
P-QFJ84-S115-1.27
Air reflow
Infrared reflow
A(168h)
B(72h)
A(168h)

A(168h)
A(168h)
A(168h)

A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)

A(168h)
A(168h)
A(168h)

A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
As of September, 2001
Ensure that the conditions for top/bottom heating using the
long/medium infrared reflow method are strictly adhered to, even when
this method is used in combination with the air reflow method.
Symbols A (168h), B (72h), C (48h), D (24h), E(12h), ● and  indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
QUA-13
2002-02-20
Quality and Reliability Assurance / Handling Precautions
(3)
870 Series
Table 2.5
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (1/3)
Products
Name
TMP87C800F
TMP87CH00F
TMP87PH00F
TMP87C800DF
TMP87CH00DF
TMP87CH00LF
TMP87PH00DF
TMP87PH00LF
TMP87C807U
TMP87C408M
TMP87C408LM
TMP87C808M
TMP87C808LM
TMP87C408DM
TMP87P808M
TMP87P808LM
TMP87C814F
TMP87CH14F
TMP87CK14F
TMP87CM14F
TMP87PM14F
TMP87CC20F
TMP87CH20F
TMP87PH20F
TMP87CK20AF
TMP87CM20AF
TMP87PM20F
TMP87CH21F
TMP87CH21BF
TMP87CH21DF
TMP87CH21BDF
TMP87CM21F
TMP87CM21DF
TMP87PP21F
TMP87PP21DF
TMP87CM23F
TMP87CP23F
TMP87PP23F
TMP87CM24AF
TMP87CP24AF
TMP87PP24AF
TMP87CH29U
TMP87CK29U
TMP87CM29U
TMP87PM29U
Note 1:
Note 2:
030901
Air reflow
Infrared reflow
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
As of March, 2001
Symbols A (168h), B (72h), C (48h), D (24h), E(12h), ● and  indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
QUA-14
2002-02-20
Quality and Reliability Assurance / Handling Precautions
Table 2.5
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (2/3)
Products
Name
TMP87CH38F
TMP87CK38F
TMP87CM38F
TMP87CP38F
TMP87CS38F
TMP87PS38F
TMP87CM39F
TMP87CP39F
TMP87CS39F
TMP87PS39F
TMPA8700CHF
TMPA8700CKF
TMPA8700CMF
TMPA8700CPF
TMPA8700CSF
TMPA8700PSF
TMPA8701CHF
TMPA8701CKF
TMPA8701CMF
TMP87C840F
TMP87CC40F
TMP87CH40F
TMP87PH40AF
TMP87CK40AF
TMP87CK40F
TMP87CM40AF
TMP87PM40AF
TMP87C841F
TMP87CC41F
TMP87CH41F
TMP87CK41F
TMP87CM41F
TMP87PM41F
TMP87C841U
TMP87CC41U
TMP87CH41U
TMP87CK41U
TMP87CM41U
TMP87PM41U
TMP87C447U
TMP87C847U
TMP87C847LU
TMP87CH47U
TMP87CH47LU
TMP87PH47U
TMP87PH47LU
TMP87CH48U
Note 1:
Note 2:
030901
Air reflow
Infrared reflow
A(168h)
A(168h)
D(24h)
D(24h)
A(168h)

A(168h)
A(168h)
A(168h)

A(168h)
A(168h)
A(168h)
A(168h)
A(168h)

A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
D(24h)
D(24h)
A(168h)

A(168h)
A(168h)
A(168h)

A(168h)
A(168h)
A(168h)
A(168h)
A(168h)

A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
As of March, 2001
Symbols A (168h), B (72h), C (48h), D (24h), E(12h), ● and  indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
QUA-15
2002-02-20
Quality and Reliability Assurance / Handling Precautions
Table 2.5
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (3/3)
Products
Name
TMP87CH48DF
TMP87PH48U
TMP87PH48DF
TMP87CM53F
TMP87PM53F
TMP87CM64F
TMP87CP64F
TMP87CS64F
TMP87PS64F
TMP87CS68DF
TMP87PS68DF
TMP87CC70F
TMP87CH70F
TMP87CK70AF
TMP87CM70AF
TMP87CH70BF
TMP87CM70BF
TMP87PM70F
TMP87CM71F
TMP87CN71F
TMP87CP71F
TMP87CS71F
TMP87PS71F
TMP87CH74AF
TMP87CM74AF
TMP87PM74F
TMP87CH75F
TMP87CM75F
TMP87PM75F
TMP87CC78F
TMP87CH78F
TMP87CK78F
TMP87CM78F
TMP87PM78F
Note 1:
Note 2:
030901
Air reflow
Infrared reflow
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
●
●
As of March, 2001
Symbols A (168h), B (72h), C (48h), D (24h), E(12h), ● and  indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
QUA-16
2002-02-20
Quality and Reliability Assurance / Handling Precautions
(4)
870/C Series
Table 2.6
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method
Products
Name
Package no.
TMP86CH06U
TMP86PH06U
TMP86C420F
TMP86C420U
TMP86C820F
TMP86C820U
TMP86C829AF
TMP86C829AU
TMP86CH29AF
TMP86CH29AU
TMP86CM29AF
TMP86CM29AU
TMP86PM29AF
TMP86PM29AU
TMP86CM41F
TMP86FS41F
Note 1:
Note 2:
030901
P-QFP44-1010-0.80
P-QFP44-1010-0.80
P-QFP64-1414-0.80A
P-LQFP64-1010-0.50
P-QFP64-1414-0.80A
P-LQFP64-1010-0.50
P-QFP64-1414-0.80A
P-LQFP64-1010-0.50
P-QFP64-1414-0.80A
P-LQFP64-1010-0.50
P-QFP64-1414-0.80A
P-LQFP64-1010-0.50
P-QFP64-1414-0.80A
P-LQFP64-1010-0.50
P-QFP64-1414-0.80A
P-QFP64-1414-0.80B
Air reflow
Infrared reflow
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
As of March, 2001
Symbols A (168h), B (72h), C (48h), D (24h), E(12h), ● and  indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
QUA-17
2002-02-20
Quality and Reliability Assurance / Handling Precautions
(5)
870/X Series
Table 2.7
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method
Products
Name
Package no.
TMP88CK48F
TMP88CM48F
TMP88CS48AF
TMP88CK49F
TMP88CM49F
TMP88PS49F
TMP88C060F
TMP88CU74F
TMP88PU74F
TMP88CP76F
TMP88CS76F
TMP88PS76F
TMP88CP77F
TMP88CS77F
TMP88PU77F
Note 1:
Note 2:
030901
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-LQFP80-1212-0.50A
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP100-1420-0.65A
P-QFP100-1420-0.65A
P-QFP100-1420-0.65A
Air reflow
Infrared reflow
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
B(72h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
B(72h)
A(168h)
B(72h)
As of March, 2001
Symbols A (168h), B (72h), C (48h), D (24h), E(12h), ● and  indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
QUA-18
2002-02-20
Quality and Reliability Assurance / Handling Precautions
(6)
47 Series
Table 2.8
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (1/3)
Products
Name
Package no.
TMP47C101M
TMP47C201M
TMP47C102M
TMP47C202M
TMP47P202VM
TMP47C103M
TMP47C203M
TMP47C206M
TMP47P206VM
TMP47C241VM
TMP47P241VM
TMP47P403VM
TMP47C222F
TMP47C422F
TMP47P422VF
TMP47C243M
TMP47C243DM
TMP47C443M
TMP47C443DM
TMP47P443VM
TMP47P443VDM
TMP47E186M
TMP47E187M
TMP47P186M
TMP47P187M
TMP47E885AIF
TMP47E885AWF
TMP47P885F
TMP47C200BF
TMP47C400BF
TMP47P400VF
TMP47C407AF
TMP47P407VF
TMP47C210AF
TMP47C410AF
TMP47P410AF
TMP47C216F
TMP47C416F
TMP47P416VF
TMP47C221ADF
TMP47C421ADF
TMP47P421ADF
TMP47C423ADF
Note 1:
Note 2:
030901
P-SOP16-300-1.27
P-SOP16-300-1.27
P-SOP20-300-1.27
P-SOP20-300-1.27
P-SOP20-300-1.27
P-SOP28-450-1.27
P-SOP28-450-1.27
P-SOP20-300-1.27
P-SOP20-300-1.27
P-SOP28-450-1.27
P-SOP28-450-1.27
P-SOP28-450-1.27
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-SOP28-450-1.27
P-SSOP30-56-0.65
P-SOP28-450-1.27
P-SSOP30-56-0.65
P-SOP28-450-1.27
P-SSOP30-56-0.65
P-SOP16-300-1.27
P-SOP16-300-1.27
P-SOP16-300-1.27
P-SOP16-300-1.27
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
Air reflow
Infrared reflow
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
C(48h)
C(48h)
C(48h)
C(48h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
D(24h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
C(48h)
C(48h)
C(48h)
C(48h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
D(24h)
A(168h)
A(168h)
A(168h)
A(168h)
As of March, 2001
Symbols A (168h), B (72h), C (48h), D (24h), E(12h), ● and  indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
QUA-19
2002-02-20
Quality and Reliability Assurance / Handling Precautions
Table 2.8
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (2/3)
Products
Name
Package no.
TMP47C440BF
TMP47P440VF
TMP47C441AF
TMP47P441AF
TMP47C446ADF
TMP47P446VDF
TMP47C452BF
TMP47P452VF
TMP47C453AF
TMP47P453VF
TMP47C456ADF
TMP47C434AF
TMP47C634AF
TMP47C800F
TMP47P800F
TMP47C620DF
TMP47C820DF
TMP47P820VDF
TMP47C623F
TMP47C823F
TMP47P823VF
TMP47C834F
TMP47P834F
TMP47C640F
TMP47C840F
TMP47P840VF
TMP47C647F
TMP47C847F
TMP47P847VF
TMP47C850F
TMP47P850VF
TMP47C853F
TMP47P853VF
TMP47C857F
TMP47C457F
TMP47P857F
TMP47C655F
TMP47C855F
TMP47P855VF
TMP47C858F
Note 1:
Note 2:
030901
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP80-1420-0.80B
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP100-1420-0.65A
Air reflow
Infrared reflow
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)

A(168h)
A(168h)
A(168h)

A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)

A(168h)
A(168h)
A(168h)

A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
As of March, 2001
Symbols A (168h), B (72h), C (48h), D (24h), E(12h), ● and  indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
QUA-20
2002-02-20
Quality and Reliability Assurance / Handling Precautions
Table 2.8
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (3/3)
Products
Name
Package no.
TMP47C660AF
TMP47C860AF
TMP47P860VF
TMP47C1220F
TMP47C1620F
TMP47P1620VF
TMP47C1260F
TMP47C1660F
TMP47P1660VF
Note 1:
Note 2:
030901
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
Air reflow
Infrared reflow
A(168h)
A(168h)
A(168h)
A(168h)
●
●
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
As of March, 2001
Symbols A (168h), B (72h), C (48h), D (24h), E(12h), ● and  indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
QUA-21
2002-02-20
Quality and Reliability Assurance / Handling Precautions
(7)
68000 Series
Table 2.9
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method
Products
Name
Package no.
TMP68301AF-xx
TMP68301AKF-xx
TMP68303DF-xx
TMP68305F-xx
TMP68301AFR-xx
TMP68301AKFR-xx
TMP68HC003F-xx
TMP68204F-xx
Note 1:
Note 2:
Note 3:
P-QFP100-2222-0.80A
P-QFP100-2222-0.80A
P-QFP100-2222-0.80A
P-QFP100-2222-0.80A
P-QFP100-1420-0.65A
P-QFP100-1420-0.65A
P-QFP80-1420-0.80B
P-QFP160-2828-0.65A
Air reflow
Infrared reflow
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
●
A(168h)
A(168h)
A(168h)
A(168h)
●
As of February, 1998
Ensure that the conditions for top/bottom heating using the
long/medium infrared reflow method are strictly adhered to, even when
this method is used in combination with the air reflow method.
Symbols A (168h), B (72h), C (48h), D (24h), E(12h), ● and  indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
(8) Z80 Series
Table 2.10
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method
Products
Name
Package no.
TMPZ84C011BF
TMPZ84C015BF
TMPZ84C013AT
TMPZ84C112AF
TMPZ84C711AF
TMPZ84C810AF
Note 1:
Note 2:
Note 3:
030901
P-QFP100-1420-0.65A
P-QFP100-1420-0.65A
P-QFJ84-S115-1.27
P-QFP64-1420-1.00A
P-QFP144-2626-0.65B
P-QFP100-1420-0.65A
Air reflow
Infrared reflow
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
As of September, 1994
Ensure that the conditions for top/bottom heating using the
long/medium infrared reflow method are strictly adhered to, even when
this method is used in combination with the air reflow method.
Symbols A (168h), B (72h), C (48h), D (24h), E(12h), ● and  indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
QUA-22
2002-02-20
Quality and Reliability Assurance / Handling Precautions
2.1.2
Writing an OTP type Microcontrollers-Recommended Flow
In the case of blank OTP (One Time PROM) type MCU, it is not
completely possible to screen defect parts that occur during assembly
process, because it is not possible to perform programming test after a
chip is assembled in a plastic package.
As a result, it is recommended to do the following screening process to
maintain quality and reliability of OTP type MCU after data are
programmed.
Programming and verification with an
EPROM programmer.
Stored in high temperature.
125°C, more than 20 hours.
Data verification with an EPROM programmer
Board assembly
For details of the initial failure rate of OTP-type microcontrollers when
screening is not performed at 125°C for 20 hours or more after
programming, please contact your Toshiba local offices.
Figure 2.3
030901
Recommended Screening flow chart of type MCU
QUA-23
2002-02-20
Quality and Reliability Assurance / Handling Precautions
2.2
Transport Precautions
The device and its packaging material should be handled with care. To avoid
damage to the device, do not toss or drop it. During transport, ensure that the
device is not subjected to mechanical vibration or shock.
Avoid getting devices wet. Moisture can also adversely affect the packaging by
nullifying the effect of the anti-static agent.
2.3
Using Toshiba Semiconductor Safely
TOSHIBA is continually working to improve the quality and reliability of its
products. Nevertheless, semiconductor devices in general can malfunction or fail
due to their inherent electrical sensitivity and vulnerability to physical stress. It is
the responsibility of the buyer, when utilizing TOSHIBA products, to comply with
the standards of safety in making a safe design for the entire system, and to avoid
situations in which a malfunction or failure of such TOSHIBA products could cause
loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within
specified operating ranges as set forth in the most recent TOSHIBA products
specifications. Also, please keep in mind the precautions and conditions set forth in
the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor
Reliability Handbook” etc..
The TOSHIBA products listed in this document are intended for usage in general
electronics applications (computer, personal equipment, office equipment,
measuring equipment, industrial robotics, domestic appliances, etc.). These
TOSHIBA products are neither intended nor warranted for usage in equipment
that requires extraordinarily high quality and/or reliability or a malfunction or
failure of which may cause loss of human life or bodily injury (“Unintended Usage”).
Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments,
combustion control instruments, medical instruments, all types of safety devices,
etc.. Unintended Usage of TOSHIBA products listed in this document shall be made
at the customer’s own risk.
030901
QUA-24
2002-02-20
Quality and Reliability Assurance / Handling Precautions
2.4
Product-Specific Precautions and Usage Considerations
2.4.1
Using Resonators not Listed Under “Recommended Types”
Resonators recommended for use with Toshiba products in microcontroller
oscillator applications are listed in Toshiba databooks along with information
about oscillation conditions. If you use a resonator not included in this list,
please consult Toshiba or the resonator manufacturer concerning the
suitability of the device for your application.
2.4.2
Undefined Functions
In some microcontrollers certain instruction code values do not constitute
valid processor instructions. Also, it is possible that the values of bits in
registers will become undefined. Take care in your applications not to use
invalid instructions or to let register bit values become undefined.
2.4.3
Injuries from Probe Tips
Some probes and adapters have sharp pointed leads. Be careful not to injure
yourself on the leads of devices.
030901
QUA-25
2002-02-20
Quality and Reliability Assurance / Handling Precautions
3 Safety Precautions
This section lists important precautions which users of semiconductor devices (and anyone
else) should observe in order to avoid injury and damage to property, and to ensure safe
and correct use of devices.
Please be sure that you understand the meanings of the labels and the graphic symbol
described below before you move on to the detailed descriptions of the precautions.
[Explanation of labels]
Graphic symbol
Meaning
Indicates an imminently hazardous situation which will result in death or
serious injury if you do not follow instructions.
Indicates a potentially hazardous situation which could result in death or
serious injury if you do not follow instructions.
Indicates a potentially hazardous situation which if not avoided, may result in
minor injury or moderate injury.
[Explanation of graphic symbol]
Graphic symbol
Meaning
Indicates that caution is required (laser beam is dangerous to eyes).
030901
QUA-26
2002-02-20
Quality and Reliability Assurance / Handling Precautions
3.1
General Precautions Regarding Semiconductor Devices
Do not use devices under conditions exceeding their absolute maximum ratings (e.g. current, voltage,
power dissipation or temperature).
This may cause the device to break down, degrade its performance, or cause it to catch fire or explode,
resulting in injury.
Do not insert devices in the wrong orientation.
Make sure that the positive and negative terminals of power supplies are connected correctly. Otherwise
the rated maximum current or power dissipation may be exceeded and the device may break down or
undergo performance degradation, causing it to catch fire or explode and resulting in injury.
When power to a device is on, do not touch the device’s heat sink.
Heat sinks become hot, so you may burn your hand.
Do not touch the tips of device leads.
Because some types of device have leads with pointed tips, you may prick your finger.
When conducting any kind of evaluation, inspection or testing, be sure to connect the testing equipment’s
electrodes or probes to the pins of the device under test before powering it on.
Otherwise, you may receive an electric shock causing injury.
Before grounding an item of measuring equipment or a soldering iron, check that there is no electrical
leakage from it.
Electrical leakage may cause the device which you are testing or soldering to break down, or could give
you an electric shock.
Always wear protective glasses when cutting the leads of a device with clippers or a similar tool.
If you do not, small bits of metal flying off the cut ends may damage your eyes.
030901
QUA-27
2002-02-20
Quality and Reliability Assurance / Handling Precautions
4 General Safety Precautions and Usage Considerations
This section is designed to help you gain a better understanding of semiconductor devices,
so as to ensure the safety, quality and reliability of the devices which you incorporate into
your designs.
4.1
From Incoming to Shipping
4.1.1
Electrostatic Discharge (ESD)
When handling individual devices (which are not yet
mounted on a printed circuit board), be sure that the
environment is protected against electrostatic electricity.
Operators should wear anti-static clothing, and containers
and other objects which come into direct contact with devices
should be made of anti-static materials and should be
grounded to earth via an 0.5- to 1.0-MΩ protective resistor.
Please follow the precautions described below; this is particularly important
for devices which are marked “Be careful of static.”.
4.1.1.1 Work Environment
(1) When humidity in the working environment decreases, the human
body and other insulators can easily become charged with static
electricity due to friction. Maintain the recommended humidity of
40% to 60% in the work environment, while also taking into account
the fact that moisture-proof-packed products may absorb moisture
after unpacking.
(2) Be sure that all equipment, jigs and tools in the working area are
grounded to earth.
(3) Place a conductive mat over the floor of the work area, or take other
appropriate measures, so that the floor surface is protected against
static electricity and is grounded to earth. The surface resistivity
should be 104 to 108 Ω/sq and the resistance between surface and
ground, 7.5 × 105 to 108 Ω.
(4) Cover the workbench surface also with a conductive mat (with a
surface resistivity of 104 to 108 Ω/sq, for a resistance between
surface and ground of 7.5 × 105 to 108 Ω). The purpose of this is to
disperse static electricity on the surface (through resistive
components) and ground it to earth. Workbench surfaces must not
be constructed of low-resistance metallic materials that allow rapid
static discharge when a charged device touches them directly.
030901
QUA-28
2002-02-20
Quality and Reliability Assurance / Handling Precautions
(5) Pay attention to the following points when using automatic
equipment in your workplace:
(a) When picking up ICs with a vacuum unit, use a conductive
rubber fitting on the end of the pick-up wand to protect against
electrostatic charge.
(b) Minimize friction on IC package surfaces. If some rubbing is
unavoidable due to the device’s mechanical structure,
minimize the friction plane or use material with a small
friction coefficient and low electrical resistance. Also consider
the use of an ionizer.
(c) In sections that come into contact with device lead terminals,
use a material which dissipates static electricity.
(d) Ensure that no statically charged bodies (such as work clothes
or the human body) touch the devices.
(e) Make sure that sections of the tape carrier which come into
contact with installation devices or other electrical machinery
are made of a low-resistance material.
(f) Make sure that jigs and tools used in the assembly process do
not touch devices.
(g) In processes in which packages may retain an electrostatic
charge, use an ionizer to neutralize the ions.
(6) Make sure that CRT displays in the working area are protected
against static charge, for example by a VDT filter. As much as
possible, avoid turning displays on and off. Doing so can cause
electrostatic induction in devices.
(7) Keep track of charged potential in the working area by taking
periodic measurements.
(8) Ensure that work chairs are protected by an anti-static textile cover
and are grounded to the floor surface by a grounding chain.
(Suggested resistance between the seat surface and grounding
chain is 7.5 × 105 to 1012 Ω.)
(9) Install anti-static mats on storage shelf surfaces. (Suggested
surface resistivity is 104 to 108 Ω/sq; suggested resistance between
surface and ground is 7.5 × 105 to 108 Ω.)
(10) For transport and temporary storage of devices, use containers
(boxes, jigs or bags) that are made of anti-static materials or
materials which dissipate electrostatic charge.
(11) Make sure that cart surfaces which come into contact with device
packaging are made of materials which will conduct static
electricity, and verify that they are grounded to the floor surface via
a grounding chain.
(12) In any location where the level of static electricity is to be closely
controlled, the ground resistance level should be Class 3 or above.
Use different ground wires for all items of equipment which may
come into physical contact with devices.
030901
QUA-29
2002-02-20
Quality and Reliability Assurance / Handling Precautions
4.1.1.2 Operating Environment
(1) Operators must wear anti-static
clothing and conductive shoes (or a
leg or heel strap).
(2) Operators must wear a wrist strap
grounded to earth via a resistor of about 1 MΩ.
(3) Soldering irons must be grounded from iron tip to earth, and must
be used only at low voltages (6 V to 24 V).
(4) If the tweezers you use are likely to touch the device terminals, use
anti-static tweezers and in particular avoid metallic tweezers. If a
charged device touches a low-resistance tool, rapid discharge can
occur. When using vacuum tweezers, attach a conductive chucking
pat to the tip, and connect it to a dedicated ground used especially
for anti-static purposes (suggested resistance value: 104 to 108 Ω).
(5) Do not place devices or their containers near sources of strong
electrical fields (such as above a CRT).
(6) When storing printed circuit boards which have devices mounted on
them, use a board container or bag that is protected against static
charge. To avoid the occurrence of static charge or discharge due to
friction, keep the boards separate from one other and do not stack
them directly on top of one another.
(7) Ensure, if possible, that any articles (such as clipboards) which are
brought to any location where the level of static electricity must be
closely controlled are constructed of anti-static materials.
(8) In cases where the human body comes into direct contact with a
device, be sure to wear anti-static finger covers or gloves (suggested
resistance value: 108 Ω or less).
(9) Equipment safety covers installed near devices should have
resistance ratings of 109 Ω or less.
(10) If a wrist strap cannot be used for some reason, and there is a
possibility of imparting friction to devices, use an ionizer.
(11) The transport film used in TCP products is manufactured from
materials in which static charges tend to build up. When using
these products, install an ionizer to prevent the film from being
charged with static electricity. Also, ensure that no static electricity
will be applied to the product’s copper foils by taking measures to
prevent static occurring in the peripheral equipment.
030901
QUA-30
2002-02-20
Quality and Reliability Assurance / Handling Precautions
4.1.2
Vibration, Impact and Stress
Handle devices and packaging materials with care.
To avoid damage to devices, do not toss or drop
packages. Ensure that devices are not subjected to
Vibration
mechanical vibration or shock during
transportation. Ceramic package devices and
devices in canister-type packages which have
empty space inside them are subject to damage
from vibration and shock because the bonding wires are secured only at their
ends.
Plastic molded devices, on the other hand, have a relatively high level of
resistance to vibration and mechanical shock because their bonding wires are
enveloped and fixed in resin. However, when any device or package type is
installed in target equipment, it is to some extent susceptible to wiring
disconnections and other damage from vibration, shock and stressed solder
junctions. Therefore when devices are incorporated into the design of
equipment which will be subject to vibration, the structural design of the
equipment must be thought out carefully.
If a device is subjected to especially strong vibration, mechanical shock or
stress, the package or the chip itself may crack. In products such as CCDs
which incorporate window glass, this could cause surface flaws in the glass or
cause the connection between the glass and the ceramic to separate.
Furthermore, it is known that stress applied to a semiconductor device
through the package changes the resistance characteristics of the chip because
of piezoelectric effects. In analog circuit design attention must be paid to the
problem of package stress as well as to the dangers of vibration and shock as
described above.
030901
QUA-31
2002-02-20
Quality and Reliability Assurance / Handling Precautions
4.2
Storage
4.2.1
General Storage
(1) Avoid storage locations where devices will be exposed to moisture or
direct sunlight.
(2) Follow the instructions printed on the
device cartons regarding transportation and
storage.
Temperature:
Humidity:
(3) The storage area temperature should be
kept within a temperature range of 5°C to
35°C, and relative humidity should be
maintained at between 45% and 75%.
(4) Do not store devices in the presence of
harmful (especially corrosive) gases, or in
dusty conditions.
(5) Use storage areas where there is minimal temperature fluctuation. Rapid
temperature changes can cause moisture to form on stored devices,
resulting in lead oxidation or corrosion. As a result, the solderability of
the leads will be degraded.
(6) When repacking devices, use anti-static containers.
(7) Do not allow external forces or loads to be applied to devices while they
are in storage.
(8) If devices have been stored for more than two years, their electrical
characteristics should be tested and their leads should be tested for ease
of soldering before they are used.
030901
QUA-32
2002-02-20
Quality and Reliability Assurance / Handling Precautions
4.2.2
Moisture-Proof Packing
(1) Moisture-proof packing should be handled with
care. The handling procedure specified for each
packing type should be followed scrupulously. If
the proper procedures are not followed, the quality
and reliability of devices may be degraded. This
section describes general precautions for handling moisture-proof packing.
Since the details may differ from device to device, refer also to the
relevant individual datasheets or databook.
(2) General precautions
Follow the instructions printed on the device cartons regarding
transportation and storage.
(3) Do not drop or toss device packing. The laminated aluminum material in
it can be rendered ineffective by rough handling.
(4) The storage area temperature should be kept within a temperature range
of 5°C to 30°C, and relative humidity should be maintained at 90% (max).
Use devices within 12 months of the date marked on the package seal.
(5) If the 12-month storage period has expired, or if the 30% humidity
indicator shown in Figure 4.1 is pink when the packing is opened, it may
be advisable, depending on the device and packing type, to back the
devices at high temperature to remove any moisture. Please refer to the
table below. After the pack has been opened, use the devices in a 5°C to
30°C. 60% RH environment and within the effective usage period listed
on the moisture-proof package. If the effective usage period has expired,
or if the packing has been stored in a high-humidity environment, bake
the devices at high temperature.
Packing
Tray
Tube
Tape
Moisture removal
If the packing bears the “Heatproof” marking or indicates the maximum temperature which it can withstand,
bake at 125°C for 20 hours. (Some devices require a different procedure.)
Transfer devices to trays bearing the “Heatproof” marking or indicating the temperature which they can
withstand, or to aluminum tubes before baking at 125°C for 20 hours.
Deviced packed on tape cannot be baked and must be used within the effective usage period after
unpacking, as specified on the packing.
When baking devices, protect the devices from static electricity.
Moisture indicators can detect the approximate humidity level at a standard temperature
of 25°C. 6-point indicators and 3-point indicators are currently in use, but eventually all
indicators will be 3-point indicators.
030901
QUA-33
2002-02-20
Quality and Reliability Assurance / Handling Precautions
HUMIDITY INDICATOR
60%
50%
30%
20%
10%
HUMIDITY INDICATOR
40
30
DANGER IF PINK
DANGER IF PINK
CHANGE DESICCANT
40%
20
READ AT LAVENDER
BETWEEN PINK & BLUE
READ AT LAVENDER
BETWEEN PINK & BLUE
(a) 6-point indicator
(b) 3-point indicator
Figure 4.1 Humidity Indicator
030901
QUA-34
2002-02-20
Quality and Reliability Assurance / Handling Precautions
4.3
Design
Care must be exercised in the design of electronic equipment to achieve the desired
reliability. It is important not only to adhere to specifications concerning absolute
maximum ratings and recommended operating conditions, it is also important to
consider the overall environment in which equipment will be used, including factors
such as the ambient temperature, transient noise and voltage and current surges,
as well as mounting conditions which affect device reliability. This section describes
some general precautions which you should observe when designing circuits and
when mounting devices on printed circuit boards.
For more detailed information about each product family, refer to the relevant
individual technical datasheets available from Toshiba.
4.3.1
Absolute Maximum Ratings
Do not use devices under conditions in which their absolute maximum
ratings (e.g. current, voltage, power dissipation or temperature) will
be exceeded. A device may break down or its performance may be
degraded, causing it to catch fire or explode resulting in injury to the
user.
The absolute maximum ratings are rated values which
must not be exceeded during operation, even for an instant.
Although absolute maximum ratings differ from product to
product, they essentially concern the voltage and current
at each pin, the allowable power dissipation, and the
junction and storage temperatures.
If the voltage or current on any pin exceeds the absolute
maximum rating, the device’s internal circuitry can become degraded. In the
worst case, heat generated in internal circuitry can fuse wiring or cause the
semiconductor chip to break down.
If storage or operating temperatures exceed rated values, the package seal can
deteriorate or the wires can become disconnected due to the differences
between the thermal expansion coefficients of the materials from which the
device is constructed.
4.3.2
Recommended Operating Conditions
The recommended operating conditions for each device are those necessary to
guarantee that the device will operate as specified in the datasheet.
If greater reliability is required, derate the device’s absolute maximum ratings
for voltage, current, power and temperature before using it.
4.3.3
Derating
When incorporating a device into your design, reduce its rated absolute
maximum voltage, current, power dissipation and operating temperature in
order to ensure high reliability.
Since derating differs from application to application, refer to the technical
datasheets available for the various devices used in your design.
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4.3.4
Unused Pins
If unused pins are left open, some devices can exhibit input instability
problems, resulting in malfunctions such as abrupt increase in current flow.
Similarly, if the unused output pins on a device are connected to the power
supply pin, the ground pin or to other output pins, the IC may malfunction or
break down.
Since the details regarding the handling of unused pins differ from device to
device and from pin to pin, please follow the instructions given in the relevant
individual datasheets or databook.
CMOS logic IC inputs, for example, have extremely high impedance. If an
input pin is left open, it can easily pick up extraneous noise and become
unstable. In this case, if the input voltage level reaches an intermediate level,
it is possible that both the P-channel and N-channel transistors will be turned
on, allowing unwanted supply current to flow. Therefore, ensure that the
unused input pins of a device are connected to the power supply (Vcc) pin or
ground (GND) pin of the same device. For details of what to do with the pins of
heat sinks, refer to the relevant technical datasheet and databook.
4.3.5
Latch-up
Latch-up is an abnormal condition inherent in CMOS devices, in which Vcc
gets shorted to ground. This happens when a parasitic PN-PN junction
(thyristor structure) internal to the CMOS chip is turned on, causing a large
current of the order of several hundred mA or more to flow between Vcc and
GND, eventually causing the device to break down.
Latch-up occurs when the input or output voltage exceeds the rated value,
causing a large current to flow in the internal chip, or when the voltage on the
Vcc (Vdd) pin exceeds its rated value, forcing the internal chip into a
breakdown condition. Once the chip falls into the latch-up state, even though
the excess voltage may have been applied only for an instant, the large current
continues to flow between Vcc (Vdd) and GND (Vss). This causes the device to
heat up and, in extreme cases, to emit gas fumes as well. To avoid this problem,
observe the following precautions:
(1) Do not allow voltage levels on the input and output pins either to rise
above Vcc (Vdd) or to fall below GND (Vss). Also, follow any prescribed
power-on sequence, so that power is applied gradually or in steps rather
than abruptly.
(2) Do not allow any abnormal noise signals to be applied to the device.
(3) Set the voltage levels of unused input pins to Vcc (Vdd) or (GND) Vss.
(4) Do not connect outputs to one another.
4.3.6
Input/Output Protection
Wired-AND configurations, in which outputs are connected together, cannot
be used, since this short-circuits the outputs. Outputs should, of course, never
be connected to Vcc (Vdd) or GND (Vss).
Furthermore, ICs with tri-state outputs can undergo performance degradation
if a shorted output current is allowed to flow for an extended period of time.
Therefore, when designing circuits, make sure that tri-state outputs will not
be enabled simultaneously.
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4.3.7
Load Capacitance
Some devices display increased delay times if the load capacitance is large. Also,
large charging and discharging currents will flow in the device, causing noise.
Furthermore, since outputs are shorted for a relatively long time, wiring can
become fused.
Consult the technical information for the device being used to determine the
recommended load capacitance.
4.3.8
Thermal Design
The failure rate of semiconductor devices is greatly increased as operating
temperatures increase. As shown in Figure 4.2, the internal thermal stress on a
device is the sum of the ambient temperature and the temperature rise due to
power dissipation in the device. Therefore, to achieve optimum reliability, observe
the following precautions concerning thermal design:
(1) Keep the ambient temperature (Ta) as low as possible.
(2) If the device’s dynamic power dissipation is relatively large, select the
most appropriate circuit board material, and consider the use of heat
sinks or of forced air cooling. Such measures will help lower the thermal
resistance of the package.
(3) Derate the device’s absolute maximum ratings to minimize thermal stress
from power dissipation.
θja = θjc + θca
θja = (Tj – Ta)/P
θjc = (Tj – Tc)/P
θca = (Tc – Ta)/P
in which θja = thermal resistance between junction and surrounding air (°C/W)
θjc = thermal resistance between junction and package surface, or
internal thermal resistance (°C/W)
θca = thermal resistance between package surface and
surrounding air, or external thermal resistance (°C/W)
Tj = junction temperature or chip temperature (°C)
Tc = package surface temperature or case temperature (°C)
Ta = ambient temperature (°C)
P = power dissipation (W)
Ta
θca
Tc
θjc
Tj
Figure 4.2 Thermal Resistance of Package
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2002-02-20
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4.3.9
Interfacing
When connecting inputs and outputs between devices, make sure input
voltage (VIL/VIH) and output voltage (VOL/VOH) levels are matched. Otherwise,
the devices may malfunction. When connecting devices operating at different
supply voltages, such as in a dual-power-supply system, be aware that
erroneous power-on and power-off sequences can result in device breakdown.
For details of how to interface particular devices, consult the relevant
technical datasheets and databooks. If you have any questions or doubts about
interfacing, contact your nearest Toshiba office or distributor.
4.3.10 Decoupling
Spike currents generated during switching can cause Vcc (Vdd) and GND
(Vss) voltage levels to fluctuate, causing ringing in the output waveform or a
delay in response speed. (The power supply and GND wiring impedance is
normally 50Ω to 100 Ω.) For this reason, the impedance of power supply lines
with respect to high frequencies must be kept low. This can be accomplished
by using thick and short wiring for the Vcc (Vdd) and GND (Vss) lines and by
installing decoupling capacitors (of approximately 0.01 to 1 µF capacitance) as
high-frequency filters between Vcc (Vdd) and GND (Vss) at strategic locations
on the printed circuit board.
For low-frequency filtering, it is a good idea to install a 10- to 100-µF capacitor
on the printed circuit board (one capacitor will suffice). If the capacitance is
excessively large, however, (e.g. several thousandµF) latch-up can be a
problem. Be sure to choose an appropriate capacitance value.
An important point about wiring is that, in the case of high-speed logic ICs,
noise is caused mainly by reflection and crosstalk, or by the power supply
impedance. Reflections cause increased signal delay, ringing, overshoot and
undershoot, thereby reducing the device’s safety margins with respect to noise.
To prevent reflections, reduce the wiring length by increasing the device
mounting density so as to lower the inductance (L) and capacitance (C) in the
wiring. Extreme care must be taken, however, when taking this corrective
measure, since it tends to cause crosstalk between the wires. In practice, there
must be a trade-off between these two factors.
4.3.11 External Noise
Printed circuit boards with long I/O or signal
pattern lines are vulnerable to induced noise or
surges from outside sources. Consequently,
malfunctions or breakdowns can result from
overcurrent or overvoltage, depending on the
types of device used. To protect against noise,
lower the impedance of the pattern line or insert
a noise-canceling circuit. Protective measures
must also be taken against surges.
For details of the appropriate protective measures for a particular device,
consult the relevant databook.
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2002-02-20
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4.3.12 Electromagnetic Interference
Widespread use of electrical and electronic equipment in recent years has
brought with it radio and TV reception problems due to electromagnetic
interference. To use the radio spectrum effectively and to maintain radio
communications quality, each country has formulated regulations limiting the
amount of electromagnetic interference which can be generated by individual
products.
Electromagnetic interference includes conduction noise propagated through
power supply and telephone lines, and noise from direct electromagnetic
waves radiated by equipment. Different measurement methods and corrective
measures are used to assess and counteract each specific type of noise.
Difficulties in controlling electromagnetic interference derive from the fact
that there is no method available which allows designers to calculate, at the
design stage, the strength of the electromagnetic waves which will emanate
from each component in a piece of equipment. For this reason, it is only after
the prototype equipment has been completed that the designer can take
measurements using a dedicated instrument to determine the strength of
electromagnetic interference waves.
Yet it is possible during system design to incorporate some measures for the
prevention of electromagnetic interference, which can facilitate taking
corrective measures once the design has been completed. These include
installing shields and noise filters, and increasing the thickness of the power
supply wiring patterns on the printed circuit board. One effective method, for
example, is to devise several shielding options during design, and then select
the most suitable shielding method based on the results of measurements
taken after the prototype has been completed.
4.3.13 Peripheral Circuits
In most cases semiconductor devices are used with peripheral circuits and
components. The input and output signal voltages and currents of these
circuits must be chosen to match the semiconductor device’s specifications.
The following factors must be taken into account.
(1) Inappropriate voltages or currents applied to a device’s input pins may
cause it to operate erratically. Some devices contain pull-up or pull-down
resistors. When designing your system, remember to take the effect of this
on the voltage and current levels into account.
(2) The output pins on a device have a predetermined external circuit drive
capability. If this drive capability is greater than that required, either
incorporate a compensating circuit into your design or carefully select
suitable components for use in external circuits.
4.3.14 Safety Standards
Each country has safety standards which must be observed. These safety
standards include requirements for quality assurance systems and design of
device insulation. Such requirements must be fully taken into account to
ensure that your design conforms to the applicable safety standards.
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4.3.15 Other Precautions
(1) When designing a system, be sure to incorporate fail-safe and other
appropriate measures according to the intended purpose of your system.
Also, be sure to debug your system under actual board-mounted
conditions.
(2) If a plastic-package device is placed in a strong electric field, surface
leakage may occur due to the charge-up phenomenon, resulting in device
malfunction. In such cases, take appropriate measures to prevent this
problem, for example by protecting the package surface with a conductive
shield.
(3) With some microcomputers and MOS memory devices, caution is required
when powering on or resetting the device. To ensure that your design does
not violate device specifications, consult the relevant databook for each
constituent device.
(4) Ensure that no conductive material or object (such as a metal pin) can
drop onto and short the leads of a device mounted on a printed circuit
board.
4.4
Inspection, Testing and Evaluation
4.4.1
Grounding
Ground all measuring instruments, jigs, tools and soldering irons to
earth.
Electrical leakage may cause a device to break down or may result in
electric shock.
4.4.2
Inspection Sequence
① Do not insert devices in the wrong orientation. Make sure that the
positive and negative electrodes of the power supply are correctly
connected. Otherwise, the rated maximum current or maximum
power dissipation may be exceeded and the device may break down
or undergo performance degradation, causing it to catch fire or
explode, resulting in injury to the user.
② When conducting any kind of evaluation, inspection or testing using
AC power with a peak voltage of 42.4 V or DC power exceeding 60
V, be sure to connect the electrodes or probes of the testing
equipment to the device under test before powering it on.
Connecting the electrodes or probes of testing equipment to a device
while it is powered on may result in electric shock, causing injury.
(1) Apply voltage to the test jig only after inserting the device securely into it.
When applying or removing power, observe relevant precautions, if any.
(2) Make sure that the voltage applied to the device is off before removing the
device from the test jig. Otherwise, the device may undergo performance
degradation or be destroyed.
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(3) Make sure that no surge voltages from the measuring equipment are
applied to the device.
(4) The chips housed in tape carrier packages (TCPs) are bare chips and are
therefore exposed. During inspection take care not to crack the chip or
cause any flaws in it.
Electrical contact may also cause a chip to become faulty. Therefore make
sure that nothing comes into electrical contact with the chip.
4.5
Mounting
There are essentially two main types of semiconductor device package: lead
insertion and surface mount. During mounting on printed circuit boards, devices
can become contaminated by flux or damaged by thermal stress from the soldering
process. With surface-mount devices in particular, the most significant problem is
thermal stress from solder reflow, when the entire package is subjected to heat.
This section describes a recommended temperature profile for each mounting
method, as well as general precautions which you should take when mounting
devices on printed circuit boards. Note, however, that even for devices with the
same package type, the appropriate mounting method varies according to the size of
the chip and the size and shape of the lead frame. Therefore, please consult the
relevant technical datasheet or databook.
4.5.1
Lead Forming
① Always wear protective glasses when cutting the leads of a device
with clippers or a similar tool. If you do not, small bits of metal
flying off the cut ends may damage your eyes.
② Do not touch the tips of device leads. Because some types of device
have leads with pointed tips, you may prick your finger.
Semiconductor devices must undergo a process in which the leads are cut and
formed before the devices can be mounted on a printed circuit board. If undue
stress is applied to the interior of a device during this process, mechanical
breakdown or performance degradation can result. This is attributable
primarily to differences between the stress on the device’s external leads and
the stress on the internal leads. If the relative difference is great enough, the
device’s internal leads, adhesive properties or sealant can be damaged.
Observe these precautions during the lead-forming process (this does not
apply to surface-mount devices):
(1) Lead insertion hole intervals on the printed circuit board should match
the lead pitch of the device precisely.
(2) If lead insertion hole intervals on the printed circuit board do not
precisely match the lead pitch of the device, do not attempt to forcibly
insert devices by pressing on them or by pulling on their leads.
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2002-02-20
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(3) For the minimum clearance specification between
a device and a printed circuit board, refer to the
relevant device’s datasheet or databook. If
necessary, achieve the required clearance by
forming the device’s leads appropriately. Do not
use the spacers which are used to raise devices
above the surface of the printed circuit board during soldering to achieve
clearance. These spacers normally continue to expand due to heat, even
after the solder has begun to solidify; this applies severe stress to the
device.
(4) Observe the following precautions when forming the leads of a device
prior to mounting so as to avoid mechanical stress to the device. Also
avoid ending or stretching device leads repeatedly.
(a) Use a tool or jig to secure the lead at its base (where the lead meets
the device package) while bending so as to avoid mechanical stress
to the device. Also avoid bending or stretching device leads
repeatedly.
(b) Be careful not to damage the lead during lead forming.
(c) Follow any other precautions described in the individual datasheets
and databooks for each device and package type.
4.5.2
Socket Mounting
(1) When socket mounting devices on a printed circuit board, use sockets
which match the inserted device’s package.
(2) Use sockets whose contacts have the appropriate contact pressure. If the
contact pressure is insufficient, the socket may not make a perfect contact
when the device is repeatedly inserted and removed; if the pressure is
excessively high, the device leads may be bent or damaged when they are
inserted into or removed from the socket.
(3) When soldering sockets to the printed circuit board, use sockets whose
construction prevents flux from penetrating into the contacts or which
allows flux to be completely cleaned off.
(4) Make sure the coating agent applied to the printed circuit board for
moisture-proofing purposes does not stick to the socket contacts.
(5) If the device leads are severely bent by a socket as it is inserted or
removed and you wish to repair the leads so as to continue using the
device, make sure that this lead correction is only performed once. Do not
use devices whose leads have been corrected more than once.
(6) If the printed circuit board with the devices mounted on it will be
subjected to vibration from external sources, use sockets which have a
strong contact pressure so as to prevent the sockets and devices from
vibrating relative to one another.
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2002-02-20
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4.5.3
Soldering Temperature Profile
The soldering temperature and heating time vary from device to device.
Therefore, when specifying the mounting conditions, refer to the individual
datasheets and databooks for the devices used.
(1) Using a Soldering Iron
Complete soldering within ten seconds for lead temperatures of up to
260°C, or within three seconds for lead temperatures up to 350°C.
(2) Standard Mounting Conditions for SMDs
(Surface Mount Devices)
For details, refer to section 2.1 Mounting Precautions in chapter 2
Handling Precautions for Microcontrollers.
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4.5.4
Flux Cleaning and Ultrasonic Cleaning
(1) When cleaning circuit boards to remove flux, make sure that no residual
reactive ions such as Na or Cl remain. Note that organic solvents react
with water to generate hydrogen chloride and other corrosive gases which
can degrade device performance.
(2) Washing devices with water will not cause any problems. However, make
sure that no reactive ions such as sodium and chlorine are left as residues.
Also, be sure to dry devices sufficiently after washing.
(3) Do not rub device markings with a brush or with your hand during
cleaning or while the devices are still wet from the cleaning agent. Doing
so can rub off the markings.
(4) The dip cleaning, shower cleaning and steam cleaning processes all
involve the chemical action of a solvent. Use only recommended solvents
for these cleaning methods. When immersing devices in a solvent or
steam bath, make sure that the temperature of the liquid is 50°C or below,
and that the circuit board is removed from the bath within one minute.
(5) Ultrasonic cleaning should not be used with hermetically-sealed ceramic
packages such as a leadless chip carrier (LCC), pin grid array (PGA) or
charge-coupled device (CCD), because the bonding wires can become
disconnected due to resonance during the cleaning process. Even if a
device package allows ultrasonic cleaning, limit the duration of ultrasonic
cleaning to as short a time as possible, since long hours of ultrasonic
cleaning degrade the adhesion between the mold resin and the frame
material. The following ultrasonic cleaning conditions are recommended:
Frequency: 27 kHz to 29 kHz
Ultrasonic output power: 300 W or less (0.25 W/cm2 or less)
Cleaning time: 30 seconds or less
Suspend the circuit board in the solvent bath during ultrasonic cleaning
in such a way that the ultrasonic vibrator does not come into direct
contact with the circuit board or the device.
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2002-02-20
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4.5.5
Circuit Board Coating
When devices are to be used in equipment requiring a high degree of reliability
or in extreme environments (where moisture, corrosive gas or dust is present),
circuit boards may be coated for protection. However, before doing so, you
must carefully consider the possible stress and contamination effects that may
result and then choose the coating resin which results in the minimum level of
stress to the device.
4.6
Protecting Devices in the Field
4.6.1
Temperature
Semiconductor devices are generally more sensitive to temperature than are
other electronic components. The various electrical characteristics of a
semiconductor device are dependent on the ambient temperature at which the
device is used. It is therefore necessary to understand the temperature
characteristics of a device and to incorporate device derating into circuit
design. Note also that if a device is used above its maximum temperature
rating, device deterioration is more rapid and it will reach the end of its usable
life sooner than expected.
4.6.2
Humidity
Resin-molded devices are sometimes improperly sealed. When these devices
are used for an extended period of time in a high-humidity environment,
moisture can penetrate into the device and cause chip degradation or
malfunction. Furthermore, when devices are mounted on a regular printed
circuit board, the impedance between wiring components can decrease under
high-humidity conditions. In systems which require a high signal-source
impedance, circuit board leakage or leakage between device lead pins can
cause malfunctions. The application of a moisture-proof treatment to the
device surface should be considered in this case. On the other hand, operation
under low-humidity conditions can damage a device due to the occurrence of
electrostatic discharge. Unless damp-proofing measures have been specifically
taken, use devices only in environments with appropriate ambient moisture
levels (i.e. within a relative humidity range of 40% to 60%).
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4.6.3
Corrosive Gases
Corrosive gases can cause chemical reactions in devices, degrading device
characteristics.
For example, sulphur-bearing corrosive gases emanating from rubber placed
near a device (accompanied by condensation under high-humidity conditions)
can corrode a device’s leads. The resulting chemical reaction between leads
forms foreign particles which can cause electrical leakage.
4.6.4
Radioactive and Cosmic Rays
Most industrial and consumer semiconductor devices are not designed with
protection against radioactive and cosmic rays. Devices used in aerospace
equipment or in radioactive environments must therefore be shielded.
4.6.5
Strong Electrical and Magnetic Fields
Devices exposed to strong magnetic fields can undergo a polarization
phenomenon in their plastic material, or within the chip, which gives rise to
abnormal symptoms such as impedance changes or increased leakage current.
Failures have been reported in LSIs mounted near malfunctioning deflection
yokes in TV sets. In such cases, the device’s installation location must be
changed or the device must be shielded against the electrical or magnetic field.
Shielding against magnetism is especially necessary for devices used in an
alternating magnetic field because of the electromotive forces generated in this
type of environment.
4.6.6
Interference from Light (ultraviolet rays, sunlight, fluorescent
lamps and incandescent lamps)
Light striking a semiconductor device generates electromotive force due to
photoelectric effects. In some cases the device can malfunction. This is
especially true for devices in which the internal chip is exposed. When
designing circuits, make sure that devices are protected against incident light
from external sources. This problem is not limited to optical semiconductors
and EPROMs. All types of device can be affected by light.
4.6.7
Dust and Oil
Just like corrosive gases, dust and oil can cause chemical reactions in devices,
which will adversely affect a device’s electrical characteristics. To avoid this
problem, do not use devices in dusty or oily environments. This is especially
important for optical devices because dust and oil can affect a device’s optical
characteristics as well as its physical integrity and the electrical performance
factors mentioned above.
4.6.8
Fire
Semiconductor devices are combustible; they can emit smoke and catch fire if
heated sufficiently. When this happens, some devices may generate poisonous
gases. Devices should therefore never be used in close proximity to an open
flame or a heat-generating body, or near flammable or combustible materials.
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4.7
Disposal of Devices and Packing Materials
When discarding unused devices and packing materials, follow all procedures
specified by local regulations in order to protect the environment against
contamination.
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2002-02-20