TOSHIBA TLYK1100CT11

TL(RK,RMK,SK,OK,YK)1100C(T11)
TOSHIBA LED Lamps
TLRK1100C(T11),TLRMK1100C(T11),TLSK1100C(T11)
TLOK1100C(T11),TLYK1100C(T11)
Panel Circuit Indicators
Unit: mm
•
Surface-mount devices
•
3.2 (L) mm × 2.8 (W) mm × 1.9 (H) mm
•
Flat-top type
•
InGaAℓP LEDs
•
High luminous intensity
•
Low drive current, high-intensity light emission
•
Colors: red, orange, yellow
•
Applications: automotive use, message signboards, backlighting
etc.
•
Standard embossed tape packing: T11 (2000 pcs / reel)
8-mm tape reel
Color and Material
Part Number
Color
TLRK1100C
Red
TLRMK1100C
Red
TLSK1100C
Red
TLOK1100C
Orange
TLYK1100C
Yellow
JEDEC
―
JEITA
―
TOSHIBA
Material
4-3R1
Weight: 0.035 g (typ.)
InGaAℓP
Marktech
Optoelectronics
For part availability and ordering information please call Toll Free: 800.984.5337
Website: www.marktechopto.com | Email: [email protected]
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2008-04-14
TL(RK,RMK,SK,OK,YK)1100C(T11)
Absolute Maximum Ratings (Ta = 25°C)
Product Name
Forward Current
IF (mA)
Please see Note 1
Reverse Voltage
VR (V)
Power Dissipation
PD (mW)
Operation
Temperature
Topr (°C)
Storage
Temperature
Tstg (°C)
30
4
75
−40 to 100
−40 to 100
TLRK1100C
TLRMK1100C
TLSK1100C
TLOK1100C
TLYK1100C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Forward current derating
IF – Ta
Allowable forward current
IF (mA)
50
40
30
20
10
0
0
20
40
60
80
100
120
Ambient temperature Ta (°C))
Electrical Characteristics (Ta = 25°C)
Min
Typ.
Max
TLRK1100C
1.8
2.1
2.5
TLRMK1100C
1.8
2.1
2.5
TLSK1100C
1.8
2.1
2.5
TLOK1100C
1.8
2.1
2.5
TLYK1100C
1.8
2.2
2.5
Unit
Reverse Current
IR
Forward Voltage VF
Product Name
V
IF
Max
VR
20
10
4
mA
μA
V
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2008-04-14
TL(RK,RMK,SK,OK,YK)1100C(T11)
Optical Characteristics–1 (Ta = 25°C)
Product Name
TLRK1100C
Luminous Intensity IV
Available Iv rank
Min
Typ.
Max
IF
Please see Note 2
100
300
500
20
RA / SA / TA
TLRMK1100C
160
400
800
20
SA / TA / UA
TLSK1100C
250
500
1250
20
TA / UA / VA
TLOK1100C
250
500
1250
20
TA / UA / VA
TLYK1100C
160
400
800
20
SA / TA / UA
Unit
mcd
mcd
mcd
mA
⎯
Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
Rank
Luminous Intensity IV
Min
Max
RA
100
200
SA
160
320
TA
250
500
UA
400
800
VA
630
1250
Unit
mcd
mcd
Optical Characteristics–2 (Ta = 25°C)
Emission Spectrum
Product Name
Peak Emission
Wavelength λp
Min
Typ.
Max
Δλ
Dominant Wavelength λd
Typ.
Min
Typ.
Max
TLRK1100C
⎯
644
⎯
14
624
630
638
TLRMK1100C
⎯
636
⎯
14
620
626
634
TLSK1100C
⎯
623
⎯
14
607
613
621
TLOK1100C
⎯
612
⎯
14
599
605
613
TLYK1100C
⎯
592
⎯
13
583
590
595
Unit
nm
nm
nm
IF
20
mA
Cautions
•
This product is designed as a general display light source usage, and it has applied the measurement standard
that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional
application (ex. Light source for sensor, optical communication and etc) except general display light source.
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2008-04-14
TL(RK,RMK,SK,OK,YK)1100C(T11)
TLRK1100C
IF – V F
IV (mcd)
1000
30
Luminous intensity
Forward current
IF
(mA)
IV – IF
(typ.)
100
10
3
1
1.6
1.8
2.0
2.2
Forward voltage
VF
300
100
50
30
(V)
IV – Tc
Ta = 25°C
500
10
1
2.4
(typ.)
3
5
10
30
Forward current
IF
50
100
(mA)
Wavelength characteristic
(typ.)
10
(typ.)
1.0
Relative luminous intensity
Relative luminous intensity
IV
IF = 20 mA
5
3
1
0.5
0.3
0.1
−25
0
25
50
Case temperature
75
Tc
Ta = 25°C
0.8
0.6
0.4
0.2
0
580
100
(°C)
600
620
640
Wavelength
660
680
700
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
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2008-04-14
TL(RK,RMK,SK,OK,YK)1100C(T11)
TLRMK1100C
IF – V F
IV (mcd)
1000
30
Luminous intensity
Forward current
IF
(mA)
IV – IF
(typ.)
100
10
3
1
1.6
1.8
2.0
2.2
Forward voltage
VF
500
300
100
50
30
10
1
2.4
(V)
IV – Tc
3
5
10
30
Forward current
IF
50
100
(mA)
Wavelength characteristic
(typ.)
10
(typ.)
Ta = 25°C
(typ.)
1.0
Ta = 25°C
Relative luminous intensity
Relative luminous intensity
IV
IF = 20 mA
5
3
1
0.5
0.3
0.1
−25
0
25
50
Case temperature
75
Tc
0.8
0.6
0.4
0.2
0
580
100
(°C)
600
620
640
Wavelength
660
680
700
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
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2008-04-14
TL(RK,RMK,SK,OK,YK)1100C(T11)
TLSK1100C
IF – V F
IV (mcd)
1000
30
Luminous intensity
Forward current
IF
(mA)
IV – IF
(typ.)
100
10
3
1
1.6
1.8
2.0
2.2
Forward voltage
VF
500
300
100
50
30
10
1
2.4
(V)
IV – Tc
3
5
10
30
Forward current
IF
50
100
(mA)
Wavelength characteristic
(typ.)
10
(typ.)
Ta = 25°C
(typ.)
1.0
Ta = 25°C
Relative luminous intensity
Relative luminous intensity
IV
IF = 20 mA
5
3
1
0.5
0.3
0.1
−25
0
25
50
Case temperature
75
Tc
0.8
0.6
0.4
0.2
0
560
100
(°C)
580
600
620
Wavelength
640
660
680
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
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2008-04-14
TL(RK,RMK,SK,OK,YK)1100C(T11)
TLOK1100C
IF – V F
IV – IF
(typ.)
IV (mcd)
1000
30
Luminous intensity
Forward current
IF
(mA)
100
10
3
1
1.6
1.8
2.0
2.2
Forward voltage
VF
500
300
100
50
30
10
1
2.4
(V)
IV – Tc
3
5
10
30
Forward current
IF
50
100
(mA)
Wavelength characteristic
(typ.)
10
(typ.)
Ta = 25°C
(typ.)
1.0
Ta = 25°C
Relative luminous intensity
Relative luminous intensity
IV
IF = 20 mA
5
3
1
0.5
0.3
0.1
−25
0
25
50
Case temperature
75
Tc
0.8
0.6
0.4
0.2
0
540
100
(°C)
560
580
600
Wavelength
620
640
660
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
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2008-04-14
TL(RK,RMK,SK,OK,YK)1100C(T11)
TLYK1100C
IF – V F
IV (mcd)
1000
30
Luminous intensity
Forward current
IF
(mA)
IV – IF
(typ.)
100
10
3
1
1.6
1.8
2.0
2.2
Forward voltage
VF
500
300
100
50
30
10
1
2.4
(V)
IV – Tc
3
5
10
30
Forward current
IF
50
100
(mA)
Wavelength characteristic
(typ.)
10
(typ.)
Ta = 25°C
(typ.)
1.0
Ta = 25°C
Relative luminous intensity
Relative luminous intensity
IV
IF = 20 mA
5
3
1
0.5
0.3
0.1
−25
0
25
50
Case temperature
75
Tc
0.8
0.6
0.4
0.2
0
540
100
(°C)
560
580
600
Wavelength
620
640
660
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
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2008-04-14
TL(RK,RMK,SK,OK,YK)1100C(T11)
Packaging
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C to 30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of
5°C to 30°C/60% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the devices should be baked in taping with reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 12 to 24 hours.
Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
•
Reflow soldering (example)
Temperature profile for Pb soldering (example)
Temperature profile for Pb-free soldering (example)
5 s max(*)
10 s max (*)
(*)
(*)
140 to 160°C max(*)
(*)
4°C/s max(*)
4°C/s max
60 to 120 s max(*)
Time
•
•
•
•
•
260°C max
Package surface
temperature (°C)
Package surface
temperature (°C)
240°C max
4°C/s max(*)
max(*)
150 to 180°C 230°C
4°C/s max(*)
60 to 120 s
Time
(s)
max(*)
30 to 50 s max(*)
(s)
The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of
opening the package.
Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron: 25 W
Temperature: 300°C or less
Time:
within 3 s
If the products need to be performed by other soldering method (ex. wave soldering), please contact Toshiba
sales representative.
Recommended soldering pattern
1.65
Unit: mm
1.15
1.65
2.41
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2008-04-14
TL(RK,RMK,SK,OK,YK)1100C(T11)
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the
recommended conditions). In selecting the one for your actual usage, please perform sufficient review
on washing condition, using condition and etc.
ASAHI CLEAN AK-225AES:
KAO CLEAN THROUGH 750H:
PINE ALPHA ST-100S:
(made by ASAHI GLASS)
(made by KAO)
(made by ARAKAWA CHEMICAL)
Precautions when Mounting
Do not apply force to the plastic part of the LED under high-temperature conditions.
To avoid damaging the LED plastic, do not apply friction using a hard material.
When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The
method of classification is as below. (this method, however does not apply to products whose electrical
characteristics differ from standard Toshiba specifications)
(1) Tape Type: T11 (4-mm pitch)
(2) Example
TLYK1100C (T11)
Tape type
Toshiba product No.
2.
Tape dimensions
Unit: mm
Symbol
Dimension
Tolerance
Symbol
Dimension
Tolerance
D
1.5
+0.1/−0
P2
2.0
±0.05
E
1.75
±0.1
W
8.0
±0.3
P0
4.0
±0.1
P
4.0
±0.1
t
0.3
±0.05
A0
2.9
±0.1
F
3.5
±0.05
B0
3.7
±0.1
D1
1.5
±0.1
K0
2.3
±0.1
K0
P0
D
t
P2
E
F
W
B0
P
D1
Polarity
A0
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2008-04-14
TL(RK,RMK,SK,OK,YK)1100C(T11)
3. Reel dimensions
Unit: mm
9 +1/ −0
φ60
2 ± 0.5
φ13
φ44
+0
180 −4
11.4 ± 1.0
4. Leader and trailer sections of tape
40 mm or more
40 mm or more
(Note 1)
(Note 2)
Leading part: 190 mm (min)
Note 1: Empty trailer section
Note 2: Empty leader section
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2008-04-14
TL(RK,RMK,SK,OK,YK)1100C(T11)
5. Packing form
(1) Packing quantity
Reel
2,000 pcs
Carton
10,000 pcs
(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.
6. Label format
(1) Example: TLYK1100C (T11)
P/N:
TOSHIBA
TYPE
TLYK1100C
ADDC
(T11)
Q’TY
Lot Number
Key code for TSB
(RANK SYMBOL)
32C
2,000 pcs
2000
Use under 5-30degC/60%RH within 168h
SEALED
DIFFUSED IN *****
ASSEMBLED IN *****
[[G]]/RoHS COMPATIBLE
*Y380xxxxxxxxxxxxxxxxxx*
(2) Label location
• Reel
• Carton
Tape feel direction
Label position
Label position
• The aluminum package in which the reel is supplied also has the label attached to
center of one side.
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TL(RK,RMK,SK,OK,YK)1100C(T11)
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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2008-04-14