TOSHIBA TLEGD1100B

TL(BD,EGD)1100B(T11)
TOSHIBA LED Lamps
TLBD1100B(T11), TLEGD1100B(T11)
Panel Circuit Indicator
Unit: mm
•
Surface-mount devices
•
3.2 (L) × 2.8 (W) × 1.9 (H) mm
•
Flat-top type
•
InGaN LEDs
•
High luminous intensity
•
Low drive current, high-intensity light emission
•
Colors:
Blue
λd=470nm(typ)
Green
λd=528nm(typ)
•
Pb free reflow soldering is possible
•
Applications: automotive use, message signboards, backlighting
etc.
•
Standard embossed tape packing: T11 (2000/reel)
8-mm tape reel
Color and Material
Product Name
Color
TLBD1100B
Material
Blue
TLEGD1100B
InGaN
Green
JEDEC
―
JEITA
―
TOSHIBA
4-3R1
Weight: 0.035 g (typ.)
Absolute Maximum Ratings (Ta = 25°C)
Product Name
TLBD1100B
TLEGD1100B
Forward Current
IF (mA)
Please see Note 1
Reverse Voltage
VR (V)
Power Dissipation
PD (mW)
Operation
Temperature
Topr (°C)
Storage
Temperature
Tstg (°C)
30
4
120
−40~100
−40~100
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Forward current derating
IF – Ta
Allowable forward current
IF
(mA)
40
30
20
10
0
0
20
40
60
Ambient temperature
80
Ta
100
(°C)
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TL(BD,EGD)1100B(T11)
Electrical Characteristics (Ta = 25°C)
Reverse Current
IR
Forward Voltage VF
Product Name
Min
Typ.
Max
TLBD1100B
2.7
3.3
4.0
TLEGD1100B
2.7
3.3
4.0
Unit
V
IF
Max
VR
20
10
4
mA
μA
V
Optical Characteristics–1 (Ta = 25°C)
Luminous Intensity IV
Product Name
Available Iv rank
(Note 2)
Min
Typ.
Max
IF
TLBD1100B
40
70
200
20
PA / QA / RA
TLEGD1100B
100
200
500
20
RA / SA / TA
Unit
mcd
mA
Note 2: The specification as following table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
Iv rank
Rank symbol
Min
Max
PA
40
80
QA
63
125
RA
100
200
SA
160
320
TA
250
500
Unit
mcd
mcd
Optical Characteristics–2 (Ta = 25°C)
Emission Spectrum
Peak Emission
Wavelength λp
Product Name
Δλ
Dominant Wavelength λd
Min
Typ.
Max
Typ.
Min
Typ.
Max
TLBD1100B
⎯
468
⎯
22
463
470
477
TLEGD1100B
⎯
523
⎯
35
518
528
538
Unit
nm
nm
nm
IF
20
mA
Note 3: Caution
ESD withstand voltage according to MIL STD 883D, Method 3015.7 : ≥1000V
When handling this LED, take the following measures to prevent the LED from being damaged or otherwise
adversely affected.
1) Use a conductive tablemat and conductive floor mat, and ground the workbench and floor.
2) Operators handling laser diodes must be grounded via a high resistance (about 1MΩ). A conductive strap is
good for this purpose.
3) Ground all tools including soldering irons.
This product is designed as a general display light source usage, and it has applied the measurement standard
that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional application
(ex. Light source for sensor, optical communication and etc) except general display light source.
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2007-10-01
TL(BD,EGD)1100B(T11)
TLBD1100B
IF – V F
IV – IF
(typ.)
100
(typ.)
300
IV (mcd)
30
Ta = 25°C
100
50
Luminous intensity
Forward current
IF
(mA)
Ta = 25°C
10
3
1
2.2
2.6
3.0
3.4
3.8
4.2
Forward voltage
4.6
30
10
5
3
1
5.0
3
5
10
30
Forward current
VF
IV – Tc
IF
1.0
(typ.)
IF = 20 mA
Ta = 25°C
5
0.8
3
Relative luminosity
IV
100
(mA)
Relative luminosity - λ
(typ.)
10
Relative luminosity
50
1
0.5
0.3
0.6
0.4
0.2
0.1
−20
0
20
40
Case temperature
60
Tc
0
360
100
80
(°C)
400
440
480
Wavelength
520
560
600
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
50
80°
80°
90°
0
0.2
0.4
0.6
0.8
90°
1.0
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2007-10-01
TL(BD,EGD)1100B(T11)
TLEGD1100B
IF – V F
IV – IF
(typ.)
(typ.)
300
100
IV (mcd)
30
Ta = 25°C
100
50
Luminous intensity
Forward current
IF
(mA)
Ta = 25°C
10
3
1
2.2
2.6
3.0
3.4
3.8
Forward voltage
4.6
4.2
VF
30
10
5
3
1
5.0
(V)
3
5
10
30
Forward current
IV – Tc
IF
100
(mA)
Relative luminosity - λ
(typ.)
10
1.0
(typ.)
IF = 20 mA
Ta = 25°C
5
0.8
IV
3
Relative luminosity
Relative luminosity
50
1
0.5
0.3
0.1
0.6
0.4
0.2
−20
0
20
40
60
Case temperature
Tc
0
400
100
80
(°C)
440
480
520
Wavelength
560
600
640
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
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TL(BD,EGD)1100B(T11)
Packaging
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C~30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of
5°C to 30°C/60% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the devices should be baked in taping with reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 12 to 24 hours.
Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
•
Reflow soldering (example)
Temperature profile for Pb soldering (example)
Temperature profile for Pb-free soldering (example)
5 s max(*)
10 s max (*)
(*)
(*)
140~160°C max(*)
(*)
4°C/s max(*)
4°C/s max
60~120 s max(*)
Time
•
•
•
•
•
260°C max
Package surface
temperature (°C)
Package surface
temperature (°C)
240°C max
4°C/s max(*)
max(*)
150~180°C 230°C
4°C/s max(*)
max(*)
60~120 s
Time
(s)
30~50s max(*)
(s)
The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of
opening the package.
Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron : 25 W
Temperature : 300°C or less
Time
: within 3 s
If the product needs to be performed by other soldering method (ex. wave soldering), please contact Toshiba
sales representative.
Recommended soldering pattern
1.65
1.15
Unit: mm
1.65
2.41
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TL(BD,EGD)1100B(T11)
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the
recommended conditions). In selecting the one for your actual usage, please perform sufficient review
on washing condition, using condition and etc.
ASAHI CLEAN AK-225AES
KAO CLEAN TROUGH 750H
PINE ALPHA ST-100S
TOSHIBA TECHNOCARE
(FRW-17, FRW-1, FRV-100)
: (made by ASAHI GLASS)
: (made by KAO)
: (made by ARAKAWA CHEMICAL)
: (made by GE TOSHIBA SILICONES)
Precautions when Mounting
Do not apply force to the plastic part of the LED under high-temperature conditions.
To avoid damaging the LED plastic, do not apply friction using a hard material.
When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The
method of classification is as below. (this method, however does not apply to products whose electrical
characteristics differ from standard Toshiba specifications)
(1) Tape Type: T14 (4-mm pitch)
(2) Example
TLBD1100B (T11)
Tape type
Toshiba product No.
2.
Tape dimensions
Unit: mm
Symbol
Dimension
Tolerance
Symbol
Dimension
Tolerance
D
1.5
+0.1/−0
P2
2.0
±0.05
E
1.75
±0.1
W
8.0
±0.3
P0
4.0
±0.1
P
4.0
±0.1
t
0.3
±0.05
A0
2.9
±0.1
F
3.5
±0.05
B0
3.7
±0.1
D1
1.5
±0.1
K0
2.3
±0.1
K0
P0
D
t
P2
E
F
W
B0
P
D1
Polarity
A0
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TL(BD,EGD)1100B(T11)
3. Reel dimensions
Unit: mm
9 ± 0.3
φ60
2 ± 0.5
φ13
φ44
+0
180 −4
11.4 ± 1.0
4. Leader and trailer sections of tape
40 mm or more
40 mm or more
(Note 1)
(Note 2)
Leading part: 190 mm (min)
Note1: Empty trailer section
Note2: Empty leader section
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TL(BD,EGD)1100B(T11)
5. Packing display
(1) Packing quantity
Reel
2,000 pcs
Carton
10,000 pcs
(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.
6. Label format
(1) Example: TLBD1100B (T11)
P/N:
TOSHIBA
TYPE
TLBD1100B
ADDC
(T11)
Q’TY
Lot Number
Key code for TSB
(RANK SYMBOL)
32C
2,000 pcs
2000
Use under 5-30degC/6-%RH within 168h
SEAL DATE:
DIFFUSED IN *****
ASSEMBLED IN *****
[[G]]/RoHS COMPATIBLE
*Y3804xxxxxxxxxxxxxxxxx*
(2) Label location
• Reel
• Carton
Tape feel direction
Label position
Label position
• The aluminum package in which the reel is supplied also has the label attached to
center of one side.
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TL(BD,EGD)1100B(T11)
RESTRICTIONS ON PRODUCT USE
20070701-EN GENERAL
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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