TD62783,784AP/AFW TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62783AP,TD62783AFW,TD62784AP,TD62784AFW (Manufactured by Toshiba Malaysia) 8CH HIGH−VOLTAGE SOURCE DRIVER The TD62783AP / AFW Series are comprised of eight source current Transistor Array. These drivers are specifically designed for fluorescent display applications. Applications include relay, hammer and lamp drivers. FEATURES l High output voltage Type−AP, AFW : VCC = 50 V MIN. Type−F : VCC = 35 V MIN. l Output current (single output) IOUT = −500 mA MIN. l Output clamp diodes l Single supply voltage l Input compatible with various types of logic l Package Type−AP : DIP−18 pin l Package Type−AFW : SOL−18 pin TYPE DESIGNATION TD62783AP / AFW TTL, 5 V CMOS TD62784AP / AFW 6~15 V PMOS, CMOS Weight DIP18−P−300−2.54F : 1.478 g (Typ.) SOL18−P−300−1.27 : 0.48 g (Typ.) PIN CONNECTION (TOP VIEW) SCHEMATICS (EACH DRIVER) Note: 1 The input and output parasitic diodes cannot be used as clamp diodes. 2001-07-05 TD62783,784AP/AFW MAXIMUM RATINGS (Ta = 25°C) CHARACTERISTIC SYMBOL RATING UNIT Supply Voltage VCC 50 V Output Current IOUT −500 mA / ch VIN (Note 1) 15 VIN (Note 2) 30 Clamp Diode Reverse Voltage VR 50 V Clamp Diode Forward Current IF 500 mA Input Voltage AP Power Dissipation PD AFW V 1.47 0.92 / 1.31 (Note 3) W Operating Temperature Topr −40~85 °C Storage Temperature Tstg −55~150 °C Note 1: Only TD62783AP / AFW Note 2: Only TD62784AP / AFW Note 3: On Glass Epoxy PCB (75 × 114 × 1.6 mm Cu 20%) RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C) CHARACTERISTIC Supply Voltage Output Current SYMBOL TEST CONDITION MIN TYP. MAX UNIT VCC ― ― ― 50 V Duty = 10% 8Circuits ― ― −260 Ta = 85°C Duty = 50% 8Circuits Tj = 120°C Tpw = 25ms Duty = 10% 8Circuits ― ― −59 ― ― −180 Duty = 50% 8Circuits ― ― −38 ― ― ― 12 ― ― ― 24 ― 2.0 5.0 15 ― 4.5 12.0 30 ― 0 ― 0.8 ― 0 ― 2.0 ― ― ― 50 ― ― ― 35 ― ― ― 400 ― ― 0.76 ― ― 0.48 IOUT AFW TD62783AP / AFW Input Voltage Input Voltage TD62784AP / AFW Output On Output Off TD62783AP / AFW TD62784AP / AFW TD62783AP / AFW TD62784AP / AFW Clamp Diode Reverse Voltage AP AFW Clamp Diode Forward Current Power Dissipation Note: VIN VIN (ON) VIN (OFF) VR IF AP AFW PD Ta = 85°C Ta = 85°C (Note) mA / ch V V V mA W On Glass Epoxy PCB (75 × 114 × 1.6 mm Cu 20%) 2 2001-07-05 TD62783,784AP/AFW ELECTRICAL CHARACTERISTICS (Ta = 25°C) CHARACTERISTIC Output Leakage Current Output Saturation Voltage SYMBOL TEST CIR− CUIT ICEX 1 VCE (sat) 2 TD62783AP / AFW Input Current IIN (ON) 3 TD62784AP / AFW TD62783AP / AFW Input Voltage TD62784AP / AFW TD62783AP / AFW TD62784AP / AFW VIN (ON) 4 TEST CONDITION MIN TYP. MAX UNIT VCC = VCC MAX. VIN = 0.4 V Ta = 25°C ― ― 100 µA VIN = VIN (ON), IOUT = −350 mA ― ― 2.0 VIN = VIN (ON), IOUT = −225 mA ― ― 1.9 VIN = VIN (ON), IOUT = −100 mA ― ― 1.8 VIN = 2.4 V ― 36 52 VIN = 3.85 V ― 180 260 VIN = 5 V ― 92 130 VIN = 12 V ― 790 1130 VCE = 2.0 V ― ― 2.0 IOUT = −350 mA ― ― 4.5 0.8 ― ― 2.0 ― ― IOUT = −500 µA VIN (OFF) V µA V ICC (ON) 3 VIN = VIN (ON), VCC = 50 V ― ― 2.5 mA / ch Clamp Diode Reverse Current IR 5 VR = 50 V ― ― 50 µA Clamp Diode Forward Voltage VF 6 IF = 350 mA ― ― 2.0 V Turn−On Delay tON 0.15 ― tOFF VCC = VCC MAX. RL = 125 Ω CL = 15 pF, RL = 88 Ω (F) ― Turn−Off Delay 7 ― 1.8 ― Supply Current 3 µs 2001-07-05 TD62783,784AP/AFW TEST CIRCUIT 1. ICEX 2. VCE (sat) 3. IIN (ON), ICC 4. VIN (ON), VIN (OFF) 5. IR 6. VF 7. tON, tOFF Note 1: Pulse width 50 µs, duty cycle 10% Output impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns Note 2: CL includes probe and jig capacitance PRECAUTIONS for USING This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. 4 2001-07-05 TD62783,784AP/AFW 5 2001-07-05 TD62783,784AP/AFW 6 2001-07-05 TD62783,784AP/AFW PACKAGE DIMENSIONS DIP18−P−300−2.54F Unit: mm Weight: 1.478 g (Typ.) 7 2001-07-05 TD62783,784AP/AFW PACKAGE DIMENSIONS SOL18−P−300−1.27 Unit: mm Weight: 0.48 g (Typ.) 8 2001-07-05 TD62783,784AP/AFW RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The products described in this document are subject to the foreign exchange and foreign trade laws. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 9 2001-07-05