TC7SP300WBG TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TC7SP300WBG Dual supply 2-Input NAND Gate with Level Translator The TC7SP300 is a dual supply, advanced high-speed CMOS 2-input dual supply voltage interface NAND gate fabricated with silicon gate CMOS technology. It is also designed with over voltage tolerant inputs and outputs up to 3.6 V. Designed for use as an interface between a 1.2-V, 1.5-V, 1.8-V, or 2.5-V bus and a 1.8-V, 2.5-V or 3.3-V bus in mixed 1.2-V, 1.5-V, 1.8-V or 2.5-V/1.8-V, 2.5-V or 3.3-V supply systems. All inputs are equipped with protection circuits against static discharge. S-WFBGA6-0102-0.40A01 Weight: 1 mg (typ.) Features • Level converter for interfacing 1.2-V to 1.8-V, 1.2-V to 2.5-V, 1.2-V to 3.3-V, 1.5-V to 2.5-V, 1.5-V to 3.3-V, 1.8-V to 2.5-V, 1.8-V to 3.3-V or 2.5 V to 3.3-V system. • High-speed operation : tpd = 6.8 ns (max) (VCCA = 2.5 ± 0.2 V, VCCB = 3.3 ± 0.3 V) tpd = 7.8 ns (max) (VCCA = 1.8 ± 0.15 V, VCCB = 3.3 ± 0.3 V) tpd = 9.0 ns (max) (VCCA = 1.5 ± 0.1 V, VCCB = 3.3 ± 0.3 V) tpd = 31 ns (max) (VCCA = 1.2 ± 0.1 V, VCCB = 3.3 ± 0.3 V) tpd = 9.5 ns (max) (VCCA = 1.8 ± 0.15 V, VCCB = 2.5 ± 0.2 V) tpd = 10.5 ns (max) (VCCA = 1.5 ± 0.1 V, VCCB = 2.5 ± 0.2 V) tpd = 32 ns (max) (VCCA = 1.2 ± 0.1 V, VCCB = 2.5 ± 0.2 V) tpd = 37 ns (max) (VCCA = 1.2 ± 0.1 V, VCCB = 1.8 ± 0.15 V) • Output current : IOH/IOL = ±12 mA (min) (VCCB = 3.0 V) IOH/IOL = ±9mA (min) (VCCB = 2.3 V) IOH/IOL = ±3 mA (min) (VCCB = 1.65 V) • Latch-up performance: -300 mA • ESD performance: Machine model ≥ ±200 V Human body model ≥ ±2000 V • Ultra-small package: WCSP6 • Power-down protection is provided on all inputs and outputs 1 2009-01-19 TC7SP300WBG Pin Assignment (top view) 1 VCCA 2 A VCCB GND B B A C Y ● G Truth Table Inputs Output A B Y L L H L H H H L H H H L Block Diagram - VCCA A B VCCB Logic level converter Y 2 2009-01-19 TC7SP300WBG Absolute Maximum Ratings (Note 1) Characteristics Power supply voltage (Note 2) DC input voltage (A, B) DC output voltage (Y) Symbol Rating VCCA −0.5 to 4.6 VCCB −0.5 to 4.6 VIN −0.5 to 4.6 VOUTB −0.5 to 4.6 IIK −25 Output diode current IOK ±50 IOUTB ±25 ICCA ±25 ICCB ±50 DC VCC / ground current per supply pin V V (Note 3) −0.5 to VCCB + 0.5 (Note 4) Input diode current DC output current Unit V mA (Note 5) mA mA mA Power dissipation PD 100 mW Storage temperature Tstg −65 to 150 °C Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even destruction. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 2: Don’t supply a voltage to VCCB pin when VCCA is in the OFF state. Note 3: Output in OFF state Note 4: High or Low state. IOUT absolute maximum rating must be observed. Note 5: VOUT < GND, VOUT > VCC Operating Ranges (Note 6) Characteristics Power supply voltage Input voltage (A, B) Output voltage (Y) Symbol Rating VCCA 1.1 to 2.7 VCCB 1.65 to 3.6 VIN 0 to 3.6 0 to 3.6 VOUTB Unit V V (Note 7) 0 to VCCB (Note 8) ±12 (Note 9) IOUTB ±9 (Note 10) ±3 (Note 11) Operating temperature Topr −40 to 85 Input rise and fall time dt/dv 0 to 10 Output current (Y) V mA °C (Note 12) ns/V Note 6: The operating ranges must be maintained to ensure the normal operation of the device. Unused inputs must be tied to either VCC or GND. Note 7: Output in OFF state Note 8: High or Low state Note 9: VCCB = 3.0 to 3.6 V Note 10: VCCB = 2.3 to 2.7 V Note 11: VCCB = 1.65 to 1.95 V Note 12: VIN = 0.8 to 2.0 V, VCCA = 2.5 V, VCCB = 3.0 V 3 2009-01-19 TC7SP300WBG Electrical Characteristics DC Characteristics (Ta = −40 to 85°C) Characteristics H-level Symbol Test Condition Hysteresis voltage H-level VOHB VIN = VIH or VIL Output voltage L-level VOLB VIN = VIH or VIL Max ⎯ 1.10 ⎯ 1.20 ⎯ 1.35 2.3 1.65 to 3.6 ⎯ 1.70 2.7 1.65 to 3.6 ⎯ 2.00 1.2 1.65 to 3.6 0.10 ⎯ 1.4 1.65 to 3.6 0.20 ⎯ 1.65 1.65 to 3.6 0.30 ⎯ 2.3 1.65 to 3.6 0.50 ⎯ 2.7 1.65 to 3.6 0.70 ⎯ 1.2 1.65 to 3.6 0.20 0.90 1.4 1.65 to 3.6 0.20 0.90 1.65 1.65 to 3.6 0.20 0.95 2.3 1.65 to 3.6 0.30 1.00 2.7 1.65 to 3.6 0.30 1.20 IOHB = −100 μA 1.1 to 2.7 1.65 to 3.6 VCCB − 0.2 ⎯ IOHB = −3 mA 1.1 to 2.7 1.65 1.25 ⎯ IOHB = −9 mA 1.1 to 2.7 2.3 1.7 ⎯ IOHB = −12 mA 1.1 to 2.7 3.0 2.2 ⎯ IOLB = 100 μA 1.1 to 2.7 1.65 to 3.6 ⎯ 0.2 IOLB = 3 mA 1.1 to 2.7 1.65 ⎯ 0.3 IOLB = 9 mA 1.1 to 2.7 2.3 ⎯ 0.6 IOLB = 12 mA 1.1 to 2.7 3.0 ⎯ 0.55 1.1 to 2.7 1.65 to 3.6 ⎯ ±1.0 μA 0 0 ⎯ 2.0 μA VIN = 0 to 3.6 V Input leakage current IIN Power-off leakage current IOFF VIN, VOUT = 0 to 3.6 V ICCA VIN = VCCA or GND 1.1 to 2.7 1.65 to 3.6 ⎯ 2.0 ICCB VIN = VCCA or GND 1.1 to 2.7 1.65 to 3.6 ⎯ 2.0 ICCA VCCA < VIN ≤ 3.6 V 1.1 to 2.7 1.65 to 3.6 ⎯ ±2.0 1.1 to 2.7 1.65 to 3.6 ⎯ ±2.0 Quiescent supply current ICCB Unit 1.65 to 3.6 ⎯ VH 1.65 to 3.6 Min 1.65 to 3.6 ⎯ VN 1.2 Ta = −40 to 85°C 1.4 Input voltage L-level VCCB (V) 1.65 ⎯ VP VCCA (V) VIN = VCCA VCCB ≤ Y ≤ 3.6 V 4 V V V V V μA 2009-01-19 TC7SP300WBG AC Characteristics (Ta = −40 to 85°C, Input: tr = tf = 2.0 ns) VCCA = 2.5 ± 0.2 V, VCCB= 3.3 ± 0.3 V Characteristics Propagation delay time Symbol tpLH tpHL Test Condition Figure 1, Figure 2 Min Max Unit 1.0 6.8 ns Min Max Unit 1.0 7.8 ns Min Max Unit 1.0 9.0 ns Min Max Unit 1.0 31 ns Min Max Unit 1.0 9.5 ns Min Max Unit 1.0 10.5 ns Min Max Unit 1.0 32 ns Min Max Unit 1.0 37 ns VCCA = 1.8 ± 0.15 V, VCCB = 3.3 ± 0.3 V Characteristics Propagation delay time Symbol tpLH tpHL Test Condition Figure 1, Figure 2 VCCA = 1.5 ± 0.1 V, VCCB = 3.3 ± 0.3 V Characteristics Propagation delay time Symbol tpLH tpHL Test Condition Figure 1, Figure 2 VCCA = 1.2 ± 0.1 V, VCCB = 3.3 ± 0.3 V Characteristics Propagation delay time Symbol tpLH tpHL Test Condition Figure 1, Figure 2 VCCA = 1.8 ± 0.15 V, VCCB = 2.5 ± 0.2 V Characteristics Propagation delay time Symbol tpLH tpHL Test Condition Figure 1, Figure 2 VCCA = 1.5 ± 0.1 V, VCCB = 2.5 ± 0.2 V Characteristics Propagation delay time Symbol tpLH tpHL Test Condition Figure 1, Figure 2 VCCA = 1.2 ± 0.1 V, VCCB = 2.5 ± 0.2 V Characteristics Propagation delay time Symbol tpLH tpHL Test Condition Figure 1, Figure 2 VCCA = 1.2 ± 0.1 V, VCCB = 1.8 ± 0.15 V Characteristics Propagation delay time Symbol tpLH tpHL Test Condition Figure 1, Figure 2 5 2009-01-19 TC7SP300WBG Capacitive Characteristics (Ta=25°C) Characteristics Test Circuit Symbol Input capacitance CIN Power dissipation capacitance (Note) Typ. Unit 3.3 5 pF VCCA (V) VCCB (V) A, B 2.5 CPDA fIN = 10 MHz 2.5 3.3 5 CPDB fIN = 10 MHz 2.5 3.3 10 pF Note: CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC (opr) = CPD･VCC･fIN + ICC / 2 (per bit) AC Test Circuit Output RL CL Measure VCC (output) Symbol 3.3 ± 0.3 V 2.5 ± 0.2 V 1.8 ± 0.15 V RL 500 Ω 1 kΩ CL 30 pF 30 pF Figure 1 AC Waveform tf 2.0 ns tr 2.0 ns VIH 90% VIM Input (A, B) 10% GND VOH Output (Y) VOM tpLH tpHL VOL Figure 2 tpLH, tpHL 6 2009-01-19 TC7SP300WBG Package Dimensions Unit: mm Weight: 1 mg (typ.) The resins used in this product include no flame retardants. 7 2009-01-19 TC7SP300WBG RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. 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