TB7001FL Preliminary TOSHIBA Multi Chip Module TB7001FL For high current and low voltage applications Synchronous buck converter module This product is a synchronous buck switching converter module. The additional components for DC-DC converter are a PWM control IC, an external inductor, and input and output capacitors. Features • 3 chips (high-side MOSFET, low-side MOSFET, MOSFET gate driver- IC) are in 1 package. • Maximum Input voltage is 19V, it is capable for note-PC applications. • Under voltage lockout and thermal shut down • Keeping off low-side MOSFET function. When load current is low, low-side MOSFET is able to been kept off. Consequently the efficiency increases at low load condition. • Internal control circuit disable function. The quiescent current is less than 10μA. • High operation frequency : fc = 1MHz (Max.) • High output current : IOUT = 20A (Max.) • High efficiency : η = 85% (＠VIN = 12 V、VOUT = 1.5 V、IOUT = 20A、fc = 1MHz) Maximum ratings (Ta = 25°C) Characteristics Symbol Ratings Unit VIN to PGND voltage VIN 30 V LX to PGND voltage VLX -2 ∼ 30 V VDD to SGND voltage VDD -0.3 ∼ 6 V VBST-LX -0.3 ∼ VDD +0.3 V VBST -0.3 ∼ 30 V VON/OFF -0.3 ∼ VDD +0.3 V VSD -0.3 ∼ VDD +0.3 V VDISBL -0.3 ∼ VDD +0.3 V IOUT 20 A PD TBD W Tch-opr −40 ~ 150 °C Tstg −55 ~ 150 °C BST to LX voltage BST to SGND voltage ON/OFF to SGND voltage SD to SGND voltage DISBL to SGND voltage Output RMS current Power dissipation Operating channel temperature Storage temperature 1 2004-12-24 TB7001FL Package outline 0.25mm min. 3.65mm 2.30mm 0.20mm 14 28 43 56 28 43 29 42 42 Top view 15 0.25mm min 3.65mm 2.30mm 56 8.00mm 15 29 14 1 1 0.25mm min. Side view 6.35mm 0.50mm 0.23mm 0.25mm min. 0.25mm min. 0.25mm min 0.85mm 8.00mm Bottom view Block diagram ∼19V HO VIN SD ON/OFF DISBL BST Driver IC 5V±0.5V Level shift 1.5V/20A SGND UVLO LX VDD LO Overlap protection + PGND PGND(IC) 2 2004-12-24 TB7001FL CGND SGND SD BST HO NC NC NC VIN VIN VIN VIN VIN VIN Terminal configurations ON/OFF DISBL VDD 2 3 4 5 6 7 8 9 10 11 12 13 14 15 55 54 53 16 CGND VIN 17 18 52 19 51 20 50 21 49 22 48 23 47 24 46 LX 25 45 26 44 27 28 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 VIN VIN VIN VIN VIN VIN LX PGND PGND PGND PGND PGND PGND PGND LX LX LX NC PGND PGND PGND PGND PGND PGND PGND PGND PGND PGND PGND(IC) LO CGND LX LX LX LX LX LX LX LX 1 56 Bottom view Terminal functions Name CGND No. 1,51,Tab Functions Notes Internal driver-IC chip bed Connect to the SGND Connect to the PGND SGND 2 Internal driver-IC signal ground SD 3 Shut down signal for the low-side MOSFET. When set to low, the low-side MOSFET is turned off. BST 4 Connect to the external boot strap capacitor HO 5 High-side MOSFET gate signal NC 6,7,8,39 No internal connection. Keep them open. VIN 9∼20,Tab Input voltage for the DC-DC converter LX 21,40∼50,Tab Switching node. Connect to the output inductor. PGND 22∼38 Power ground LO 52 Low-side MOSFT gate signal PGND(IC) 53 Internal driver-IC power ground VDD 54 Supply voltage for the internal driver-IC DISBL 55 Disable signal for the internal control circuit. When set to low, the Internal control circuit is disabled. The high-side MOSFET and low-side MOSFET are turned off. ON/OFF 56 Input signal 3 For monitoring For monitoring 2004-12-24 TB7001FL Recommended PCB footprint (unit：mm) 4 2004-12-24 TB7001FL Timing chart ON/OFF VDD Under voltage lockout stop threshold Under voltage lockout start threshold LX Under voltage lockout : When VDD is lower than Under voltage lockout start threshold, the operation is stopped. When VDD is higher than Under voltage lockout stop threshold, it return to the normal operation. (The hysteresis between lockout start and lockout stop is 0.7V.) 5 2004-12-24 TB7001FL Electrical specifications (VDD=5V , Ta=25℃ ℃ , unless otherwise noted.) Terminal Conditions Min. Typ. Max. Unit VIN(OPR) VIN − 7 − 19 V VDD(OPR) VDD − 4.5 5 5.5 V VDD quiescent current IDD(OFF) VDD VDISBL = 0 − − 15 μA ON/OFF input current H IINH(ON/OFF) ON/OFF VON/OFF = 5V − 0.25 0.4 mA ON/OFF input current L IINL(ON/OFF) ON/OFF VON/OFF = 0 − 0 − mA SD input current H IINH(SD) SD VSD = 5V − 0 − mA SD input current L IINL(SD) SD VSD = 0 -0.4 -0.25 − mA ON/OFF input rising threshold VH(ON/OFF) ON/OFF − 2.0 − − V ON/OFF input falling threshold VL(ON/OFF) ON/OFF − − − 0.8 V SD input rising threshold VH(SD) SD − 2.0 − − V SD input falling threshold VL(SD) SD − − − 0.8 V DISBL input rising threshold VH(DISBL) DISBL − 2.0 − − V DISBL input falling threshold VL(DISBL) DISBL − − − 0.8 V ILX = 10A − 5 mΩ mΩ Characteristics Operating (VIN) input Voltage Operating (VDD) input Voltage Output ON resistance Symbol RDS(ON)(L) LX-PGND RDS(ON)(H) VIN-LX ILX = -10A , VBST-LX = 5V − 10 ILEAK(H) VIN-LX VIN = 24V , LX = 0 − − 10 μA ILEAK(L) LX-PGND VLX = 24V , PGND = 0 − − 100 μA LX VBST-LX = 5V − 30 − ns LX ILX=-20A − 60 − ns PGND-LX IDR=10A − 0.6 0.7 V Output cut-OFF current Switching time Turn off Turn on toff ton Internal SBD foreword voltage VF Under voltage lock out start threshold VUVLO VDD − 2.6 2.8 3.1 V Under voltage lock out hysteresis Vhys-UVLO VDD − − 0.7 − V 90% ON/OFF 10% 90% LX 10% ton toff 6 2004-12-24