XC25BS6 Series Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit September 17, 2003 V1 Preliminary CMOS Low Power Consumption 2.3V (MIN.) 32.768kHz 2MHz ~ 36MHz (fundamental) Selectable from divisions of 1024, 512, 256, 128 3-State SOT-26 Low Operating Supply Voltage Output Frequency Oscillation Frequency Built-In Divider Circuit Output Ultra Small Package Chip Form APPLICATIONS z z z z z GENERAL DESCRIPTION Crystal Oscillation Modules Clocks for Micro-computers, DSPs, etc. Communication Equipment Various System Clocks Clock Time-Base FEATURES The XC25BS6 is a low operating voltage, low current consumption series of CMOS ICs with built-in crystal oscillator and divider circuits designed for clock generators. Oscillation capacitors Cg and Cd are externally set up. Output is selectable from any one of the following values for f0:f0/1024, f0/512, f0/256, and f0/128. With oscillation feedback resistors built-in, it is possible to configure a stable fundamental oscillator using about 10pF of external oscillation capacitor and an external crystal. The series has a stand-by function. The oscillation completely stops in the stand-by state and output will be one of high-impedance. Oscillation Frequency 2MHz ~ 36MHz (fundamental) - Oscillation feedback resistor built-in - External oscillation capacitor Divider Ratio f0/1024, f0/ 512, f0/256, f0/128 Output 3-State Operating Supply 2.3 ~ 4.0V Voltage Range Supply Current PIN CONFIGURATION 0.5µA (MAX.) when stand-by mode Chip Form Chip size 1.3 x 0.8mm Package SOT-26 mini mold PIN ASSIGNMENT /XT 1 6 XT VSS 2 5 VDD Q0 3 4 CE PIN NUMBER PIN NAME 1 / XT 2 3 4 5 VSS Q0 CE VDD 6 XT FUNCTIONS Crystal Oscillator Connection (Output) Ground Clock Output Stand-by Control * Power Supply Crystal Oscillator Connection (Input) * The stand-by control pin (pin #4) has a pull-down resistor built-in. PAD LAYOUT FOR CHIP FORM PAD LOCATIONS PIN NUMBER (1300,800) VSS (NC) /XT Q0 VDD VDD XT (0,0) VSS CE Chip Size : 1300 x 800µm Chip Thickness : 280±20µm Chip Back : VDD level Pad Aperture : 88 x 88 µm Note) There are two VSS pads and two VDD pads. Please connect both VSS pads to GND, and connect both VDD pads to a power supply. PIN NAME 1 / XT 2 3 4 5 6 7 VSS (NC) VSS Q0 VDD CE 8 XT 9 VDD Crystal Oscillator Connection (Output) Ground No Connection Ground Clock Output Power Supply Stand-by Control * Crystal Oscillator Connection (Input) Power Supply PAD DIMENSIONS X Y 128.0 610.0 328.0 741.0 952.0 1172.0 1172.0 1172.0 672.0 672.0 672.0 672.0 430.0 189.0 128.0 187.0 128.0 399.0 * The stand-by control pin (pin #4) has a pull-down resistor built-in. BLOCK DIAGRAM CE, Q0 PIN FUNCTION CE VDD /XT (Unit:µm) FUNCTIONS Counter Q0 Q0 'H' Clock Output 'L' or Open High Impedance CE XT VSS Semiconductor Ltd. Data Sheet 1 XC25BS6 Series Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit Preliminary ABSOLUTE MAXIMUM RATINGS Ta=25OC PARAMETER SYMBOL RATINGS UNITS Supply Voltage VDD VSS -0.3 ~ VSS +7.0 V CE Pin Voltage VCE VSS -0.3 ~ VDD +0.3 V Q0 Pin Voltage VQ0 VSS -0.3 ~ VDD +0.3 V Q0 Output Current IQ0 ± 50 mA mW Continuous Power Dissipation Pd 150 ** Operating Temperature Range Topr - 40 ~ + 85 Storage Temperature Range Tstg - 65 ~ + 150 (Chip Form) O C O C - 55 ~ + 125 (SOT-26) ** SOT-26 package, When implemented on a glass epoxy PCB. PRODUCT CLASSIFICATION Ordering Information XC25BS6 12345 DESIGNATOR DESCRIPTION Package: 128 = 128 divider 4 256 = 256 divider 512 = 512 divider 123 DESCRIPTION DESIGNATOR Divider Ratio: C : Chip Form W : Wafer Form M : SOT-26 A24 = 1024 divider Device Orientation: R : Embossed Tape : Standard Feed 5 L : Embossed Tape : Reverse Feed T : Chip Tray W : Wafer MARKING RULE 1 Represents XC25BS6 Series 6 5 4 1234 1 2 3 MARK Product Name B XC25BS6 2 Represents XC25BS6 Series MARK Product Name 6 XC25BS6 3 Represents divider ratio MARK Divider Ratio MARK 1 f0/128 2 Divider Ratio f0/256 5 f0/512 A f0/1024 4 Represents the assembly lot no. (Based on internal standards) PACKAGING INFORMATION SOT-26 Semiconductor Ltd. Data Sheet 2 XC25BS6 Series Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit Preliminary WIRE BONDING CONNECTION VSS VSS /XT Q0 (NC) VDD VDD XT CE * There are two VSS pads and VDD pads. Please connect both VSS pads to GND, and connect both VDD pads to a power supply. TYPICAL APPLICATION CIRCUIT Rq0 VDD fQ0 measurement Q0 /XT XT Cd Cg VSS CE 0.1uF * Please use oscillation capacitors Cg, Cd =10pF externally * The same power supply can be used for VDD and CE. NOTES ON USE (1) The oscillation circuit of this IC does not have internal oscillation capacitors. Please make the oscillation circuitry using an external crystal transducer and oscillation capacitors Cg and Cd. *) A higher harmonic wave oscillation may occur without Cg and Cd. *) Cg and Cd can be connected either to GND or VDD. (Cg and Cd in the above circuit example are connected to GND.) *) It is recommended to use around for 10pF of Cg and Cd. For trimmer capacitors, 10pF as a standard value is appropriate. *) The crystal oscillation frequency should be measured at the output of the Q0 pin. When a probe is directly connected to the XT pin or the /XT pin, oscillation frequency will change and a precise value can not be taken. (2) Please insert a by-pass capacitor of 0.1µF between VDD and GND. (3) The use of a matching resistor Rq0 of 50Ω connected in series to the Q0 pin is recommended in order to counter unwanted radiations. (4) Please place a by-pass capacitor and the matching resistor as close to the IC as possible. If the by-pass capacitor is placed away from the IC, it may cause abnormal oscillation. If the matching resistor is placed away from the IC, it may cause unwanted radiations in the pattern between the Q0 pin and the resistor. (5) When the CE pin is not controlled by external signals, please connect the CE pin to VDD power supply. *) When the CE pin is not connected, the IC goes into stand-by mode due to the internal pull-down resistor. (6) As for the supply voltage, it is recommended to apply a low noise power supply, such as a series regulator. Using a power supply like a switching regulator might lead to an unstable oscillation jitter which in turn may lead the oscillation frequency to fluctuate due to the ripple of the switching regulator. Semiconductor Ltd. Data Sheet 3 XC25BS6 Series Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit Preliminary DC ELECTRICAL CHARACTERISTICS 3.0V Operation (unless otherwise stated, VDD=3.0V, fOSC=16MHz, No load, Ta=25OC) XC25BS6xxxxx PARAMETER STANDARD VALUE FUNCTIONS SYMBOL UNIT MIN TYP MAX Operating Supply Voltage VDD (2.3) 3.0 4.0 V Crystal Oscillation Frequency fOSC Cf=Cd=10pF (External) 2 - 36 MHz H Level Output Voltage VOH VDD=2.7V, IOH= - 4mA 2.3 - - V L Level Output Voltage VOL VDD=2.7V, IOL=4mA - - 0.4 V fOSC=4MHz, XC25BS6128 - (0.4) (0.8) Supply Current 1 IDD1 Supply Current 2 IDD2 CE H Level Voltage VCEH CE L Level Voltage VCEL CE=3.0V fOSC=8MHz, XC25BS6256 - (0.5) (1.0) fOSC=16MHz, XC25BS6512 - (0.8) (1.6) fOSC=36MHz, XC25BS6A24 - (1.0) (1.8) - - 0.5 µA 2.4 - - V - 0.6 V 3.0 MΩ CE=0V mA CE Pull-Down Resistance 1 Rp1 CE=3.0V 0.5 1.6 CE Pull-Down Resistance 2 Rp2 CE=0.3V 22 55 90 KΩ Internal Oscillation Feedback Resistance Rf XT Pin, CE=/XT=3.0V 0.2 0.5 1.0 MΩ Output Disable Leakage Current IOZ Q0 Pin, VDD=4.0V, CE=0V - - 0.5 µA * External oscillation capacitor AC ELECTRICAL CHARACTERISTICS 3.0V Operation (unless otherwise stated, VDD=3.0V, fOSC=16MHz, CL=15pF, Ta=25OC) XC25BS6xxxxx PARAMETER STANDARD VALUE FUNCTIONS SYMBOL UNIT MIN TYP MAX Output Rise Time Tr VDD=3.0V (10% to 90%) *1 - 10 15 ns Output Fall Time Tf VDD=3.0V (10% to 90%) *1 - 10 15 ns Duty Cycle DUTY 45 50 55 % Output Start Time Ton - - 3.0 ms *1 *1 R&D guarantee AC ELECTRICAL CHARACTERISTICS MEASUREMENT WAVE FORMS (1) Output Rise Time , Output Fall Time 0.9VDD 0.9VDD 0.1VDD 0.1VDD tr tf (2) Duty Cycle DUTY Measurement Level 0.5VDD TW T DUTY = (TW/T) x 100 [%] Semiconductor Ltd. Data Sheet 4