FAIRCHILD FAN7361

FAN7361, FAN7362
High-Side Gate Driver
Features
Description
! Floating Channel Designed for Bootstrap
The FAN7361/FAN7362, a monolithic high-side gate
drive IC, can drive MOSFETs and IGBTs that operate up
to +600V. Fairchild’s high-voltage process and commonmode noise canceling techniques provide stable operation of the high-side driver under high dv/dt noise circumstances. An advanced level shift circuit offers high-side
gate driver operation up to VS=-9.8V(typ.) for VBS=15V.
!
!
!
!
!
!
Operation to +600V
Typically 250mA/500mA Sourcing/Sinking Current
Driving Capability
Common-Mode dv/dt Noise Canceling Circuit
VCC & VBS Supply Range from 10V to 20V
UVLO Function for VBS
Output In-phase with Input Signal
8-SOP
Applications
! PDP Scan Driver
! Motor Control
The UVLO circuit prevents malfunction when VBS is
lower than the specified threshold voltage. Output drivers
typically source/sink 250mA/500mA, respectively, which
is suitable for fluorescent lamp ballast, PDP scan driver,
motor control, and so on.
! SMPS
! Electronic Ballast
8-SOP
Ordering Information
Part Number
Package
Operating
Temperature Range
Eco Status
Packing Method
FAN7361M(1)
Tube
FAN7361MX(1)
Tape & Reel
FAN7362M(1)
8-SOP
-40°C ~ 125°C
(1)
FAN7362MX
RoHS
Tube
Tape & Reel
Note:
1. These devices passed wave soldering test by JESD22A-111.
For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
© 2005 Fairchild Semiconductor Corporation
FAN7361, FAN7362 Rev. 1.0.8
www.fairchildsemi.com
FAN7361, FAN7362 High-Side Gate Driver
November 2009
FAN7361, FAN7362 High-Side Gate Driver
Typical Application Circuit
15V
600V
RBOOT
DBOOT
1 NC
IN1
VB 8
IN
3
VCC
Q1
R1
HO 7
2
R2
CBOOT
VS 6
IN2
4 GND
NC 5
Q2
R3
Load
R4
FAN7361 Rev.04
Figure 1. Typical Application Circuit
Internal Block Diagram
VCC
3
8
VB
7
HO
6
VS
UVLO
GND
4
R
DRIVER
2
PULSE
GENERATOR
IN
NOISE
CANCELLER
R
S
Q
Pin 1 and 5 are not connection
FAN7361 Rev.04
Figure 2. Functional Block Diagram
© 2005 Fairchild Semiconductor Corporation
FAN7361, FAN7362 Rev. 1.0.8
www.fairchildsemi.com
2
FAN7361, FAN7362 High-Side Gate Driver
Pin Assignments
NC
1
IN
2
VCC
3
GND
4
FAN7361
FAN7362
8
VB
7
HO
6
VS
5
NC
FAN7361 Rev.04
Figure 3. Pin Configuration (Top View)
Pin Definitions
Pin
Name
Function/ Description
1
NC
No Connection
2
IN
Logic Input for High-Side Gate Driver Output
3
VCC
Supply Voltage
4
GND
Logic Ground
5
NC
No Connection
6
VS
High-Voltage Floating Supply Return
7
HO
High-Side Driver Output
8
VB
High-Side Floating Supply
© 2005 Fairchild Semiconductor Corporation
FAN7361, FAN7362 Rev. 1.0.8
www.fairchildsemi.com
3
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. TA=25°C, unless otherwise specified.
Symbol
Characteristics
Min.
Max.
VB-25
VB+0.3
High-Side Floating Supply Voltage
-0.3
625
VHO
High-Side Floating Output Voltage
VS-0.3
VB+0.3
VCC
Logic Fixed Supply Voltage
-0.3
25
VIN
Logic Input Voltage
-0.3
VCC+0.3
VS
High-Side Offset Voltage
VB
dVS/dt
PD(2)(3)(4)
Unit
V
Allowable Offset Voltage Slew Rate
± 50
V/ns
Power Dissipation
0.625
W
θJA
Thermal Resistance, Junction-to-Ambient
200
°C/W
TJ
Junction Temperature
+150
°C
TS
Storage Temperature
+150
°C
TA
Ambient Temperature
+125
°C
-40
Notes:
2. Mounted on 76.2 x 114.3 x 1.6mm PCB (FR-4 glass epoxy material).
3. Refer to the following standards:
JESD51-2: Integral circuits thermal test method environmental conditions - Natural convection
JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages
4. Do not exceed PD under any circumstances.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Min.
Max.
VB
High-Side Floating Supply Voltage
VS+10
VS+20
VS
High-Side Floating Supply Offset Voltage
6-VCC
600
VHO
High-Side Output Voltage
VIN
Logic Input Voltage
VCC
Logic Supply Voltage
© 2005 Fairchild Semiconductor Corporation
FAN7361, FAN7362 Rev. 1.0.8
VS
VB
GND
VCC
10
20
Unit
V
www.fairchildsemi.com
4
FAN7361, FAN7362 High-Side Gate Driver
Absolute Maximum Ratings
VBIAS(VCC, VBS)=15.0V, TA = 25°C, unless otherwise specified. The VIN and IIN parameters are referenced to GND.
The VO and IO parameters are referenced to VS and are applicable to the respective output HO.
Symbol
Characteristics
Test Condition
Min.
Typ. Max.
VBSUV+
VBS Supply Under-Voltage Positive Going
VBS=Sweep
Threshold
FAN7361
8.2
9.2
10.2
FAN7362
7.6
8.6
9.6
VBSUV-
VBS Supply Under-Voltage Negative
Going Threshold
VBS=Sweep
FAN7361
7.4
8.6
9.2
FAN7362
7.2
8.2
9.2
VBSHYS
VBS Supply Under-Current Lockout
Hysteresis
VBS=Sweep
ILK
Offset Supply Leakage Current
VB=VS=600V
FAN7361
0.5
FAN7362
0.4
Unit
V
10
IQBS
Quiescent VBS Supply Current
VIN=0V or 5V
50
80
IQCC
Quiescent VCC Supply Current
VIN=0V
30
75
IPBS
Operating VBS Supply Current
CL=1nF, f=10kHz
420
550
VIH
Logic "1" Input Voltage
FAN7361
3.6
FAN7362
2.9
FAN7361
1.0
FAN7362
0.8
VIL
Logic "0" Input Voltage
VOH
High Level Output Voltage, VB-VHO
No load
VOL
Low Level Output Voltage, VHO
No load
IIN+
Logic "1" Input Bias Current
VIN=5V
50
90
IIN-
Logic "0" Input Bias Current
VIN=0V
1.0
2.0
IO+
Output High Short Circuit Pulse Current
VHO=0V, VIN=5V, PW ≤ 10µs
200
250
IO-
Output Low Short Circuit Pulse Current
VHO=15V, VIN=0V,PW ≤ 10µs
400
500
VS
Allowable Negative VS Pin Voltage for IN
Signal Propagation to HO
µA
V
0.1
0.1
µA
mA
-9.8
-7.0
V
Typ.
Max.
Unit
VS=0V
120
200
VS=0V or 600V
Dynamic Electrical Characteristics
VBIAS(VCC, VBS)=15.0V, VS=GND, CL=1000pF and TA = 25°C, unless otherwise specified.
Symbol
ton
toff
Characteristics
Turn-on Propagation Delay
Turn-off Propagation Delay
(5)
Test Condition
Min.
90
180
tr
Turn-on Rise Time
70
160
tf
Turn-off Fall Time
30
100
ns
Note:
5. This parameter guaranteed by design.
© 2005 Fairchild Semiconductor Corporation
FAN7361, FAN7362 Rev. 1.0.8
www.fairchildsemi.com
5
FAN7361, FAN7362 High-Side Gate Driver
Electrical Characteristics
200
80
VCC=15V
150
50
IIN [μA]
-40°C
25°C
125°C
60
IQCC [μA]
-40°C
25°C
125°C
IN=COM=0V
70
100
40
30
50
20
10
0
0
0
5
10
15
20
0
25
2
4
6
PROPAGATION DELAY TIME [nsec]
10.5
VBSUVP1
VBSUVP2
VBSUVN1
VBSUVN2
VBS [V]
9.5
9.0
8.5
8.0
7.5
-20
0
20
40
60
10
12
14
Figure 5. Input Bias Current vs. Input Voltage
Figure 4. IQCC vs. Supply Voltage
10.0
8
VIN [V]
VCC [V]
80
100
120
200
TON
180
TOFF
160
140
120
100
80
60
40
20
0
0
20
AMBIENT TEMPERATURE [°C]
40
60
80
100
120
AMBIENT TEMPERATURE [°C]
Figure 6. VBS UVLO vs. Temp.
Figure 7. Turn On/Off Propagation Time vs. Temp.
90
OUTPUT CAPABILITY [mA]
TR
80
TF
tr/tf [nsec]
70
60
50
40
30
20
10
-20
0
20
40
60
80
100
IOH+
IOH-
500
400
300
200
-20
120
AMBIENT TEMPERATURE [°C]
0
20
40
60
80
100
120
AMBIENT TEMPERATURE [°C]
Figure 8. Rising/Falling Time vs. Temp.
Figure 9. Output Sinking/Sourcing Current vs. Temp.
© 2005 Fairchild Semiconductor Corporation
FAN7361, FAN7362 Rev. 1.0.8
600
www.fairchildsemi.com
6
FAN7361, FAN7362 High-Side Gate Driver
Typical Characteristics
5V
50%
IN
50%
VCC=15V
VB
10μF
0.1μF
0.1μF
10μF
HVIC
GND
IN
tr
15V
tf
ton
VS
toff
90%
CL
HO-V S
HO
10%
90%
10%
FAN7361 Rev.02
FAN7361 Rev.03
Figure 10. Switching Time Test Circuit
Figure 11. Input / Output Timing Diagram
© 2005 Fairchild Semiconductor Corporation
FAN7361, FAN7362 Rev. 1.0.8
www.fairchildsemi.com
7
FAN7361, FAN7362 High-Side Gate Driver
Switching Time Definition
5.00
4.80
A
0.65
3.81
8
5
6.20
5.80
PIN ONE
INDICATOR
B
1.75
4.00
3.80
1
5.60
4
1.27
(0.33)
0.25
M
1.27
C B A
LAND PATTERN RECOMMENDATION
0.25
0.10
SEE DETAIL A
1.75 MAX
0.25
0.19
C
0.10
0.51
0.33
0.50 x 45°
0.25
R0.10
C
OPTION A - BEVEL EDGE
GAGE PLANE
R0.10
0.36
OPTION B - NO BEVEL EDGE
NOTES: UNLESS OTHERWISE SPECIFIED
8°
0°
0.90
0.406
SEATING PLANE
(1.04)
DETAIL A
SCALE: 2:1
A) THIS PACKAGE CONFORMS TO JEDEC
MS-012, VARIATION AA, ISSUE C,
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) LANDPATTERN STANDARD: SOIC127P600X175-8M.
E) DRAWING FILENAME: M08AREV13
Figure 12. 8-Lead Small Outline Package (SOP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2005 Fairchild Semiconductor Corporation
FAN7361, FAN7362 Rev. 1.0.8
www.fairchildsemi.com
8
FAN7361, FAN7362 High-Side Gate Driver
Physical Dimensions
FAN7361, FAN7362 High-Side Gate Driver
© 2005 Fairchild Semiconductor Corporation
FAN7361, FAN7362 Rev. 1.0.8
www.fairchildsemi.com
9