TOSHIBA TA8462F

TA8462F/FG
TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT
SILICON MONOLITHIC
TA8462F/FG
FAN MOTOR DRIVER IC
The TA8462F/FG is a 2 phase half−wave hall motor driver IC.
This IC is best suited for the fan motor driving.
The output current of this IC is 1.5 A (peak) and all functions
needed for fan motor driving have been incorporated into a 1 chip,
enabling it to largely reduce peripheral parts and a space, thus
realizing down−sizing.
Further, the TA8462F/FG is provided with the FG output pin
(outputs pulses proportional to the motor speed) and the RD
output pin (outputs the motor ON / OFF statues).
FEATURES
z Built−in Automatic Self Rotation Recovery Circuit After
Release of Motor Locking.
Weight : 0.09 g (Typ.)
z Thermal Shutdown Circuit Incorporated.
z Operating Voltage: 4~15 V
z Recommended Operating Voltage: VCC = 5 V, 12 V
z No VCC−GND Reverse Connection Preventive Diode Required.
The TA8462FG:
The TA8462FG is a Pb-free product.
The following conditions apply to solderability:
*Solderability
1. Use of Sn-37Pb solder bath
*solder bath temperature = 230°C
*dipping time = 5 seconds
*number of times = once
*use of R-type flux
2. Use of Sn-3.0Ag-0.5Cu solder bath
*solder bath temperature = 245°C
*dipping time = 5 seconds
*the number of times = once
*use of R-type flux
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TA8462F/FG
BLOCK DIAGRAM
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PIN FUNCTION
PIN No.
SYMBOL
FUNCTIONAL DESCRIPTION
1
NC
Non connection
2
OUT A
Output terminal
3
GND
4
OUT B
5
FG
Rotation speed output terminal
6
RD
Rotation detect output terminal
7
VCC
Power voltage supply terminal
8
IN A
Hall input terminal
9
IN B
Hall input terminal
10
CSC
Lock protector time constant determined terminal
GND terminal
Output terminal
z FG and RD outputs
Both the FG and RD outputs are the open collector outputs.
The FG output is pulse proportional to the number of revolutions (the cycle is the same as OUT B) and the RD
output is at the GND level (actually, at Vsat (RD) level) when the motor is being driven and the RD output at the
potential level that is to be applied to the RD terminal as shown in Figure 2 is output when the motor is kept
restrained.
z Automatic self rotation recovery circuit
If the rotation of the fan motor is forced to stop by any physical power, the driving coil may be burnt as inducing
voltage caused when the motor is running disappears and large current flows to the driving coil.
Therefore, it becomes necessary to provide the fan motor with a circuit to prevent the driving coil from being
burned by detecting the forced stop of the motor rotation from the outside by some method and a circuit to
automatically rotate the motor when it is released from the restraint.
The TA8462F/FG is an IC that has cleared the above problems by the burning preventive automatic return
circuit.
This operation is shown in Figure 1.
The capacitor CSC connected to the CSC terminal is charged by the charging current ISL (6.3 µA Typ.) and its
potential rises as shown below :
V=
1
∫ I dt
CSC SL
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TA8462F/FG
Fig.1
Auto mAtic Self Rotation Recovery Circuit Operation
When the motor is rotating, it is charged and discharged repeatedly by trigger pulse but if the motor rotation is
physically restrained, CSC discharge by trigger pulse is stopped and the potential further increases. During this
period, current flows continuously to the motor. If VSC (OSC potential) reaches VSCU (3.5 V Typ.), discharge
starts slowly and at the same time, the output is turned OFF to cur off current flowing to the motor. When the
VSC potential reaches VSCL (1.5 V Typ.), the output is turned ON to allow current flow to the motor and torque
is generated.
As long as the motor rotation is kept restrained, this operation is repeated and the output is turned ON / OFF at
a ratio of nearly 1 : 5.
By this operation, the motor is heated and cooled and its temperature rise can be suppressed to a certain level.
If the motor is released from the above restraint, the motor is started to run again by the generated torque and
is continuously rotated by the generated trigger pulse.
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ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)
CHARACTERISTIC
SYMBOL
RATING
UNIT
VCER
35
V
Output Terminal Breakdown Voltage
Output Current (PEAK)
IO (PEAK)
1.5
(Note 1)
A
FG Output Current (PEAK)
IFG (PEAK)
10
(Note 1)
mA
RD Output Current (PEAK)
IRD (PEAK)
10
(Note 1)
mA
Hall Input Voltage
VHM
300 (Note 2)
mV
Power Dissipation
PD
735 (Note 3)
mW
Operating Temperature
Topr
−30~85
°C
Storage Temperature
Tstg
−55~150
°C
Note 1: t = 0.1 s
Note 2: Tj = −25~150°C
Note 3: This value is obtained by 50 × 50 × 1.6 mm PCB mounting occupied in excess of 30% of copper area.
ELECTRICAL CHARACTERISTICS
(Ta = 25°C, VCC = 12 V, RVCC = 200 Ω, CSC = 1.0 µF)
CHARACTERISTIC
SYMBOL
TEST
CIR−
CUIT
TEST CONDITION
MIN
TYP.
MAX
A: ON
―
8.7
13.0
B: ON
―
7.7
12.0
A: ON
―
28
35
B: ON
―
28
35
IO = 0.2 A, Tj = 25°C
―
0.8
1.0
IO = 1.0 A, Tj = 25°C
―
1.15
1.6
―
31
―
35
VCC = 5 V, RVCC = 0 Ω
Output open
Supply Current
ICC
―
VCC = 12 V
RVCC = 200 Ω
Output open
Output Saturation Voltage
VSAT
―
Output Terminal Clamp Voltage
VCER
―
Charge Current
Ic
―
CSC = GND
3.0
6.2
8.2
Discharge
Current
Id
―
CSC = 4 V
0.5
1.15
1.3
Output OFF
Voltage
VSCU
―
VCC = 5 V
―
3.5
―
Output ON
Voltage
VSCL
―
VCC = 5 V
―
1.5
―
Duty
DR
―
Id / Ic = tOFF / tON
3
5
8
ON Time
tON
―
―
―
0.35
―
OFF Time
tOFF
―
―
―
1.75
―
Automatic
Self
Rotation
Recovery
Circuit
UNIT
mA
V
V
µA
V
5
s
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TA8462F/FG
SYMBOL
TEST
CIR−
CUIT
Sensitivity
VHS
―
Hysteresis
VHH
―
Operating DC
Potential
CMR
CHARACTERISTIC
MIN
TYP.
MAX
10
―
―
―
―
2.5
―
―
―
0
~
3
V
VZ
―
―
5.4
6.0
6.3
V
FG Output Saturation Voltage
Vsat (FG)
―
IFG = 5 mA
―
0.2
0.4
V
RD Output Saturation Voltage
Vsat (RD)
―
IRD = 5 mA
―
0.2
0.4
V
Thermal Shutdown Operating
Temperature
TSD
―
Tj
150
―
―
°C
Hall Amp.
Supply Zener Voltage
TEST CONDITION
Include offset / hysteresis
UNIT
mV
APPLICATION CIRCUIT
z
12 V use
z 5 V use
TA8462F/FG
TA8462F/FG
Note 1: In order to prevent the mutual induction of a motor, connect a additional diode between each output to motor.
Note 2: Utmost care is necessary in the design of the output, VCC, VM, and GND lines since the IC may be destroyed
by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by
short-circuiting between contiguous pins.
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PACKAGE DIMENSIONS
SSOP10−P−225−1.00
Unit : mm
Weight : 0.09 g (Typ.)
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified
for explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for
explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case
of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location,
are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into
the design to prevent device malfunction or breakdown caused by the current resulting from the
inrush current at power ON or the negative current resulting from the back electromotive force at
power OFF. IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is
unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause
injury, smoke or ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
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Points to remember on handling of ICs
(1) Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal
shutdown circuits operate against the over temperature, clear the heat generation status
immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.
(2) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ)
at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown.
In addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(3) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s
power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the
device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid
this problem, take the effect of back-EMF into consideration in system design.
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