BOURNS CG0603MLD-12E

Features
■
■
■
■
■
0402 and 0603 package options
Rated for IEC 61000-4-2, level 4
Withstands multiple ESD strikes
Low capacitance and leakage currents for invisible load protection
Tape and reel packaging
Chip Guard® MLD Series Varistor ESD Clamp Protectors
Description
The Chip Guard® CG0402MLD and CG0603MLD Series has been specifically designed to protect sensitive electronic components from
electrostatic discharge damage. The MLD family has been designed to protect equipment to IEC61000-4-2, level 4 ESD specifications
targeted for high speed data applications. The Chip Guard® MLD Series has been manufactured to provide very low cpacitance with
excellent clamp qualities, making the family almost transparent under normal working conditions.
Electrical Characteristics @ 25 °C (unless otherwise noted)
Model
Continuous
Operating
Voltage
Breakdown
Voltage
Clamping
Voltage
Off-state
Current
Capacitance
VDC
(V)
VB @ 1 mA
(V)
VC @ 1 A 8/20 µs
(V)
IL
(µA)
COFF
(pF)
Max.
Typ.
Max.
Max.
Max.
CG0402MLD-12G
12
50 ~ 60
140
1
5
CG0603MLD-12E
12
50 ~ 60
140
1
5
Environmental Characteristics
Device Symbol
Operating Temperature..................................................................................-30 °C to +85 °C
Storage Temperature ....................................................................................-30 °C to +85 °C
Standard ..............................................................................................IEC 61000-4-2 Level 4
Surge Withstand Ratings
Parameter
V
How to Order
Peak Voltage
ESD Voltage Capability,
Contact Discharge
8 kV
ESD Voltage Capability,
Air Discharge
15 kV
Standard
Repetitions
(Min.)
100 at 8 kV
100 at 15 kV
CG 0603 MLD - 12 E
Chip Guard®
Product Designator
Package Option
0402 = 0402 Package
0603 = 0603 Package
Multilayer Series Designator
Operating Voltage
12 = 12 V
IEC61000-4-2 Level 4
Tape & Reel Packaging
E = 4,000 pcs. per reel (CG0603MLD Series)
G = 10,000 pcs. per reel (CG0402MLD Series)
Ni barrier terminations are standard on all
Chip Guard® part numbers.
Reliable Electronic Solutions
Asia-Pacific:
TEL +886-2 25624117 • FAX +886-2 25624116
Europe:
TEL +41-41 7685555 • FAX +41-41 7685510
North America:
TEL +1-909 781-5500 • FAX +1-909 781-5700
TEL +1-951 781-5500 • FAX +1-951 781-5700 (after 7/17/04)
www.bourns.com
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Chip Guard® MLD Series Varistor ESD Clamp Protectors
Recommended Pad Layout
Product Dimensions
A
A
W
B
L
DIMENSIONS =
B
C
MM
(INCHES)
D
Dimension
CG0402MLD
Series
CG0603MLD
Series
Dim.
CG0402MLD
Series
CG0603MLD
Series
L
1.00 ± 0.15
(0.04 ± 0.006)
1.60 ± 0.20
(0.064 ± 0.008)
A
0.51
(0.020)
0.76
(0.030)
W
0.50 ± 0.10
(0.02 ± 0.004)
0.80 ± 0.20
(0.032 ± 0.008)
B
0.61
(0.024)
1.02
(0.040)
A
0.50 ± 0.10
(0.02 ± 0.004)
0.80 ± 0.20
(0.032 ± 0.008)
C
0.51
(0.020)
0.50
(0.020)
B
0.25 ± 0.15
(0.010 ± 0.006)
0.30 ± 0.20
(0.012 ± 0.008)
D
1.70
(0.067)
2.54
(0.100)
Solder Reflow Recommendations
300
Preheat Stages 1-3
Soldering
Cooling
A
Stage 1 Preheat Ambient to Preheating 30 s to 60 s
Temperature
200
B
Stage 2 Preheat 140 °C to 160 °C
150
C
Stage 3 Preheat Preheat to 200 °C
20 s to 40 s
D
Main Heating
200
210
220
230
240
60
55
50
40
30
E
Cooling
200 °C to 100 °C
Temperature (°C)
250
100
50
0
110 sec. (min.)
30-70
sec.
120 sec. (min.)
°C
°C
°C
°C
°C
60 s to 120 s
s
s
s
s
s
to
to
to
to
to
70
65
60
50
40
s
s
s
s
s
1 °C/s to 4 °C/s
Time (seconds)
•
•
•
•
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under
30 watts is recommended.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Chip Guard® MLD Series Varistor ESD Clamp Protectors
Packaging Dimensions
13.0 ± 1.0
(0.52 ± 0.04)
8.00 ± 0.30
(0.32 ± 0.012)
4.00 ± 0.10
(0.16 ± 0.004)
C
1.50 ± 0.10
(0.06 ± 0.004)
62.0 ± 1.50
(2.48 ± 0.06)
2.0 ± 0.50
(0.08 ± 0.02)
L
13.0 ± 0.50
(0.52 ± 0.02)
TOP
TAPE
G
W
21.0 ± 0.80
(0.84 ± 0.032)
D
180.8 ± 2.0
(7.12 ± 0.08)
3.50 ± 0.05
(0.14 ± 0.002)
NOTES: TAPE MATERIAL IS PAPER.
0.60 ± 0.05
TAPE THICKNESS IS
(0.024 ± 0.002)
COVER TAPE ADHESION IS 40 ± 15 GRAMS.
9.0 ± 0.50
(0.36 ± 0.02)
Dimension
CG0402MLD
Series
CG0603MLD
Series
C
1.75 ± 0.05
(0.04 ± 0.002)
1.75 ± 0.10
(0.04 ± 0.004)
D
2.00 ± 0.02
(0.08 ± 0.0008)
2.00 ± 0.05
(0.08 ± 0.002)
L
1.12 ± 0.03
(0.045 ± 0.0012)
1.80 ± 0.20
(0.072 ± 0.008)
W
0.62 ± 0.03
(0.025 ± 0.0012)
0.90 ± 0.20
(0.036 ± 0.008)
G
2.0 ± 0.05
(0.08 ± 0.002)
REV. A 02/04
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
“Chip Guard” is a registered trademark of Bourns, Inc.
COPYRIGHT © 2004, BOURNS, INC. LITHO IN U.S.A. E 02/04/CG0401