DIODES PDS3200

SPICE MODEL: PDS3200
PDS3200
3A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER
PowerDI ä5
NEW PRODUCT
Features
·
·
·
·
·
·
·
Guard Ring Die Construction for
Transient Protection
PowerDIä5
Low Forward Voltage Drop
D
Very Low Leakage Current
b2
·
·
·
·
·
A2
L1
High Junction Temperature Capability
High Forward Surge Current Capability
E
E1
Lead Free Finish, RoHS Compliant (Note 1)
"Green" Molding Compound (No Br, Sb)
Mechanical Data
·
·
A
L1
LEFT PIN
RIGHT PIN
Case: PowerDIä5
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating
94V-0
e
BOTTOMSIDE
b1
HEAT SINK
A2
b1
Dim
Min
Max
A
1.05
1.15
A2
0.33
0.43
b1
0.80
0.99
b2
1.70
1.88
D
3.90
4.05
3.05 NOM
D2
6.40
E
Note: Pins Left & Right must
be electrically connected
at the printed circuit board.
D
D2
b2
5.30
E1
L
Terminals: Finish – Matte Tin annealed over
Copper leadframe. Solderable per MIL-STD-202,
Method 208 e3
W
E
L1
5.45
3.55 NOM
E2
E2
Moisture sensitivity: Level 1 per J-STD-020C
6.60
1.84 NOM
e
L
0.75
0.95
L1
0.50
0.65
W
1.20
1.50
e
b1
Polarity: See Diagram
All Dimensions in mm
b1
Marking: See Page 3
Weight: 0.096 grams (approx.)
Maximum Ratings
@ TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See also figure 5)
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
Operating and Storage Temperature Range
Thermal Characteristics
Symbol
Value
Unit
VRRM
VRWM
VR
200
V
VR(RMS)
141
V
IO
3
A
IFSM
180
A
Tj, TSTG
-65 to +150
°C
@ TA = 25°C unless otherwise specified
Symbol
Typ
Max
Unit
Thermal Resistance Junction to Soldering Point
Characteristic
RqJS
¾
2.0
°C/W
Thermal Resistance Junction to Ambient Air (Note 2)
RqJA
75
90
°C/W
Notes:
1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
DS30470 Rev. 12 - 2
PowerDI is a trademark of Diodes Incorporated.
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PDS3200
ã Diodes Incorporated
@ TA = 25°C unless otherwise specified
Symbol
Min
Typ
Max
Unit
V(BR)R
200
¾
¾
V
IR = 10mA
Forward Voltage
VF
¾
¾
¾
¾
0.75
0.59
0.82
0.66
0.78
0.64
0.88
0.71
V
IF = 3A, TS = 25°C
IF = 3A, TS = 125°C
IF = 6A, TS = 25°C
IF = 6A, TS = 125°C
Reverse Leakage Current (Note 3)
IR
¾
¾
1
0.8
10
4.5
mA
mA
Characteristic
Reverse Breakdown Voltage (Note 3)
Notes:
Test Condition
TS = 25°C, VR = 200V
TS = 125°C, VR = 200V
3. Short duration test pulse used to minimize self-heating effect.
IF, INSTANTANEOUS FORWARD CURRENT (mA)
1
100000
10000
Tj = +25°C
0.1
Tj = 150°C
1000
Tj = 125°C
100
0.01
Tj = 85°C
10
Tj = 25°C
1
0.001
Tj = -65°C
Tj = -65°C
0.1
0.01
0
100 200 300 400 500 600 700 800 900 1000 1100 1200 1300
0.0001
40
0
VF, INSTANTANEOUS FORWARD VOLTAGE (mV)
Fig. 1 Typical Forward Characteristics
120
80
160
200
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 2 Typical Reverse Characteristics
800
10
700
CT, TOTAL CAPACITANCE (pF)
IR, INSTANTANEOUS REVERSE CURRENT (mA)
NEW PRODUCT
Electrical Characteristics
Tj = +150°C
1
Tj = +125°C
0.1
Tj = +85°C
0.01
f = 1MHz
600
500
400
300
200
100
0.001
0
40
80
120
160
200
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 3 Typical Reverse Characteristics
DS30470 Rev. 12 - 2
PowerDI is a trademark of Diodes Incorporated.
0
0
5
10
15
20
25
30
35
40
VR, REVERSE VOLTAGE (V)
Fig. 4 Typical Total Capacitance
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PDS3200
10
Tj = 150°C
PF(AV), AVERAGE FORWARD
POWER DISSIPATION (W)
IF, DC FORWARD CURRENT (A)
Tj = 150°C
3.0
Note 4
2.25
Note 2
1.5
0.75
0
0
20
40
IPK
= 1 (DC)
IAV
8
6
4
2
0
80 100 120 140 160 180
60
0
6
3
9
IF(AV), AVERAGE FORWARD CURRENT (A)
Fig. 6 Forward Power Dissipation
TA, AMBIENT TEMPERATURE (°C)
Fig. 5 DC Forward Current Derating
200
TA, DERATED AMBIENT TEMPERATURE (°C)
NEW PRODUCT
3.75
180
Note 2
160
140
120
100
80
60
40
20
0
0
50
100
150
200
VR, DC REVERSE VOLTAGE (V)
Fig. 7 Operating Temperature Derating
Ordering Information
Notes:
2.
3.
4.
5.
(Note 5)
Device
Packaging
Shipping
PDS3200-13
PowerDIä5
5000/Tape & Reel
FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
Short duration test pulse used to minimize self-heating effect.
Polyimide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
S3200
YYWWK
S3200 = Product type marking code
= Manufacturers’ code marking
YYWW = Date code marking
YY = Last digit of year ex: 04 for 2004
WW = Week code 01 to 52
K = Factory Designator
DS30470 Rev. 12 - 2
PowerDI is a trademark of Diodes Incorporated.
3 of 3
www.diodes.com
PDS3200