NE5532, SA5532, SE5532, NE5532A, SE5532A Internally Compensated Dual Low Noise Operational Amplifier The 5532 is a dual high-performance low noise operational amplifier. Compared to most of the standard operational amplifiers, such as the 1458, it shows better noise performance, improved output drive capability and considerably higher small-signal and power bandwidths. This makes the device especially suitable for application in high-quality and professional audio equipment, instrumentation and control circuits, and telephone channel amplifiers. The op amp is internally compensated for gains equal to one. If very low noise is of prime importance, it is recommended that the 5532A version be used because it has guaranteed noise voltage specifications. Features • • • • • • • • • • http://onsemi.com SOIC−8 D SUFFIX CASE 751 8 1 PDIP−8 N SUFFIX CASE 626 8 1 SOIC−16 WB D SUFFIX CASE 751G 16 Small-Signal Bandwidth: 10 MHz Output Drive Capability: 600 W, 10 VRMS 1 Input Noise Voltage: 5.0 nVń ǸHz (Typical) PIN CONNECTIONS DC Voltage Gain: 50000 AC Voltage Gain: 2200 at 10 kHz Power Bandwidth: 140 kHz Slew Rate: 9.0 V/ms Large Supply Voltage Range: "3.0 to "20 V Compensated for Unity Gain Pb−Free Packages are Available N, D8 Packages 8 V+ OUTA 1 −INA 2 +INA 3 6 −INB V- 4 5 +INB A B 7 OUTB Top View D Package* −INA 1 16 NC +INA 2 15 NC NC 3 14 NC V− 4 13 OUTA NC 5 12 V+ NC 6 11 OUTB +INB 7 10 NC −INB 8 9 NC Top View *SOL and non-standard pinout. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 6 of this data sheet. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2006 March, 2006 − Rev. 1 1 Publication Order Number: NE5532/D NE5532, SA5532, SE5532, NE5532A, SE5532A + _ Figure 1. Equivalent Schematic (Each Amplifier) MAXIMUM RATINGS Symbol Value Unit Supply Voltage Rating VS "22 V Input Voltage VIN "VSUPPLY V Differential Input Voltage (Note 1) VDIFF "0.5 V Operating Temperature Range NE5532/A SA5532 SE5532/A Tamb Storage Temperature Tstg −65 to +150 °C Junction Temperature Tj 150 °C Maximum Power Dissipation, Tamb = 25°C (Still-Air) 8 D8 Package 8 N Package 16 D Packagee PD Thermal Resistance, Junction−to−Ambient 8 D8 Package 8 N Package 16 D Packagee RqJA Lead Soldering Temperature (10 sec max) Tsld 0 to 70 −40 to +85 −55 to +125 780 1200 1200 182 130 140 230 °C mW °C/W °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input voltage exceeds 0.6 V. Maximum current should be limited to "10 mA. http://onsemi.com 2 NE5532, SA5532, SE5532, NE5532A, SE5532A DC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = "15 V, unless otherwise noted.) (Notes 2, 3 and 4) SE5532/A NE5532/A, SA5532 Symbol Test Conditions Min Typ Max Min Typ Max Unit VOS − − 0.5 2.0 − 0.5 4.0 mV − Overtemperature − − 3.0 − − 5.0 mV DVOS/DT − − 5.0 − − 5.0 − mV/°C IOS − − − 100 − 10 150 nA − Overtemperature − − 200 − − 200 nA DIOS/DT − − 200 − − 200 − pA/°C IB − − 200 400 − 200 800 nA − Overtemperature − − 700 − − 1000 nA DIB/DT − − 5.0 − − 5.0 − nA/°C ICC − − 8.0 10.5 − 8.0 16 mA − Overtemperature − − 13 − − − VCM − "12 "13 − "12 "13 − V Common-Mode Rejection Ratio CMRR − 80 100 − 70 100 − dB Power Supply Rejection Ratio PSRR − − 10 50 − 10 100 mV/V Large-Signal Voltage Gain AVOL RL w 2.0 kW; VO = "10 V 50 100 − 25 100 − V/mV Overtemperature 25 − − 15 − − RL w 600 W; VO = "10 V 40 50 − 15 50 − Overtemperature 20 − − 10 − − RL w 600 W "12 "13 − "12 "13 − Overtemperature "10 "12 − "10 "12 − RL w 600 W; VS = "18 V "15 "16 − "15 "16 − Overtemperature "12 "14 − "12 "14 − RL w 2.0 kW "13 "13.5 − "13 "13.5 − Overtemperature "12 "12.5 − "10 "12.5 − Characteristic Offset Voltage Offset Current Input Current Supply Current Common-Mode Input Range Output Swing VOUT V Input Resistance RIN − 30 300 − 30 300 − kW Output Short Circuit Current ISC − 10 38 60 10 38 60 mA 2. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input voltage exceeds 0.6 V. Maximum current should be limited to "10 mA. 3. For operation at elevated temperature, derate packages based on the package thermal resistance. 4. Output may be shorted to ground at VS = "15 V, Tamb = 25°C. Temperature and/or supply voltages must be limited to ensure dissipation rating is not exceeded. http://onsemi.com 3 NE5532, SA5532, SE5532, NE5532A, SE5532A AC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = "15 V, unless otherwise noted.) NE/SE5532/A, SA5532 Characteristic Output Resistance Overshoot Symbol Test Conditions Min Typ Max Unit ROUT AV = 30 dB Closed-loop f = 10 kHz, RL = 600 W − 0.3 − W − Voltage-Follower % VIN = 100 mVP-P − 10 − CL = 100 pF; RL = 600 W Gain Gain Bandwidth Product Slew Rate Power Bandwidth AV f = 10 kHz − 2.2 − V/mV GBW CL = 100 pF; RL = 600 W − 10 − MHz SR − − 9.0 − V/ms − VOUT = "10 V − 140 − kHz VOUT = "14 V; RL = 600 W − 100 − VCC = "18 V ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = "15 V, unless otherwise noted.) NE/SE5532 Characteristic Input Noise Voltage Input Noise Current Channel Separation NE/SA/SE5532A Symbol Test Conditions Min VNOISE fO = 30 Hz − 8.0 − − 8.0 12 fO = 1.0 kHz − 5.0 − − 5.0 6.0 fO = 30 Hz − 2.7 − − 2.7 − fO = 1.0 kHz − 0.7 − − 0.7 − f = 1.0 kHz; RS = 5.0 kW − 110 − − 110 − INOISE − http://onsemi.com 4 Typ Max Min Typ Max Unit nV/√Hz pA/√Hz dB NE5532, SA5532, SE5532, NE5532A, SE5532A TYPICAL PERFORMANCE CHARACTERISTICS 60 120 TYPICAL VALUES GAIN (dB) GAIN (dB) 40 30 RF = 9 kW; RE = 1 kW 20 10 102 103 104 105 106 107 (V) Vo(p-p) 20 RF = 1 kW; RE = ∞ 0 0 VS = "15 V TYPICAL VALUES RF = 10 kW; RE = 100 W 40 80 -40 40 TYPICAL VALUES -20 103 104 10 105 106 107 0 102 108 103 104 f (Hz) f (Hz) Figure 2. Open-Loop Frequency Response Figure 3. Closed-Loop Frequency Response 80 106 107 Figure 4. Large−Signal Frequency Response 30 1,4 VS = "15 V TYPICAL VALUES VS = "15 V 60 105 f (Hz) 1,2 20 IO 40 (mA) II (mA) TYP 0,8 VIN (V) 10 20 0 -55 0,4 0 0 -25 0 25 50 75 100 +125 -55 -25 0 Tamb (oC) 25 75 100 +125 0 10 Figure 6. Input Bias Current 6 TYP 4 Figure 7. Input Common−Mode Voltage Range 10−2 IO = 0 10 TYP IP IN (nVń ǸHz) 1 2 10−1 10−2 0 0 10 20 10 102 103 104 Vp; −VN (V) f (Hz) Figure 8. Supply Current Figure 9. Input Noise Voltage Density http://onsemi.com 5 20 Vp; −VN (V) Tamb (oC) Figure 5. Output Short−Circuit Current (mA) 50 NE5532, SA5532, SE5532, NE5532A, SE5532A + V+ 5532 (1/2) RS 25 W − 5532 RF VOUT − + VIN 1 kW VI RE 100 pF 100 pF 800 W 600 W V− Closed-Loop Frequency Response Voltage-Follower Figure 10. Test Circuits MARKING DIAGRAMS 8 1 8 N5532 ALYWA G 1 8 N5532 ALYW G SOIC−8 D SUFFIX CASE 751 1 NE5532AN AWL YYWWG S5532 ALYWA G NE5532N AWL YYWWG SA5532N AWL YYWWG PDIP−8 N SUFFIX CASE 626 16 NE5532D AWLYYWWG 1 SOIC−16 WB D SUFFIX CASE 751G A WL, L YY, Y WW, W G or G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Packagee http://onsemi.com 6 SE5532N AWL YYWWG NE5532, SA5532, SE5532, NE5532A, SE5532A ORDERING INFORMATION Description Temperature Range Shipping† NE5532AD8 8−Pin Plastic Small Outline (SO−8) Packagee 0 to 70°C 98 Units / Rail NE5532AD8G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 0 to 70°C 98 Units / Rail NE5532AD8R2 8−Pin Plastic Small Outline (SO−8) Packagee 0 to 70°C 2500 / Tape & Reel NE5532AD8R2G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 0 to 70°C 2500 / Tape & Reel NE5532AN 8−Pin Plastic Dual In−Line Package (PDIP−8) 0 to 70°C 50 Units / Rail NE5532ANG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) 0 to 70°C 50 Units / Rail NE5532D 16−Pin Plastic Small Outline (SO−16 WB) Package 0 to 70°C 47 Units / Rail NE5532DG 16−Pin Plastic Small Outline (SO−16 WB) Package (Pb−Free) 0 to 70°C 47 Units / Rail NE5532DR2 16−Pin Plastic Small Outline (SO−16 WB) Package 0 to 70°C 1000 Tape & Reel NE5532DR2G 16−Pin Plastic Small Outline (SO−16 WB) Package (Pb−Free) 0 to 70°C 1000 Tape & Reel NE5532D8 8−Pin Plastic Small Outline (SO−8) Packagee 0 to 70°C 98 Units / Rail NE5532D8G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 0 to 70°C 98 Units / Rail NE5532D8R2 8−Pin Plastic Small Outline (SO−8) Packagee 0 to 70°C 2500 / Tape & Reel NE5532D8R2G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 0 to 70°C 2500 / Tape & Reel NE5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) 0 to 70°C 50 Units / Rail NE5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) 0 to 70°C 50 Units / Rail SA5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) −40 to +85°C 50 Units / Rail SA5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) −40 to +85°C 50 Units / Rail SE5532AD8 8−Pin Plastic Small Outline (SO−8) Packagee −55 to +125°C 98 Units / Rail SE5532AD8G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) −55 to +125°C 98 Units / Rail SE5532AD8R2 8−Pin Plastic Small Outline (SO−8) Packagee −55 to +125°C 2500 / Tape & Reel SE5532AD8R2G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) −55 to +125°C 2500 / Tape & Reel SE5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) −55 to +125°C 50 Units / Rail SE5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) −55 to +125°C 50 Units / Rail Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 7 NE5532, SA5532, SE5532, NE5532A, SE5532A PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AG −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 1 0.25 (0.010) M Y M 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− H 0.10 (0.004) D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0 _ 8 _ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 NE5532, SA5532, SE5532, NE5532A, SE5532A PACKAGE DIMENSIONS 8−Pin Plastic Dual In−Line Package (PDIP−8) N SUFFIX CASE 626−05 ISSUE L 8 5 −B− 1 4 F −A− NOTE 2 L C J −T− N SEATING PLANE D H M K G 0.13 (0.005) M T A M B M http://onsemi.com 9 NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. DIM A B C D F G H J K L M N MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC −−− 10_ 0.76 1.01 INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC −−− 10_ 0.030 0.040 NE5532, SA5532, SE5532, NE5532A, SE5532A PACKAGE DIMENSIONS SOIC−16 WB D SUFFIX CASE 751G−03 ISSUE C A D 9 h X 45_ H E 0.25 8X M B M 16 q 1 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS DIM MIN MAX A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 q 0_ 7_ 8 16X M 14X e T A S B S A1 L A 0.25 B B SEATING PLANE T C ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: [email protected] http://onsemi.com 10 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NE5532/D