ONSEMI NCP583XV28T2G

NCP583
Ultra−Low Iq 150 mA CMOS
LDO Regulator with Enable
The NCP583 series of low dropout regulators are designed for
portable battery powered applications which require precise output
voltage accuracy and low quiescent current. These devices feature an
enable function which lowers current consumption significantly and
are offered in two small packages; SC−82AB and the SOT−563.
A 1.0 mF ceramic capacitor is the recommended value to be used
with these devices on the output pin.
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MARKING
DIAGRAMS
Features
•
•
•
Ultra−Low Dropout Voltage of 250 mV at 150 mA
Excellent Line Regulation of 0.05%/V
Excellent Load Regulation of 20 mV
High Output Voltage Accuracy of "2%
Ultra−Low Iq Current of 1.0 mA
Very Low Shutdown Current of 0.1 mA
Wide Output Voltage Range of 1.5 V to 3.3 V
Low Temperature Drift Coefficient on the Output Voltage of
"100 ppm/°C
Fold Back Protection Circuit
Input Voltage up to 6.5 V
These are Pb−Free Devices
Typical Applications
SC−82AB
SQ SUFFIX
CASE 419C
4
M
•
•
•
•
•
•
•
•
1
1
SOT−563
XV SUFFIX
CASE 463A
6
xxx M G
G
xxx M G
G
1
1
xxx = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
• Portable Equipment
• Hand−Held Instrumentation
• Camcorders and Cameras
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
Vin
Vout
−
+
Vref
Current Limit
CE
GND
Figure 1. Simplified Block Diagram
© Semiconductor Components Industries, LLC, 2006
April, 2006 − Rev. 5
1
Publication Order Number:
NCP583/D
NCP583
PIN FUNCTION DESCRIPTION
SOT−563
Pin
SC−82AB
Pin
Symbol
1
4
Vin
2
2
GND
Power supply ground.
3
3
Vout
Regulated output voltage.
4
−
NC
No connect.
5
−
GND
6
1
CE
Description
Power supply input voltage.
Power supply ground.
Chip enable pin.
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage
Vin
6.5
V
Input Voltage (CE or CE Pin)
VCE
6.5
V
Output Voltage
Vout
−0.3 to Vin +0.3
V
Output Current
Iout
180
mA
Power Dissipation
SC−82AB
SOT−563
PD
Operating Junction Temperature Range
TJ
−40 to +85
°C
Tstg
+150
°C
mW
150
500
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (Vin = Vout + 1.0 V, TA = 25°C, unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
Input Voltage
Vin
1.7
−
6.0
V
Output Voltage (1.0 mA ≤ Iout ≤ 30 mA)
Vout
Vout X 0.980
−
Vout X 1.020
V
Line Regulation (Iout = 30 mA)
(Vout + 0.5 V v Vin v 6.0 V)
Regline
−
0.05
0.20
%/V
Load Regulation (1.0 mA ≤ Iout ≤ 100 mA)
Regload
−
20
40
mV
−
−
−
−
0.60
0.50
0.35
0.25
0.90
0.75
0.55
0.40
Dropout Voltage (Iout = 150 mA)
Vout = 1.5 V
Vout = 1.8 V
Vout = 2.5 V
2.8 V v Vout v 3.3 V
VDO
Quiescent Current (Iout = 0 mA)
Iq
−
1.0
1.5
mA
Output Current
Iout
150
−
−
mA
Shutdown Current (VCE = Gnd)
ISD
−
0.1
1.0
mA
Output Short Circuit Current (Vout = 0)
Ilim
−
40
−
mA
Vthenh
Vthenl
1.2
0
−
−
6.0
0.3
Enable Input Threshold Voltage
High
Low
V
V
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NCP583
TYPICAL CHARACTERISTICS
2.9
2.8
2.5
Vin = 3.1 V
OUTPUT VOLTAGE Vout (V)
OUTPUT VOLTAGE Vout (V)
3.0
2.0
3.3 V
3.5 V
1.5
1.0
0.5
Vout = 2.8 V
0
0
100
300
200
400
2.7
2.6
2.5
2.4
Iout = 1.0 mA
2.3
Iout = 30 mA
2.2
Iout = 50 mA
2.1
2.0
1.0
500
Vout = 2.8 V
2.0
OUTPUT CURRENT Iout (mA)
5.0
6.0
Figure 3. Output Voltage vs. Input Voltage
1.2
2.86
1.0
OUTPUT VOLTAGE, Vout (V)
QUIESCENT CURRENT, Iq (mA)
4.0
INPUT VOLTAGE Vin (V)
Figure 2. Output Voltage vs. Output Current
0.8
0.6
0.4
0.2
2.84
2.82
2.80
2.78
2.76
Vout = 2.8 V
0.0
0
1.0
2.0
4.0
3.0
5.0
Vout = 2.8 V
2.74
−40
6.0
−15
INPUT VOLTAGE Vin (V)
10
35
60
85
TEMPERATURE (°C)
Figure 5. Output Voltage vs. Temperature
Figure 4. Quiescent Current vs. Input Voltage
1.4
QUIESCENT CURRENT, Iq (mA)
1.4
QUIESCENT CURRENT, Iq (mA)
3.0
1.2
1.0
0.8
0.6
0.4
0.2
Vout = 1.5 V
0.0
−40
−15
10
35
60
1.2
1.0
0.8
0.6
0.4
0.2
Vout = 2.8 V
0.0
−40
85
TEMPERATURE (°C)
−15
10
35
60
TEMPERATURE (°C)
Figure 6. Quiescent Current vs. Temperature
Figure 7. Quiescent Current vs. Temperature
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3
85
NCP583
TYPICAL CHARACTERISTICS
0.40
Vout = 1.5 V
0.9
85°C
0.35
DROPOUT VOLTAGE, VDO (V)
DROPOUT VOLTAGE, VDO (V)
1.0
0.8
0.30
25°C
0.7
85°C
25°C
0.25
0.6
−40°C
0.5
0.20
0.4
0.15
0.3
−40°C
0.10
0.2
0.05
0.1
Vout = 1.8 V
0.0
0
25
50
75
100
0.00
0
150
125
25
OUTPUT CURRENT Iout (mA)
100
125
150
Figure 9. Dropout Voltage vs. Output Current
0.40
70
RIPPLE REJECTION, RR (dB)
0.35
0.30
0.25
85°C
25°C
0.20
0.15
−40°C
0.10
0.05
Vout = 2.8 V
25
50
75
100
125
Vout = 2.8 V
Vin = 3.8 V + 0.5 Vp−p
Cout = 0.1 mF
60
50
40
30
Iout = 1.0 mA
20
Iout = 30 mA
10
Iout = 50 mA
0
0.1
150
10
1
OUTPUT CURRENT Iout (mA)
FREQUENCY, f (kHz)
Figure 11. Ripple Rejection vs. Frequency
Figure 10. Dropout Voltage vs. Output Current
70
RIPPLE REJECTION, RR (dB)
DROPOUT VOLTAGE, VDO (V)
75
OUTPUT CURRENT Iout (mA)
Figure 8. Dropout Voltage vs. Output Current
0.00
0
50
Vout = 2.8 V
Vin = 3.8 V + 0.5 Vp−p
Cout = 1.0 mF
60
50
40
30
Iout = 1.0 mA
20
Iout = 30 mA
10
Iout = 50 mA
0
0.1
10
1
100
FREQUENCY, f (kHz)
Figure 12. Ripple Rejection vs. Frequency
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4
100
NCP583
TYPICAL CHARACTERISTICS
Cout = 0.1 mF
6
5
5.0
Input Voltage
4.5
4
4.0
3
3.5
2
Output Voltage
3.0
1
INPUT VOLTAGE, Vin (V)
OUTPUT VOLTAGE, Vout (V)
5.5
0
2.5
2.0
0
20
40
60
80
100
120
140
160
180
−1
200
TIME, T (ms)
Cout = 0.47 mF
6
5
5.0
Input Voltage
4.5
4
4.0
3
3.5
2
Output Voltage
3.0
1
INPUT VOLTAGE, Vin (V)
OUTPUT VOLTAGE, Vout (V)
5.5
0
2.5
2.0
0
20
40
60
80
100
120
140
160
180
−1
200
TIME, T (ms)
Cout = 1.0 mF
6
5
5.0
Input Voltage
4.5
4
4.0
3
3.5
2
Output Voltage
3.0
1
0
2.5
2.0
0
20
40
60
80
100
120
140
160
TIME, T (ms)
Figure 13. Input Transient Response
(Vout = 2.8 V, Iout = 30 mA, tr = tf = 5.0 ms, Cin = 0)
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5
180
−1
200
INPUT VOLTAGE, Vin (V)
OUTPUT VOLTAGE, Vout (V)
5.5
NCP583
TYPICAL CHARACTERISTICS
Cout = 1.0 mF
20
4.5
10
Output Current
4.0
0
3.5
−10
Output Voltage
3.0
2.5
OUTPUT CURRENT, Iout (mA)
OUTPUT VOLTAGE, Vout (V)
5.0
2.0
0
100
200
300
400
500
600
700
800
900
1000
TIME, T (ms)
Cout = 10 mF
20
4.5
10
Output Current
4.0
0
3.5
−10
Output Voltage
3.0
2.5
2.0
0
100
200
300
400
500
600
700
800
TIME, T (ms)
Figure 14. Load Transient Response
(Vout = 2.8 V, tr = tf = 5.0 ms, Vin = 3.8 V)
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6
900
1000
OUTPUT CURRENT, Iout (mA)
OUTPUT VOLTAGE, Vout (V)
5.0
NCP583
TYPICAL CHARACTERISTICS
Cout = 0.1 mF
150
4.5
100
Output Current
4.0
50
3.5
0
Output Voltage
3.0
2.5
OUTPUT CURRENT, Iout (mA)
OUTPUT VOLTAGE, Vout (V)
5.0
2.0
0
20
40
60
80
100
120
140
160
180
200
TIME, T (ms)
Cout = 0.47 mF
150
4.5
100
Output Current
4.0
50
3.5
0
Output Voltage
3.0
2.5
OUTPUT CURRENT, Iout (mA)
OUTPUT VOLTAGE, Vout (V)
5.0
2.0
0
20
40
60
80
100
120
140
160
180
200
TIME, T (ms)
Cout = 1.0 mF
150
4.5
100
Output Current
4.0
50
3.5
0
Output Voltage
3.0
2.5
2.0
0
20
40
60
80
100
120
140
160
TIME, T (ms)
Figure 15. Load Transient Response
(Vout = 2.8 V, tr = tf = 5.0 ms, Vin = 3.8 V)
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7
180
200
OUTPUT CURRENT, Iout (mA)
OUTPUT VOLTAGE, Vout (V)
5.0
NCP583
APPLICATION INFORMATION
Input Decoupling
Output Decoupling
A 1.0 mF ceramic capacitor is the recommended value to
be connected between Vin and GND. For PCB layout
considerations, the traces of Vin and GND should be
sufficiently wide in order to minimize noise and prevent
unstable operation.
It is recommended to use a 0.1 mF ceramic capacitor on
the Vout pin. For better performance, select a capacitor with
low Equivalent Series Resistance (ESR). For PCB layout
considerations, place the output capacitor close to the
output pin and keep the leads short as possible.
ORDERING INFORMATION
Device
Output Type / Features
Nominal
Output Voltage
Marking
Package
Shipping†
NCP583SQ15T1G
Active High w/Enable
1.5
A5
SC−82AB
(Pb−Free)
3000 Tape & Reel
NCP583SQ18T1G
Active High w/Enable
1.8
A8
SC−82AB
(Pb−Free)
3000 Tape & Reel
NCP583SQ25T1G
Active High w/Enable
2.5
B5
SC−82AB
(Pb−Free)
3000 Tape & Reel
NCP583SQ28T1G
Active High w/Enable
2.8
B8
SC−82AB
(Pb−Free)
3000 Tape & Reel
NCP583SQ30T1G
Active High w/Enable
3.0
C0
SC−82AB
(Pb−Free)
3000 Tape & Reel
NCP583SQ33T1G
Active High w/Enable
3.3
C3
SC−82AB
(Pb−Free)
3000 Tape & Reel
NCP583XV15T2G
Active High w/Enable
1.5
G15B
SOT−563
(Pb−Free)
4000 Tape & Reel
NCP583XV18T2G
Active High w/Enable
1.8
G18B
SOT−563
(Pb−Free)
4000 Tape & Reel
NCP583XV25T2G
Active High w/Enable
2.5
G25B
SOT−563
(Pb−Free)
4000 Tape & Reel
NCP583XV28T2G
Active High w/Enable
2.8
G28B
SOT−563
(Pb−Free)
4000 Tape & Reel
NCP583XV29T2G
Active High w/Enable
2.9
G29B
SOT−563
(Pb−Free)
4000 Tape & Reel
NCP583XV30T2G
Active High w/Enable
3.0
G30B
SOT−563
(Pb−Free)
4000 Tape & Reel
NCP583XV33T2G
Active High w/Enable
3.3
G33B
SOT−563
(Pb−Free)
4000 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Other voltages are available. Consult your ON Semiconductor representative.
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8
NCP583
PACKAGE DIMENSIONS
SOT−563
XV SUFFIX
CASE 463A−01
ISSUE F
D
−X−
6
5
1
2
A
L
4
E
−Y−
3
b
e
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
DIM
A
b
C
D
E
e
L
HE
HE
C
5 PL
6
0.08 (0.003)
M
X Y
MILLIMETERS
MIN
NOM MAX
0.50
0.55
0.60
0.17
0.22
0.27
0.08
0.12
0.18
1.50
1.60
1.70
1.10
1.20
1.30
0.5 BSC
0.10
0.20
0.30
1.50
1.60
1.70
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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9
INCHES
NOM MAX
0.021 0.023
0.009 0.011
0.005 0.007
0.062 0.066
0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN
0.020
0.007
0.003
0.059
0.043
NCP583
PACKAGE DIMENSIONS
SC−82AB
SQ SUFFIX
CASE 419C−02
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. 419C−01 OBSOLETE. NEW STANDARD IS
419C−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
A
G
C
D 3 PL
N
DIM
A
B
C
D
F
G
H
J
K
L
N
S
3
4
K
B
S
1
2
F
L
H
J
0.05 (0.002)
MILLIMETERS
MIN
MAX
1.8
2.2
1.15
1.35
0.8
1.1
0.2
0.4
0.3
0.5
1.1
1.5
0.0
0.1
0.10
0.26
0.1
−−−
0.05 BSC
0.2 REF
1.8
2.4
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.008
0.016
0.012
0.020
0.043
0.059
0.000
0.004
0.004
0.010
0.004
−−−
0.002 BSC
0.008 REF
0.07
0.09
SOLDERING FOOTPRINT*
1.30
0.512
0.65
0.026
1.90
0.95 0.075
0.037
0.90
0.035
0.70
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
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personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
Literature Distribution Center for ON Semiconductor
USA/Canada
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Phone: 81−3−5773−3850
Email: [email protected]
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ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
NCP583/D