AP2280 SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH Description Features • • • • • • • • • • Wide input voltage range: 1.5V – 6V Low RDS(ON): 80mΩ typical @ 5V Turn-on slew rate controlled AP2280-1: 100us turn-on rise time AP2280-2: 1ms turn-on rise time Very low turn-on quiescent current: << 1uA Fast load discharge pin Temperature range -40ºC to 85°C Green Package: SOT25 SOT25: Available in “Green” Molding Compound (No Br, Sb) (Note 1) The AP2280 slew rate controlled load switch is a single P-channel MOSFET power switch designed for high-side load-switching or power distribution applications. The MOSFET has a typical RDS(ON) of 80mΩ at 5V, allowing increased load current handling capability with a low forward voltage drop. The turn-on slew rate of the device is controlled internally to reduce turn-on inrush current. The AP2280 load switch is designed to operate from 1.5V to 6.0V, making it ideal for 1.8V, 2.5V, 3.3V, and 5V systems. The typical quiescent supply current is only 0.004uA, making it ideal for battery powered distribution systems where power consumption is a concern. Applications • • • • • • • Smart Phones Personal Digital Assistant (PDA) Cell Phones GPS Navigators Bluetooth Headsets PMP/MP4 Notebook and Pocket PC Ordering Information AP2280 - X X X X Note: Note: Turn-on rise time Package Lead Free 1 : 100us 2 : 1ms W : SOT25 G : Green Packing -7 : Taping & Reel 1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7. Device Package Code AP2280-1W AP2280-2W W W Packaging (Note 2) SOT25 SOT25 7” Tape and Reel Quantity Part Number Suffix 3000/Tape & Reel -7 3000/Tape & Reel -7 2. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. AP2280 Rev. 2 1 of 9 www.diodes.com OCTOBER 2007 © Diodes Incorporated AP2280 SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH Pin Assignments ( Top View ) DIS 1 5 EN GND 2 OUT 3 4 IN SOT25 Pin Description Pin Name Pin Number Description SOT25 DIS 1 Discharge pin. If DIS pin is tied to OUT pin externally, the output voltage will be discharged to ground when disabled. GND 2 Ground. OUT 3 Voltage output pin. This is the pin to the P-channel MOSFET drain. Bypass to ground through a 0.1uF capacitor. IN 4 Voltage input pin. This is the pin to the P-channel MOSFET source. Bypass to ground through a 1µF capacitor. EN 5 Enable input, active high. AP2280 Rev. 2 2 of 9 www.diodes.com OCTOBER 2007 © Diodes Incorporated AP2280 SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH Block Diagram Typical Application Circuits V IN V OUT IN V IN V OUT IN O UT OUT D IS 1uF Enable D IS 0.1uF 1uF EN G ND Enable 0.1uF EN G ND For applications without output discharge For applications with output discharge Absolute Maximum Ratings Symbol ESD HBM Parameter Human Body Model ESD Protection ESD MM VIN Ratings 4 Units KV Machine Model ESD Protection 400 V Input Voltage 6.5 VOUT Output Voltage VIN + 0.3 V V VEN Enable Voltage 6.5 V Iload Maximum Continuous Load Current 2 A 125 °C -65 ~ 150 °C 750 mW TJ(max) Maximum Junction Temperature TST Storage Temperature Range PD Power Dissipation (Note 3,5) SOT25 Note: 3. Ratings apply to ambient temperature at 25°C. AP2280 Rev. 2 3 of 9 www.diodes.com OCTOBER 2007 © Diodes Incorporated AP2280 SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH Recommended Operating Conditions Symbol VIN IOUT TA Note: Parameter Input voltage Output Current (Note 4) Operating Ambient Temperature Min 1.5 0 -40 Max 6.0 2.0 85 Units V A °C 4. Maximum output current depends on application conditions. Please refer to the application note section. Electrical Characteristics o (TA = 25 C, VIN = VEN = 5.0V, unless otherwise stated) Symbol Parameters Input Quiescent Current IQ Input Shutdown Current ISHDN Input Leakage Current ILEAK RDS(ON) Switch on-resistance VIL EN Input Logic Low Voltage VIH EN Input Logic High Voltage ISINK TD(ON) TON TD(OFF) RDISCH θJA θJC Note: EN Input leakage Output turn-on delay time Output turn-on rise time Output turn-off delay time Discharge FET on-resistance Thermal Resistance Junction-to-Ambient Thermal Resistance Junction-to-Case Test Conditions VEN = VIN, IOUT = 0 VEN = 0V, OUT open VEN = 0V, OUT grounded VIN = 5.0V VIN = 3.3V VIN = 1.8V VIN = 1.5V VIN = 1.5V to 6V VIN > 2.7V VIN = 1.5V to 2.7V VEN = 5V Rload=10Ω AP2280-1, Rload = 10Ω AP2280-2, Rload = 10Ω Rload = 10Ω VEN = GND SOT25 (Note 5) SOT25 (Note 5) Min ⎯ ⎯ ⎯ 2.0 1.4 ⎯ Typ. Max 0.004 1 0.004 1 0.01 1 80 92 150 200 0.4 Unit μA μA μA mΩ mΩ mΩ mΩ V V V 1 μA 1 μS 100 150 μS 1000 1500 μS 0.4 1 μS 20 40 Ω o 160 C/W o 38 C/W 5. Test condition for SOT25: Device mounted on FR-4 substrate PC board, with minimum recommended pad layout. AP2280 Rev. 2 4 of 9 www.diodes.com OCTOBER 2007 © Diodes Incorporated AP2280 SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH Typical Performance Characteristics Quiescent Current vs. Input Voltage Quiescent Current vs. Temperature 0.020 Quiescent Current (μA) Quiescent Current (μA) 0.01 0.008 0.006 0.004 0.002 0 VIN=3.3V 0.015 VIN=5.0V 0.010 0.005 0.000 1.0 2.0 3.0 4.0 5.0 6.0 -40 -20 0 20 40 60 Input Voltage (V) Temperature (°C) RDS(ON) vs. Input Voltage RDS(ON) vs. Temperature 80 I=100mA 180.00 I=500mA 250.00 160.00 RDS(ON) (mΩ) I=1A I=2A 200.00 150.00 140.00 120.00 100.00 80.00 60.00 VIN =1.8V 40.00 100.00 VIN =3.3V 20.00 VIN =5V 0.00 50.00 1.5 2 2.5 3 3.5 4 4.5 5 5.5 -50 6 -25 0 25 50 75 100 Temperature (°C) Input Voltage (V) Input Shutdown Current vs. Temperature ENABLE Threshold vs. Input Voltage VIN=5V 0.010 1.8 1.6 0.008 1.4 ISHDN (μA) ON/OFF Threshold (V) 100 200.00 300.00 RDS(ON) (mΩ) VIN=1.8V 1.2 1 0.006 0.004 0.8 VIL (V) 0.6 0.002 VIH (V) 0.000 0.4 1.5 2 2.5 3 3.5 4 4.5 5 5.5 AP2280 Rev. 2 -40 -20 0 20 40 60 80 100 Temperature (°C) Input Voltage (V) 5 of 9 www.diodes.com OCTOBER 2007 © Diodes Incorporated AP2280 SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH Typical Performance Characteristics (Continued) AP2280-1 Turn-On AP2280-1 Turn-Off (VIN=3.3V, RL=7Ω) (VIN=3.3V, RL=7Ω) VEN (2V/div) VEN (2V/div) VOUT (2V/div) VOUT (2V/div) IIN (500mA/div) IIN (500mA/div) Time (50μs/div) Time (5μs/div) AP2280-1 Turn-On AP2280-1 Turn-Off (VIN=5V, RL=10Ω) (VIN=5V, RL=10Ω) VEN (2V/div) VEN (2V/div) VOUT (2V/div) VOUT (2V/div) IIN (500mA/div) IIN (500mA/div) Time (5μs/div) Time (50μs/div) AP2280 Rev. 2 6 of 9 www.diodes.com OCTOBER 2007 © Diodes Incorporated AP2280 SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH Typical Performance Characteristics (Continued) AP2280-2 Turn-On AP2280-2 Turn-Off (VIN=3.3V, RL=7Ω) (VIN=3.3V, RL=7Ω) VEN (2V/div) VEN (2V/div) VOUT (2V/div) VOUT (2V/div) IIN (500mA/div) IIN (500mA/div) Time (500μs/div) Time (5μs/div) AP2280-2 Turn-On AP2280-2 Turn-Off (VIN=5V, RL=10Ω) (VIN=5V, RL=10Ω) VEN (2V/div) VEN (2V/div) VOUT (2V/div) VOUT (2V/div) IIN (200mA/div) IIN (500mA/div) Time (500μs/div) AP2280 Rev. 2 Time (5μs/div) 7 of 9 www.diodes.com OCTOBER 2007 © Diodes Incorporated AP2280 SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH Application Note Input Capacitor A 1μF capacitor is recommended to connect between IN and GND pins to decouple input power supply glitch and noise. The input capacitor has no specific type or ESR (Equivalent Series Resistance) requirement. However, for higher current application, ceramic capacitors are recommended due to their capability to withstand input current surges from low impedance sources, such as batteries in portable applications. This input capacitor must be located as close as possible to the device to assure input stability and less noise. For PCB layout, a wide copper trace is required for both IN and GND. Output Capacitor A 0.1μF capacitor is recommended to connect between OUT and GND pins to stabilize and accommodate load transient condition. The output capacitor has no specific type or ESR requirement. The amount of the capacitance may be increased without limit. For PCB layout, the output capacitor must be placed as close as possible to OUT and GND pins, and keep the traces as short as possible. Enable/Shutdown Operation The AP2280 is turned on by setting the EN pin high and is turned off by pulling it low. To ensure proper operation, the signal source used to drive the EN pin must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section under VIL and VIH. Discharge Operation The AP2280 offers a discharge option that helps to discharge the output when disabled. To use this feature, the DIS pin is connected to the OUT pin AP2280 Rev. 2 externally. If this feature is not used, the DIS pin should be left open. Power Dissipation The device power dissipation and proper sizing of the thermal plane is critical to avoid thermal shutdown and ensure reliable operation. Power dissipation of the device depends on input voltage and load conditions and can be calculated by: PD = IOUT xR DSON 2 (1) However, the maximum power dissipation that can be handled by the device depends on the maximum junction to ambient thermal resistance, maximum ambient temperature, and maximum device junction temperature, which can be approximated by the equation below: PD (max@ TA ) = ( +125°C − TA ) (2) θ JA For example at VIN = 5V, the typical RDSON = 80mΩ. For IOUT = 2A, the maximum power dissipation calculated using equation (1) is PD = 0.32W. Based on θJA = 160°C/W and equation (2), the calculated junction temperature rise from ambient is approximately 51°C. Since the maximum junction temperature is 125°C, the operating ambient temperature must be kept below 74°C to safely operate the device. On the other hand, at TA = 85°C and VIN = 5V, the calculated maximum power dissipation from equation (2) is PDmax = 0.25W. Hence the safe operating maximum continuous current is 1.77A. For other application conditions, the users should recalculate the device maximum power dissipation based on the operating conditions. 8 of 9 www.diodes.com OCTOBER 2007 © Diodes Incorporated AP2280 SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH Marking Information ( Top View ) 4 7 5 XX Y M X 1 2 XX : UA : AP2280-1 UB : AP2280-2 Y : Year 0~9 M : Month A~L X : G : Green 3 SOT25 Package Information (All Dimensions in mm) IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated. AP2280 Rev. 2 9 of 9 www.diodes.com OCTOBER 2007 © Diodes Incorporated