BAQ333...BAQ335 Vishay Telefunken Silicon Planar Diodes Features D D D D Saving space Hermetic sealed parts Fits onto SOD 323 / SOT 23 footprints Electrical data identical with the devices BAQ33...BAQ35 / BAQ133...BAQ135 D Very low reverse current 96 12315 Applications Protection circuits, time delay circuits, peak follower circuits, logarithmic amplifiers Absolute Maximum Ratings Tj = 25_C Parameter Reverse voltage g Test Conditions Peak forward surge current Forward current Junction temperature Storage temperature range Type BAQ333 BAQ334 BAQ335 tp=1ms Symbol VR VR VR IFSM IF Tj Tstg Value 30 60 125 2 200 200 –65...+200 Unit V V V A mA °C °C Symbol RthJA Value 500 Unit K/W Maximum Thermal Resistance Tj = 25_C Parameter Junction ambient Test Conditions mounted on epoxy–glass hard tissue, Fig. 1 35mm copper clad, 0.9 mm2 copper area per electrode Document Number 85538 Rev. 2, 01-April-99 www.vishay.de • FaxBack +1-408-970-5600 1 (4) BAQ333...BAQ335 Vishay Telefunken Electrical Characteristics Tj = 25_C Parameter Forward voltage Reverse current Breakdown voltage g Test Conditions IF=100mA E 300lx, VR E 300lx, VR, Tj=125°C E 300lx, VR=15V E 300lx, VR=30V E 300lx, VR=60V IR=5mA, tp/T=0.01, tp=0.3ms Diode capacitance VR=0, f=1MHz x x x x x Type Symbol VF IR IR IR IR IR V(BR) V(BR) V(BR) CD BAQ333 BAQ334 BAQ335 BAQ333 BAQ334 BAQ335 Min Typ Max 1 3 0.5 1 1 1 1 0.5 0.5 0.5 40 70 140 3 Unit V nA mA nA nA nA V V V pF Characteristics (Tj = 25_C unless otherwise specified) 1000 IF – Forward Current ( mA ) I R – Reverse Current ( nA ) 10000 VR = VRRM 1000 Scattering Limit 100 10 Tj = 25°C 100 1 1 0.1 0 94 9079 Scattering Limit 10 40 80 120 160 200 Tj – Junction Temperature ( °C ) Figure 1. Reverse Current vs. Junction Temperature www.vishay.de • FaxBack +1-408-970-5600 2 (4) 0 94 9078 0.4 0.8 1.2 1.6 2.0 VF – Forward Voltage ( V ) Figure 2. Forward Current vs. Forward Voltage Document Number 85538 Rev. 2, 01-Apr-99 BAQ333...BAQ335 Vishay Telefunken 0.71 1.3 Reflow Soldering 1.27 95 10330 1.2 0.152 9.9 0.6 0.355 25 1.2 0.6 2.4 Figure 4. Recommended foot pads (in mm) 10 Wave Soldering 95 10331 2.5 1.4 95 10329 24 0.7 1.4 0.7 2.8 Figure 3. Board for RthJA definition (in mm) Figure 5. Recommended foot pads (in mm) Dimensions in mm 96 12072 Document Number 85538 Rev. 2, 01-April-99 www.vishay.de • FaxBack +1-408-970-5600 3 (4) BAQ333...BAQ335 Vishay Telefunken Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs ). The Montreal Protocol ( 1987 ) and its London Amendments ( 1990 ) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA ) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay-Telefunken products for any unintended or unauthorized application, the buyer shall indemnify Vishay-Telefunken against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423 www.vishay.de • FaxBack +1-408-970-5600 4 (4) Document Number 85538 Rev. 2, 01-Apr-99