ONSEMI BUB323Z

BUB323Z
NPN Silicon Power
Darlington
High Voltage Autoprotected
D2PAK for Surface Mount
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The BUB323Z is a planar, monolithic, high−voltage power
Darlington with a built−in active zener clamping circuit. This device is
specifically designed for unclamped, inductive applications such as
Electronic Ignition, Switching Regulators and Motor Control.
Features
• Integrated High−Voltage Active Clamp
• Tight Clamping Voltage Window (350 V to 450 V) Guaranteed
AUTOPROTECTED
DARLINGTON
10 AMPERES
360−450 VOLTS CLAMP
150 WATTS
Over the −40°C to +125°C Temperature Range
• Clamping Energy Capability 100% Tested in a Live
•
•
•
Ignition Circuit
High DC Current Gain/Low Saturation Voltages
Specified Over Full Temperature Range
Design Guarantees Operation in SOA at All Times
Pb−Free Packages are Available
360 V
CLAMP
MAXIMUM RATINGS
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Rating
MARKING
DIAGRAM
Symbol
Value
Unit
Collector−Emitter Sustaining Voltage
VCEO
350
Vdc
Collector−Emitter Voltage
VEBO
6.0
Vdc
Collector Current − Continuous
− Peak
IC
ICM
10
20
Adc
Base Current
IB
IBM
3.0
6.0
Adc
150
1.0
W
W/_C
TJ, Tstg
−65 to
+175
_C
Symbol
Max
Unit
Thermal Resistance, Junction−to−Case
RqJC
1.0
_C/W
Thermal Resistance, Junction−to−Ambient
RqJA
62.5
_C/W
ORDERING INFORMATION
TL
260
_C
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
− Continuous
− Peak
Total Power Dissipation
@ TC = 25_C
Derate above 25_C
Operating and Storage Junction
Temperature Range
PD
THERMAL CHARACTERISTICS
Characteristic
Maximum Lead Temperature
for Soldering Purposes,
1/8 in from Case for 5 Seconds
BUB323ZG
AYWW
D2PAK
CASE 418B
STYLE 1
BUB323Z
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 1
1
Publication Order Number:
BUB323Z/D
BUB323Z
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ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
VCLAMP
350
−
450
Vdc
Collector−Emitter Cutoff Current
(VCE = 200 V, IB = 0)
ICEO
−
−
100
mAdc
Emitter−Base Leakage Current
(VEB = 6.0 Vdc, IC = 0)
IEBO
−
−
50
mAdc
−
−
−
−
2.2
2.5
−
−
−
−
−
−
−
−
−
−
1.6
1.8
1.8
2.1
1.7
1.1
1.3
−
−
2.1
2.3
−
−
2.5
150
500
−
−
−
3400
fT
−
−
2.0
MHz
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Cob
−
−
200
pF
Input Capacitance
(VEB = 6.0 V)
Cib
−
−
550
pF
WCLAMP
200
−
−
mJ
tfi
−
625
−
ns
tsi
−
10
30
ms
tc
−
1.7
−
ms
OFF CHARACTERISTICS (Note 1)
Collector−Emitter Clamping Voltage (IC = 7.0 A)
(TC = − 40°C to +125°C)
ON CHARACTERISTICS (Note 1)
Base−Emitter Saturation Voltage
(IC = 8.0 Adc, IB = 100 mAdc)
(IC = 10 Adc, IB = 0.25 Adc)
VBE(sat)
Collector−Emitter Saturation Voltage
(IC = 7.0 Adc, IB = 70 mAdc)
VCE(sat)
(TC = 125°C)
(IC = 8.0 Adc, IB = 0.1 Adc)
(TC = 125°C)
(IC = 10 Adc, IB = 0.25 Adc)
Base−Emitter On Voltage
(IC = 5.0 Adc, VCE = 2.0 Vdc)
(IC = 8.0 Adc, VCE = 2.0 Vdc)
Vdc
Vdc
VBE(on)
(TC = − 40°C to +125°C)
Diode Forward Voltage Drop
(IF = 10 Adc)
VF
DC Current Gain
(IC = 6.5 Adc, VCE = 1.5 Vdc)
(IC = 5.0 Adc, VCE = 4.6 Vdc)
Vdc
hFE
(TC = − 40°C to +125°C)
Vdc
−
DYNAMIC CHARACTERISTICS
Current Gain Bandwidth
(IC = 0.2 Adc, VCE = 10 Vdc, f = 1.0 MHz)
CLAMPING ENERGY (See Notes)
Repetitive Non−Destructive Energy Dissipated at turn−off:
(IC = 7.0 A, L = 8.0 mH, RBE = 100 W) (see Figures 2 and 4)
SWITCHING CHARACTERISTICS: Inductive Load (L = 10 mH)
Fall Time
Storage Time
Cross−over Time
(IC = 6.5 A, IB1 = 45 mA,
VBE(off) = 0, RBE(off) = 0,
VCC = 14 V, VZ = 300 V)
1. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle = 2.0%.
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2
BUB323Z
IC
MERCURY CONTACTS
WETTED RELAY
INOM = 6.5 A
Output transistor turns on: IC = 40 mA
L INDUCTANCE
(8 mH)
VCE
MONITOR
(VGATE)
IC CURRENT
SOURCE
High Voltage Circuit turns on: IC = 20 mA
RBE = 100 W
Avalanche diode turns on: IC = 100 mA
250 V
IB CURRENT
SOURCE
300 V
Icer Leakage Current
340 V
VBEoff
IB2 SOURCE
VCE
VCLAMP NOMINAL
= 400 V
IC
MONITOR
0.1 W
NON
INDUCTIVE
Figure 1. IC = f(VCE) Curve Shape
Figure 2. Basic Energy Test Circuit
By design, the BU323Z has a built−in avalanche diode and
a special high voltage driving circuit. During an
auto−protect cycle, the transistor is turned on again as soon
as a voltage, determined by the zener threshold and the
network, is reached. This prevents the transistor from going
into a Reverse Bias Operating limit condition. Therefore, the
device will have an extended safe operating area and will
always appear to be in “FBSOA.” Because of the built−in
zener and associated network, the IC = f(VCE) curve exhibits
an unfamiliar shape compared to standard products as
shown in Figure 1.
The bias parameters, VCLAMP, IB1, VBE(off), IB2, IC, and
the inductance, are applied according to the Device Under
Test (DUT) specifications. VCE and IC are monitored by the
test system while making sure the load line remains within
the limits as described in Figure 4.
Note: All BU323Z ignition devices are 100% energy
tested, per the test circuit and criteria described in Figures 2
and 4, to the minimum guaranteed repetitive energy, as
specified in the device parameter section. The device can
sustain this energy on a repetitive basis without degrading
any of the specified electrical characteristics of the devices.
The units under test are kept functional during the complete
test sequence for the test conditions described:
IC(peak) = 7.0 A, ICH = 5.0 A, ICL = 100 mA, IB = 100 mA,
RBE = 100 W, Vgate = 280 V, L = 8.0 mH
10
IC, COLLECTOR CURRENT (AMPS)
300ms
1
1ms
TC = 25°C
10ms
250ms
0.1
0.01
0.001
10
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
CURVES APPLY BELOW
RATED VCEO
100
340V
VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS)
Figure 3. Forward Bias Safe Operating Area
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3
1000
BUB323Z
IC
The shaded area represents the amount of energy the device can sustain, under given DC biases (IC/IB/VBE(off)/
RBE), without an external clamp; see the test schematic diagram, Figure 2.
The transistor PASSES the Energy test if, for the inductive
load and ICPEAK/IB/VBE(off) biases, the VCE remains outside
the shaded area and greater than the VGATE minimum limit,
Figure 4a.
ICPEAK
IC HIGH
IC LOW
VCE
(a)
VGATE MIN
IC
ICPEAK
IC HIGH
IC LOW
VCE
(b)
VGATE MIN
IC
ICPEAK
IC HIGH
The transistor FAILS if the VCE is less than the VGATE
(minimum limit) at any point along the VCE/IC curve as
shown on Figures 4b, and 4c. This assures that hot spots and
uncontrolled avalanche are not being generated in the die,
and the transistor is not damaged, thus enabling the sustained
energy level required.
IC LOW
VCE
(c)
VGATE MIN
IC
ICPEAK
IC HIGH
The transistor FAILS if its Collector/Emitter breakdown
voltage is less than the VGATE value, Figure 4d.
IC LOW
VCE
(d)
VGATE MIN
Figure 4. Energy Test Criteria for BU323Z
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4
BUB323Z
10000
10000
hFE , DC CURRENT GAIN
hFE , DC CURRENT GAIN
TYPICAL
TJ = 125°C
1000
−40°C
25°C
100
1000
TYP − 6Σ
TYP + 6Σ
100
VCE = 5 V, TJ = 25°C
VCE = 1.5 V
10
100
1000
IC, COLLECTOR CURRENT (MILLIAMPS)
10
100
10000
5.0
4.5
TJ = 25°C
IC = 3 A
4.0
3.5
5A
3.0
8A
10 A
2.5
2.0
7A
1.5
1.0
0.5
0
1
10
IB, BASE CURRENT (MILLIAMPS)
100
2.4
VBE(on), BASE−EMITTER VOLTAGE (VOLTS)
VBE, BASE−EMITTER VOLTAGE (VOLTS)
IC/IB = 150
1.8
TJ = 25°C
1.4
125°C
1.0
0.8
0.1
1
IC, COLLECTOR CURRENT (AMPS)
TJ = 125°C
2.0
1.8
1.6
1.4
1.2
1.0
25°C
0.8
0.6
0.4
0.1
1
IC, COLLECTOR CURRENT (AMPS)
10
Figure 8. Collector−Emitter Saturation Voltage
2.0
1.2
IC/IB = 150
2.2
Figure 7. Collector Saturation Region
1.6
100000
Figure 6. DC Current Gain
VCE , COLLECTOR−EMITTER VOLTAGE (VOLTS)
VCE , COLLECTOR−EMITTER VOLTAGE (VOLTS)
Figure 5. DC Current Gain
1000
10000
IC, COLLECTOR CURRENT (MILLIAMPS)
10
2.0
1.8
VCE = 2 VOLTS
1.6
1.4
TJ = 25°C
1.2
1.0
125°C
0.8
0.6
0.1
Figure 9. Base−Emitter Saturation Voltage
1
IC, COLLECTOR CURRENT (AMPS)
Figure 10. Base−Emitter “ON” Voltages
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5
10
BUB323Z
ORDERING INFORMATION
Package
Shipping †
BUB323Z
D2PAK
50 Units / Rail
BUB323ZG
D2PAK
50 Units / Rail
Device
(Pb−Free)
BUB323ZT4
D2PAK
800 Units / Tape & Reel
BUB323ZT4G
D2PAK
800 Units / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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6
BUB323Z
PACKAGE DIMENSIONS
D2PAK
CASE 418B−04
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
C
E
V
W
−B−
4
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
V
A
1
2
S
3
−T−
SEATING
PLANE
K
W
J
G
D 3 PL
0.13 (0.005)
VARIABLE
CONFIGURATION
ZONE
H
M
T B
M
N
R
M
STYLE 1:
PIN 1.
2.
3.
4.
P
U
L
L
L
M
M
F
F
F
VIEW W−W
1
VIEW W−W
2
VIEW W−W
3
SOLDERING FOOTPRINT*
8.38
0.33
1.016
0.04
10.66
0.42
5.08
0.20
3.05
0.12
17.02
0.67
SCALE 3:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
INCHES
MIN
MAX
0.340 0.380
0.380 0.405
0.160 0.190
0.020 0.035
0.045 0.055
0.310 0.350
0.100 BSC
0.080 0.110
0.018 0.025
0.090 0.110
0.052 0.072
0.280 0.320
0.197 REF
0.079 REF
0.039 REF
0.575 0.625
0.045 0.055
BASE
COLLECTOR
EMITTER
COLLECTOR
MILLIMETERS
MIN
MAX
8.64
9.65
9.65 10.29
4.06
4.83
0.51
0.89
1.14
1.40
7.87
8.89
2.54 BSC
2.03
2.79
0.46
0.64
2.29
2.79
1.32
1.83
7.11
8.13
5.00 REF
2.00 REF
0.99 REF
14.60 15.88
1.14
1.40
BUB323Z
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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BUB323Z/D