NSDEMP11XV6T1, NSDEMP11XV6T5 Common Anode Quad Array Switching Diode These Common Anode Epitaxial Planar QUAD Diodes are designed for use in ultra high speed switching applications. The NSDEMP11XV6T1 device is housed in the SOT−563 package which is designed for low power surface mount applications, where board space is at a premium. http://onsemi.com (2) (3) (1) Features • Fast trr • Low CD • These are Pb−Free Devices (4) (5) (6) MAXIMUM RATINGS (TA = 25°C) Rating Reverse Voltage Peak Reverse Voltage Forward Current Peak Forward Current Peak Forward Surge Current Symbol Value Unit VR 80 Vdc VRM 80 Vdc IF 100 mAdc 1 IFM 300 mAdc IFSM (Note 1) 2.0 Adc Symbol Max Unit PD 357 (Note 2) 2.9 (Note 2) mW SOT−563 CASE 463A PLASTIC THERMAL CHARACTERISTICS Characteristic (One Junction Heated) Total Device Dissipation TA = 25°C MARKING DIAGRAM Derate above 25°C Thermal Resistance, Junction-to-Ambient RqJA 350 (Note 2) °C/W Characteristic (Both Junctions Heated) Symbol Max Unit PD 500 (Note 2) 4.0 (Note 2) mW Total Device Dissipation TA = 25°C Derate above 25°C Thermal Resistance, Junction-to-Ambient Junction and Storage Temperature RqJA TJ, Tstg May, 2006 − Rev. 3 P9 = Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) mW/°C 250 (Note 2) °C/W −55 to +150 °C ORDERING INFORMATION Device Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. t = 1 mS 2. FR−4 @ Minimum Pad © Semiconductor Components Industries, LLC, 2006 P9 M G G mW/°C 1 NSDEMP11XV6T1 Package Shipping † SOT−563* 4000/Tape & Reel NSDEMP11XV6T1G SOT−563* 4000/Tape & Reel NSDEMP11XV6T5 SOT−563* 8000/Tape & Reel NSDEMP11XV6T5G SOT−563* 8000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. Publication Order Number: NSDEMP11XV6T1/D NSDEMP11XV6T1, NSDEMP11XV6T5 ELECTRICAL CHARACTERISTICS (TA = 25°C) Characteristic Symbol Condition Min Max Unit Reverse Voltage Leakage Current IR VR = 70 V − 0.1 mAdc Forward Voltage VF IF = 100 mA − 1.2 Vdc Reverse Breakdown Voltage VR IR = 100 mA 0 − Vdc Diode Capacitance CD VR = 6.0 V, f = 1.0 MHz − 3.5 pF trr (Note 3) IF = 5.0 mA, VR = 6.0 V, RL = 100 W, Irr = 0.1 IR − 4.0 ns Reverse Recovery Time 3. trr Test Circuit for NSDEMP11XV6T1 in Figure 4. TYPICAL ELECTRICAL CHARACTERISTICS 10 IR , REVERSE CURRENT (μA) TA = 85°C 10 TA = −40°C 1.0 0.1 TA = 25°C 0.2 0.4 0.6 0.8 1.0 VF, FORWARD VOLTAGE (VOLTS) TA = 125°C 1.0 TA = 85°C 0.1 TA = 55°C 0.01 0.001 1.2 TA = 150°C TA = 25°C 0 10 Figure 1. Forward Voltage 50 20 30 40 VR, REVERSE VOLTAGE (VOLTS) Figure 2. Reverse Current 1.75 CD, DIODE CAPACITANCE (pF) IF, FORWARD CURRENT (mA) 100 1.5 1.25 1.0 0.75 0 2 4 6 8 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Diode Capacitance tr tp t IF trr t 10% A RL Irr = 0.1 IR 90% VR tp = 2 ms tr = 0.35 ns INPUT PULSE RECOVERY TIME EQUIVALENT TEST CIRCUIT Figure 4. Reverse Recovery Time Test Circuit for the NSDEMP11XV6T1 http://onsemi.com 2 IF = 5.0 mA VR = 6 V RL = 100 W OUTPUT PULSE NSDEMP11XV6T1, NSDEMP11XV6T5 PACKAGE DIMENSIONS SOT−563, 6 LEAD CASE 463A−01 ISSUE F D −X− 6 1 e NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 5 4 2 3 E −Y− HE b 65 PL 0.08 (0.003) DIM A b C D E e L HE C M X Y MILLIMETERS MIN NOM MAX 0.50 0.55 0.60 0.17 0.22 0.27 0.08 0.12 0.18 1.50 1.60 1.70 1.10 1.20 1.30 0.5 BSC 0.10 0.20 0.30 1.50 1.60 1.70 INCHES NOM MAX 0.021 0.023 0.009 0.011 0.005 0.007 0.062 0.066 0.047 0.051 0.02 BSC 0.004 0.008 0.012 0.059 0.062 0.066 MIN 0.020 0.007 0.003 0.059 0.043 SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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