ONSEMI CM1223-04MR

Industry First Low Capacitance ESD
Protection Arrays w/Backdrive Protection
CM1223
Features
•
•
•
•
•
•
•
•
•
•
•
•
Two, four, and eight channels of ESD protection with
integrated backdrive protection on all lines
Provides ESD protection to IEC61000-4-2 Level 4:
±8kV contact discharge
±15kV air discharge
Low channel input capacitance of 1.0pF (typical)
Minimal capacitance change with temperature and
voltage
Channel I/O to GND capacitance difference of 0.02pF
typical is ideal for differential signals
Mutual capacitance between signal pin and adjacent
signal pin at 0.11pF (typical)
Zener diode protects supply rail and eliminates the
need for external bypass capacitors
Pin compatible with CM1213-02, -04, and -08
Each I/O pin can withstand over 1000 ESD strikes*
Available in SOT, and MSOP packages
RoHS-compliant, lead-free packaging
Applications
•
•
•
•
•
•
•
USB2.0 ports at 480Mbps in desktop PCs, notebooks
and peripherals
IEEE1394 Firewire ports at 400Mbps / 800Mbps
DVI ports, HDMI ports in notebooks, set top boxes,
digital TVs, LCD displays
UDI and display ports
Serial ATA ports in desktop PCs and hard disk drives
PCI Express ports
General purpose high-speed data line ESD
protection
Product Description
The CM1223 family of diode arrays are designed to provide
ESD protection for electronic components or subsystems
requiring minimal capacitive loading. These devices are
ideal for protecting systems with high data and clock rates
or for circuits requiring low capacitive loading. Each ESD
channel consists of a pair of diodes in series, which steer
the positive or negative ESD current pulse to either the
positive (VP) or negative (VN) supply rail. A Zener diode is
embedded between VP and VN, to absorb positive ESD
strikes and provide ESD protection for the VP rail. An
additional diode is integrated to serve as backdrive current
protection. The CM1223 protects against ESD pulses up to
±8kV per the IEC 61000-4-2 standard. In addition, all pins
are protected from contact discharges of greater than
±15kV as outlined by the MIL-STD-883D (Method 3015)
specification for Human Body Model (HBM) ESD.
These devices are particularly well-suited for protecting
systems using high-speed ports such as USB2.0,
IEEE1394 (Firewire, iLink), serial ATA, DVI, HDMI and
corresponding ports in removable storage, digital
camcorders, DVD-RW drives, as well as other applications
where extremely low loading capacitance with ESD
protection are required in a small package footprint.
The CM1223 family of devices are manufactured with
RoHS-compliant, lead-free packaging.
Block Diagram
©2010 SCILLC. All rights reserved.
April 2010 – Rev.4
Publication Order Number:
CM1223/D
CM1223
Package/Pinout Diagrams
Rev. 4 | Page 2 of 19 | www.onsemi.com
CM1223
Pin Configuration
PIN DESCRIPTIONS
4-CHANNEL, 10-LEAD MSOP-10 PACKAGE
2-CHANNEL, 4-LEAD SOT143-4 PACKAGE
PIN
PIN
NAME
TYPE
1
CH1
I/O
2
NC
3
VP
PWR
I/O
PIN
NAME
TYPE
1
VN
GND
2
CH1
I/O
ESD Channel
3
CH2
I/O
ESD Channel
4
CH2
4
VP
PWR
Positive voltage supply rail
5
NC
6
CH3
7
NC
8
VN
GND
9
CH4
I/O
10
NC
Negative voltage supply rail
DESCRIPTION
ESD Channel
No connect
Positive voltage supply rail
ESD Channel
No connect
I/O
ESD Channel
2-CHANNEL, 5-LEAD SOT23-5 PACKAGE
PIN
NAME
TYPE
DESCRIPTION
1
NC
2
VN
GND
3
CH1
I/O
ESD Channel
4
CH2
I/O
ESD Channel
5
VP
PWR
No connect
Negative voltage supply rail
No connect
Negative voltage supply rail
4-CHANNEL, 6-LEAD SOT23-6 PACKAGE
NAME
TYPE
1
CH1
I/O
2
VN
GND
3
CH2
I/O
ESD Channel
4
CH3
I/O
ESD Channel
5
VP
PWR
6
CH4
I/O
DESCRIPTION
ESD Channel
Negative voltage supply rail
Positive voltage supply rail
ESD Channel
No connect
8-CHANNEL, 10-LEAD MSOP-10 PACKAGE
Positive voltage supply rail
PIN
ESD Channel
PIN
NAME
TYPE
1
CH1
I/O
ESD Channel
2
CH2
I/O
ESD Channel
3
CH3
I/O
ESD Channel
4
CH4
I/O
ESD Channel
5
VN
GND
6
CH5
I/O
ESD Channel
7
CH6
I/O
ESD Channel
8
VP
PWR
9
CH7
I/O
ESD Channel
10
CH8
I/O
ESD Channel
Rev. 4 | Page 3 of 19 | www.onsemi.com
DESCRIPTION
Negative voltage supply rail
Positive voltage supply rail
CM1223
Ordering Information
PART NUMBERING INFORMATION
# of Channels
Leads
Package
Ordering Part Number
Part Marking
2
5
SOT23-5
CM1223-02SO
D334
2
4
SOT143-4
CM1223-02SR
D337
4
6
SOT23-6
CM1223-04SO
D335
4
10
MSOP-10
CM1223-04MR
D338
8
10
MSOP-10
CM1223-08MR
D336
1
Note 1: Parts are shipped in Tape and Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
6.0
V
Operating Temperature Range
-40 to +85
°C
Storage Temperature Range
-65 to +150
°C
(VN - 0.5) to (VP + 0.5)
V
Operating Supply Voltage (VP - VN)
DC Voltage at any channel input
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
Package Power Rating
SOT143-4 Package (CM1223-02SR)
SOT23-5 Package (CM1223-02SO)
SOT23-6 Package (CM1223-04SO)
MSOP-10 Package (CM1223-04MR)
MSOP-10 Package (CM1223-08MR)
Rev. 4 | Page 4 of 19 | www.onsemi.com
RATING
UNITS
-40 to +85
°C
225
225
225
400
400
mW
mW
mW
mW
mW
CM1223
ELECTRICAL OPERATING CHARACTERISTICS
SYMBOL PARAMETER
CONDITIONS
(SEE NOTE 1)
MIN
TYP
MAX
UNITS
3.3
5.5
V
8.0
µA
VP
Operating Supply Voltage (VP-VN)
IP
Operating Supply Current
(VP-VN)=3.3V
Signal Clamp Voltage
Positive Transients
Negative Transients
IF = 8mA; TA=25°C
ILEAK
Channel Leakage Current
TA=25°C; VP=5V, VN=0V
±0.1
±1.0
µA
CIN
Channel Input Capacitance
At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V
1.0
1.5
pF
∆C
Channel Input Capacitance
Matching
At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V
0.02
pF
CMUTUAL
Mutual Capacitance between
signal pin and adjacent signal pin
At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V
0.11
pF
VESD
ESD Protection
Peak Discharge Voltage at any
channel input, in system
a) Contact discharge per
IEC 61000-4-2 standard
b) Human Body Model,
MIL-STD-883, Method
3015
VSCL
IN
VCL
RDYN
6.7
0.60
V
V
TA=25°C; Notes 3 and 4
±8
kV
TA=25°C; Notes 2 and 4
±15
kV
Channel Clamp Voltage
Positive Transients
Negative Transients
TA=25°C, IPP = 1A, tP = 8/20µS;
Note 4
Dynamic Resistance
Positive Transients
Negative Transients
TA=25°C, IPP = 1A, tP = 8/20µS
Any I/O pin to Ground; Note 4
Note 1:
Note 2:
Note 3:
Note 4:
8.2
0.80
+8.8
-1.4
V
V
0.7
0.4
Ω
Ω
All parameters specified at TA = -40°C to +85°C unless otherwise noted.
Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KΩ, VP = 3.3V, VN grounded.
Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded.
These measurements performed with no external capacitor on VP (VP floating).
Rev. 4 | Page 5 of 19 | www.onsemi.com
CM1223
Performance Information
Input Channel Capacitance Performance Curves
Rev. 4 | Page 6 of 19 | www.onsemi.com
CM1223
Performance Information (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Insertion Loss (S21) VS. Frequency (0V DC Bias, VP=3.3V, MSOP-8 Package)
Figure 2. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, VP=3.3V, MSOP-8 Package)
Rev. 4 | Page 7 of 19 | www.onsemi.com
CM1223
Performance Information (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 3. Insertion Loss (S21) VS. Frequency (0V DC Bias, VP=3.3V, MSOP-10 Package)
Figure 4. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, VP=3.3V)
Rev. 4 | Page 8 of 19 | www.onsemi.com
CM1223
Backdrive Protection
Backdrive protection is needed to block against backdrive current flowing from a high potential voltage node
toward a lower potential voltage node through the interface cable.
For example, consider a DVD player connected to a TV via an HDMI interface. If the DVD player is switched off
and the TV is left on, there is a possibility of reverse current flow back into the main power supply rail of the
DVD player. Typically, the DVD's power supply has some form of associated bulk supply capacitance, and it is
possible over time to charge that bulk supply capacitance to some intermediate level.
If that level rises above the power-on-reset (POR) voltage level of some of the integrated circuits, the DVD
player may not reset properly when the DVD player is turned back on. This is largely because all CMOS logic
exhibits a very high impedance on the power rail node even when "off".
To avoid this situation, the CM1223 with integrated backdrive protection diode was designed to block backdrive
current, guaranteeing no more than 5µA on any I/O pin when the I/O pin voltage is greater than the CM1223
supply voltage.
Application Information
Design Considerations
To realize the maximum protection against ESD pulses, care must be taken in the PCB layout to minimize
parasitic series inductances on the Supply/Ground rails as well as the signal trace segments between the signal
input (typically a connector) and the ESD protection device. Application of Positive ESD Pulse between Input
Channel and Ground illustrates an example of a positive 8kV ESD pulse striking an input channel. The 8kV ESD
current pulse will divert along the path as indicated in Application of Positive ESD Pulse between Input Channel
and Ground, through the D1 diode and the Zener diode back to the ground rail.
An ESD current pulse can rise from zero to its peak value in a very short time. For example, a level 4 contact
discharge per the IEC61000-4-2 standard results in a current pulse that rises from zero to 30 Amps in 1ns. The
CM1223 has a fast response time of less than 1ns and low clamp voltage to handle this pulse scenario.
Similarly for negative ESD pulses, parasitic series inductance from the VN pin to the ground rail will lead to
drastically increased negative voltage on the line being protected.
The CM1223 also has an integrated backdrive diode between VP and VN to prevent backdrive current flow from
the powered sources.
As a general rule, the ESD Protection Array should be located as close as possible to the point of entry of
expected electrostatic discharges.
Additional Information
See also California Micro Devices Application Note AP209, “Design Considerations for ESD Protection”, in the
Applications section at www.cmd.com.
Rev. 4 | Page 9 of 19 | www.onsemi.com
CM1223
POSITIVE SUPPLY
One Channel of
CM1223
PATH OF POSI
TIVE ESD
CURRENT
PULSE IESD
LINE BEING PROTECTED
SYSTEM
OR CIR
CUITRY
I/O pin
PATH OF NEGA
TIVE ESD
GROUND RAIL
Figure 5. Application of Positive ESD Pulse between Input Channel and Ground
Figure 6. Application of Positive ESD Pulse between Input Channel and Ground
Rev. 4 | Page 10 of 19 | www.onsemi.com
CM1223
Mechanical Details
The CM1223 is available in SOT143-4, SOT23-5, SOT23-6, and MSOP-10 packages with a lad-free finishing
option. The various package drawings are presented below.
SOT143 Mechanical Specifications
Dimensions for CM1223-02SR devices supplied in 4-pin SOT143 packages are presented below.
PACKAGE DIMENSIONS
Package
SOT143
Pins
4
Dimensions
Millimeters
Inches
Min
Max
Min
Max
A
0.80
1.22
0.031
0.048
A1
0.05
0.15
0.002
0.006
b
0.30
0.50
0.012
0.019
b2
0.76
0.89
0.030
0.035
c
0.08
0.20
0.003
0.008
D
2.80
3.04
0.110
0.119
E
2.10
2.64
0.082
0.103
E1
1.20
1.40
e
1.92 BSC
e1
0.20 BSC
L
L1
# per tape
and reel
0.4
0.055
0.075 BSC
0.008 BSC
0.6
0.54 REF
0.047
0.016
0.024
0.021 REF
3000 pieces
Package Dimensions for SOT143
Controlling dimension: millimeters
Rev. 4 | Page 11 of 19 | www.onsemi.com
CM1223
Tape and Reel Specifications
PACKAGE SIZE
PART NUMBER (mm)
CM1223-02SR
2.92 X 2.37 X 1.01
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
2.60 X 3.15 X 1.20
8mm
178mm (7")
3000
4mm
4mm
Rev. 4 | Page 12 of 19 | www.onsemi.com
CM1223
Mechanical Details (cont’d)
SOT23-5 Mechanical Specifications
The CM1223-02SO is supplied in a 5-pin SOT23 package. Dimensions are presented below.
PACKAGE DIMENSIONS
Package
SOT23-5 (JEDEC name is MO-178)
Pins
5
Dimensions
Millimeters
Inches
Min
Max
Min
Max
A
--
1.45
--
0.0571
A1
0.00
0.15
0.0000
0.0059
b
0.30
0.50
0.0118
0.0197
c
0.08
0.22
0.0031
0.0087
D
2.75
3.05
0.1083
0.1201
E
2.60
3.00
0.1024
0.1181
E1
1.45
1.75
0.0571
0.0689
e
0.95 BSC
0.0374 BSC
e1
1.90 BSC
0.0748 BSC
L
L1
# per tape
and reel
0.30
0.60
0.60 REF
0.0118
0.0236
0.0236 REF
3000 pieces
Controlling dimension: millimeters
Package Dimensions for SOT23-5
Rev. 4 | Page 13 of 19 | www.onsemi.com
CM1213
Tape and Reel Specifications
PART NUMBER
PACKAGE SIZE
(mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1223-02SO
2.90 X 2.80 X 1.45
3.20 X 3.20 X 1.40
8mm
178mm (7")
3000
4mm
4mm
Rev. 4 | Page 14 of 19 | www.onsemi.com
CM1223
Mechanical Details (cont’d)
SOT23-6 Mechanical Specifications
CM1223-04SO devices are packaged in 6-pin SOT23 packages. Dimensions are presented below.
PACKAGE DIMENSIONS
Package
SOT23-6 (JEDEC name is MO-178)
Pins
6
Dimensions
Millimeters
Inches
Min
Max
Min
Max
A
--
1.45
--
0.0571
A1
0.00
0.15
0.0000
0.0059
b
0.30
0.50
0.0118
0.0197
c
0.08
0.22
0.0031
0.0087
D
2.75
3.05
0.1083
0.1201
E
2.60
3.00
0.1024
0.1181
E1
1.45
1.75
0.0571
0.0689
e
0.95 BSC
0.0374 BSC
e1
1.90 BSC
0.0748 BSC
L
L1
# per tape
and reel
0.30
0.60
0.60 REF
0.0118
0.0236
0.0236 REF
3000 pieces
Controlling dimension: millimeters
Package Dimensions for SOT23-6
Rev. 4 | Page 15 of 19 | www.onsemi.com
CM1213
Tape and Reel Specifications
PART NUMBER
PACKAGE SIZE
(mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1223-04SO
2.90 X 2.80 X 1.45
3.20 X 3.20 X 1.40
8mm
178mm (7")
3000
4mm
4mm
Rev. 4 | Page 16 of 19 | www.onsemi.com
CM1223
Mechanical Details (cont’d)
MSOP-10 Mechanical Specifications, 10 pin
The CM1223-08MR 10-lead MSOP package dimensions are presented below.
PACKAGE DIMENSIONS
Package
MSOP
Pins
10
Dimensions
Millimeters
Inches
Min
Max
Min
Max
A
0.75
0.95
0.028
0.038
A1
0.05
0.15
0.002
0.006
B
0.17
0.27
0.007
0.013
C
0.13
0.23
0.005
0.009
D
2.90
3.10
0.114
0.122
E
2.90
3.10
0.114
0.122
e
0.50 BSC
0.0196 BSC
H
4.90 BSC
0.193 BSC
L
# per tape
and reel
0.40
0.70
0.0137
0.029
4000
Controlling dimension: millimeters
Package Dimensions for MSOP-10
Rev. 4 | Page 17 of 19 | www.onsemi.com
CM1223
Tape and Reel Specifications
PART NUMBER
PACKAGE SIZE
(mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1223-08MR
3.00 X 3.00 X 0.85
3.30 X 5.30 X 1.30
12mm
330mm (13")
4000
4mm
8mm
Rev. 4 | Page 18 of 19 | www.onsemi.com
CM1223
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or
use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors
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Rev. 4 | Page 19 of 19 | www.onsemi.com
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