HDMI Receiver Port Protection and Interface Device CM2021-02TR Features Product Description • • The CM2021-02TR HDMI Receiver Port Protection and Interface Device is specifically designed for next generation HDMI Host interface protection. An integrated package provides all ESD, level shift and backdrive protection for an HDMI port in a single 38-Pin TSSOP package. The CM2021-02TR part is specifically designed to complement the CM2020 protection part in HDMI transmitters (DVD, STB/OPVR, etc.). • • • • • • HDMI 1.3 compliant 0.05pF matching capacitance between the TMDS intra-pair Level shifting/isolation circuitry Provides ESD protection to IEC61000-4-2 Level 4: ±8kV contact discharge ±15kV air discharge Matched 0.5mm trace spacing (TSSOP) Simplified layout for HDMI connectors Backdrive protection RoHS-compliant, lead-free packaging Applications • • • PC Consumer electronics Displays and digital television ©2010 SCILLC. All rights reserved. May 2010 – Rev. 3 Publication Order Number: CM2021-02TR/D CM2021-02TR Electrical Schematic Rev. 3 | Page 2 of 12 | www.onsemi.com CM2021-02TR PIN DESCRIPTIONS PINS NAME ESD Level 4, 35 TMDS_D2+ 8kV 2 TMDS 0.9pF ESD protection. 1 6, 33 TMDS_D2– 8kV 2 TMDS 0.9pF ESD protection. 1 7, 32 TMDS_D1+ 8kV 2 TMDS 0.9pF ESD protection. 1 9, 30 TMDS_D1– 8kV 2 TMDS 0.9pF ESD protection. 1 10, 29 TMDS_D0+ 8kV 2 TMDS 0.9pF ESD protection. 1 12, 27 TMDS_D0– 8kV 2 TMDS 0.9pF ESD protection. 1 13, 26 TMDS_CK+ 8kV 2 TMDS 0.9pF ESD protection. 1 15, 24 TMDS_CK– 8kV 2 TMDS 0.9pF ESD protection. 1 16 CE_REMOTE_IN 2kV 3 LV_SUPPLY referenced logic level into ASIC. 23 CE_REMOTE_OUT 8kV 2 5V_SUPPLY referenced logic level out plus 3.5pF ESD to connector. 17 DDC_CLK_IN 2kV 3 LV_SUPPLY referenced logic level into ASIC. 5V_SUPPLY referenced logic level out plus 3.5pF ESD to connector. DESCRIPTION 22 DDC_CLK_OUT 8kV 2 18 DDC_DAT_IN 2kV 3 LV_SUPPLY referenced logic level into ASIC. 5V_SUPPLY referenced logic level out plus 3.5pF ESD to connector. 21 DDC_DAT_OUT 8kV 2 19 HOTPLUG_DET_IN 2kV 3 LV_SUPPLY referenced logic level into ASIC. 5V_SUPPLY referenced logic level out plus 3.5pF ESD to connector. 20 HOTPLUG_DET_OUT 8kV 2 2 LV_SUPPLY 2kV 3 Bias for CE / DDC / HOTPLUG level shifters. 1 5V_SUPPLY 2kV 3 Current source for 5V_OUT. 3 This pin may be connected to a 0.1 F ceramic capacitor, but it is not necessary. 37 ESD_BYP 2kV 5, 34, 8, 31, 11, 28, 14, 25 TMDS_GND N/A TMDS ESD and Parasitic GND return. 3, 36 GND N/A Supply GND reference. 38 NC N/A No connect. 4 Note 1: These 2 pins need to be connected together in-line on the PCB. Note 2: Standard IEC 61000-4-2, CDISCHARGE=150pF, RDISCHARGE=330Ω, 5V_SUPPLY and LV_SUPPLY within recommended operating conditions, GND=0V, each bypassed with a 0.1µF ceramic capacitor connected to GND. Note 3: Human Body Model per MIL-STD-883, Method 3015, CDISCHARGE=100pF, RDISCHARGE=1.5kΩ, 5V_SUPPLY and LV_SUPPLY within recommended operating conditions, GND=0V, and each bypassed with a 0.1µF ceramic capacitor connected to GND. Note 4: These pins should be routed directly to the associated GND pins on the HDMI connector with single point ground vias at the connector Rev. 3 | Page 3 of 12 | www.onsemi.com CM2021-02TR Backdrive Protection Two scenarios below describe what can happen when a powered device is connected to an unpowered device via an HDMI interface, substantiating the need for backdrive protection for this type of interface. In a classic scenario, a DVD player is connected to a TV via an HDMI interface. If the DVD player is switched off and the TV is left on, there is a possibility of reverse current flow back into the main power supply rail of the DVD player. Typically, the DVD’s power supply has some form of bulk supply capacitance associated with it. Because all CMOS logic exhibits a very high impedance on the power rail node when “off,” if there is very little parasitic shunt resistance and as little as a few milliamps of “backdrive” current flowing back into the power rail, it is possible over time to charge that bulk supply capacitance to some intermediate level. If this level rises above the power-on-reset (POR) voltage level of some of the integrated circuits in the DVD player, these devices may not reset properly when the DVD player is turned back on. In a more serious scenario, if any SOC devices are incorporated in the design which have built-in level shifter and DRC diodes for ESD protection, there is even a higher risk for damage. In this case, if there is a pullup resistor (such as with DDC) on the other end of the cable, that resistance will pull the SOC chips “output” up to a high level. This will forward bias the upper ESD diode in the DRC and charge the bulk capacitance in a similar fashion like above. If the current flow is high enough, even as little as a few milliamps, it could destroy one of the SOC chip’s internal DRC diodes, as they are not designed for passing DC. To avoid either of these situations, the CM2021-02TR is designed to block backdrive current, guaranteeing no more than 5µA on any I/O pin when the I/O pin voltage is greater than the CM2021-02TR supply voltage. Figure 1. Backdrive Protection Diagram Rev. 3 | Page 4 of 12 | www.onsemi.com CM2021-02TR Ordering Information PART NUMBERING INFORMATION Lead-free Finish Pins Package Ordering Part Number Part Marking 38 TSSOP-38 CM2021-02TR CM2021-02TR 1 Note 1: Parts are shipped in Tape and Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS VCC5V, VCCLV 6.0 V DC Voltage at any Channel Input 6.0 V –65 to +150 ûC Storage Temperature Range STANDARD (RECOMMENDED) OPERATING CONDITIONS SYMBOL PARAMETER MIN TYP MAX UNITS 5V_SUPPLY Operating Supply Voltage GND 5 5.5 V LV_SUPPLY Bias Supply Voltage 1 3.3 5.5 V 85 ûC Operating Temperature Range Rev. 3 | Page 5 of 12 | www.onsemi.com –40 CM2021-02TR (SEE NOTE 1) ELECTRICAL OPERATING CHARACTERISTICS SYMBOL PARAMETER CONDITIONS ICC5V Operating Supply Current ICCLV TYP MAX UNITS 5V_SUPPLY = 5.0V 110 130 µA Bias Supply Current LV_SUPPLY = 3.3V 1 5 µA IOFF OFF state leakage current, level shifting NFET LV_SUPPLY = 0V 0.1 5 µA IBACKDRIVE Current conducted from output pins to V_SUPPLY rails when powered down 5V_SUPPLY VCH_OUT; Signal pins: TMDS_[2:0]+/–, TMDS_CK+/–, CE_REMOTE_OUT, DDC_DAT_OUT, DDC_CLK_OUT, HOTPLUG_DET_OUT Only 0.1 5 µA CE-REMOTE_IN = CE_SUPPLY < CE_REMOTE_OUT 0.1 1 µA 75 95 140 mV 0.6 0.6 0.85 0.85 0.95 0.95 V V IBACKDRIVE, CEC VON VOLTAGE drop across level shifting NFET when ON LV_SUPPLY = 2.5V, VS = GND, IDS = 3mA VF Diode Forward Voltage Top Diode Bottom Diode IF = 8mA, TA = 25ûC; Note 2 VESD ESD Withstand Voltage (IEC) Pins 4, 7,10,13, 20, 21, 22, 23, 24, 27, 30, 33; Notes 2 and 3 VCL Channel Clamp Voltage Positive Transients Negative Transients TA = 25ûC, IPP = 1A, tP = 8/20µs; Notes 2 and 4 Dynamic Resistance Positive Transients Negative Transients TA = 25ûC, IPP = 1A, tP = 8/20µs; Notes 2 and 4 TMDS Channel Leakage Current TA = 25ûC; Note 2 0.01 1 µA TMDS Channel Input Capacitance 5V_SUPPLY = 5.0V, Measured at 1MHz, VBIAS=2.5V; Note 2 0.9 1.2 pF TMDS Channel Input Capacitance Matching 5V_SUPPLY = 5.0V, Measured at 1MHz, VBIAS=2.5V; Notes 2 and 5 0.05 RDYN ILEAK CIN, TMDS ∆C Current through CE-REMOTE_OUT when powered down MIN IN, TMDS Rev. 3 | Page 6 of 12 | www.onsemi.com kV 8 11.0 –2.0 V V 1.2 0.9 Ω Ω pF CM2021-02TR SYMBOL PARAMETER CONDITIONS CIN, DDC Level Shifting Input Capacitance, Capacitance to GND CIN, CEC CIN, HP MIN TYP MAX UNITS 5V_SUPPLY = 5V, Measured at 100KHz, VBIAS=2.5V; Note 2 3.5 4 pF Level Shifting Input Capacitance, Capacitance to GND 5V_SUPPLY = 5V, Measured at 100KHz, VBIAS=2.5V; Note 2 3.5 4 pF Level Shifting Input Capacitance, Capacitance to GND 5V_SUPPLY = 5V, Measured at 100KHz, VBIAS=2.5V; Note 2 3.5 4 pF Note 1: Operating characteristics are over standard operating conditions unless otherwise specified. Note 2: This parameter is guaranteed by design and verified by device characterization. Note 3: Standard IEC 61000-4-2, CDISCHARGE=150pF, RDISCHARGE=330Ω, 5V_SUPPLY and LV_SUPPLY within recommended operating conditions, GND=0V, each bypassed with a 0.1µF ceramic capacitor connected to GND. Note 4: These measurements performed with no external capacitor on ESD_BYP. Note 5: Intra-pair matching, each TMDS pair (i.e. D+, D–) Rev. 3 | Page 7 of 12 | www.onsemi.com CM2021-02TR Performance Information Typical Filter Performance (TA=25ûC, DC Bias=0V, 50 Ohm Environment) Figure 2. Insertion Loss vs. Frequency (TMDS_D1– to GND) Rev. 3 | Page 8 of 12 | www.onsemi.com CM2021-02TR Application Information DCEC Figure 3. Typical Application for CM2021-02TR Rev. 3 | Page 9 of 12 | www.onsemi.com CM2021-02TR Application Information Design Considerations 1. DUT On vs. DUT Off Many HDMI CTS tests require a power off condition on the System Under Test. Many Dual Rail Clamp (DRC) ESD diode configurations will be forward biased when their VDD rail is lower than the I/O pin bias, thereby exhibiting extremely high apparent capacitance measurements, for example. The MediaGuard backdrive isolation circuitry limits this current to less than 10 A, and will help ensure HDMI compliance. 2. EEPROM Configurations The EDID EEPROM may be connected to either the ASIC LV domain or Connector 5V domain of the CM2021. See the MediaGuard EEPROM Application Note for further circuit connection and layout examples. Figure 4. Design Example Rev. 3 | Page 10 of 12 | www.onsemi.com CM2021-02TR Mechanical Details TSSOP-38 Mechanical Specifications CM2021-02TR devices are supplied in 38-pin TSSOP packages. Dimensions are presented below. For complete information on the TSSOP-38, see the California Micro Devices TSSOP Package Information document. PACKAGE DIMENSIONS Package TSSOP JEDEC No. MO-153 (Variation BD-1) Pins 38 Dimensions Millimeters Inches Min Max Min Max A — 1.20 — 0.047 A1 0.05 0.15 0.002 0.006 b 0.17 0.27 0.007 0.011 c 0.09 0.20 0.004 0.008 D 9.60 9.80 0.378 0.386 E E1 e L # per tape and reel 6.40 BSC 4.30 0.252 BSC 4.50 0.50 BSC 0.45 0.169 0.177 0.020 BSC 0.75 0.018 0.030 2500 pieces Controlling dimension: millimeters Package Dimensions for TSSOP-38 Rev. 3 | Page 11 of 12 | www.onsemi.com CM2021-02TR Tape and Reel Specifications PART NUMBER PACKAGE SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM2021-02TR 9.70 X 6.40 X 1.20 10.20 X 6.90 X 1.80 16mm 330mm (13") 2500 4mm 12mm ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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