MC74VHC1GT32 2-Input OR Gate/CMOS Logic Level Shifter The MC74VHC1GT32 is an advanced high speed CMOS 2–input OR gate fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The device input is compatible with TTL–type input thresholds and the output has a full 5 V CMOS level output swing. The input protection circuitry on this device allows overvoltage tolerance on the input, allowing the device to be used as a logic–level translator from 3.0 V CMOS logic to 5.0 V CMOS Logic or from 1.8 V CMOS logic to 3.0 V CMOS Logic while operating at the high–voltage power supply. The MC74VHC1GT32 input structure provides protection when voltages up to 7 V are applied, regardless of the supply voltage. This allows the MC74VHC1GT32 to be used to interface 5 V circuits to 3 V circuits. The output structures also provide protection when VCC = 0 V. These input and output structures help prevent device destruction caused by supply voltage – input/output voltage mismatch, battery backup, hot insertion, etc. • • • • • • • • High Speed: tPD = 3.5 ns (Typ) at VCC = 5 V Low Power Dissipation: ICC = 2 µA (Max) at TA = 25°C TTL–Compatible Inputs: VIL = 0.8 V; VIH = 2.0 V CMOS–Compatible Outputs: VOH > 0.8 VCC; VOL < 0.1 VCC @Load Power Down Protection Provided on Inputs and Outputs Balanced Propagation Delays Pin and Function Compatible with Other Standard Logic Families Chip Complexity: FETs = 65; Equivalent Gates = 15 IN B 5 1 IN A 2 GND 3 4 http://onsemi.com MARKING DIAGRAMS SC–88A / SOT–353/SC–70 DF SUFFIX CASE 419A VNd Pin 1 d = Date Code TSOP–5/SOT–23/SC–59 DT SUFFIX CASE 483 VNd Pin 1 d = Date Code PIN ASSIGNMENT 1 IN B 2 IN A 3 GND 4 OUT Y 5 VCC FUNCTION TABLE VCC Inputs OUT Y Output A B Y L L H H L H L H L H H H Figure 1. Pinout (Top View) ORDERING INFORMATION ≥1 IN A IN B See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. OUT Y Figure 2. Logic Symbol Semiconductor Components Industries, LLC, 2001 November, 2001 – Rev. 4 1 Publication Order Number: MC74VHC1GT32/D MC74VHC1GT32 MAXIMUM RATINGS (Note 1) Symbol Value Unit VCC DC Supply Voltage Characteristics –0.5 to +7.0 V VIN DC Input Voltage –0.5 to +7.0 V VOUT DC Output Voltage –0.5 to 7.0 –0.5 to VCC + 0.5 V IIK Input Diode Current IOK Output Diode Current IOUT VCC = 0 High or Low State –20 mA +20 mA DC Output Current, per Pin +25 mA ICC DC Supply Current, VCC and GND +50 mA PD Power dissipation in still air SC–88A, TSOP–5 200 mW JA Thermal resistance SC–88A, TSOP–5 333 C/W TL Lead temperature, 1 mm from case for 10 s 260 °C TJ Junction temperature under bias +150 °C Tstg Storage temperature –65 to +150 °C VESD ESD Withstand Voltage > 2000 > 200 N/A V VOUT < GND; VOUT > VCC Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) ILatch–Up Latch–Up Performance Above VCC and Below GND at 125°C (Note 5) ±500 mA 1. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 2. Tested to EIA/JESD22–A114–A 3. Tested to EIA/JESD22–A115–A 4. Tested to JESD22–C101–A 5. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit VCC DC Supply Voltage 3.0 5.5 V VIN DC Input Voltage 0.0 5.5 V VOUT DC Output Voltage 0.0 0.0 5.5 VCC V TA Operating Temperature Range –55 +125 °C tr , tf Input Rise and Fall Time 0 0 100 20 ns/V VCC = 0 High or Low State VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 TJ = 80 ° C 117.8 419,300 TJ = 90 ° C 1,032,200 90 TJ = 100 ° C 80 FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 110° C Time, Years TJ = 120° C Time, Hours TJ = 130 ° C Junction Temperature °C NORMALIZED FAILURE RATE DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES 1 1 10 100 TIME, YEARS Figure 3. Failure Rate vs. Time Junction Temperature http://onsemi.com 2 1000 MC74VHC1GT32 DC ELECTRICAL CHARACTERISTICS VCC Symbol Parameter Test Conditions (V) Min 1.4 2.0 2.0 VIH Minimum High–Level Input Voltage 3.0 4.5 5.5 VIL Maximum Low–Level Input Voltage 3.0 4.5 5.5 VOH Minimum High–Level Output Voltage g VIN = VIH or VIL VOL Maximum Low–Level Output Voltage g VIN = VIH or VIL TA ≤ 85°C TA = 25°C Typ Max Min 1.4 2.0 2.0 0.53 0.8 0.8 VIN = VIH or VIL IOH = –50 µA 3.0 4.5 2.9 4.4 VIN = VIH or VIL IOH = –4 mA IOH = –8 mA 3.0 4.5 2.58 3.94 VIN = VIH or VIL IOL = 50 µA 3.0 4.5 VIN = VIH or VIL IOL = 4 mA IOL = 8 mA Max 3.0 4.5 –55 ≤ TA ≤ 125°C Min Max 1.4 2.0 2.0 0.53 0.8 0.8 V 0.53 0.8 0.8 2.9 4.4 2.9 4.4 2.48 3.80 2.34 3.66 Unit V V V 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V V IIN Maximum Input Leakage Current VIN = 5.5 V or GND 0 to 5.5 ±0.1 ±1.0 ±1.0 µA ICC Maximum Quiescent Supply Current VIN = VCC or GND 5.5 2.0 20 40 µA ICCT Quiescent Supply Current Input: VIN = 3.4 V 5.5 1.35 1.50 1.65 mA IOPD Output Leakage Current VOUT = 5.5 V 0.0 0.5 5.0 10 µA ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS (Cload = 50 pF, Input tr = tf = 3.0ns) TA ≤ 85°C TA = 25°C Symbol tPLH, tPHL CIN Parameter Maximum Propogation Delay, g y I Input t A or B to t Y Min Test Conditions Typ Max Min Max –55 ≤ TA ≤ 125°C Min Max Unit ns VCC = 3.3 ± 0.3 V CL = 15 pF CL = 50 pF 4.8 6.1 7.9 11.4 9.5 13.0 11.5 15.5 VCC = 5.0 ± 0.5 V CL = 15 pF CL = 50 pF 3.7 4.4 5.5 7.5 6.5 8.5 8.0 10.0 5.5 10 10 10 Maximum Input Capacitance pF Typical @ 25°C, VCC = 5.0 V 11 CPD Power Dissipation Capacitance (Note 6) pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no–load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 MC74VHC1GT32 TEST POINT Input A or B 50% OUTPUT 50% VCC DEVICE UNDER TEST GND tPLH tPHL CL* VOH Output Y 50% VCC VOL *Includes all probe and jig capacitance Figure 4. Switching Waveforms Figure 5. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number MC74VHC1GT32DFT1 MC74VHC1GT32DFT2 MC74VHC1GT32DTT1 Circuit Indicator MC MC MC Temp Range Identifier 74 74 74 Device Function Technology VHC1G T32 VHC1G T32 VHC1G T32 http://onsemi.com 4 Package Suffix DF DF DT Tape & Reel Suffix Package Type Tape and Reel Size T1 SC–88A / SOT–353 / SC–70 178 mm (7”) 3000 Unit T2 SC–88A / SOT–353 / SC–70 178 mm (7”) 3000 Unit T1 TSOPS / SOT–23 / SC–59 178 mm (7”) 3000 Unit MC74VHC1GT32 CAVITY TAPE TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN TOP TAPE COMPONENTS TAPE LEADER NO COMPONENTS 400 mm MIN DIRECTION OF FEED Figure 6. Tape Ends for Finished Goods TAPE DIMENSIONS mm 4.00 1.50 TYP 4.00 2.00 1.75 3.50 0.50 8.00 0.30 1 1.00 MIN DIRECTION OF FEED Figure 7. SC–70–5/SC–88A/SOT–353 DFT1 Reel Configuration/Orientation TAPE DIMENSIONS mm 4.00 1.50 TYP 4.00 2.00 1.75 3.50 0.50 8.00 0.30 1 1.00 MIN DIRECTION OF FEED Figure 8. SC–70/SC–88A/SOT–353 DFT2 and SOT23–5/TSOP–5/SC59–5 DTT1 Reel Configuration/Orientation http://onsemi.com 5 MC74VHC1GT32 t MAX 1.5 mm MIN (0.06 in) A 13.0 mm 0.2 mm (0.512 in 0.008 in) 50 mm MIN (1.969 in) 20.2 mm MIN (0.795 in) FULL RADIUS G Figure 9. Reel Dimensions REEL DIMENSIONS Tape Size T and R Suffix A Max G t Max 8 mm T1, T2 178 mm (7 in) 8.4 mm, + 1.5 mm, –0.0 (0.33 in + 0.059 in, –0.00) 14.4 mm (0.56 in) DIRECTION OF FEED BARCODE LABEL POCKET Figure 10. Reel Winding Direction http://onsemi.com 6 HOLE MC74VHC1GT32 PACKAGE DIMENSIONS SC–88A/SOT–353/SC–70 DF SUFFIX 5–LEAD PACKAGE CASE 419A–01 ISSUE E A G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. V 5 DIM A B C D G H J K N S V 4 –B– S 1 2 3 D 5 PL 0.2 (0.008) M B M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 0.012 0.016 J C 0.4 mm (min) 0.5 mm (min) ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 1.9 mm ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ http://onsemi.com 7 0.65 mm 0.65 mm K H MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 0.30 0.40 MC74VHC1GT32 PACKAGE DIMENSIONS TSOP–5/SOT–23/SC–59 DT SUFFIX 5–LEAD PACKAGE CASE 483–01 ISSUE A D S 5 4 1 2 3 B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. L DIM A B C D G H J K L M S G A J C 0.05 (0.002) H M K ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ 0.094 2.4 0.037 0.95 0.074 1.9 0.037 0.95 MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.00 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0 10 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0 10 0.0985 0.1181 ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 0.039 1.0 0.028 0.7 inches mm ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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