MC74LCX540 Low−Voltage CMOS Octal Buffer Flow Through Pinout With 5 V−Tolerant Inputs and Outputs (3−State, Inverting) The MC74LCX540 is a high performance, inverting octal buffer operating from a 2.3 to 3.6 V supply. This device is similar in function to the MC74LCX240, while providing flow through architecture. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX540 inputs to be safely driven from 5 V devices. The MC74LCX540 is suitable for memory address driving and all TTL level bus oriented transceiver applications. Current drive capability is 24 mA at the outputs. The Output Enable (OE1, OE2) inputs, when HIGH, disables the outputs by placing them in a HIGH Z condition. • • • MARKING DIAGRAMS 20 20 1 Designed for 2.3 to 3.6 V VCC Operation 5 V Tolerant − Interface Capability With 5 V TTL Logic Supports Live Insertion and Withdrawal IOFF Specification Guarantees High Impedance When VCC = 0 V LVTTL Compatible LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current in All Three Logic States (10 A) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA ESD Performance: Human Body Model >2000 V Machine Model >200 V Pb−Free Packages are Available* SOIC−20 DW SUFFIX CASE 751D LCX540 AWLYYWW 1 20 20 Features • • • • • • • • http://onsemi.com 1 LCX 540 ALYW TSSOP−20 DT SUFFIX CASE 948E 1 20 20 1 SOEIAJ−20 M SUFFIX CASE 967 1 A L, WL Y, YY W, WW = = = = 74LCX540 AWLYWW Assembly Location Wafer Lot Year Work Week ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2005 January, 2005 − Rev. 5 1 Publication Order Number: MC74LCX540/D MC74LCX540 OE1 OE2 1 19 D0 VCC OE2 O0 O1 O2 O3 O4 O5 O6 O7 20 19 18 17 16 15 14 13 12 11 D1 D2 D3 1 2 3 4 5 6 7 8 9 10 OE1 D0 D1 D2 D3 D4 D5 D6 D7 GND D4 Figure 1. Pinout: 20−Lead (Top View) D5 D6 PIN NAMES D7 Pins Function OEn Dn On Output Enable Inputs Data Inputs 3−State Outputs 2 18 3 17 4 16 5 15 6 14 7 13 8 12 9 11 O0 O1 O2 O3 O4 O5 O6 O7 Figure 2. LOGIC DIAGRAM TRUTH TABLE INPUTS OUTPUTS OE1 OE2 Dn On L L L H L L H L X H X Z H X X Z H = High Voltage Level L = Low Voltage Level Z = High Impedance State X = High or Low Voltage Level and Transitions are Acceptable For ICC reasons, DO NOT FLOAT Inputs http://onsemi.com 2 MC74LCX540 MAXIMUM RATINGS Symbol Parameter VCC DC Supply Voltage VI VO Value Condition Unit −0.5 to +7.0 V DC Input Voltage −0.5 ≤ VI ≤ +7.0 V DC Output Voltage −0.5 ≤ VO ≤ +7.0 Output in 3−State V −0.5 ≤ VO ≤ VCC + 0.5 Note 1 V IIK DC Input Diode Current −50 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Output in HIGH or LOW State. IO absolute maximum rating must be observed. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit 2.0 1.5 3.3 3.3 3.6 3.6 V 0 5.5 V 0 0 VCC 5.5 V HIGH Level Output Current, VCC = 3.0 V − 3.6 V −24 mA IOL LOW Level Output Current, VCC = 3.0 V − 3.6 V 24 mA IOH HIGH Level Output Current, VCC = 2.7 V − 3.0 V −12 mA IOL LOW Level Output Current, VCC = 2.7 V − 3.0 V TA Operating Free−Air Temperature t/V Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V VCC Supply Voltage VI Input Voltage VO Output Voltage IOH Operating Data Retention Only (HIGH or LOW State) (3−State) 12 mA −40 +85 °C 0 10 ns/V ORDERING INFORMATION Package Shipping† MC74LCX540DWR2 SOIC−20 1000 Tape & Reel MC74LCX540DR2G SOIC−20 (Pb−Free) 1000 Tape & Reel MC74LCX540DT TSSOP−20* 75 Units / Rail MC74LCX540DTR2 TSSOP−20* 2000 Tape & Reel MC74LCX540MEL SOEIAJ−20 2000 Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 3 MC74LCX540 DC ELECTRICAL CHARACTERISTICS TA = −40°C to +85°C Symbol Condition Min VIH HIGH Level Input Voltage (Note 2) 2.7 V ≤ VCC ≤ 3.6 V 2.0 VIL LOW Level Input Voltage (Note 2) 2.7 V ≤ VCC ≤ 3.6 V VOH HIGH Level Output Voltage VOL Characteristic LOW Level Output Voltage Max Unit V 0.8 2.7 V ≤ VCC ≤ 3.6 V; IOH = −100 A VCC − 0.2 VCC = 2.7 V; IOH = −12 mA 2.2 VCC = 3.0 V; IOH = −18 mA 2.4 VCC = 3.0 V; IOH = −24 mA 2.2 V V 2.7 V ≤ VCC ≤ 3.6 V; IOL = 100 A 0.2 VCC = 2.7 V; IOL= 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 V VCC = 3.0 V; IOL = 24 mA 0.55 II Input Leakage Current 2.7 V ≤ VCC ≤ 3.6 V; 0 V ≤ VI ≤ 5.5 V ±5.0 A IOZ 3−State Output Current 2.7 ≤ VCC ≤ 3.6 V; 0 V ≤ VO ≤ 5.5 V; VI = VIH or V IL ±5.0 A IOFF Power−Off Leakage Current VCC = 0 V; VI or VO = 5.5 V 10 A ICC Quiescent Supply y Current 2.7 ≤ VCC ≤ 3.6 V; VI = GND or VCC 10 A 2.7 ≤ VCC ≤ 3.6 V; 3.6 ≤ VI or VO ≤ 5.5 V ±10 A 500 A ICC Increase in ICC per Input 2.7 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 2. These values of VI are used to test DC electrical characteristics only. AC CHARACTERISTICS (tR = tF = 2.5ns; CL = 50pF; RL = 500) Limits TA = −40°C to +85°C VCC = 3.0 V to 3.6 V Symbol Parameter VCC = 2.7 V Waveform Min Max Max Unit tPLH tPHL Propagation Delay Input to Output 1 1.5 1.5 6.5 6.5 7.5 7.5 ns tPZH tPZL Output Enable Time to High and Low Level 2 1.5 1.5 8.5 8.5 9.5 9.5 ns tPHZ tPLZ Output Disable Time From High and Low Level 2 1.5 1.5 7.5 7.5 8.5 8.5 ns tOSHL tOSLH Output−to−Output Skew (Note 3) 1.0 1.0 ns 3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design. DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol Characteristic Condition VOLP Dynamic LOW Peak Voltage (Note 4) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V Min Typ 0.8 Max Unit V VOLV Dynamic LOW Valley Voltage (Note 4) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V 0.8 V 4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol Parameter CIN Input Capacitance COUT Output Capacitance CPD Power Dissipation Capacitance Condition Typical Unit VCC = 3.3 V, VI = 0 V or VCC 7 pF VCC = 3.3 V, VI = 0 V or VCC 8 pF 10 MHz, VCC = 3.3V, VI = 0 V or VCC 25 pF http://onsemi.com 4 MC74LCX540 2.7 V Dn 1.5 V 1.5 V 0V tPHL tPLH 1.5 V On VOH 1.5 V VOL WAVEFORM 1 − PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns 2.7 V 1.5 V OEn 0V tPZH tPHZ VCC VOH − 0.3 V 1.5 V On ≈0V tPZL tPLZ ≈ 3.0 V 1.5 V On VOL + 0.3 V GND WAVEFORM 2 − OUTPUT ENABLE AND DISABLE TIMES tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 3. AC Waveforms VCC PULSE GENERATOR R1 DUT RT CL TEST RL SWITCH tPLH, tPHL Open tPZL, tPLZ 6V Open Collector/Drain tPLH and tPHL 6V tPZH, tPHZ GND CL = 50 pF or equivalent (Includes jig and probe capacitance) RL = R1 = 500 or equivalent RT = ZOUT of pulse generator (typically 50 ) Figure 4. Test Circuit http://onsemi.com 5 6V OPEN GND MC74LCX540 PACKAGE DIMENSIONS SOIC−20 DW SUFFIX CASE 751D−05 ISSUE G 20 11 X 45 h 1 10 20X DIM A A1 B C D E e H h L B B 0.25 M T A B S S A L H M E 0.25 10X NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. A B M D e 18X MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0 7 SEATING PLANE A1 C T TSSOP−20 DT SUFFIX CASE 948E−02 ISSUE B 20X 0.15 (0.006) T U 2X K REF 0.10 (0.004) S L/2 20 M T U S V S K K1 ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ 11 J J1 B −U− L PIN 1 IDENT SECTION N−N 1 10 0.25 (0.010) N 0.15 (0.006) T U S M A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C D G H DETAIL E 0.100 (0.004) −T− SEATING PLANE http://onsemi.com 6 DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0 8 INCHES MIN MAX 0.252 0.260 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0 8 MC74LCX540 PACKAGE DIMENSIONS SOEIAJ−20 M SUFFIX CASE 967−01 ISSUE O 20 LE 11 Q1 E HE 1 M L 10 DETAIL P Z D VIEW P e A c DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). 0.10 (0.004) http://onsemi.com 7 MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 0 0.70 0.90 −−− 0.81 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 0 0.028 0.035 −−− 0.032 MC74LCX540 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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