MC74LCX06 Low−Voltage CMOS Hex Inverter with Open Drain Outputs With 5 V − Tolerant Inputs http://onsemi.com The MC74LCX06 is a high performance hex inverter operating from a 2.3 V to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers. These LCX devices have open drain outputs which provide the ability to set output levels, or do active−HIGH AND or active−LOW OR functions. A VI specification of 5.5 V allows MC74LCX06 inputs to be safely driven from 5.0 V devices. MARKING DIAGRAMS 14 14 1 Features • • • • • • SOIC−14 D SUFFIX CASE 751A 1 Designed for 2.3 V to 3.6 V VCC Operation 5.0 V Tolerant Inputs/Outputs 14 LVTTL Compatible LVCMOS Compatible 24 mA Output Sink Capability 14 Near Zero Static Supply Current (10 A) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA 1 1 14 Device Functionally Compatible with LCX05 • • ESD Performance: Human Body Model >1500 V; Machine Model >200 V Pb−Free Packages are Available* VCC A3 O3 A4 O4 A5 O5 14 13 12 11 10 9 8 LCX 06 ALYW TSSOP−14 DT SUFFIX CASE 948G • • Wired−OR, Wired−AND • Output Level Can Be Set Externally Without Affecting Speed of • LCX06 AWLYWW 74LCX06 ALYW SOEIAJ−14 M SUFFIX CASE 965 14 1 1 A WL, L Y WW, W = Assembly Location = Wafer Lot = Year = Work Week ORDERING INFORMATION 1 2 3 4 5 6 7 A0 O0 A1 O1 A2 O2 GND See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Figure 1. Pinout: 14−Lead (Top View) *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2005 January, 2005 − Rev. 7 1 Publication Order Number: MC74LCX06/D MC74LCX06 A0 A1 A2 A3 A4 A5 1 * 2 3 * 4 5 * 6 13 * 12 * 10 * 8 11 9 Table 1. PIN NAMES O0 O1 Pins Function An On Data Inputs Outputs O2 Table 2. TRUTH TABLE O3 O4 An On L H Z L O5 * OD Figure 2. Logic Diagram MAXIMUM RATINGS Symbol Parameter VCC DC Supply Voltage VI Value Condition Unit −0.5 to +7.0 V DC Input Voltage −0.5 ≤ VI ≤ +7.0 V VO DC Output Voltage −0.5 ≤ VO ≤ +7.0 Output in HIGH or LOW State (Note 1) V IIK DC Input Diode Current −50 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output/Sink Current +50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. ORDERING INFORMATION Package Shipping† MC74LCX06D SOIC−14 50 Units / Rail MC74LCX06DG SOIC−14 (Pb−Free) 50 Units / Rail MC74LCX06DR2 SOIC−14 2500 / Tape & Reel MC74LCX06DR2G SOIC−14 (Pb−Free) 2500 / Tape & Reel MC74LCX06DT TSSOP−14* 96 Units / Rail MC74LCX06DTR2 TSSOP−14* 2500 / Tape & Reel MC74LCX06M SOEIAJ−14 50 Units / Rail MC74LCX06MEL SOEIAJ−14 2000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 2 MC74LCX06 RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage IOL LOW Level Output Current Sink TA Operating Free−Air Temperature t/V Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V Min Typ Max Unit 2.0 1.5 2.5, 3.3 2.5, 3.3 3.6 3.6 V 0 5.5 V 0 VCC V +24 +12 +8 mA −40 +85 °C 0 10 ns/V Operating Data Retention Only (HIGH or LOW State) VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V DC ELECTRICAL CHARACTERISTICS (TA = −40°C to +85°C) Symbol VIH Characteristic HIGH Level Input Voltage (Note 2) VIL LOW Level Input Voltage (Note 2) VOL LOW Level Output Voltage II Input Leakage Current IOFF Power−Off Leakage Current ICC Quiescent Supply Current ICC Increase in ICC per Input Condition Min 2.3 V ≤ VCC ≤ 2.7 V 1.7 2.7 V ≤ VCC ≤ 3.6 V 2.0 Max Unit V 2.3 V ≤ VCC ≤ 2.7 V 0.7 2.7 V ≤ VCC ≤ 3.6 V 0.8 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 A 0.2 VCC = 2.3 V; IOL= 8 mA 0.3 VCC = 2.7 V; IOL= 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 V V VCC = 3.0 V; IOL = 24 mA 0.55 2.3 V ≤ VCC ≤ 3.6 V; 0 V ≤ VI ≤ 5.5 V ±5.0 A VCC = 0 V; VI or VO = 5.5 V 10 A 2.3 V ≤ VCC ≤ 3.6 V; VI = GND or VCC 10 A 2.3 V ≤ VCC ≤ 3.6 V; 3.6 ≤ VI ≤ 5.5 V ±10 A 2.3 V ≤ VCC ≤ 3.6 V One Input at VIH = VCC − 0.6 V 500 A 2. These values of VI are used to test DC electrical characteristics only. AC ELECTRICAL CHARACTERISTICS (TA = −40°C to +85°C) VCC = 3.3 V ± 0.3 V CL = 50 pF Symbol tPLZ tPZL Parameter Propagation Delay Input to Output VCC= 2.7 V CL = 50 pF VCC = 2.5 V ± 0.2 V CL = 30 pF Min Max Min Max Min Max Unit 0.8 0.8 3.7 3.7 1.0 1.0 4.1 4.1 0.8 0.8 3.5 3.5 ns ns DYNAMIC SWITCHING CHARACTERISTICS (TA = +25°C) Symbol Characteristic Condition Min Typ Max Unit VOLP Dynamic LOW Peak Voltage (Note 3) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.9 0.7 V VOLV Dynamic LOW Valley Voltage (Note 3) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V −0.8 −0.6 V 3. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF http://onsemi.com 3 MC74LCX06 VCC Vmi An Vmi 0V tPLZ tPZL On Vmo VLZ VOL PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Table 3. AC WAVEFORMS VCC 3.3 V 0.3 V 2.7 V 2.5 V 0.2 V Vmi 1.5 V 1.5 V VCC / 2 Vmo 1.5 V 1.5 V VCC / 2 VLZ VOL + 0.3 V VOL + 0.3 V VOL + 0.15 V Symbol VCC 6 V or VCC × 2 PULSE GENERATOR R1 DUT RT CL RL Table 4. TEST CIRCUIT TEST SWITCH tPZL, tPLZ 6V Open Collector/Drain tPLH and tPHL tPZH, tPHZ 6V GND CL = 50 pF at VCC = 3.3 0.3 V or equivalent (includes jig and probe capacitance) CL = 30 pF at VCC = 2.5 0.2 V or equivalent (includes jig and probe capacitance) RL = R1 = 500 or equivalent RT = ZOUT of pulse generator (typically 50 ) http://onsemi.com 4 GND MC74LCX06 PACKAGE DIMENSIONS SOIC−14 D SUFFIX CASE 751A−03 ISSUE G −A− 14 8 −B− P 7 PL 0.25 (0.010) M B M 7 1 G F R X 45 C −T− D 14 PL 0.25 (0.010) SEATING PLANE M T B A S DIM A B C D F G J K M P R J M K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. S MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.228 0.244 0.010 0.019 TSSOP−14 DT SUFFIX CASE 948G−01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S N 2X 14 L/2 0.25 (0.010) 8 M B −U− L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E K A −V− ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 J J1 SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D G H DETAIL E http://onsemi.com 5 DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0 8 INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0 8 MC74LCX06 PACKAGE DIMENSIONS SOEIAJ−14 M SUFFIX CASE 965−01 ISSUE O 14 LE 8 Q1 E HE L 7 1 M DETAIL P Z D VIEW P A e c DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). 0.10 (0.004) MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 0 0.70 0.90 −−− 1.42 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 0 0.028 0.035 −−− 0.056 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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