6 Channel EMI Filter Array with ESD Protection CM1400-03 Features Product Description • The CM1400-03 is a six channel low-pass filter array that reduces EMI/RFI emissions while at the same time providing ESD protection. It is used on data ports on mobile devices. To reduce EMI/RFI emissions, the CM1400-03 integrates a pi-style filter (C-R-C) for each of the 6 channels. Each high quality filter provides greater than 30dB attenuation in the 800-2700 MHz range relative to the pass band attenuation. These pi-style filters also support bidirectional filtering, controlling EMI both to and from a data port connector. • • • • • • • • • • Functionally and pin compatible with CSPEMI306A device OptiGuard™ coated for improved reliability at assembly Six channels of EMI filtering for data ports Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network 40dB absolute attenuation (typical) at 1 GHz 35dB attenuation (typical) at 1 GHz relative to pass band ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) 15-bump, 2.960mm X 1.330mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance RoHS compliant (lead-free) finishing Applications • • • • • • EMI filtering and ESD protection for both data and I/O ports Wireless Handsets Handheld PCs / PDAs MP3 Players Notebooks Desktop PCs In addition, the CM1400-03 provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of ±15kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±30kV. The CM1400-03 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package footprint and low weight. The CM1400-03 incorporates OptiGuard™ coating which results in improved reliability at assembly. The CM1400-03 is available in a space-saving, low-profile chip scale package with RoHS compliant lead-free finishing. ©2010 SCILLC. All rights reserved. April 2010 Rev. 3 Publication Order Number: CM1400-03/D CM1400-03 Block Diagram Package/Pinout Diagrams Rev. 3 | Page 2 of 14 | www.onsemi.com CM1400-03 PIN DESCRIPTIONS PIN(s) NAME DESCRIPTION A1 FILTER1 Filter Channel 1 A2 FILTER2 Filter Channel 2 A3 FILTER3 Filter Channel 3 A4 FILTER4 Filter Channel 4 A5 FILTER5 Filter Channel 5 A6 FILTER6 Filter Channel 6 B1-B3 GND Device Ground C1 FILTER1 Filter Channel 1 C2 FILTER2 Filter Channel 2 C3 FILTER3 Filter Channel 3 C4 FILTER4 Filter Channel 4 C5 FILTER5 Filter Channel 5 C6 FILTER6 Filter Channel 6 Ordering Information PART NUMBERING INFORMATION Bumps Package Ordering Part Number1 Part Marking 15 CSP CM1400-03CP N003 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Rev. 3 | Page 3 of 14 | www.onsemi.com CM1400-03 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 600 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev. 3 | Page 4 of 14 | www.onsemi.com CM1400-03 ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL PARAMETER R Resistance C Capacitance CONDITIONS At 2.5V DC TCR Temperature Coefficient of Resistance TCC Temperature Coefficient of Capacitance VDIODE MIN TYP MAX UNITS 80 100 120 Ω 24 30 36 pF 1200 ppm/°C At 2.5V DC -300 ppm/°C Diode Voltage (reverse bias) IDIODE=10μA 6.0 V ILEAK Diode Leakage Current (reverse bias) VDIODE=3.3V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Note 2 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2 and 3 Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω R=100Ω, C=30pF VESD VCL f C 5.6 -1.5 6.8 -0.8 100 nA 9.0 -0.4 V V ±30 kV ±15 kV +10 -5 V V 58 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Rev. 3 | Page 5 of 14 | www.onsemi.com CM1400-03 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B2) Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B2) Rev. 3 | Page 6 of 14 | www.onsemi.com CM1400-03 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2) Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2) Rev. 3 | Page 7 of 14 | www.onsemi.com CM1400-03 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B2) Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B2) Rev. 3 | Page 8 of 14 | www.onsemi.com CM1400-03 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 7. Comparison of Filter Response Curves for CM1400-03 with DC Bias Rev. 3 | Page 9 of 14 | www.onsemi.com CM1400-03 Performance Information (cont’d) Figure 8. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) Figure 9. Resistance vs. Temperature (normalized to resistance at 25°C) Rev. 3 | Page 10 of 14 | www.onsemi.com CM1400-03 Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 3 | Page 11 of 14 | www.onsemi.com 260°C CM1400-03 Mechanical Details CSP Mechanical Specifications The CM1400-03 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps 15 Millimeters Inches Dim Min Nom Max Min Nom Max A1 2.915 2.960 3.005 0.1148 0.1165 0.1183 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1400-03 Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 3 | Page 12 of 14 | www.onsemi.com CM1400-03 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1400-03 2.96 X 1.33 X 0.644 3.10 X 1.45 X 0.74 8mm 178mm (7") 3500 4mm 4mm Figure 12. Tape and Reel Mechanical Data Rev. 3 | Page 13 of 14 | www.onsemi.com CM1400-03 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. 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