Praetorian® 8-Channel EMI Filter Array with ESD Protection CM1453-08CP Features • • • • • • • • Eight channels of EMI filtering ±15kV ESD protection (IEC 61000-4-2, contact discharge) ±30kV ESD protection (HBM) Greater than -40dB of attenuation at 1GHz Chip Scale Package (CSP) with 0.40mm pitch and 0.25mm CSP solder ball which features extremely low parasitic inductance for optimum filter and ESD performance OptiGuard™ Coating for improved reliability at assembly RoHS compliant Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules Product Description The CM1453-08CP is a pi-style EMI filter array with ESD protection, which integrates eight filters (C-L-C) in CSP form factor with 0.40mm pitch. Each EMI filter channel of the CM1453-08CP is implemented as a 3-pole L-C filter where the component values are 9.5pF-20nH-9.5pF. The roll-off frequency at -6dB attenuation is 380MHz and can be used in applications where the data rates are as high as 160Mbps while providing greater than -35dB over the 800MHz to 2.7GHz frequency range. The parts include ESD diodes on every I/O pin and provide a high level of protection against electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±15kV, beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. This device is particularly well suited for wireless handsets, mobile LCD modules and PDAs because of its small package format and easy-to-use pin assignments. In particular, the CM1453-08CP is ideal for EMI filtering and protecting data and control lines for the LCD display and camera interface in mobile handsets. The CM1453-08CP incorporates OptiGuard™ which results in improved reliability at assembly. It is manufactured with a 0.40mm pitch and 0.25mm CSP solder ball to provide up to 28% board space savings vs. competing CSP devices with 0.50mm pitch and 0.30mm CSP solder ball. ©2010 SCILLC. All rights reserved. April 2010 Rev. 2 Publication Order Number: CM1453-08CP/D CM1453-08CP Electrical Schematic m 1 of 8 Channels Rev. 2 | Page 2 of 12 | www.onsemi.com CM1453-08CP PIN DESCRIPTIONS PIN NUMBER PIN DESCRIPTION PIN NUMBER A1 Filter #1 C1 Filter #1 A2 Filter #2 C2 Filter #2 A3 Filter #3 C3 Filter #3 A4 Filter #4 C4 Filter #4 A5 Filter #5 C5 Filter #5 A6 Filter #6 C6 Filter #6 A7 Filter #7 C7 Filter #7 A8 Filter #8 C8 Filter #8 B1 GND – B2 GND – B3 GND – B4 GND – -08 PIN DESCRIPTION -08 Ordering Information PART NUMBERING INFORMATION Lead-free Finish Bumps Package Ordering Part Number1 Part Marking 20 CSP CM1453-08CP N538 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Rev. 2 | Page 3 of 12 | www.onsemi.com CM1453-08CP Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC current per Inductor 30 mA DC Package Power Rating 0.5 W RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev. 2 | Page 4 of 12 | www.onsemi.com CM1453-08CP ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL PARAMETER CONDITIONS LTOT Total Channel Inductance CTOT Total Channel Capacitance (C1 x 2) 2.5V dc; 1MHz, 30mV ac C1 Capacitance 2.5V dc; 1MHz, 30mV ac VST Stand-off Voltage I = 10μA ILEAK Diode Leakage Current VIN = 3.3V VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA VESD MIN TYP MAX 20 In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 15.2 19 nH 22.8 9.5 pF pF 5.5 5.6 -1.5 UNITS V 0.1 1.0 μA 6.8 -0.8 9.0 -0.4 V V Notes 2 and 3 ± 30 kV ±15 kV fC Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω 300 MHz fC Roll-off frequency at -6dB Attenuation ZSOURCE = 50Ω, ZLOAD = 50Ω 380 MHz 2.3 0.9 Ω Ω RDYN Dynamic Resistance Positive Negative Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Unused pins are left open. Rev. 2 | Page 5 of 12 | www.onsemi.com CM1453-08CP Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (CM1453-08: Filter 1) Figure 2. Insertion Loss VS. Frequency (CM1453-08: Filter 2) Rev. 2 | Page 6 of 12 | www.onsemi.com CM1453-08CP Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 3. Insertion Loss VS. Frequency (CM1453-08: Filter 3) Figure 4. Insertion Loss VS. Frequency (CM1453-08: Filter 4) Rev. 2 | Page 7 of 12 | www.onsemi.com CM1453-08CP Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 5. Insertion Loss VS. Frequency (CM1453-08: Filter 5) Figure 6. Insertion Loss VS. Frequency (CM1453-08: Filter 6) Rev. 2 | Page 8 of 12 | www.onsemi.com CM1453-08CP Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 7. Insertion Loss VS. Frequency (CM1453-08: Filter 7) Figure 8. Insertion Loss VS. Frequency (CM1453-08: Filter 8) Rev. 2 | Page 9 of 12 | www.onsemi.com CM1453-08CP Performance Information (cont’d) Figure 9. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5V d.c) Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. See http://www.wlcspforum.org/documents/pdf/ap-217.pdf for download. Rev. 2 | Page 10 of 12 | www.onsemi.com CM1453-08CP Mechanical Specifications CM1453 devices are packaged in custom Chip Scale Packages (CSP). See Application Note AP-217 for more information at: http://www.wlcspforum.org/documents/pdf/ap-217.pdf. PACKAGE DIMENSIONS Package Custom CSP Bumps 20 Millimeters Inches Dim Min Nom Max Min Nom Max A1 3.229 3.274 3.319 0.1271 0.1289 0.1307 A2 1.099 1.144 1.189 0.0433 0.0450 0.0468 B1 0.395 0.400 0.405 0.0156 0.0157 0.0159 B2 0.195 0.200 0.205 0.0077 0.0079 0.0081 B3 0.342 0.347 0.352 0.0135 0.0137 0.0139 B4 0.342 0.347 0.352 0.0135 0.0137 0.0139 C1 0.187 0.237 0.287 0.0074 0.0093 0.0113 C2 0.175 0.225 0.275 0.0069 0.0089 0.0108 D1 0.545 0.615 0.685 0.0215 0.0242 0.0270 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1453-08CP Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 11 of 12 | www.onsemi.com CM1453-08CP CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1453-08CP 3.27 X 1.14X 0.615 3.40 X 1.27 X 0.73 12mm 330mm (13") 3500 4mm 4mm + + + ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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