NUF8402MN 8 Line EMI Filter with ESD Protection This device is an 8 line EMI filter array for wireless applications. Greater than −35 dB attenuation is obtained at frequencies from 800 MHz to 2.2 GHz. It also offers ESD protection−clamping transients from static discharges. ESD protection is provided across all capacitors. 1 Features • EMI Filtering and ESD Protection • Integration of 24 Discrete Components • Compliance with IEC61000−4−2 (Level 4) • • • • http://onsemi.com 16 Cd Cd 2 15 Cd > 18 kV (Contact) DFN Package, 1.6 x 4.0 mm Moisture Sensitivity Level 1 ESD Ratings: Human Body Model = 3B Machine Model = C This is a Pb−Free Device* Cd 14 3 Cd Cd 4 13 Cd Cd 5 12 Benefits • Reduces EMI/RFI Emissions on a Data Line • Integrated Solution Offers Cost and Space Savings • Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass Filter Response Cd Cd 6 11 Cd Cd Cd Cd 7 • Integrated Solution Improves System Reliability 10 Applications • • • • • 8 EMI Filtering and ESD Protection for Data Lines Wireless Phones Handheld Products Notebook Computers LCD Displays 1 2 3 4 5 6 7 9 Cd (Top View) MARKING DIAGRAM 8 1 16 GND 16 15 14 13 12 11 (Bottom View) Cd DFN CASE 506AC 842 AYW 1 10 842 A Y W 9 Figure 1. Pin Connections = Specific Device Code = Assembly Location = Year = Work Week ORDERING INFORMATION *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Device Package Shipping† NUF8402MNT4G DFN16 (Pb−Free) 4000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2005 May, 2005 − Rev. 2 1 Publication Order Number: NUF8402MN/D NUF8402MN MAXIMUM RATINGS Parameter Symbol Value Unit VPP 18 kV Operating Temperature Range TOP −40 to 85 °C Storage Temperature Range TSTG −55 to 150 °C TL 260 °C ESD Discharge IEC61000−4−2 Contact Discharge Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Test Conditions Min Typ VBR IR = 1.0 mA 6.0 7.0 Leakage Current IR VRWM = 3.3 V Resistance RA IR = 20 mA Capacitance (Notes 1 and 2) Cd Cut−Off Frequency (Note 3) f3dB Parameter Maximum Reverse Working Voltage Breakdown Voltage Symbol VRWM Above this frequency, appreciable attenuation occurs 1. Measured at 25°C, VR = 2.5 V, f = 1.0 MHz. 2. Total Line Capacitance is 2 times the Diode Capacitance (Cd). 3. 50 source and 50 load termination. http://onsemi.com 2 Max Unit 5.0 V 8.0 V 100 nA 85 100 115 15 17 20 pF 105 MHz NUF8402MN TYPICAL PERFORMANCE CURVES (TA= 25°C unless otherwise specified) 0 0 −5 −10 −10 −20 −20 S41 (dB) S21 (dB) −15 −25 −30 −35 −40 −50 −60 −40 −70 −45 −50 1.E+06 −30 1.E+07 1.E+08 1.E+09 −80 1.E+06 1.E+10 1.E+07 1.E+08 1.E+09 1.E+10 FREQUENCY (Hz) FREQUENCY (Hz) Figure 2. Insertion Loss Characteristic (S21 Measurement) Figure 3. Analog Crosstalk Curve (S41 Measurement) 110 2.0 108 RESISTANCE () CAPACITANCE (pF) 106 1.5 1.0 0.5 104 102 100 98 96 94 92 0 0 1.0 2.0 3.0 4.0 90 −40 5.0 −20 0 20 40 60 80 REVERSE VOLTAGE (V) TEMPERATURE (°C) Figure 4. Typical Capacitance vs. Reverse Biased Voltage (Normalized Capacitance Cd at 2.5 V) Figure 5. Typical Resistance over Temperature NORMALIZED CAPACITANCE (%) 102.0 101.5 101.0 100.5 100.0 99.5 99.0 98.5 98.0 −60 −40 −20 0 20 40 60 80 100 TEMPERATURE (°C) Figure 6. Normalized Capacitance over Temperature (Normalized @ 255C, VR = 2.5 V, f = 1 MHz) http://onsemi.com 3 NUF8402MN PACKAGE DIMENSIONS DFN16 CASE 506AC−01 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION b APPLIES TO TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A D B PIN ONE REFERENCE E 2X 0.15 C (A3) TOP VIEW 2X DIM A A1 A3 b D D2 E E2 e K L 0.15 C (A3) 0.10 C A 16X 0.08 C SEATING PLANE SIDE VIEW A1 C D2 16X L 1 SOLDERING FOOTPRINT* e 2X 0.25 x 0.40 mm TEST PAD SIZE 8 4.10 14X 0.50 E2 16X K 16 MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.18 0.30 4.00 BSC 3.10 3.30 1.60 BSC 0.30 0.50 0.50 BSC 0.20 −−− 0.20 0.40 9 16X b NOTE 3 PITCH 0.10 C A B 0.05 C BOTTOM VIEW 0.50 1.91 16X 0.28 16X 0.51 SCALE 16:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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