MC74AC86, MC74ACT86 Quad 2−Input Exclusive−OR Gate Features • Outputs Source/Sink 24 mA • Pb−Free Packages are Available* http://onsemi.com PDIP−14 N SUFFIX CASE 646 14 1 SOIC−14 D SUFFIX CASE 751A MAXIMUM RATINGS Rating Symbol Value Unit DC Supply Voltage (Referenced to GND) VCC −0.5 to +7.0 V DC Input Voltage (Referenced to GND) Vin −0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) Vout −0.5 to VCC +0.5 V DC Input Current, per Pin Iin ±20 mA DC Output Sink/Source Current, per Pin Iout ±50 mA DC VCC or GND Current per Output Pin ICC ±50 mA Storage Temperature Tstg −65 to +150 °C 14 1 TSSOP−14 DT SUFFIX CASE 948G 14 1 SOEIAJ−14 M SUFFIX CASE 965 14 1 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Pinout: 14−Lead Packages Conductors (Top View) VCC 14 13 12 11 10 9 8 1 2 3 4 5 6 7 GND ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 4 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2005 April, 2005 − Rev. 7 1 Publication Order Number: MC74AC86/D MC74AC86, MC74ACT86 RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage Vin, Vout DC Input Voltage, Output Voltage (Ref. to GND) tr, tf Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs Min Typ Max ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 Unit V VCC V VCC @ 3.0 V − 150 − VCC @ 4.5 V − 40 − VCC @ 5.5 V − 25 − VCC @ 4.5 V − 10 − VCC @ 5.5 V − 8.0 − − − 140 °C −40 25 85 °C ns/V tr, tf In ut Rise and Fall Time (Note 2) Input ′ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range IOH Output Current − High − − −24 mA IOL Output Current − Low − − 24 mA ns/V 1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. DC CHARACTERISTICS Symbol VIH VIL VOH VOL TA = +25°C TA = −40°C to +85°C Typ Minimum u High g Level e e Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC − 0.1 V Maximum a u Low o Level e e Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC − 0.1 V Minimum u High g Level e e Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 − − − 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 − − − 0.36 0.36 0.36 0.44 0.44 0.44 55 5.5 − ±0 1 ±0.1 5.5 − 5.5 55 5.5 Parameter Maximum a u Low o Level e e Output Voltage Maximum a u Input u Leakage Current IOLD †Minimum Dynamic O t t Current Output C t ICC 74AC VCC (V) IIN IOHD 74AC Maximum a u Quiescent Qu esce Supply Current Guaranteed Limits Conditions IOUT = −50 A V *VIN = VIL or VIH −12 mA IOH −24 mA −24 mA IOUT = 50 A V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA ±1 0 ±1.0 A VI = VCC, GND − 75 mA VOLD = 1.65 V Max − − −75 mA VOHD = 3.85 V Min − 40 4.0 40 A VIN = VCC or GND *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. http://onsemi.com 2 Unit MC74AC86, MC74ACT86 AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol Parameter 74AC 74AC TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF VCC* (V) Min Typ Max Min Max Unit Fig. No. tPLH Propagation o aga o Delay e ay Inputs to Outputs 3.3 5.0 2.0 1.5 6.0 4.5 11.5 8.5 1.5 1.0 12.5 9.0 ns 3−5 tPHL Propagation o aga o Delay e ay Inputs to Outputs 3.3 5.0 2.0 1.5 6.5 4.5 11.5 8.5 1.5 1.0 12.5 9.5 ns 3−5 *Voltage Range 3.3 V is 3.3 V ±0.3 V Voltage Range 5.0 V is 5.0 V ±0.5 V. DC CHARACTERISTICS Symbol Parameter 74ACT 74ACT TA = +25°C TA = −40°C to +85°C VCC (V) Typ Guaranteed Limits Unit Conditions VIH Minimum u High g Level e e Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum a u Low o Level e e Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum u High g Level e e Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 − − 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 − − 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA ±0 1 ±0.1 ±1 0 ±1.0 A VI = VCC, GND VOL Maximum a u Low o Level e e Output Voltage IOUT = −50 A *VIN = VIL or VIH −24 mA IOH −24 mA V IOUT = 50 A V IIN Maximum a u Input u Leakage Current 55 5.5 ICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V IOLD †Minimum Dynamic O t t Current Output C t 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 55 5.5 − 40 4.0 40 A VIN = VCC or GND IOHD ICC Maximum a u Quiescent Qu esce Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol Parameter 74ACT 74ACT TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF VCC* (V) Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay 5.0 1.5 8.5 9.5 1.0 10.0 ns 3−5 tPHL Propagation Delay 5.0 1.5 7.0 9.5 1.0 10.5 ns 3−5 *Voltage Range 5.0 V is 5.0 V ±0.5 V. http://onsemi.com 3 MC74AC86, MC74ACT86 CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 35 pF VCC = 5.0 V ORDERING INFORMATION Package Shipping† MC74AC86N PDIP−14 25 Units / Rail MC74AC86NG PDIP−14 (Pb−Free) 25 Units / Rail MC74ACT86N PDIP−14 25 Units / Rail MC74ACT86NG PDIP−14 (Pb−Free) 25 Units / Rail MC74AC86D SOIC−14 55 Units / Rail MC74AC86DG SOIC−14 (Pb−Free) 55 Units / Rail MC74AC86DR2 SOIC−14 2500 Tape & Reel MC74AC86DR2G SOIC−14 (Pb−Free) 2500 Tape & Reel MC74ACT86D SOIC−14 55 Units / Rail MC74ACT86DG SOIC−14 (Pb−Free) 55 Units / Rail MC74ACT86DR2 SOIC−14 2500 Tape & Reel MC74ACT86DR2G SOIC−14 (Pb−Free) 2500 Tape & Reel MC74AC86DTR2 TSSOP−14* 2500 Tape & Reel MC74ACT86DTR2 TSSOP−14* 2500 Tape & Reel MC74ACT86MEL SOEIAJ−14 2000 Tape & Reel MC74ACT86MELG SOEIAJ−14 (Pb−Free) 2000 Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. MARKING DIAGRAMS PDIP−14 SOIC−14 TSSOP−14 SOEIAJ−14 MC74AC86N AWLYYWW AC86 AWLYWW AC 86 ALYW 74AC86 ALYW MC74ACT86N AWLYYWW ACT86 AWLYWW ACT 86 ALYW 74ACT86 ALYW A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week http://onsemi.com 4 MC74AC86, MC74ACT86 PACKAGE DIMENSIONS PDIP−14 N SUFFIX CASE 646−06 ISSUE N 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. 8 B 1 7 A F DIM A B C D F G H J K L M N L N C −T− SEATING PLANE J K H D 14 PL G M 0.13 (0.005) M INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 −−− 10 0.015 0.039 MILLIMETERS MIN MAX 18.16 18.80 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 −−− 10 0.38 1.01 SOIC−14 D SUFFIX CASE 751A−03 ISSUE G −A− 14 8 −B− P 7 PL 0.25 (0.010) M B M 7 1 G F R X 45 C −T− SEATING PLANE D 14 PL 0.25 (0.010) M T B J M K S A S http://onsemi.com 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.228 0.244 0.010 0.019 MC74AC86, MC74ACT86 PACKAGE DIMENSIONS TSSOP−14 DT SUFFIX CASE 948G−01 ISSUE A 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S S N 2X 14 L/2 0.25 (0.010) 8 M B −U− L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E K A −V− ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ ÇÇÇ K1 J J1 SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D G H DETAIL E http://onsemi.com 6 DIM A B C D F G H J J1 K K1 L M MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 −−− 1.20 −−− 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0 8 0 8 MC74AC86, MC74ACT86 PACKAGE DIMENSIONS SOEIAJ−14 M SUFFIX CASE 965−01 ISSUE O 14 LE 8 Q1 E HE L 7 1 M DETAIL P Z D VIEW P A e c DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). 0.10 (0.004) http://onsemi.com 7 MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 0 0.70 0.90 −−− 1.42 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 0 0.028 0.035 −−− 0.056 MC74AC86, MC74ACT86 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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