FUJITSU MB40C338V

FUJITSU SEMICONDUCTOR
DATA SHEET
DS04-28221-1E
ASSP For Video Applications
CMOS
3 ch 8-bit 162 MSPS A/D Converter
MB40C338V
■ DESCRIPTION
MB40C338V is a high-speed 3 ch A/D converter using a fast CMOS technology.
■ FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
Resolution
No. of A/D channels
Linearity error
Maximum conversion rate
Power supply voltage
Digital input voltage range
Digital output voltage range
Video amp. input voltage range
Video amp. gain
A/D input capacity
Power dissipation
Additional features
• Package
: 8 bit
: 3 ch
: ±0.40 %(typical)
: 162 MSPS (minimum)
: 3.3 V (typical : internal circuit)
: TTL level
: 3.3 V CMOS level
: 0.7 VP-P (typical)
: 1.9 double fixed
: 15 pF (typical)
: 1100 mW (typical)
: PLL circuit
Video amp. circuit (1.9 double fixed gain, OFF operation is possible)
CLAMP circuit
VRT AMP circuit (RGB 3 ch separate)
VRB AMP circuit (RGB 3 ch common)
Overflow output
High impedance output, power down function
: LQFP120 (16 mm × 16 mm, lead pitch : 0.5 mm)
■ PACKAGE
120-pin plastic LQFP
(FPT-120P-M21)
MB40C338V
■ PIN ASSIGNMENT
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
PVSS
PVDD
HSYNC
HHOLD
PVDD
LPF
PVSS
RREF
RVRT
GVRT
BVRT
RVM
AVSS
AVDD
DVDD
DVSS
OF
DSYNC
DSYNCB
COUT
EXPCLK
EXPCLKB
EXCLK
ADCLKA
ADCLKB
CLK
CLKB
DVDD
DVSS
AVSS
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
BDB5
BDB4
BDB3
BDB2
BDB1
(LSB) BDB0
DVSS
DVDD
(MSB) BDA7
BDA6
BDA5
BDA4
BDA3
BDA2
BDA1
(LSB) BDA0
AVDD
AVSS
DVSS
DVDD
(MSB) GDB7
GDB6
GDB5
GDB4
GDB3
GDB2
GDB1
(LSB) GDB0
DVDD
DVSS
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
RVIN
VRB
GVIN
GVM
BVIN
BVM
VREF
PCLP
AVDD
AVSS
RADIN
VRBM
GADIN
VESD
BADIN
RVRTM
GVRTM
BVRTM
RVCLP
GVCLP
BVCLP
AVSS
AVDD
CS
CK
DATA
DVSS
DVDD
(MSB) BDB7
BDB6
(FPT-120P-M21)
2
RDA0 (LSB)
RDA1
RDA2
RDA3
RDA4
RDA5
RDA6
RDA7 (MSB)
DVDD
DVSS
AVSS
AVDD
RDB0 (LSB)
RDB1
RDB2
RDB3
RDB4
RDB5
RDB6
RDB7 (MSB)
DVDD
DVSS
GDA0 (LSB)
GDA1
GDA2
GDA3
GDA4
GDA5
GDA6
GDA7 (MSB)
MB40C338V
■ PIN DESCRIPTION
Pin No.
Symbol
Description
9, 23, 47,
79, 107
AVDD
Analog power supply (+3.3 V)
28, 38, 50,
59, 70, 82,
93, 106
DVDD
Digital power supply (+3.3 V)
116, 119
PVDD
PLL Power supply pin (+3.3 V)
14
VESD
Digital input power supply for protect device (+3.3 V or +5 V)
10, 22, 48,
80, 91, 108
AVSS
Analog power supply ground pin (0 V)
27, 37, 49,
60, 69, 81,
92, 105
DVSS
Digital power supply ground pin (0 V)
114, 120
PVSS
PLL Power supply ground pin (0 V)
1
3
5
RVIN
GVIN
BVIN
1.9 double amp. input pin
11
13
15
RADIN
GADIN
BADIN
A/D converter input pin
This pin inputs directly is possible when 1.9 double amp.OFF
19
20
21
RVCLP
GVCLP
BVCLP
Clamp voltage setting input pin
16
17
18
RVRTM
GVRTM
BVRTM
Reference voltage output pin on top side
112
111
110
RVRT
GVRT
BVRT
Reference voltage input pin on top side
12
VRBM
Reference voltage output pin on bottom side
2
VRB
Reference voltage input pin on bottom side
109
4
6
RVM
GVM
BVM
Reference 1/2 voltage output pin (Add 0.1 µF for AVSS)
25
CK
Serial data transfer clock input pin
26
DATA
24
CS
98
EXCLK
Serial data input pin
Chip select signal input pin
It is possible to input to the shift register at CS falling
The content of the shift register is executed at CS rising.
Clock input pin for A/D converter (CMOS level)
Fix to “L” level when unused.
Note: The values in parentheses are standard.
(Continued)
3
MB40C338V
(Continued)
Parameter
Symbol
Description
99
EXPCLKB
Differential clock (negative-phase) input pin for A/D converter
Fix to “H” level when unused.
100
EXPCLK
Differential clock (positive-phase) input pin for A/D converter
Fix to “L” level when unused.
8
PCLP
113
RREF
103
DSYNC
102
DSYNCB
95
CLK
94
CLKB
97
ADCLKA
96
ADCLKB
83 to 90
61 to 68
39 to 46
RDA7 to RDA0
GDA7 to GDA0
BDA7 to BDA0
Digital output pin (Port A)
RDA7, GDA7, BDA7 : MSB
RDA0, GDA0, BDA0 : LSB
71 to 78
51 to 58
29 to 36
RDB7 to RDB0
GDB7 to GDB0
BDB7 to BDB0
Digital output pin (Port B)
RDB7, GDB7, BDB7 : MSB
RDB0, GDB0, BDB0 : LSB
101
COUT
115
LPF
117
HHOLD
Phase detector operation is hold by input “H” level
118
HSYNC
Horizontal sync signal input pin
7
VREF
Internal voltage output pin (Add 3.3µF for AVSS)
104
OF
Overflow output pin (“H” level output at overflow)
Clamp pulse input pin
Internal current setting pin (Add 12 kΩ for AVSS)
Delay sync signal output pin
Inverted delay sync signal output pin
Clock output pin (See “ ■ TIMING DIAGRAM ”.)
PLL counter output pin
External capacitor/resistor connection pin
Note: The values in parentheses are standard.
4
PECL level
MB40C338V
■ BLOCK DIAGRAM
VESD
AVDD
DVDD
RVRT RVRTM VRB VRBM
RVM GVM BVM
OF
PCLP
RADIN
× 3 ch
AMP + CLAMP + A/D
× 1.9
A ch
8
8 bit A/D
RVIN
Buffer
8
RDA0
∼ RDA7
B ch
8
8 bit A/D
8
Buffer
RDB0
∼ RDB7
Buffer
ADCLKA
Buffer
ADCLKB
RVCLP
PLL block
RESET
DVSS
Buffer
DSYNC
Buffer
DSYNCB
DIV
Buffer
CLK
2 bit
(1 ∼ 1/8)
Buffer
CLKB
Delay
CLK Delay
6 bit
(32 divide, 2CLK)
HSYNC
POL
PD
CP
VCO
(1 bit)
MUX
Counter
HHOLD
AVSS
1/2
2 bit (0 ∼ 3 CLK)
11 bit Shift Reg
(12 bit)
COUT
LPF
EXPCLKB
EXCLK
EXPCLK
PVSS PVDD CK DATA CS
Filter
5
MB40C338V
■ ABSOLUTE MAXIMUM RATINGS
Parameter
Power supply voltage
Input/output voltage
Storage temperature
Symbol
Rating
Unit
Min.
Max.
AVDD, DVDD, PVDD
−0.3
+4.0
V
VESD
−0.3
+7.0
V
RVIN, GVIN, BVIN,
RADIN, GADIN, BADIN,
RVCLP, GVCLP, BVCLP,
RVRT, GVRT, BVRT,
RVRTM, GVRTM, BVRTM,
VRB, VRBM,
RVM, GVM, BVM, VREF, RREF
−0.3
AVDD+0.3*1
V
RDA0 to RDA7, RDB0 to RDB7,
GDA0 to GDA7, GDB0 to GDB7,
BDA0 to BDA7, BDB0 to BDB7,
DSYNC, DSYNCB, OF,
COUT, CLK, CLKB,
ADCLKA, ADCLKB
−0.3
DVDD+0.3*1
V
LPF
−0.3
PVDD+0.3*1
V
CK, DATA, CS,
EXPCLKB, EXPCLK,
PCLP, EXCLK,
HHOLD, HSYNC
−0.3
VESD+0.3*2
V
TSTG
−55
+125
°C
*1 : Do not exceed +4.0 V.
*2 : Do not exceed +7.0 V.
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
6
MB40C338V
■ RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Value
Unit
Min.
Typ.
Max.
AVDD, DVDD
3.00
3.30
3.60
V
PVDD
3.00
3.30
3.60
V
VESD
3.00

5.25
V
A/D converter input voltage
VADIN
VRB

VRT
V
Analog reference voltage: T
VRT

2.2
AVDD − 0.6
V
Analog reference voltage : B
VRB
0.6
0.7

V
VRT − VRB
1.0
1.5
1.8
V
VIN (P-P)
0.5

0.9
VP-P
Clamp input voltage
VCLP
0.6
VRB
1.7
V
Digital “H” level input voltage
VIHD
2.5

VESD
V
Digital “L” level input voltage
VILD
0

0.5
V
Digital “H” level output current
IOHD
−400


µA
Digital “L” level output current
IOLD


1.6
mA
PLL counter
PC
100

4095

HSYNC input frequency range
fHSYNC
10

100
kHz
HHOLD set up time
tsHHOLD
20


ns
HHOLD hold time
thHHOLD
20


ns
Clamp pulse width
tWCLP
0.5


µs
tWCKL, tWCKH
100


ns
DATA set up time
tsDATA
30


ns
DATA hold time
thDATA
30


ns
CS set up time
tsCS
50


ns
CS hold time
thCS
50


ns
tWCSH
100


ns
Ta
−20

70
°C
Power supply voltage
Analog reference voltage range
Video AMP input voltage
CK clock pulse width
CS “H” level hold time
Operating temperature range
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
7
MB40C338V
■ ELECTRICAL CHARACTERISTICS
1. DC Characteristics in Analog Section
• Power supply current
(AVDD = DVDD = PVDD = 3.0 V to 3.6 V, VESD = 3.0 V to 5.25 V, Ta = −20 °C to +70 °C)
Value
Parameter
Symbol
Unit
Min.
Typ.
Max.
Analog power supply current
AIDD

220
310
mA
Digital power supply current
DIDD

100
110
mA
Power supply current PLL section
(@ fVCOH = 162 MHz, Icp = 0.5 mA, DIV = 1/1)
PIDD

16
20
mA
ISB

10

mA
Standby current
• A/D Block
Parameter
(AVDD = DVDD = PVDD = 3.0 V to 3.6 V, VESD = 3.0 V to 5.25 V, Ta = −20 °C to +70 °C)
Value
Symbol
Unit
Min.
Typ.
Max.
Resolution


8

bit
Linearity error (DC Accuracy)
LE
−0.8
±0.4
+0.8
%
DLE
−0.36
±0.2
+0.65
%
Analog reference voltage input current
IRT, IRB

5
20
µA
ADIN input capacity
CADIN

15

pF
Differential linearity error
(DC Accuracy)
(AVDD = DVDD = PVDD = 3.0 V to 3.6 V, VESD = 3.0 V to 5.25 V, Ta = −20 °C to +70 °C)
Value
Symbol
Unit
Min.
Typ.
Max.
• Video AMP Block
Parameter
GAMP
1.8
1.9
2.0

VAMPOUT
0.5

AVDD − 0.6
V
Video AMP frequency width
BW

250

MHz
Video AMP input capacity
CVIN

5

pF
Video AMP gain
Video AMP output voltage range
• CLAMP Block
Parameter
VCLP input current
Clamp voltage
• PLL Block
(AVDD = DVDD = PVDD = 3.0 V to 3.6 V, VESD = 3.0 V to 5.25 V, Ta = −20 °C to +70 °C)
Value
Symbol
Unit
Min.
Typ.
Max.
ICLP

5
20
µA
VCLAMP
VCLP − 0.1
VCLP
VCLP + 0.1
V
(AVDD = DVDD = PVDD = 3.0 V to 3.6 V, VESD = 3.0 V to 5.25 V, Ta = −20 °C to +70 °C)
Value
Parameter
Symbol
Unit
Min.
Typ.
Max.
CLK jitter (@ fHSYNC = 79.98 kHz, fCLK = 135.0 MHz)
8
Ptj

1.0
1.5
ns
MB40C338V
2. DC characteristics in Digital Section
(AVDD = DVDD = PVDD = 3.0 V to 3.6 V, VESD = 3.0 V to 5.25 V, Ta = −20 °C to +70 °C)
Parameter
Value
Symbol
Unit
Min.
Typ.
Max.
IID
−20

5
µA
Digital “H” level output voltage
VOHD
DVDD − 0.4


V
Digital “L” level output voltage
VOLD


0.4
V
Digital input current
3. Switching Characteristics
(AVDD = DVDD = PVDD = 3.0 V to 3.6 V, VESD = 3.0 V to 5.25 V, Ta = −20 °C to +70 °C)
Parameter
A/D Maximum
conversion rate
Symbol
Min.
Typ.
Max.
Unit
Timing diagram 1
fS1
100


MSPS
Timing diagram 2
fS2
162


MSPS
tAD

1.5

ns
VCOL
fVCOL
75

140
MHz
VCOH
fVCOH
85

162
MHz
tpd (HSYNC-CLK)
1.0
2.0
4.0
ns
tpd (CLK-ADCLK1)
0.0
1.0
2.0
ns
tpd (CLK-DATA1)
2.5
4.0
6.0
ns
tpd (CLK-ADCLK2)
0.0
1.0
2.0
ns
tpd (CLK-DATA2)
2.5
4.0
6.0
ns
tpd (CLK-DSYNC)
0.5
1.5
2.0
ns
Aperture time
VCO oscillation
frequency
Value
CLK output delay time
Timing diagram 1
Digital output delay
time
Timing diagram 2
DSYNC output delay time
■ DIGITAL OUTPUT BUFFER LOAD CIRCUIT
To the
measurement
point
Measurement point
CL = 15 pF
DVSS
Note: CL includes a stray capacitance of a probe and a fixture.
9
MB40C338V
■ SERIAL DATA SETTING (MSB FAST)
(Address)
(Data)
LSB
RES
MSB
D0
D1
D2
D3
D4
D5
D6
D7
D8
0
0
0
0
0
0
X
X
X
X
X
CE : 0 = operation mode, 1 = all function
power off
0
0
0
0
0
0
X
X
X
X
X
DSEL : 0 = demultiplex output,
1 = straight output
0
0
0
0
0
0
X
X
X
X
X
Video AMP : 0 = operation , 1 = off
1
1
0
0
0
0
0
0
0
0
1
0
Counter low ranking 8 bit
2
0
1
0
0
0
0
0
X
X
X
X
Counter high ranking 4 bit
1
1
0
0
0
0
0
0
0
1
0
CLK delay adjust*1 : td = N / (32 × fCLK)
1
1
0
0
0
0
0
0
0
1
0
HSYNC polarity : 0 = through,
1 = inversion
1
1
0
0
0
0
0
0
0
1
0
A/D converter output : 0 = operation,
1 = high impedance
0
0
1
0
0
0
0
0
0
1
0
CLK output : 0 = on, 1 = “L”
0
0
1
0
0
0
0
0
0
1
0
CLKB output : 0 = on, 1 = “L”
0
0
1
0
0
0
0
0
0
1
0
DSYNC output : 0 = on, 1 = “L”
0
0
1
0
0
0
0
0
0
1
0
DSYNCB output : 0 = on, 1 = “L”
0
0
1
0
0
0
0
0
0
1
0
ADCLKA output : 0 = on, 1 = “L”
0
0
1
0
0
0
0
0
0
1
0
ADCLKB output : 0 = on, 1 = “L”
0
0
1
0
0
0
0
0
0
1
0
DSYNC delay*2 : 0, 1, 2, 3
1
0
1
0
0
0
0
0
0
1
0
CLK change : 0 = VCO,
1 = External clock
1
0
1
0
0
0
0
0
0
1
0
External clock input : 0 = CMOS,
1 = PECL
1
0
1
0
0
0
0
0
0
1
0
Counter operation : 0 = on, 1 = off
1
0
1
0
0
0
0
0
0
1
0
Charge pump current*3 :
0.1 mA, 0.5 mA, 1 mA
1
0
1
0
0
0
0
0
0
1
0
VCO select : 0 = VCOL, 1 = VCOH
1
0
1
0
0
0
0
0
0
1
0
Divider setting*4 : 1, 1/2, 1/4, 1/8
0
3
4
5
D9 D10
Function
*1 : Setting at 6bit Resolution : 1/32 × CLK, Setting range : 0 to 63/32 × CLK
*2, *3, *4 : See under table
Setting
DSYNC delay*2
Charge pump current*
Divider setting*
10
4
3
0 (0, 0)
1 (1, 0)
2 (0, 1)
3 (1, 1)
0 CLK
1 CLK
2 CLK
3 CLK
0.1 mA
0.5 mA
1.0 mA

1/1
1/2
1/4
1/8
MB40C338V
Example: input at 16 bit
MSB
DATA input
LSB
Invalid data
DATA
(5 bit)
Address
(8 bit)
(3 bit)
CS input
■ RECOMMENDED VALUE OF SERIAL DATA SETTING
UXGA
SXGA
XGA
SVGA
VGA
PAL
NTSC
fCLK (MHz)
fHSYNC (kHz)
Counter
Icp (mA)
VCO select
Divider
fVCO (MHz)
162.000
75.000
2160
0.5
VCOH
1/1
162.000
157.500
91.146
1728
0.5
VCOH
1/1
157.500
135.000
81.130
1664
0.5
VCOH or VCOL
1/1
135.000
108.000
64.904
1664
0.5
VCOH or VCOL
1/1
108.000
94.500
68.677
1376
0.5
VCOH or VCOL
1/1
94.500
78.750
60.023
1312
0.5
VCOL
1/1
78.750
75.000
56.476
1328
0.5
VCOH
1/2
150.000
65.000
48.363
1344
0.5
VCOH or VCOL
1/2
130.000
56.250
53.674
1048
0.5
VCOH or VCOL
1/2
112.500
50.000
48.077
1040
0.5
VCOH or VCOL
1/2
100.000
49.500
46.875
1056
0.5
VCOH or VCOL
1/2
99.000
40.000
37.879
1056
0.5
VCOL
1/2
80.000
36.000
43.269
832
0.5
VCOH
1/4
144.000
31.500
37.861
832
0.5
VCOH or VCOL
1/4
126.000
25.175
31.469
800
0.5
VCOH or VCOL
1/4
100.700
25.149
31.436
800
0.5
VCOH or VCOL
1/4
100.596
29.375
15.625
1880
0.5
VCOH or VCOL
1/4
117.500
22.031
15.625
1410
0.5
VCOH or VCOL
1/4
88.125
14.688
15.625
940
0.5
VCOH or VCOL
1/8
117.500
24.545
15.734
1560
0.5
VCOH or VCOL
1/4
98.180
18.409
15.734
1170
0.5
VCOH
1/8
147.270
12.273
15.734
780
0.5
VCOH or VCOL
1/8
98.180
VCO select : VCOH (fVCO = 85 MHz to 162 MHz)
VCOL (fVCO = 75 MHz to 140 MHz)
fCLK = fHSYNC × Counter
fVCO = fHSYNC × Counter/Divider
11
MB40C338V
■ TIMING DIAGRAM
• Straight Output Mode (Timing Diagram 1)
VIHD
HSYNC input
VILD
tpd (HSYNC-CLK)
VOHD
CLK output
CLKB output
VOLD
tpd (CLK-DSYNC)
VOHD
DSYNC output
VOLD
tpd (CLK-ADCLK1)
VOHD
ADCLKA output
VOLD
VOHD
ADCLKB output
VOLD
N+1
N
N+2
N+3
N+4
N+5
N+6
N+7
N+8
N+9
ADIN input
tAD
tpd (CLK-DATA1)
VOHD
DA0 to DA7 output
X
X
X
X
X
X
X
X
N
N+1
N+2
N+3
X
X
N
N+1
N+2
N+3
VOLD
VOHD
ALL “L” fix
DB0 to DB7 output
VOLD
VOHD
OF output
VOLD
X
X
X
X
X
X
• ADIN input - Sampling at CLK rising (at CLKB falling)
• DA0 to DA7 - Output (after 5 CLK + tpd (CLK-DATA1) from sampling ) at CLK rising (at CLKB falling)
12
MB40C338V
• Demultiplex Output (in- phase) Mode (Timing Diagram 2)
VIHD
HSYNC input
VILD
tpd (HSYNC-CLK)
VOHD
CLKB output
CLK output
VOLD
tpd (CLK-DSYNC)
VOHD
DSYNC output
VOLD
tpd (CLK-ADCLK2)
VOHD
ADCLKA output
VOLD
VOHD
ADCLKB output
VOLD
N+1
N
N+2
N+3
N+4
N+5
N+6
N+7
N+8
N+9
ADIN input
tAD
tpd (CLK-DATA2)
VOHD
DA0 to DA7 output
VOLD
X
X
X
X
X
N
N+2
VOHD
DB0 to DB7 output
VOLD
X
X
X
X
X
N+1
N+3
X
X
X
X
X
N
N+2
VOHD
OF output
VOLD
• ADIN input - Sampling at CLK rising (at CLKB falling)
• DA0 to DA7 - Output (after 6 CLK + tpd (CLK-DATA2) from sampling ) at CLK rising (at CLKB falling)
• DB0 to DB7 - Output (after 5 CLK + tpd (CLK-DATA2) from sampling ) at CLK rising (at CLKB falling)
13
MB40C338V
■ CLAMP and AMP OPERATION
Amp/CLAMP circuit
−
RVCLP
+
Clamp pulse
RVIN
Image signal
+
10 µF
× 1.9
RADIN
−
R1
R2
Internal BIAS
(0.6 × AVDD)
< For example, Sync on G signal input >
0.7 Vp-p
GVIN
PCLP
GVRT
1.33 VP-P (fixed)
GADIN
GVCLP
VRB
Contrast adjust : controlling the voltage difference between VRT and VRB (typ : VRT − VRB = 1.33 V)
Brightness adjust : controlling the voltage difference between VCLP and VRB (typ : VCLP = VRB)
14
MB40C338V
■ CLAMP SIGNAL and HOLD SIGNAL
HSYNC input
thHHOLD
tsHHOLD
thHHOLD
tsHHOLD
HHOLD input
tWCLP
PCLP input
CLK output
■ SERIAL DATA TRANSFER TIMING
DATA input
D10
D9
tWCKL tWCKH
D8
D7
D1
D0
tsDATA thDATA
CK input
tsCS
thCS
tWCSH
CS input
15
AVDD
(+3.3 V)
AVSS
(0 V)
+
100 µF
Serial Data
VCLP
+3.3 V or +5 V
10 µF
75Ω 10 µF
75Ω
75Ω
10 µF VRB
HSYNC
100 µF
+
+
PCLP
BVIN
GVIN
RVIN
PVDD
(+3.3 V)
PVSS
(0 V)
1 RVIN
2 VRB
3 GVIN
4 GVM
5 BVIN
6 BVM
7 VREF
8 PCLP
9 AVDD
10 AVSS
11 RADIN
12 VRBM
13 GADIN
14 VESD
15 BADIN
16 RVRTM
17 GVRTM
18 BVRTM
19 RVCLP
20 GVCLP
21 BVCLP
22 AVSS
23 AVDD
24 CS
25 CK
26 DATA
27 DVSS
28 DVDD
29 BDB7 (MSB)
30 BDB6
VRT
12 kΩ
0.1 µF
1.6 kΩ
(LSB) RDA0 90
RDA1 89
RDA2 88
RDA3 87
RDA4 86
RDA5 85
RDA6 84
(MSB) RDA7 83
DVDD 82
DVSS 81
AVSS 80
AVDD 79
(LSB) RDB0 78
RDB1 77
RDB2 76
RDB3 75
RDB4 74
RDB5 73
RDB6 72
(MSB) RDB7 71
DVDD 70
DVSS 69
(LSB) GDA0 68
GDA1 67
GDA2 66
GDA3 65
GDA4 64
GDA5 63
GDA6 62
(MSB) GDA7 61
(MB40C338V)
PVSS 120
PVDD 119
HSNYC 118
HHOLD 117
PVDD 116
LPF 115
PVSS 114
RREF 113
RVRT 112
GVRT 111
BVRT 110
RVM 109
AVSS 108
AVDD 107
DVDD 106
DVSS 105
OF 104
DSYNC 103
DSYNCB 102
COUT 101
EXPCLK 100
EXPCLKB 99
EXCLK 98
ADCLKA 97
ADCLKB 96
CLK 95
CLKB 94
DVDD 93
DVSS 92
AVSS 91
16
+
31 BDB5
32 BDB4
33 BDB3
34 BDB2
35 BDB1
36 BDB0 (LSB)
37 DVSS
38 DVDD
39 BDA7 (MSB)
40 BDA6
41 BDA5
42 BDA4
43 BDA3
44 BDA2
45 BDA1
46 BDA0 (LSB)
47 AVDD
48 AVSS
49 DVSS
50 DVDD
51 GDB7 (MSB)
52 GDB6
53 GDB5
54 GDB4
55 GDB3
56 GDB2
57 GDB1
58 GDB0 (LSB)
59 DVDD
60 DVSS
HHOLD
0.001 µF
100 µF +
DVDD
(+3.3 V)
DVSS
(0 V)
Note : Unexpresstion
capacitance values
are all 1 µF
EXPCLK
EXPCLKB
EXCLK
MB40C338V
■ TYPICAL APPLICATION
+
MB40C338V
■ USAGE PRECAUTIONS
Be sure to ground the pins of AVDD, DVDD, PVDD, VESD, RVRTM, GVRTM, BVRTM, VRBM, RVM, GVM, BVM and VREF via
high-frequency capacitor.
Place the high-frequency capacitor as close as possible to the pin.
■ ORDERING INFORMATION
Part number
MB40C338VPFV
Package
Remark
120-pin plastic LQFP
(FPT-120P-M21)
17
MB40C338V
■ PACKAGE DIMENSION
120-pin plastic LQFP
(FPT-120P-M21)
18.00±0.20(.709±.008)SQ
16.00±0.10(.630±.004)SQ
90
61
91
60
0.08(.003)
Details of "A" part
+0.20
1.50 –0.10
+.008
(Mounting height)
.059 –.004
INDEX
120
LEAD No.
1
30
0.50(.020)
C
18
0~8°
"A"
31
1998 FUJITSU LIMITED F120033S-2C-2
0.22±0.05
(.009±.002)
0.08(.003)
M
0.145
.006
+0.05
–0.03
+.002
–.001
0.45/0.75
(.018/.030)
0.10±0.05
(.004±.002)
(Stand off)
0.25(.010)
Dimension in mm (inches)
MB40C338V
FUJITSU LIMITED
For further information please contact:
Japan
FUJITSU LIMITED
Corporate Global Business Support Division
Electronic Devices
Shinjuku Dai-Ichi Seimei Bldg. 7-1,
Nishishinjuku 2-chome, Shinjuku-ku,
Tokyo 163-0721, Japan
Tel: +81-3-5322-3347
Fax: +81-3-5322-3386
http://www.fujitsu.co.jp/
North and South America
FUJITSU MICROELECTRONICS, INC.
3545 North First Street,
San Jose, CA 95134-1804, U.S.A.
Tel: +1-408-922-9000
Fax: +1-408-922-9179
Customer Response Center
Mon. - Fri.: 7 am - 5 pm (PST)
Tel: +1-800-866-8608
Fax: +1-408-922-9179
http://www.fujitsumicro.com/
Europe
FUJITSU MICROELECTRONICS EUROPE GmbH
Am Siebenstein 6-10,
D-63303 Dreieich-Buchschlag,
Germany
Tel: +49-6103-690-0
Fax: +49-6103-690-122
http://www.fujitsu-fme.com/
Asia Pacific
FUJITSU MICROELECTRONICS ASIA PTE. LTD.
#05-08, 151 Lorong Chuan,
New Tech Park,
Singapore 556741
Tel: +65-281-0770
Fax: +65-281-0220
http://www.fmap.com.sg/
Korea
FUJITSU MICROELECTRONICS KOREA LTD.
1702 KOSMO TOWER, 1002 Daechi-Dong,
Kangnam-Gu,Seoul 135-280
Korea
Tel: +82-2-3484-7100
Fax: +82-2-3484-7111
F0009
 FUJITSU LIMITED Printed in Japan
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information and circuit diagrams in this document are
presented as examples of semiconductor device applications, and
are not intended to be incorporated in devices for actual use. Also,
FUJITSU is unable to assume responsibility for infringement of
any patent rights or other rights of third parties arising from the use
of this information or circuit diagrams.
The contents of this document may not be reproduced or copied
without the permission of FUJITSU LIMITED.
FUJITSU semiconductor devices are intended for use in standard
applications (computers, office automation and other office
equipments, industrial, communications, and measurement
equipments, personal or household devices, etc.).
CAUTION:
Customers considering the use of our products in special
applications where failure or abnormal operation may directly
affect human lives or cause physical injury or property damage, or
where extremely high levels of reliability are demanded (such as
aerospace systems, atomic energy controls, sea floor repeaters,
vehicle operating controls, medical devices for life support, etc.)
are requested to consult with FUJITSU sales representatives before
such use. The company will not be responsible for damages arising
from such use without prior approval.
Any semiconductor devices have inherently a certain rate of failure.
You must protect against injury, damage or loss from such failures
by incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of
over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Control Law of Japan, the
prior authorization by Japanese government should be required for
export of those products from Japan.