0.635mm Pitch S.O. DIMM Socket SX1 Series Variation in Mounting Height ● Low Profile Type (Mounting Height: 4.0mm) ● Standard Type (Mounting Height: 5.5mm) ■Features 1. 72pos. Small Outline DIMM Socket SX1 series is a 0.635mm pitch horizontal SMT type socket applicable to Small Outline DIMM standardized in JEDEC. The size is about half as large as the conventional 72 contacts DRAM SIMM socket. Corresponding to double density (both surfaces), this socket realizes high functionality and density of the module board. ● High Profile Type (Mounting Height: 8.0mm) 2. Variation in Mounting Height Three grades of variation are available for the mounting height. 3. Easy Insertion and Extraction of Module Board One-touch operation to insert the module board slantly and push it downward. Widen latches right and left, and the module board will be automatically raised. This mechanism allows easy automatic insertion and extraction. 4. Achieve High Performance Easy Insertion and Extraction Operation of Module Board This socket achieves high performance by the wiping effect in the insertion and the unique press-fit face contact. 5. Insertion and Extraction Operation with Click Sensibility The unique mold twin-latch allows excellent insertion and extraction operation with a sensible click. ■Applications Personal computers, business equipment, Measuring instrument, telecommunication equipment, FA, game, etc. D31 ■Product Specifications Current rating -55ç+85ç Voltage rating 125V AC Operating Temperature Range 0.5A Rating Item Operating Humidity Range -55ç to +85ç Specification Condition 35m ohms min. 100mA 2. Insulation Resistance 1000M ohms min. 250V DC 3. Withstanding voltage No flashover or insulation breakdown. 250V AC / 1 minute 4. Vibration No electrical discontinuity of 1µs or more 5. Humidity Contact resistance: 55m ohms max. 96 hours at temperature of 40ç Insulation Resistance: 1000M ohms min and humidity of 90% to 95% 1. Contact Resistance (Steady state) 6. Temperature Cycle 7. Durability (Insertion/withdrawal) 8. Salt spray Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 50 minutes in each of the 3 directions. 5 cycles under following condition; Contact resistance: 55m ohms max. Insulation Resistance: 1000M ohms min: Temperature : -55➝ +5 to 35➝ +85➝ +5 to 35ç Time : -30➝ 10 to 15➝ +30➝ 10 to 15 Contact resistance: 55m ohms max. 30 cycles Contact resistance: 55m ohms max. Exposed to density 5% salt water for 48 hours ■Material Part Material Finish Contact Phosphor copper Selictive Gold plating Insulator Metal Fitting PA(UL94V-0) ---------- Phosphor copper Solder plating ■Ordering Information SX1 C A - 72 S - 0.635 SH q q Series Name w e r : SX1 w Mounting Height B : Standard type (Height: 5.5mm) C : High profile type (Height: 8.0mm) E : Low profile type (Height: 4.0mm) e DIMM Key None : 3.3V type A D32 : 5V type t y u r Number of Contacts : 72 t Contact Type : Female contact y Contact Pitch : 0.635mm u Contact type SH : SMT type ■Standard Type Part Number CL No. π SX1B-72S-0.635SH 530-0018-9 π SX1BA-72S-0.635SH 530-0019-1 Number of Contacts 72 Key D Remarks 3.3V Type 3.1 Selective gold plating 5V Type 5.4 Selective gold plating Note 1: The tube packaging product is provided for products marked with *. In order to designate the tube package product, add (20) to the tail of the Part Number (Delivery unit: 20 pcs per set) Note 2: The 3.3V and 5V keys correspond to the Small Outline DIMM key. ■High Profile Type Part Number CL No. SX1C-72S-0.635SH 530-0003-1 SX1CA-72S-0.635SH 530-0004-4 Number of Contacts 72 Key D Remarks 3.3V Type 3.1 Selective gold plating 5V Type 5.4 Selective gold plating Note 2: The 3.3V and 5V keys correspond to the Small Outline DIMM key. D33 ■Low Profile Type Part Number CL No. SX1E-72S-0.635SH 530-0006-0 SX1EA-72S-0.635SH 530-0007-2 Number of Contacts 72 Key D Remarks 3.3V Type 3.1 Selective gold plating 5V Type 5.4 Selective gold plating Note 2: The 3.3V and 5V keys correspond to the Small Outline DIMM key. BRecommended Temperature Profile ● IR Reflow: Recommended Temperature Profile (Up to second reflow) 240 Soldering iron temperature: 300±10ç 235 220 Manual soldering time: 3 seconds max. The temperature may be slightly changed according to solder paste types and amount. Temperature This temperature profile is recommended. 5 seconds max. 250 ● Manual Soldering 200 180 150 140 (ç) ●Applicable Conditions Reflow system : IR reflow Solder : Paste type 63 Sn/37 Pb (Flux content 11 wt%) Preheating time, 80 seconds Test board Glass epoxy 110mm x 85mm x 1.6 mm Metal mask thickness: 0.15 mm Recommended temperature profile. The temperature may be slightly changed according to the solder paste type and amount. D34 (Time) Soldering time, Naturally 30 seconds exposed BRecommended Module Board Dimensions Unit: mm A B 3.3V 5V 25.40 3.18 6.35 31.75 3.18 6.35 38.10 3.18 6.35 BPCB mounting pattern D35 BPrecautions for use Latch knob Side notch Latch claw Latch section Latch arm Polarizing key Procedures for Board Insertion Key 1. Adjust the socket polarizing key and the board key to the same direction. 2. Insert the board obliquely. Moreover, lay the board in parallel to the opening at angle of 20° to 30° , and softly insert the board so as to hit the socket bottom. Stopping insertion halfway will result in improper insertion. Procedures for Board Insertion q 3. Applying the board side notch in parallel to the socket bottom so that the board position cannot be displaced, press the board side notch up, and fix it to the latch portion at both socket edges. Press the board side notch, and release the notch with a snap "click" tone, if the printed board exceeds the latch claw head. 3. With this action, the board has been completely installed in the socket. At this time, pressing force is equivalent to the extent to turn on the electric product switch. If the stronger pressing force is needed, check whether the direction and depth to insert the board is adequate or not, and then re-push the board. Procedures for Board Extraction w Standard type and high profile type Apply the thumb nail to the latch knob at both socket edges. Forcibly widen the latch knobs to right and left ways, and release the latch. Then, draw the board out along an angle where the board is raised. Low profile type Press the top of the latch unit down with fingers to release the latch, and directly draw the board out. Cautions 1. The latch has strength enough to endure. However, if force is applied according to other operation methods instead of the Procedures for Handling Sockets, or if further force is given in the state where the module board is raised, products could be damaged. Be sure to observe the Procedures for Handling Sockets. e 2. The board is designed in compliance with JEDEC "Small Outline DIMM (Dual Inline Memory Module". However, if the board is used instead of the recommended module board, or if the mounting product is used for other devices than DRAM memory IC, troubles due to vibration or other failures could occur. If needed, consult the HRS company. 3. The above illustration shows SX1B. 4. The recommended module board pad or sharp angle edges could cause failure in contacts. Therefore, it is recommended to offset the tie-bar from the center line, set the internal pad (0.1mm), or remove sharp corners or burrs according to the recommended sizes. 5. Don't provide the external contact surface of the module board with the convex/concave and chamfer areas at both edges. Comply with the recommended sizes. 6. When the board is mounted or housing is installed, if warpage or flexure has occurred, an excessive load could cause changes in the solder bonding area and the strength. Check individual conditions. D36 Procedures for Board Extraction