MITSUBISHI LASER DIODES ML9xx37 SERIES PRELIMINARY Notice: Some parametric limits are subject to change High Power InGaAsP DFB LASER DIODE ML99237/ML9SM37 TYPE NAME DESCRIPTION APPLICATION CW light source for external modulator ML9xx37 series are high power DFB (Distributed Feedback) laser diodes for optical transmission emitting light beam at 1550nm. ML9xx37 achieves 60mW CW operation with stable single longitudinal mode oscillation and narrow linewidth. ML9xx37 is a suitable light source for a 10Gbps/40Gbps external modulator. FEATURES High power operation: 60mW (@25 oC ) High side-mode suppression ratio: 45dB (typ) Narrow line width: 0.5MHz (typ) Small size chip-on-carrier ABSOLUTE MAXIMUM RATINGS Parameter Symbol Ratings Conditions Unit Po Optical output power CW 80 mW If Laser forward current - 45 0 mA VRL Laser reverse voltage - 2 Tsld Soldering temperature 1 minute 320 Operation temperature - Storage temperature - Tc Tstg V o C +15 ~ +35 o C -40 ~+100 o C ELECTRICAL/OPTICAL CHARACTERISTICS (Tc=25 C) o Parameter Symbol Conditions Min. Limits Typ. Max . Unit Ith Threshold current CW - 20 35 mA Iop Operation current CW,Po=60 mW - 20 0 30 0 mA Vop Operating voltage CW,Po=60 mW - 1.8 2.5 V η λp Slope efficiency CW,Po=60 mW 0.30 0.35 - mW/mA Peak wavelength CW,Po=60 mW 1530 1550 1565 nm Side mode suppression ratio CW,Po=60 mW 35 45 - dB Beam divergence angle (parallel) CW,Po=60 mW - 20 40 deg. (perpendicular) CW,Po=60 mW - 25 45 deg. SMSR θ θ⊥ ∆f Linewidth CW,Po=60 mW - 0.5 1.0 MHz RIN Relative Intensity Noise CW,Po=60 mW,0.5~10GHz - - -145 dB/Hz MITSUBISHI ELECTRIC Feb. 2003 MITSUBISHI LASER DIODES ML9xx37 SERIES High Power InGaAsP DFB LASER DIODE OUTLINE DRAWINGS ML99237 (2) 3.0±0.1 Beam Point (1) (2) φ 1.0±0.1 Light output 2.0 2.0 1.0±0.1 (1) Case 6.0±0.2 ML9SM37 ( 1 ) Anode electrode ( 2 ) Cathode electrode (2) Residual Solder (Au80Sn20) Light output 0±0.06 (Beam Point) front facet (1) Case 1.2±0.06 0.37±0.05 Au metalized * Notification for a submount product The submount product may show the change of the optical and electrical characteristics due to the influences of an assembly substrate (strain, thermal conductivity, etc.) prepared by the customer. Therefore, the supplier is not obliged to guarantee that all optical and electrical characteristics meet specifications after the shipment. MITSUBISHI ELECTRIC Feb. 2003