MOTOROLA MC68HC705SR3

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TECHNICAL DATA
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MC68HC05SR3
MC68HC05SR3D/H
REV. 2
HC05
MC68HC05SR3
MC68HC705SR3
TECHNICAL
DATA
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GENERAL DESCRIPTION
1
PIN DESCRIPTIONS
2
INPUT/OUTPUT PORTS
3
MEMORY AND REGISTERS
4
RESETS AND INTERRUPTS
5
TIMER
6
ANALOG TO DIGITAL CONVERTER
7
CPU CORE AND INSTRUCTION SET
8
LOW POWER MODES
9
OPERATING MODES
10
ELECTRICAL SPECIFICATIONS
11
MECHANICAL SPECIFICATIONS
12
MC68HC705SR3
A
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1
GENERAL DESCRIPTION
2
PIN DESCRIPTIONS
3
INPUT/OUTPUT PORTS
4
MEMORY AND REGISTERS
5
RESETS AND INTERRUPTS
6
TIMER
7
ANALOG TO DIGITAL CONVERTER
8
CPU CORE AND INSTRUCTION SET
9
LOW POWER MODES
10
OPERATING MODES
11
ELECTRICAL SPECIFICATIONS
12
MECHANICAL SPECIFICATIONS
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A
MC68HC705SR3
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MC68HC05SR3
MC68HC705SR3
High-density Complementary
Metal Oxide Semiconductor
(HCMOS) Microcontroller Units
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subject to change without notice.
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and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
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This document supersedes any earlier documentation relating to the products referred to herein. The information contained
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 MOTOROLA LTD., 1996
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Conventions
Register and bit mnemonics are defined in the paragraphs describing them.
An overbar is used to designate an active-low signal, eg: RESET.
Unless otherwise stated, blank cells in a register diagram indicate that the bit is
either unused or reserved; shaded cells indicate that the bit is not described in the
following paragraphs; ‘u’ is used to indicate an undefined state (on reset).
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SECTION 1
GENERAL DESCRIPTION
SECTION 2
PIN DESCRIPTIONS
SECTION 3
INPUT/OUTPUT PORTS
SECTION 4
MEMORY AND REGISTERS
SECTION 5
RESETS AND INTERRUPTS
SECTION 6
TIMER
SECTION 7
ANALOG TO DIGITAL CONVERTER
SECTION 8
CPU CORE AND INSTRUCTION SET
SECTION 9
LOW POWER MODES
SECTION 10
OPERATING MODES
SECTION 11
ELECTRICAL SPECIFICATIONS
SECTION 12
MECHANICAL SPECIFICATIONS
APPENDIX A
MC68HC705SR3
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TABLE OF CONTENTS
Paragraph
Number
TITLE
Page
Number
1
GENERAL DESCRIPTION
1.1
1.2
Features.................................................................................................................1-1
Mask Options.........................................................................................................1-2
2
PIN DESCRIPTIONS
2.1
Functional Pin Descriptions ...................................................................................2-1
2.2
OSC1 and OSC2 Connections ..............................................................................2-2
2.2.1
Crystal Oscillator..............................................................................................2-3
2.2.2
External Clock..................................................................................................2-3
2.2.3
RC Oscillator Option ........................................................................................2-4
2.3
Pin Assignments ....................................................................................................2-5
3
INPUT/OUTPUT PORTS
3.1
3.1.1
3.1.2
3.2
3.3
3.4
3.5
3.6
3.6.1
Parallel Ports..........................................................................................................3-1
Port Data Registers..........................................................................................3-1
Port Data Direction Registers ..........................................................................3-2
Port A — Keyboard Interrupts (KBI) ......................................................................3-2
PD0:PD5 — ADC Inputs........................................................................................3-2
PD6 — IRQ2..........................................................................................................3-3
Programmable Current Drive .................................................................................3-3
Programmable Pull-Up Devices.............................................................................3-5
Port Option Register ........................................................................................3-5
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4
MEMORY AND REGISTERS
4.1
4.2
4.3
4.4
4.5
I/O Registers .........................................................................................................4-1
RAM ......................................................................................................................4-1
ROM ......................................................................................................................4-1
Memory Map .........................................................................................................4-2
I/O Registers Summary .........................................................................................4-3
5
RESETS AND INTERRUPTS
5.1
RESETS ................................................................................................................5-1
5.1.1
Power-On Reset (POR) ...................................................................................5-1
5.1.2
RESET Pin.......................................................................................................5-1
5.1.3
Low Voltage Reset (LVR) .................................................................................5-2
5.2
INTERRUPTS........................................................................................................5-2
5.2.1
Non-maskable Software Interrupt (SWI) ..........................................................5-3
5.2.2
Maskable Hardware Interrupts.........................................................................5-5
5.2.2.1
External Interrupt (IRQ)..............................................................................5-5
5.2.2.2
External Interrupt 2 (IRQ2).........................................................................5-7
5.2.2.3
Timer Interrupt............................................................................................5-7
5.2.2.4
Keyboard Interrupt (KBI) ............................................................................5-8
6
TIMER
6.1
6.2
6.3
6.4
Timer Overview .....................................................................................................6-1
Timer Control Register (TCR)................................................................................6-3
Timer Data Register (TDR)....................................................................................6-4
Operation during Low Power Modes .....................................................................6-4
7
ANALOG TO DIGITAL CONVERTER
7.1
7.2
7.3
7.4
ADC Operation ......................................................................................................7-2
ADC Status and Control Register (ADSCR)..........................................................7-3
ADC Data Register (ADDR) ..................................................................................7-4
ADC during Low Power Modes..............................................................................7-4
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8
CPU CORE AND INSTRUCTION SET
8.1
Registers ...............................................................................................................8-1
8.1.1
Accumulator (A) ...............................................................................................8-1
8.1.2
Index register (X)..............................................................................................8-2
8.1.3
Program counter (PC) ......................................................................................8-2
8.1.4
Stack pointer (SP) ............................................................................................8-2
8.1.5
Condition code register (CCR).........................................................................8-2
8.2
Instruction set ........................................................................................................8-3
8.2.1
Register/memory Instructions ..........................................................................8-4
8.2.2
Branch instructions ..........................................................................................8-4
8.2.3
Bit manipulation instructions ............................................................................8-4
8.2.4
Read/modify/write instructions .........................................................................8-4
8.2.5
Control instructions ..........................................................................................8-4
8.2.6
Tables...............................................................................................................8-4
8.3
Addressing modes .................................................................................................8-11
8.3.1
Inherent............................................................................................................8-11
8.3.2
Immediate ........................................................................................................8-11
8.3.3
Direct................................................................................................................8-11
8.3.4
Extended..........................................................................................................8-12
8.3.5
Indexed, no offset.............................................................................................8-12
8.3.6
Indexed, 8-bit offset..........................................................................................8-12
8.3.7
Indexed, 16-bit offset........................................................................................8-12
8.3.8
Relative ............................................................................................................8-13
8.3.9
Bit set/clear ......................................................................................................8-13
8.3.10
Bit test and branch ...........................................................................................8-13
9
LOW POWER MODES
9.1
9.2
9.3
9.4
STOP Mode ...........................................................................................................9-1
WAIT Mode ............................................................................................................9-1
SLOW Mode ..........................................................................................................9-3
Data-Retention Mode ............................................................................................9-3
10
OPERATING MODES
10.1
10.2
10.3
User Mode ...........................................................................................................10-1
Self-Check Mode .................................................................................................10-1
Bootstrap Mode ...................................................................................................10-3
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11
ELECTRICAL SPECIFICATIONS
11.1
11.2
11.3
11.4
11.5
Maximum Ratings................................................................................................11-1
Thermal Characteristics ......................................................................................11-1
DC Electrical Characteristics...............................................................................11-2
ADC Electrical Characteristics ............................................................................11-4
Control Timing .....................................................................................................11-5
12
MECHANICAL SPECIFICATIONS
12.1
12.2
12.3
40-Pin DIP Package (Case 711-03) ....................................................................12-2
42-Pin SDIP Package (Case 858-01) ..................................................................12-2
44-pin QFP Package (Case 824A-01) .................................................................12-3
A
MC68HC705SR3
A.1
A.2
A.3
A.4
A.4.1
A.4.2
A.4.3
A.5
A.6
Features ............................................................................................................... A-1
Modes of Operation .............................................................................................. A-2
User Mode ............................................................................................................ A-2
Bootstrap Mode .................................................................................................... A-2
EPROM Programming .................................................................................... A-3
Program Control Register (PCR) .................................................................... A-3
EPROM Programming Sequence ................................................................... A-3
Mask Option Register (MOR) ............................................................................... A-4
Pin Assignments................................................................................................... A-5
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LIST OF FIGURES
Figure
Number
1-1
2-1
2-2
2-3
2-4
2-5
2-6
3-1
3-2
3-3
3-4
3-5
4-1
5-1
5-2
5-3
5-4
6-1
7-1
8-1
8-2
9-1
10-1
12-1
12-2
12-3
TITLE
Page
Number
MC68HC05SR3/ MC68HC705SR3 Block Diagram................................................1-3
Oscillator Connections............................................................................................2-3
Typical Oscillator Frequency for Selected External Resistor ..................................2-4
Typical Oscillator Frequency for Wire-Strap Connection ........................................2-4
Pin Assignment for 40-pin PDIP .............................................................................2-5
Pin Assignment for 42-pin SDIP .............................................................................2-6
Pin Assignment for 44-pin QFP ..............................................................................2-6
Port I/O Circuitry .....................................................................................................3-2
Typical IOL vs VOL @VDD=5V ..............................................................................3-3
Typical IOH vs VOH @VDD=5V.............................................................................3-4
Typical IOL vs VOL @VDD=3V ..............................................................................3-4
Typical IOL vs VOL @VDD=3V ..............................................................................3-5
MC68HC05SR3/MC68HC705SR3 Memory Map ...................................................4-2
Interrupt Stacking Order .........................................................................................5-3
Hardware Interrupt Processing Flowchart ..............................................................5-4
External Interrupt....................................................................................................5-6
Keyboard Interrupt Circuitry....................................................................................5-8
Timer Block Diagram ..............................................................................................6-2
ADC Converter Block Diagram ...............................................................................7-1
Programming model ...............................................................................................8-1
Stacking order ........................................................................................................8-2
STOP and WAIT Mode Flowcharts.........................................................................9-2
MC68HC05SR3 Self-Check Circuit ......................................................................10-2
40-pin DIP Package..............................................................................................12-2
42-pin SDIP Package ...........................................................................................12-2
44-pin QFP Package ............................................................................................12-3
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LIST OF TABLES
Table
Number
1-1
3-1
4-1
5-1
7-1
8-1
8-2
8-3
8-4
8-5
8-6
8-7
8-8
10-1
10-2
11-1
11-2
11-3
11-4
11-5
A-1
TITLE
Page
Number
Power-On Reset Delay Mask Option ......................................................................1-2
I/O Pin Functions ....................................................................................................3-1
MC68HC05SR3/MC68HC705SR3 I/O Registers ...................................................4-3
Reset/Interrupt Vector Addresses ..........................................................................5-3
ADC Channel Assignments ....................................................................................7-4
MUL instruction.......................................................................................................8-5
Register/memory instructions.................................................................................8-5
Branch instructions .................................................................................................8-6
Bit manipulation instructions...................................................................................8-6
Read/modify/write instructions ...............................................................................8-7
Control instructions.................................................................................................8-7
Instruction set .........................................................................................................8-8
M68HC05 opcode map...........................................................................................8-10
Mode Selection.....................................................................................................10-1
Self-Check Report ................................................................................................10-3
DC Electrical Characteristics for 5V Operation.....................................................11-2
DC Electrical Characteristics for 3V Operation.....................................................11-3
ADC Electrical Characteristics for 5V and 3V Operation......................................11-4
Control Timing for 5V Operation ...........................................................................11-5
Control Timing for 3V Operation ...........................................................................11-6
MC68HC705SR3 Operating Mode Entry Conditions ............................................ A-2
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1
GENERAL DESCRIPTION
The MC68HC05SR3 HCMOS microcontroller is a member of the M68HC05 family of low-cost
single-chip microcontrollers. This 8-bit microcontroller unit (MCU) contains on-chip oscillator,
CPU, RAM, ROM, I/O, Timer, and Analog-to-Digital Converter. The MC68HC05SR3 is pin
compatible with the MC6805R3 and is provided as a low power upgrade path for MC6805R3
applications. The low power advantage of CMOS is combined with the addition of I/O and port
modifications which help eliminate external components in cost sensitive applications.
The MC68HC705SR3 is an EPROM version of the MC68HC05SR3; it is available in windowed
and OTP packages. All references to the MC68HC05SR3 apply equally to the MC68HC705SR3,
unless otherwise stated. References specific to the MC68HC705SR3 are italicized in the text and
also, for quick reference, they are summarized in Appendix A.
1.1
Features
•
Fully static chip design featuring the industry standard 8-bit M68HC05 core
•
Pin compatible with the MC6805R3
•
Power saving STOP, WAIT, and SLOW modes
•
3840 bytes of user ROM with security feature in MC68HC05SR3
3840 bytes of EPROM with security bit in MC68HC705SR3
•
192 bytes of RAM (64 bytes for stack)
•
32 bidirectional I/O lines
•
Keyboard interrupts
•
8-bit count-down timer with programmable 7-bit prescaler
•
On-chip crystal oscillator, with built-in capacitor for RC option
•
Second software programmable external interrupt line (IRQ2)
•
Direct LED drive capability on all ports
•
Programmable 20KΩ pull-up resistors integrated into I/O ports
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GENERAL DESCRIPTION
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1
•
Internal 100KΩ pull-up resistors on IRQ and RESET pins
•
Four channel 8-bit Analog to Digital Converter
•
Low Voltage Reset
•
Available in 40-pin PDIP, 42-pin SDIP and 44-pin QFP packages
1.2
Mask Options
The following mask options are available:
•
RC or Crystal Oscillator (see Section 2.2). The default is crystal option.
•
Power-On Reset delay — Table 1-1 shows available options. The default value is 4096
cycles.
Table 1-1 Power-On Reset Delay Mask Option
Power-On Reset Delay
(cycles)
256
512
1024
2048
4096
8192
16384
32768
•
Power-On Reset Slow mode. If enabled, the device goes into Slow mode directly upon
power-on reset. The bus frequency is 16 times slower than the normal mode. Thus, the
power-on reset delay will also be 16 times longer. The default setting is “Slow mode”
disabled.
TPG
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GENERAL DESCRIPTION
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DDR A
PORT A
DDR B
SELF-CHECK/BOOTSTRAP ROM - 240 BYTES
8
PORT B
KEYBOARD
INTERRUPT
8
DDR C
USER ROM/EPROM - 3840 BYTES
PORT C
1
8
PA0 - PA7
7
M68HC05
CPU
0
ACCUMULATOR
7
PB0 - PB7
0
INDEX REGISTER
5
12
0 0 0 0 0 1 1
0
STACK POINTER
15
4
0
PROGRAM COUNTER
IRQ
RESET
LOW VOLTAGE
RESET
7-BIT PRESCALER
8-Bit
ADC
POWER
DDR D
RESET
8-BIT COUNTER
VDD
TIMER CONTROL
VSS
OSC1
OSC2
PC0 - PC7
7
0
1 1 1 H I N Z C
CONDITION CODE REGISTER
PORT D
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RAM - 192 BYTES
PD7
PD6/IRQ2
PD5/VRH
PD4/VRL
PD3/AN3
PD2/AN2
PD1/AN1
PD0/AN0
OSC
÷2
TIMER
Figure 1-1 MC68HC05SR3/MC68HC705SR3 Block Diagram
TPG
MC68HC05SR3
GENERAL DESCRIPTION
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GENERAL DESCRIPTION
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2
PIN DESCRIPTIONS
This section provides a description of the functional pins of the MC68HC05SR3 microcontroller.
2.1
Functional Pin Descriptions
40-pin PDIP
PIN No.
4
1
—
—
42-pin SDIP
PIN No.
5
—
1
2
44-pin QFP
PIN No.
10, 33
32
6
7
VPP
7
8
13
IRQ
3
4
9
RESET
2
3
8
TIMER
8
9
14
5, 6
6, 7
11, 12
PIN NAME
VDD
VSS
VSS(INT)
VSS(EXT)
OSC1, OSC2
DESCRIPTION
Power is supplied to the MCU using these pins.
VDD should be connected to the positive supply.
VSS, VSS(INT), and VSS(EXT) should be connected to
supply ground.
This is the EPROM programming voltage input pin on the
MC68HC705SR3. On the MC68HC05SR3 part, this pin
should be connected to VDD or VSS.
IRQ is software programmable to provide two choices of
interrupt triggering sensitivity. These options are:
1) negative-edge-sensitive triggering only, or
2) both negative-edge-sensitive and level-sensitive
triggering.
This pin has an integrated pull-up resistor to VDD but should
be tied to VDD if not needed to improve noise immunity. The
IRQ pin contains an internal Schmitt trigger as part of its
input to improve noise immunity. The voltage on this pin may
affect the mode of operation as described in Section 10.
This pin can be used as an input to reset the MCU to a
known start-up state by pulling it to the low state. The
RESET pin contains an internal Schmitt trigger to improve
its noise immunity as an input. It also has an internal
pull-down device that pulls the RESET pin low during the
power-on reset cycles and an integrated pull-up resistor to
VDD.
The TIMER pin provides an optional gating input to the timer.
Refer to Section 6 for additional information.
The OSC1 and OSC2 pins are the connections for the
on-chip oscillator. See Section 2.2 for detail.
TPG
MC68HC05SR3
PIN DESCRIPTIONS
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2
PIN NAME
40-pin PDIP
PIN No.
42-pin SDIP
PIN No.
44-pin QFP
PIN No.
PA0-PA7
33-40
34-41
42-44, 1-5
PB0-PB7
25-32
26-33
31, 35-41
PC0-PC7
9-16
10-17
15-22
PD0-PD7
24-21, 20-17
25-22, 21-18
30-23
AN0-AN3
IRQ2
VRH
VRL
24-21
18
19
20
25-22
19
20
21
30-27
24
25
26
2.2
DESCRIPTION
These eight I/O lines comprise port A. The state of any pin
is software programmable. All port A lines are configured as
input during power-on or external reset.
PA0-PA7 are also associated with the Keyboard Interrupt
function. Each pin is equipped with a programmable
integrated 20KΩ pull-up resistor connected to VDD when
configured as input. When programmed as output, each pin
can provide a current drive of 10mA. See Section 3 for
details on the I/O ports.
These eight I/O lines comprise port B. The state of any pin
is software programmable. All port B lines are configured as
input during power-on or external reset.
Each pin is equipped with a programmable integrated 20KΩ
pull-up resistor connected to VDD when configured as input.
When programmed as output, each pin can provide a
current drive of 10mA. PB5-PB7 can also be programmed to
provide a lower current drive of 2mA. See Section 3 for
details on the I/O ports.
These eight I/O lines comprise port C. The state of any pin
is software programmable. All port C lines are configured as
input during power-on or external reset.
Each pin is equipped with a programmable integrated 20KΩ
pull-up resistor connected to VDD when configured as input.
When programmed as output, each pin can provide a
current drive of 10mA. See Section 3 for details on the I/O
ports.
These eight I/O lines comprise port D. The state of any pin
is software programmable. All port D lines are configured as
input during power-on or external reset.
Each pin is equipped with a programmable integrated 20KΩ
pull-up resistor connected to VDD when configured as input.
When programmed as output, each pin can provide a
current drive of 10mA.
PD0-PD3 become analog inputs AN0-AN3 when the ADON
bit is set in the ADC Status and Control Register ($0E). PD4
and PD5 becomes VRL and VRH respectively for the ADC
reference voltage inputs.
PD6 is configured as IRQ2 by setting IRQ2E in the
Miscellaneous Control Register ($0C).
See Section 3 for details on the I/O ports.
OSC1 and OSC2 Connections
The OSC1 and OSC2 pins are the connections for the on-chip oscillator — the following
configurations are available:
1) A crystal or ceramic resonator as shown in Figure 2-1(a).
2) An external clock signal as shown in Figure 2-1(b).
3) RC options as shown in Figure 2-1(c) and Figure 2-1(d).
TPG
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PIN DESCRIPTIONS
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The external oscillator clock frequency, fOSC, is divided by two to produce the internal operating
frequency, fOP.
MCU
OSC1
2
MCU
OSC2
OSC1
OSC2
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10MΩ
Unconnected
External Clock
25p
25p
(b) External clock source connection
(a) Crystal or ceramic resonator connections
VDD
MCU
OSC1
OSC2
MCU
OSC1
OSC2
R
Unconnected
(d) RC option 2 - internal resistor
25% to 50% accurate
(c) RC option 1 - external resistor
10% to 25% accurate
Figure 2-1 Oscillator Connections
2.2.1
Crystal Oscillator
The circuit in Figure 2-1(a) shows a typical oscillator circuit for an AT-cut, parallel resonant crystal.
The crystal manufacturer’s recommendations should be followed, as the crystal parameters
determine the external component values required to provide maximum stability and reliable
start-up. The load capacitance values used in the oscillator circuit design should include all stray
capacitances. The crystal and components should be mounted as close as possible to the pins for
start-up stabilization and to minimize output distortion. An external start-up resistor of
approximately 10MΩ is needed between OSC1 and OSC2 for the crystal type oscillator.
2.2.2
External Clock
An external clock from another CMOS-compatible device can be connected to the OSC1 input,
with the OSC2 input not connected, as shown in Figure 2-1(b).
TPG
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PIN DESCRIPTIONS
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2.2.3
This configuration is intended to be the lowest cost option in applications where oscillator accuracy
is not important. An internal constant current source and a capacitor have been integrated on-chip,
connected between the OSC2 pin and VSS. Thus by either connecting a resistor to VDD from
OSC2 or by putting a wire strap between OSC1 and OSC2 self-oscillations at the frequency as
shown in Figure 2-2 and Figure 2-3 can be induced.
Oscillator Frequency (MHz)
4.0
3.5
3.0
2.5
2.0
1.5
30
40
50
60
70
80
90
100
110
Resistance (KΩ)
Figure 2-2 Typical Oscillator Frequency for Selected External Resistor
T=0°C
2.25
Oscillator Frequency (MHz)
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2
RC Oscillator Option
2.00
T=25°C
1.75
T=50°C
1.50
1.25
1.00
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (V)
Figure 2-3 Typical Oscillator Frequency for Wire-Strap Connection
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PIN DESCRIPTIONS
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2.3
Pin Assignments
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2
VSS
1
40
PA7
RESET
2
39
PA6
IRQ
3
38
PA5
VDD
4
37
PA4
OSC1
5
36
PA3
OSC2
6
35
PA2
VPP
7
34
PA1
TIMER
8
33
PA0
PC0
9
32
PB7
PC1
10
31
PB6
PC2
11
30
PB5
PC3
12
29
PB4
PC4
13
28
PB3
PC5
14
27
PB2
PC6
15
26
PB1
PC7
16
25
PB0
PD7
17
24
PD0/AN0
PD6/IRQ2
18
23
PD1/AN1
PD5/VRH
19
22
PD2/AN2
PD4/VRL
20
21
PD3/AN3
Figure 2-4 Pin Assignment for 40-pin PDIP
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PIN DESCRIPTIONS
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VSS(INT)
VSS(EXT)
RESET
IRQ
VDD
OSC1
OSC2
VPP
TIMER
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
PD7
PD6/IRQ2
PD5/VRH
PD4/VRL
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1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
NC
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
PD0/AN0
PD1/AN1
PD2/AN2
PD3/AN3
44
43
42
41
40
39
38
37
36
35
34
PA2
PA1
PA0
PB7
PB6
PB5
PB4
PB3
PB2
PB1
NC
Figure 2-5 Pin Assignment for 42-pin SDIP
33
32
31
30
29
28
27
26
25
24
23
1
2
3
4
5
6
7
8
9
10
11
VDD
VSS
PB0
PD0/AN0
PD1/AN1
PD2/AN2
PD3/AN3
PD4/VRL
PD5/VRH
PD6/IRQ2
PD7
12
13
14
15
16
17
18
19
20
21
22
PA3
PA4
PA5
PA6
PA7
VSS(INT)
VSS(EXT)
RESET
IRQ
VDD
OSC1
OSC2
VPP
TIMER
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
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2
Figure 2-6 Pin Assignment for 44-pin QFP
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MOTOROLA
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PIN DESCRIPTIONS
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3
INPUT/OUTPUT PORTS
The MC68HC05SR3 has 32 bidirectional I/O lines, arranged as four 8-bit I/O ports (Port A, B, C,
and D). The individual bits in these ports are programmable as either inputs or outputs under
software control by the Data Direction Registers (DDRs). All port pins each has an associated
20KΩ pull-up resistor, which can be connected/disconnected under software control. Also, each
port pin is capable of sinking and driving a maximum current of 10mA (e.g. direct drive for LEDs).
Port A can also be configured for keyboard interrupts.
3.1
Parallel Ports
Port A, B, C, and D are 8-bit bidirectional ports. Each Port pin is controlled by the corresponding
bits in a Data Direction Register and a Data Register as shown in Figure 3-1. The functions of the
I/O pins are summarized in Table 3-1.
Table 3-1 I/O Pin Functions
R/W
0
0
1
1
3.1.1
DDR
0
1
0
1
I/O Pin Function
The I/O pin is in input mode. Data is written into the output data latch.
Data is written into the output data latch and output to the I/O pin.
The state of the I/O pin is read.
The I/O pin is in an output mode. The output data latch is read.
Port Data Registers
Each Port I/O pin has a corresponding bit in the Port Data Register. When a Port I/O pin is
programmed as an output the state of the corresponding data register bit determines the state of
the output pin. All Port I/O pins can drive a current of 10mA when programmed as outputs. When
a Port pin is programmed as an input, any read of the Port Data Register will return the logic state
of the corresponding I/O pin. The locations of the Data Registers for Port A, B, C, and D are at
$00, $01, $02, and $03 respectively. The Port Data Registers are unaffected by reset.
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DATA DIRECTION
REGISTER BIT
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3
INTERNAL
MC68HC05
CONNECTIONS
LATCHED OUTPUT
DATA BIT
OUTPUT
I/O PIN
INPUT
REGISTER
BIT
INPUT I/O
Figure 3-1 Port I/O Circuitry
3.1.2
Port Data Direction Registers
Each port pin may be programmed as an input by clearing the corresponding bit in the DDR, or
programmed as an output by setting the corresponding bit in the DDR. The DDR for Port A, B, C,
and D are located at $04, $05, $06 and, $07 respectively. The DDRs are cleared by reset.
Note:
A “glitch” may occur on an I/O pin when selecting from an input to an output unless the
data register is first preconditioned to the desired state before changing the
corresponding DDR bit from a “0” to a “1”.
3.2
Port A — Keyboard Interrupts (KBI)
Port A is configured for use as keyboard interrupts when the KBIE bit is set in the Miscellaneous
Control Register (MCR). Individual keyboard interrupt port pins are also maskable by setting
corresponding bits in the Keyboard Interrupt Mask Register.
See Section 5.2.2.4 for details on the keyboard interrupts.
3.3
PD0:PD5 — ADC Inputs
When the ADON bit is set in the ADC Status and Control Register, PD0 to PD3 are configured as
ADC inputs AN0 to AN3 respectively. PD4 and PD5 are configured as VRL and VRH respectively.
See Section 7 for details on the Analog to Digital Converter.
TPG
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3.4
PD6 — IRQ2
The port pin PD6 is configured as IRQ2 by setting the IRQ2E bit in the MCR. The external interrupt
IRQ2 behaves similar to IRQ except it is edge-triggered only.
3
3.5
Programmable Current Drive
All I/O ports, when programmed as outputs, can source or sink a current of 10mA for driving LEDs
directly. By setting the PIL bit in the Port Option Register (at $0A), PB5-PB7 can be programmed
to a low-current mode that source or sink only a current of 2mA when programmed as output. This
allows a direct drive to low current LEDs.
best case
13
12
11
typical
10
All ports
9
worst case
8
IOL (mA)
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See Section 5.2.2.2 for details on the external interrupt IRQ2.
7
6
5
PB5-PB7 in low current mode
4
best case
3
typical
worst case
2
1
0
0
1
2
3
4
5
VOL (volts)
Figure 3-2 Typical IOL vs VOL @VDD =5V
Note:
Although the ports each has high current drive capability, designs should limit the total
port currents to not more than 100mA.
TPG
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VOH (volts)
0
1
2
3
4
5
0
–1
–2
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worst case
–3
typical
–4
best case
PB5-PB7 in low current mode
–5
–6
IOH (mA)
–7
–8
–9
worst case
All ports
–10
–11
typical
–12
–13
–14
best case
–15
Figure 3-3 Typical IOH vs VOH @VDD =5V
All ports
IOL (mA)
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3
5
best case
4
typical
3
worst case
2
best case
typical
1
worst case
PB5-PB7 in low current mode
0
0
1
VOL (volts)
2
3
Figure 3-4 Typical IOL vs VOL @VDD =3V
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INPUT/OUTPUT PORTS
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VOH (volts)
0
1
2
3
0
PB5-PB7 in low current mode
worst case
typical
–1
3
best case
IOH (mA)
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–2
–3
worst case
–4
typical
All ports
–5
best case
Figure 3-5 Typical IOL vs VOL @VDD =3V
3.6
Programmable Pull-Up Devices
Ports B, C, and D have 20KΩ pull-up resistors, which can be connected or disconnected, by
setting appropriate bits in the Port Option Register (at $0A).
3.6.1
Port Option Register
Address bit 7
Port Option Register (POPR)
$0A
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
PIL
PDP
PCP
PBP
PB1
PB0
0000 0000
PIL — PB5:PB7 current drive select
1 (set)
–
0 (clear) –
PB5-PB7 are configured to 2mA drive port.
PB5-PB7 are configured to 10mA drive port.
PDP — Port D Pull-up
1 (set)
–
0 (clear) –
The internal 20KΩ pull-up resistors are connected to the inputs of
Port D.
No pull-up resistor is connected to the inputs of Port D.
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PCP — Port C Pull-up
1 (set)
3
0 (clear) –
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The internal 20KΩ pull-up resistors are connected to the inputs of
Port C.
No pull-up resistor is connected to the inputs of Port C.
PBP — PB2:PB7 Pull-up
1 (set)
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–
–
0 (clear) –
The internal 20KΩ pull-up resistors are connected to the inputs of
PB2-PB7.
No pull-up resistor is connected to the inputs of PB2-PB7.
PB1 — PB1 pull-up
1 (set)
–
0 (clear) –
The internal 20KΩ pull-up resistor is connected to the input of PB1.
No pull-up resistor is connected to the input of PB1.
PB0 — PB0 pull-up
1 (set)
–
0 (clear) –
The internal 20KΩ pull-up resistor is connected to the input of PB0.
No pull-up resistor is connected to the input of PB0.
TPG
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4
MEMORY AND REGISTERS
4
The MC68HC05SR3/MC68HC705SR3 has 8K-bytes of addressable memory, consisting of I/O
registers, user ROM/EPROM, user RAM, and self-check/bootstrap ROM. Figure 4-1 shows the
memory map for MC68HC05SR3/MC68HC705SR3 device.
4.1
I/O Registers
The I/O, status and control registers are located within the first 16 bytes of memory, from $0000
to $000F. These are shown in the memory map in Figure 4-1; and a summary of the register
outline is shown in Table 4-1. Reading from unimplemented bits will return unknown states, and
writing to unimplemented bits will be ignored.
4.2
RAM
The user RAM (including the stack) consists of 192 bytes. It is separated into two blocks at
locations $0010 to $008F, and $00C0 to $00FF. The stack begins at address $00FF and proceeds
down to $00C0.
4.3
ROM
The user ROM consists of 3840 bytes of memory, from $1000 to $1EFF. Twelve bytes of user
vectors are also available, from $1FF4 to $1FFF. On the MC68HC705SR3, this ROM is replaced
by EPROM.
Note:
Using the stack area for data storage or temporary work locations requires care to
prevent the data from being overwritten due to stacking from an interrupt or subroutine
call.
TPG
MC68HC05SR3
MEMORY AND REGISTERS
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4.4
Memory Map
Figure 4-1 shows the memory map for MC68HC05SR3/MC68HC705SR3 device.
$0000
$000F
$0010
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4
0
I/O
16 Bytes
Port A Data Register
Port B Data Register
Port C Data Register
Port D Data Register
Port A Data Direction Register
Port B Data Direction Register
Port C Data Direction Register
Port D Data Direction Register
Timer Data Register
Timer Control Register
Port Option Register
Keyboard Interrupt Mask Register
Miscellaneous Control Register
EPROM Programming Control Register
ADC Status and Control Register
ADC Data Register
Ports
8 Bytes
User RAM
128 Bytes
Timer Registers
2 Bytes
Port Option Register
KBI Register
$008F
$0090
Misc. Register
EPROM Register
Unused
ADC Registers
2 Bytes
$00BF
$00C0
15
Stack
64 Bytes
$00
$01
$02
$03
$04
$05
$06
$07
$08
$09
$0A
$0B
$0C
$0D
$0E
$0F
$00FF
$0100
Unused
$0FFF
$1000
User ROM/EPROM
3840 Bytes
$1EFF
$1F00
Self-Check/Bootstrap
240 Bytes
$1FEF
$1FF0
$1FFF
User Vectors
12 Bytes
$1FF0
$1FF2
$1FF4
$1FF6
$1FF8
$1FFA
$1FFC
$1FFE
Reserved
Reserved
KBI
Timer
IRQ2
IRQ
SWI
RESET
Figure 4-1 MC68HC05SR3/MC68HC705SR3 Memory Map
TPG
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4.5
I/O Registers Summary
Table 4-1 shows a summary of I/O registers for MC68HC05SR3/MC68HC705SR3 device.
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Table 4-1 MC68HC05SR3/MC68HC705SR3 I/O Registers
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
Port A Data
$00
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
unaffected
Port B Data
$01
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
unaffected
Port C Data
$02
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
unaffected
Port D Data
$03
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
unaffected
Port A Data Direction
$04
DDRA7 DDRA6 DDRA5 DDRA4 DDRA3 DDRA2 DDRA1 DDRA0 0000 0000
Port B Data Direction
$05
DDRB7 DDRB6 DDRB5 DDRB4 DDRB3 DDRB2 DDRB1 DDRB0 0000 0000
Port C Data Direction
$06
DDRC7 DDRC6 DDRC5 DDRC4 DDRC3 DDRC2 DDRC1 DDRC0 0000 0000
Port D Data Direction
$07
DDRD7 DDRD6 DDRD5 DDRD4 DDRD3 DDRD2 DDRD1 DDRD0 0000 0000
Timer Data (TDR)
$08
TD7
TD6
TD5
TD4
TD3
TD2
TD1
TD0
1111 1111
Timer Control (TCR)
$09
TIF
TIM
TCEX
TINE
PRER
PR2
PR1
PR0
0100 -000
--00 0000
Register Name
Port Option (POPR)
$0A
PIL
PDP
PCP
PBP
PB1
PB0
KBI Mask (KBIM)
$0B
KBE7
KBE6
KBE5
KBE4
KBE3
KBE2
KBE1
KBE0 0000 0000
Miscellaneous Control (MCR)
$0C
KBIE
KBIC
INTO
INTE
LVRE
SM
EPROM Programming Control
$0D
ADC Status and Control
(ADSCR)
$0E
ADC Data (ADDR)
$0F
Mask Option (MOR)
$0FFF
COCO ADRC ADON
AD7
AD6
4
IRQ2F IRQ2E 0001 0000
ELAT
PGM
---- --00
CH2
CH1
CH0
000- -000
AD5
AD4
AD3
AD2
AD1
AD0
uuuu uuuu
SMD
SEC
TMR2
TMR1
TMR0
RC
unaffected
TPG
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MEMORY AND REGISTERS
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5
RESETS AND INTERRUPTS
This section describes the reset and interrupt functions on the MCU.
5.1
5
RESETS
The MC68HC05SR3 can be reset in three ways:
•
by initial power-on reset function, (POR),
•
by an active low input to the RESET pin, (RESET), and
•
by a Low Voltage Reset, (LVR).
All of these resets will cause the program to go to the starting address, specified by the contents
of memory locations $1FFE and $1FFF, and cause the interrupt mask (I-bit) of the Condition Code
Register (CCR) to be set.
5.1.1
Power-On Reset (POR)
The power-on reset (POR) occurs on power-up to allow the clock oscillator to stabilize. The POR
is strictly for power-up conditions, and should not be used to detect any drops in power supply
voltage.
There is an oscillator stabilization delay of tPORL internal processor bus clock cycles after the
oscillator becomes active. The RESET pin will be pulled down internally during these cycles. If the
RESET pin is low (by external circuit) at the end of the tPORL period, the processor remains in the
reset condition until RESET goes high.
5.1.2
RESET Pin
The RESET input pin is used to reset the MCU to provide an orderly software start-up procedure.
When using the external reset, the RESET pin must stay low for a minimum of 1.5tCYC. The
RESET pin is connected to a Schmitt Trigger circuit as part of its input to improve noise immunity.
TPG
MC68HC05SR3
RESETS AND INTERRUPTS
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5.1.3
Low Voltage Reset (LVR)
When the LVR function is enabled, an internal reset is generated if the supply voltage, VDD, drops
below VLVR. (See Section 11 for value of VLVR).
This LVR function is enabled by setting the LVRE bit in the Miscellaneous Control Register.
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Address bit 7
5
Miscellaneous Control Register
$0C
KBIE
bit 6
bit 5
bit 4
bit 3
bit 2
KBIC
INTO
INTE
LVRE
SM
bit 1
bit 0
State
on reset
IRQ2F IRQ2E 0001 0000
LVRE — Low Voltage Reset Enable
1 (set)
Note:
–
Low Voltage Reset function enabled.
0 (clear) –
Low Voltage Reset function disabled.
The LVR function should not be enabled when operating VDD =3V.
5.2
INTERRUPTS
The MC68HC05SR3 MCU can be interrupted by different sources – four maskable hardware
interrupt and one non-maskable software interrupt:
•
Software Interrupt Instruction (SWI)
•
External signal on IRQ pin
•
External signal on IRQ2 pin
•
TImer Overflow
•
Keyboard
If the interrupt mask bit (I-bit) in the Condition Code Register (CCR) is set, all maskable interrupts
are disabled. Clearing the I-bit enables interrupts.
Interrupts cause the processor to save the register contents on the stack and to set the interrupt
mask (I-bit) to prevent additional interrupts. The RTI instruction causes the register contents to be
recovered from the stack and normal processing to resume.
Unlike reset, hardware interrupts do not cause the current instruction execution to be halted, but
are considered pending until the current instruction is complete. The current instruction is the one
already fetched and being operated on. When the current instruction is complete, the processor
checks all pending hardware interrupts. If interrupts are not masked (CCR I-bit clear) the
processor proceeds with interrupt processing; otherwise, the next instruction is fetched and
executed. Table 5-1 shows the relative priority of all the possible interrupt sources. Figure 5-2
shows the interrupt processing flow.
TPG
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$00C0 (BOTTOM OF STACK)
$00C1
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UNSTACKING
ORDER
$00C2
•
•
•
•
•
•
CONDITION CODE REGISTER
5
1
4
2
ACCUMULATOR
3
3
INDEX REGISTER
2
4
PROGRAM COUNTER (HIGH BYTE)
1
5
PROGRAM COUNTER (LOW BYTE)
STACKING
ORDER
5
•
•
•
•
•
•
$00FD
$00FE
$00FF (TOP OF STACK)
Figure 5-1 Interrupt Stacking Order
Table 5-1 Reset/Interrupt Vector Addresses
Register
—
—
—
—
TCR
—
5.2.1
Flag Name
—
—
—
—
TIF
—
Interrupt
Reset
Software
External Interrupt
External Interrupt 2
Timer Overflow
Keyboard
CPU Interrupt
RESET
SWI
IRQ
IRQ2
TIF
KBI
Vector Address
$1FFE-$1FFF
$1FFC-$1FFD
$1FFA-$1FFB
$1FF8-$1FF9
$1FF6-$1FF7
$1FF4-$1FF5
Priority
highest
lowest
Non-maskable Software Interrupt (SWI)
The software interrupt (SWI) is an executable instruction and a non-maskable interrupt: it is
execute regardless of the state of the I-bit in the CCR. If the I-bit is zero (interrupt enabled), SWI
is executed after interrupts that were pending when the SWI was fetched, but before interrupts
generated after the SWI was fetched. The SWI interrupt service routine address is specified by
the contents of memory locations $1FFC and $1FFD.
TPG
MC68HC05SR3
RESETS AND INTERRUPTS
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From RESET
Y
Is I-bit Set?
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N
IRQ External
Interrupt ?
Y
Clear
External Interrupt
Request Latch
N
5
IRQ2 External
Interrupt ?
Y
N
Timer Interrupt?
Y
PC → (SP, SP–1)
X → (SP–2)
A → (SP–3)
CC→ (SP–4)
N
Set I-bit in CCR
Keyboard Interrupt?
Y
N
Load Interrupt
Vectors to
Program Counter
Fetch Next
Instruction
SWI Instruction?
Y
N
RTI Instruction?
Y
Restore Registers
from Stack
CC, A, X, PC
N
Execute
Instruction
Figure 5-2 Hardware Interrupt Processing Flowchart
TPG
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5.2.2
Maskable Hardware Interrupts
If the interrupt mask bit (I-bit) of the CCR is set, all maskable interrupts are masked. Clearing the
I-bit allows interrupt processing to occur.
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Note:
The internal interrupt latch is cleared in the first part of the interrupt service routine;
therefore, one external interrupt pulse could be latched and serviced as soon as the
I-bit is cleared.
5.2.2.1
External Interrupt (IRQ)
The external interrupt IRQ is controlled by two bits in the Miscellaneous Control Register ($0C).
Address bit 7
Miscellaneous Control Register
$0C
KBIE
bit 6
bit 5
bit 4
bit 3
bit 2
KBIC
INTO
INTE
LVRE
SM
bit 1
bit 0
5
State
on reset
IRQ2F IRQ2E 0001 0000
INTE — INTerrupt Enable
1 (set)
–
0 (clear) –
External interrupt IRQ is enabled.
External interrupt is disabled.
The external IRQ is default enabled at power-on reset.
INTO — INTerrupt Option
1 (set)
–
Negative-edge sensitive triggering for IRQ.
0 (clear) –
Negative-level sensitive triggering for IRQ.
When the signal of the external interrupt pin, IRQ, satisfies the condition selected, an external
interrupt occurs. The actual processor interrupt is generated only if the interrupt mask bit of the
condition code register is also cleared. When the interrupt is recognized, the current state of the
processor is pushed onto the stack and the interrupt mask bit in the Condition Code Register is
set. This masks further interrupts until the present one is serviced. The service routine address is
specified by the contents in $1FFA-$1FFB.
The interrupt logic recognizes negative edge transitions and pulses (special case of negative
edges) on the external interrupt line. Figure 5-3 shows both a block diagram and timing for the
interrupt line (IRQ) to the processor. The first method is used if pulses on the interrupt line are
spaced far enough apart to be serviced. The minimum time between pulses is equal to the number
of cycles required to execute the interrupt service routine plus 21 cycles. Once a pulse occurs, the
next pulse should not occur until the MCU software has exited the routine (an RTI occurs). The
second configuration shows several interrupt lines wired-OR to perform the interrupt at the
processor. Thus, if the interrupt lines remain low after servicing one interrupt, the next interrupt is
recognized.
TPG
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RESETS AND INTERRUPTS
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INTO BIT
VDD
&
VDD
100K
Q
D
+
&
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IRQ
Q
C
&
R
EXTERNAL
INTERRUPT
REQUEST
I-BIT (CCR)
POWER-ON RESET
5
+
EXTERNAL RESET
EXTERNAL INTERRUPT
BEING SERVICED (IRQ ONLY)
(a) Interrupt Function Diagram
EDGE SENSITIVE TRIGGER
CONDITION
IRQ
tILIH
tILIL
The minimum pulse width tILIH is either
125ns (VDD=5V) or 250ns (VDD=3V).
The period tILIL should not be less than
the number of tcyc cycles it takes to execute the interrupt service routine plus
21 tCYC cycles.
tILIH
LEVEL SENSITIVE TRIGGER
CONDITION
Wired ORed
Interrupt signals
if after servicing an interrupt the
external interrupt pin (IRQ) remains
low, then the next interrupt is
recognized. Normally used with pull-up
resistors for wired-OR connection.
IRQ
(b) Interrupt Mode Diagram
Figure 5-3 External Interrupt
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5.2.2.2
External Interrupt 2 (IRQ2)
The port pin PD6 is configured as IRQ2 by setting the IRQ2E bit in the MCR. The external interrupt
IRQ2 behaves similar to IRQ except it is edge-triggered only.
Address bit 7
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Miscellaneous Control Register
$0C
KBIE
bit 6
bit 5
bit 4
bit 3
bit 2
KBIC
INTO
INTE
LVRE
SM
bit 1
bit 0
State
on reset
IRQ2F IRQ2E 0001 0000
IRQ2E — IRQ2 Enable
1 (set)
–
External interrupt IRQ2 is enabled.
0 (clear) –
External interrupt IRQ2 is disabled.
5
IRQ2F — IRQ2 Flag clear
This is a write-only bit and always read as “0”.
1 (set)
–
0 (clear) –
Writing a “1” clears the IRQ2 interrupt latch.
Writing a “0” has no effect.
When a negative-edge is sensed on IRQ2 pin, an external interrupt occurs. The actual processor
interrupt is generated only if the I-bit in the CCR is also cleared. When the interrupt is recognized,
the current state of the processor is pushed onto the stack and the I-bit in the CCR is set. This
masks further interrupts until the present one is serviced. The latch for IRQ2 is cleared by reset or
by writing a “1” to the IRQ2F bit in the MCR in the interrupt service routine. The interrupt service
routine address is specified by the contents in $1FF8-$1FF9.
5.2.2.3
Timer Interrupt
The timer interrupt is generated by the 8-bit timer when a timer overflow has occurred. The
interrupt enable and flag for the timer interrupt are located in the Timer Control Register.
Address bit 7
Timer Control Register (TCR)
$09
TIF
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
TIM
TCEX
TINE
PREP
PR2
PR1
PR0
0100 -100
TIM — Timer Interrupt Mask
1 (set)
–
Timer interrupt is disabled.
0 (clear) –
Timer interrupt is enabled.
TPG
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TIF — Timer Interrupt Flag
1 (set)
–
0 (clear) –
A timer interrupt (timer overflow) has occurred.
A timer interrupt (timer overflow) has not occurred.
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The I-bit in the CCR must be cleared in order for the timer interrupt to be processed. The interrupt
will vector to the interrupt service routine at the address specified by the contents in $1FF6-$0FF7.
5
5.2.2.4
Keyboard Interrupt (KBI)
Keyboard interrupt function is associated with Port A pins. The keyboard interrupt function is
enabled by setting the keyboard interrupt enable bit KBIE (bit 7 of MCR at $0C) and the individual
enable bits KBE0-KBE7 (bits 0-7 of KBIM at $0B). When the KBEx bit is set, the corresponding
Port A pin will be configured as an input pin, regardless of the DDR setting, and a 20KΩ pull-up
resistor is connected to the pin, as shown in Figure 5-4. When a high to low transition is sensed
on the pin, a keyboard interrupt will be generated. An interrupt to the CPU will be generated if the
I-bit in the CCR is cleared.
The keyboard interrupt flag should be cleared in the interrupt service routine (by writing a “1” to
KBIC bit in the MCR at $0C) after the key is debounced. Debouncing will avoid spurious false
triggering.
The keyboard interrupt is negative-edge sensitive only, and the interrupt service routine is
specified by the contents in $1FF4-$1FF5.
KBEx of KBIM
VDD
&
Keyboard
Interrupt
request
&
&
&
20KΩ
KBIE bit of MCR
($0C bit 7)
1 input for each of PA0-PA7
(8 input NAND)
&
DDR0-DDR7
Pad Logic
PAx
Internal Data bit (0-7), Port A
Figure 5-4 Keyboard Interrupt Circuitry
TPG
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The KBIE bit in the Miscellaneous Control Register controls the master enable for the keyboard
interrupts.
Address bit 7
Miscellaneous Control Register
$0C
KBIE
bit 6
bit 5
bit 4
bit 3
bit 2
KBIC
INTO
INTE
LVRE
SM
bit 1
bit 0
State
on reset
IRQ2F IRQ2E 0001 0000
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KBIE — KeyBoard Interrupt Enable
1 (set)
–
Keyboard interrupts master enabled.
0 (clear) –
Keyboard interrupts master disabled.
5
KBIC — KeyBoard Interrupt Clear
This is a write-only bit and always read as “0”.
1 (set)
–
0 (clear) –
Writing a “1” clears the keyboard interrupt latch.
Writing a “0” has no effect.
The Keyboard Interrupt Mask Register (KBIMR) masks individual keyboard interrupt pins and
setting of the internal pull-up resistors on port A.
Address bit 7
KBIMR
$0B
KBE7
State
on reset
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
KBE6
KBE5
KBE4
KBE3
KBE2
KBE1
KBE0 0000 0000
KBEx — PAx Keyboard Interrupt Enable
1 (set)
–
Keyboard interrupt enabled for PAx. A 20KΩ internal pull-up resistor
is connected. High to low transition on PAx will cause a keyboard
interrupt.
0 (clear) –
Keyboard interrupt for PAx pin is masked. Any transitions on PAx will
not set any flags.
TPG
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6
TIMER
This section describes the operation of the 8-bit count-down timer in the MC68HC05SR3.
6.1
Timer Overview
6
The MC68HC05SR3 timer block diagram is shown in Figure 6-1. The timer contains a single 8-bit
software programmable count-down counter with a 7-bit software selectable prescaler. The
counter may be preset under software control and decrements towards zero. When the counter
decrements to zero, the timer interrupt flag (TIF bit in Timer Control Register, TCR) is set. Once
timer interrupt flag is set, an interrupt is generated to the CPU only if the TIM bit in the TCR and
I-bit in the CCR are cleared. When a interrupt is recognized, after completion of the current
instruction, the processor proceeds to store the appropriate registers on the stack and then
fetches the timer interrupt vector from locations $1FF6 and $1FF7.
The counter continues to count after it reaches zero, allowing the software to determine the
number of internal or external clocks since the timer interrupt flag was set. The counter may be
read at any time by the processor without disturbing the count. The contents of the counter
become stable prior to the read portion of a cycle and do not change during the read. The timer
interrupt flag remains set until cleared by the software. If a write occurs before the timer interrupt
is served, the interrupt is lost. The timer interrupt flag may also be used as a scanned status bit in
a non-interrupt mode of operation.
The prescaler is a 7-bit divider which is used to extend the maximum length of the timer. Bit 0, 1,
2 (PR0, PR1, PR2) of TCR are programmed to choose the appropriate prescaler output which is
used as the 8-bit counter clock input. The processor cannot write into or read from the prescaler;
however, its contents can be cleared to all zeros by writing to the PRER bit in the TCR. This will
allow for truncation-free counting.
The input clock for the timer sub-system is selectable from internal, external, or a combination of
internal and external sources. The TCEX and TINE bits in the Timer Control Register selects the
timer input clock.
TPG
MC68HC05SR3
TIMER
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Timer Data Register ($08)
6
8
8-bit count-down timer counter
7-bit prescaler counter
RST
Internal Bus
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8
8
Prescaler
Select
Logic
(8 to 1 MUX)
Overflow
Detect
Circuit
Interrupt Circuit
8
TIF
TIM
TCEX TINE PRER PR2
PR1
PR0
Timer Control Register ($09)
TIMER
Clock Source
Logic
Internal Processor Clock
TCEX
TINE
0
0
Internal clock to timer
Clock Source
0
1
“AND” of internal clock and TIMER pin to timer
1
0
Input clock to timer disabled
1
1
TIMER pin to timer
Figure 6-1 Timer Block Diagram
TPG
MOTOROLA
6-2
TIMER
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6.2
Timer Control Register (TCR)
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The TCR enables the software to control the operation of the timer.
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
$09
TIF
TIM
TCEX
TINE
PRER
PRE2
PRE1
PRE0
0100 -100
TIF — Timer Interrupt Flag
1 (set)
–
0 (clear) –
The timer has reached a count of zero.
The timer has not reached a count of zero.
The timer interrupt flag is set when the 8-bit counter decrements to zero. This bit is cleared on
reset, or by writing a “0” to the TIF bit.
6
TIM — Timer Interrupt Mask
1 (set)
–
0 (clear) –
Timer interrupt request to the CPU is masked (disabled).
Timer interrupt request to the CPU is not masked (enabled).
A reset sets this bit to one; it must then be cleared by software to enable the timer interrupt to the
CPU. This timer interrupt mask only masks timer interrupt request to the CPU, and does not affect
counting of the 8-bit counter or the setting of TIF.
TCEX — Timer Clock EXternal
TINE — Timer INput Enable
These two bits selects the source of the timer clock. Reset or power-on clears these bits to zero.
TCEX
0
0
1
1
TINE
0
1
0
1
Clock Source
Internal clock to timer
“AND” of internal clock and TIMER pin to timer
Input clock to timer disabled
TIMER pin to timer
PRER — PREscaler Reset
Writing a “1” to this write-only bit will reset the prescaler to zero, which is necessary for any new
counts set by writing to the Timer Data Register.This bit always reads as zero, and is not affected
by reset.
TPG
MC68HC05SR3
TIMER
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PR2:PR0
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These three bits enable the program to select the division ratio of the prescaler. On reset, these
three bits are set to “100”, which corresponds to a division ratio of 16.
PR2
0
0
0
0
1
1
1
1
PR1
0
0
1
1
0
0
1
1
PR0
0
1
0
1
0
1
0
1
Divide Ratio
1
2
4
8
16
32
64
128
6
6.3
Timer Data Register (TDR)
The TDR is a read/write register which contains the current value of the 8-bit count-down timer
counter when read. Reading this register does not disturb the counter operation.
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
$08
TD7
TD6
TD5
TD4
TD3
TD2
TD1
TD0
1111 1111
6.4
Operation during Low Power Modes
The timer ceases counting in STOP mode. When STOP mode is exited by an external interrupt
(IRQ or IRQ2), the internal oscillator will resume its operation, followed by internal processor
stabilization delay. The timer is then cleared to zero and resumes its operation. The TIF bit in the
TCR will be set. To avoid generating a timer interrupt when exiting STOP mode, it is recommended
to set the TIM bit prior entering STOP mode. After exiting STOP mode TIF bit can then be cleared.
The CPU clock halts during the WAIT mode, but the timer remains active. If the interrupts are
enabled, the timer interrupt will cause the processor to exit the WAIT mode.
TPG
MOTOROLA
6-4
TIMER
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ANALOG TO DIGITAL CONVERTER
The analog to digital converter system consists of a single 8-bit successive approximation
converter and an 8-channel analog multiplexer. Four of the channels are available for analog
inputs, and the other four channels are dedicated to internal test functions. There is one 8-bit ADC
Data Register ($0F) and one 8-bit ADC Status and Control register ($0E). The reference supply,
VRL and VRH for the converter uses two input pins (shared with PD4 and PD5) instead of the power
supply lines, because drops caused by loading in the power supply lines would degrade the
accuracy of the analog to digital conversion. An internal RC oscillator is available if the bus speed
is low enough to degrade the ADC accuracy. An ADON bit allows the ADC to be switched off to
reduce power consumption, which is particularly useful in the Wait mode.
VRH
VRL
7
VRH
VRL
8-bit capacitive DAC
with sample and hold
AN0
AN1
AN2
AN3
Successive approximation
register and control
Analog MUX
(Channel assignment)
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7
Result
8
ADC Status and Control Register ($0E)
CH0
CH1
CH2
ADON ADRC COCO
(VRH +VRL)/4
(VRH +VRL)/2
ADC Data Register ($0F)
Figure 7-1 ADC Converter Block Diagram
TPG
MC68HC05SR3
ANALOG TO DIGITAL CONVERTER
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7.1
ADC Operation
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As shown in Figure 7-1, the ADC consists of an analog multiplexer, an 8-bit digital to analog
capacitor array, a comparator and a successive approximation register (SAR).
7
There are eight options that can be selected by the multiplexer; the AN0 to AN3 input pins, VRH,
VRL, (VRH +VRL)/4, or (VRH +VRL)/2. Selection is done via the CHx bits in the ADC Status and
Control Register. AN0 to AN3 are input points for ADC conversion operations; the others are
reference points which can be used for test purposes. The converter uses VRH and VRL as
reference voltages. An input voltage equal to or greater than VRH converts to $FF. An input voltage
equal to or less than VRL, but greater than VSS, converts to $00. Maximum and minimum ratings
must not be exceeded. Each analog input source should use VRH as the supply voltage and should
be referenced to VRL for the ratiometric conversions. To maintain full accuracy of the ADC, the
following should be noted:
1) VRH should be equal to or less than VCC;
2) VRL should be equal to or greater than VSS but less than maximum
specifications; and
3) VRH–VRL should be equal to or greater than 4 Volts.
The ADC reference inputs (VRH and VRL) are applied to a precision internal digital to analog
converter. Control logic drives this D/A converter and the analog output is successively compared
with the selected analog input sampled at the beginning of the conversion. The conversion is
monotonic with no missing codes.
The result of each successive comparison is stored in the successive approximation register
(SAR) and, when the conversion is complete, the contents of the SAR are transferred to the
read-only ADC Data Register ($0F), and the conversion complete flag, COCO, is set in the
ADC Status and Control Register ($0E).
Warning: Any write to the ADC Status and Control Register will abort the current conversion,
reset the conversion complete flag (COCO) and a new conversion starts on the
selected channel.
At power-on or external reset, both the ADRC and ADON bits are cleared, thus the ADC is
disabled.
TPG
MOTOROLA
7-2
ANALOG TO DIGITAL CONVERTER
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7.2
ADC Status and Control Register (ADSCR)
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The ADSCR is a read/write register containing status and control bits for the ADC.
Address
bit 7
bit 6
bit 5
$0E
COCO
ADRC
ADON
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
CH2
CH1
CH0
000- -000
COCO — COnversion COmplete
1 (set)
–
0 (clear) –
An ADC conversion has completed; ADC Data Register ($0F)
contains valid conversion result.
ADC conversion not completed.
This read-only status bit is set when a conversion is completed, indicating that the ADC Data
Register contains a valid result. This COCO bit is cleared either by a write to the ADSCR or a read
of the ADC Data Register. Once the COCO bit is cleared, a new conversion automatically starts.
If the COCO bit is not cleared, conversions are initiated every 32 cycles. In this continuous
conversion mode the ADC Data Register is refreshed with new data, every 32 cycles, and the
COCO bit remains set.
7
ADRC — ADC RC Oscillator Control
1 (set)
–
0 (clear) –
ADC uses RC oscillator as clock source.
ADC uses internal processor clock as clock source.
The RC oscillator option must be used if the internal processor is running below 1MHz. A
stabilization time of typically 1ms is required when switching to the RC oscillator option.
ADON — ADC On
1 (set)
–
0 (clear) –
ADC is switched ON.
ADC is switched OFF.
When the ADC is turned from OFF to ON, it requires a time tADON for the current sources to
stabilize. During this time ADC conversion results may be inaccurate. Switching the ADC off
disables the internal charge pump and RC oscillator (if selected by ADRC=1), and hence saving
power.
CH2:CH0 — Channel Select Bits
These three bits selects one of eight ADC channels for the conversion. Channels 0 to 3
correspond to inputs AN0-AN3 on port pins PD0-PD3 respectively. Channels 4 and 5 are the ADC
reference inputs VRH and VRL, on port pins PD4 and PD5 respectively. Channels 6 and 7 are used
for internal reference points. Table 7-1 shows the signals selected by the channel select bits.
TPG
MC68HC05SR3
ANALOG TO DIGITAL CONVERTER
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Table 7-1 ADC Channel Assignments
7
CH2
0
0
0
0
1
1
1
1
CH1
0
0
1
1
0
0
1
1
CH0
0
1
0
1
0
1
0
1
Channel
0
1
2
3
4
5
6
7
Selected Signal
AD0 on PD0
AD1 on PD1
AD2 on PD2
AD3 on PD3
VRH
VRL
(VRH–VRL) ÷ 4
(VRH–VRL) ÷ 2
Using a port D pin as both an analog and digital input simultaneously is prohibited. When the ADC
is enabled (ADON=1) and one of channels 0 to 5 is selected, the corresponding Port D pin will
appear as a logic zero when read from the Port Data Register.
7.3
ADC Data Register (ADDR)
The ADDR stores the result of a valid ADC conversion when the COCO bits is set in ADSCR.
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
$0F
AD7
AD6
AD5
AD4
AD3
AD2
AD1
AD0
uuuu uuuu
7.4
ADC during Low Power Modes
The ADC continues normal operation in WAIT mode. To reduce power consumption in WAIT
mode, the ADON and ADRC bits in the ADSCR should be cleared if the ADC is not used. If the
ADC is in use and the internal bus clock is above 1MHz, it is recommended that the ADRC bit be
cleared.
In STOP mode, the ADC stops operation.
TPG
MOTOROLA
7-4
ANALOG TO DIGITAL CONVERTER
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8
CPU CORE AND INSTRUCTION SET
This section provides a description of the CPU core registers, the instruction set and the
addressing modes of the MC68HC05SR3.
8.1
Registers
The MCU contains five registers, as shown in the programming model of Figure 8-1. The interrupt
stacking order is shown in Figure 8-2.
7
0
7
0
8
Accumulator
Index register
15
7
0
Program counter
15
7
0
0 0 0 0 0 0 0 0 1 1
7
0
1 1 1 H I N Z C
Stack pointer
Condition code register
Carry / borrow
Zero
Negative
Interrupt mask
Half carry
Figure 8-1 Programming model
8.1.1
Accumulator (A)
The accumulator is a general purpose 8-bit register used to hold operands and results of
arithmetic calculations or data manipulations.
TPG
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CPU CORE AND INSTRUCTION SET
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Unstack
Stack
0
Condition code register
Accumulator
Index register
Program counter high
Program counter low
Interrupt
Increasing
memory
address
Return
7
Decreasing
memory
address
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Figure 8-2 Stacking order
8
8.1.2
Index register (X)
The index register is an 8-bit register, which can contain the indexed addressing value used to
create an effective address. The index register may also be used as a temporary storage area.
8.1.3
Program counter (PC)
The program counter is a 16-bit register, which contains the address of the next byte to be fetched.
8.1.4
Stack pointer (SP)
The stack pointer is a 16-bit register, which contains the address of the next free location on the
stack. During an MCU reset or the reset stack pointer (RSP) instruction, the stack pointer is set to
location $00FF. The stack pointer is then decremented as data is pushed onto the stack and
incremented as data is pulled from the stack.
When accessing memory, the ten most significant bits are permanently set to 0000000011. These
ten bits are appended to the six least significant register bits to produce an address within the
range of $00C0 to $00FF. Subroutines and interrupts may use up to 64 (decimal) locations. If 64
locations are exceeded, the stack pointer wraps around and overwrites the previously stored
information. A subroutine call occupies two locations on the stack; an interrupt uses five locations.
8.1.5
Condition code register (CCR)
The CCR is a 5-bit register in which four bits are used to indicate the results of the instruction just
executed, and the fifth bit indicates whether interrupts are masked. These bits can be individually
tested by a program, and specific actions can be taken as a result of their state. Each bit is
explained in the following paragraphs.
Half carry (H)
This bit is set during ADD and ADC operations to indicate that a carry occurred between bits 3 and 4.
TPG
MOTOROLA
8-2
CPU CORE AND INSTRUCTION SET
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Interrupt (I)
When this bit is set, all maskable interrupts are masked. If an interrupt occurs while this bit is set,
the interrupt is latched and remains pending until the interrupt bit is cleared.
Negative (N)
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When set, this bit indicates that the result of the last arithmetic, logical, or data manipulation was
negative.
Zero (Z)
When set, this bit indicates that the result of the last arithmetic, logical, or data manipulation was
zero.
Carry/borrow (C)
When set, this bit indicates that a carry or borrow out of the arithmetic logical unit (ALU) occurred
during the last arithmetic operation. This bit is also affected during bit test and branch instructions
and during shifts and rotates.
8.2
Instruction set
The MCU has a set of 62 basic instructions. They can be grouped into five different types as
follows:
–
Register/memory
–
Read/modify/write
–
Branch
–
Bit manipulation
–
Control
8
The following paragraphs briefly explain each type. All the instructions within a given type are
presented in individual tables.
This MCU uses all the instructions available in the M146805 CMOS family plus one more: the
unsigned multiply (MUL) instruction. This instruction allows unsigned multiplication of the contents
of the accumulator (A) and the index register (X). The high-order product is then stored in the
index register and the low-order product is stored in the accumulator. A detailed definition of the
MUL instruction is shown in Table 8-1.
TPG
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CPU CORE AND INSTRUCTION SET
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8.2.1
Register/memory Instructions
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Most of these instructions use two operands. The first operand is either the accumulator or the
index register. The second operand is obtained from memory using one of the addressing modes.
The jump unconditional (JMP) and jump to subroutine (JSR) instructions have no register
operand. Refer to Table 8-2 for a complete list of register/memory instructions.
8
8.2.2
Branch instructions
These instructions cause the program to branch if a particular condition is met; otherwise, no
operation is performed. Branch instructions are two-byte instructions. Refer to Table 8-3.
8.2.3
Bit manipulation instructions
The MCU can set or clear any writable bit that resides in the first 256 bytes of the memory space
(page 0). All port data and data direction registers, timer and serial interface registers,
control/status registers and a portion of the on-chip RAM reside in page 0. An additional feature
allows the software to test and branch on the state of any bit within these locations. The bit set, bit
clear, bit test and branch functions are all implemented with single instructions. For the test and
branch instructions, the value of the bit tested is also placed in the carry bit of the condition code
register. Refer to Table 8-4.
8.2.4
Read/modify/write instructions
These instructions read a memory location or a register, modify or test its contents, and write the
modified value back to memory or to the register. The test for negative or zero (TST) instruction is
an exception to this sequence of reading, modifying and writing, since it does not modify the value.
Refer to Table 8-5 for a complete list of read/modify/write instructions.
8.2.5
Control instructions
These instructions are register reference instructions and are used to control processor operation
during program execution. Refer to Table 8-6 for a complete list of control instructions.
8.2.6
Tables
Tables for all the instruction types listed above follow. In addition there is a complete alphabetical
listing of all the instructions (see Table 8-7), and an opcode map for the instruction set of the
M68HC05 MCU family (see Table 8-8).
TPG
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Table 8-1 MUL instruction
X:A ← X*A
Multiplies the eight bits in the index register by the eight
Description bits in the accumulator and places the 16-bit result in the
concatenated accumulator and index register.
H : Cleared
I : Not affected
Condition
N : Not affected
codes
Z : Not affected
C : Cleared
Source
MUL
Addressing mode
Cycles
Bytes
Opcode
Form
Inherent
11
1
$42
Table 8-2 Register/memory instructions
Addressing modes
Indexed
(no
offset)
Indexed
(8-bit
offset)
Opcode
# Bytes
# Cycles
Opcode
# Bytes
# Cycles
Opcode
# Bytes
# Cycles
Opcode
# Bytes
# Cycles
Opcode
# Bytes
# Cycles
Indexed
(16-bit
offset)
# Cycles
Extended
# Bytes
Direct
Opcode
Immediate
Mnemonic
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Operation
Load A from memory
LDA
A6
2
2
B6
2
3
C6
3
4
F6
1
3
E6
2
4
D6
3
5
Load X from memory
LDX
AE
2
2
BE
2
3
CE
3
4
FE
1
3
EE
2
4
DE
3
5
Store A in memory
STA
B7
2
4
C7
3
5
F7
1
4
E7
2
5
D7
3
6
Store X in memory
STX
BF
2
4
CF
3
5
FF
1
4
EF
2
5
DF
3
6
Add memory to A
ADD
AB
2
2
BB
2
3
CB
3
4
FB
1
3
EB
2
4
DB
3
5
Add memory and carry to A
ADC
A9
2
2
B9
2
3
C9
3
4
F9
1
3
E9
2
4
D9
3
5
Subtract memory
SUB
A0
2
2
B0
2
3
C0
3
4
F0
1
3
E0
2
4
D0
3
5
Subtract memory from A
with borrow
SBC
A2
2
2
B2
2
3
C2
3
4
F2
1
3
E2
2
4
D2
3
5
Function
AND memory with A
AND
A4
2
2
B4
2
3
C4
3
4
F4
1
3
E4
2
4
D4
3
5
OR memory with A
ORA
AA
2
2
BA
2
3
CA
3
4
FA
1
3
EA
2
4
DA
3
5
Exclusive OR memory with A
EOR
A8
2
2
B8
2
3
C8
3
4
F8
1
3
E8
2
4
D8
3
5
Arithmetic compare A
with memory
CMP
A1
2
2
B1
2
3
C1
3
4
F1
1
3
E1
2
4
D1
3
5
Arithmetic compare X
with memory
CPX
A3
2
2
B3
2
3
C3
3
4
F3
1
3
E3
2
4
D3
3
5
Bit test memory with A
(logical compare)
BIT
A5
2
2
B5
2
3
C5
3
4
F5
1
3
E5
2
4
D5
3
5
Jump unconditional
JMP
BC
2
2
CC
3
3
FC
1
2
EC
2
3
DC
3
4
Jump to subroutine
JSR
BD
2
5
CD
3
6
FD
1
5
ED
2
6
DD
3
7
8
TPG
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Table 8-3 Branch instructions
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Function
Branch always
Branch never
Branch if higher
Branch if lower or same
Branch if carry clear
(Branch if higher or same)
Branch if carry set
(Branch if lower)
Branch if not equal
Branch if equal
Branch if half carry clear
Branch if half carry set
Branch if plus
Branch if minus
Branch if interrupt mask bit is clear
Branch if interrupt mask bit is set
Branch if interrupt line is low
Branch if interrupt line is high
Branch to subroutine
8
Mnemonic
BRA
BRN
BHI
BLS
BCC
(BHS)
BCS
(BLO)
BNE
BEQ
BHCC
BHCS
BPL
BMI
BMC
BMS
BIL
BIH
BSR
Relative addressing mode
Opcode # Bytes # Cycles
20
2
3
21
2
3
22
2
3
23
2
3
24
2
3
24
2
3
25
2
3
25
2
3
26
2
3
27
2
3
28
2
3
29
2
3
2A
2
3
2B
2
3
2C
2
3
2D
2
3
2E
2
3
2F
2
3
AD
2
6
Table 8-4 Bit manipulation instructions
Function
Branch if bit n is set
Branch if bit n is clear
Set bit n
Clear bit n
Mnemonic
BRSET n (n=0–7)
BRCLR n (n=0–7)
BSET n (n=0–7)
BCLR n (n=0–7)
Addressing modes
Bit set/clear
Bit test and branch
Opcode # Bytes # Cycles Opcode # Bytes # Cycles
2•n
3
5
01+2•n
3
5
10+2•n
2
5
11+2•n
2
5
TPG
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Freescale Semiconductor, Inc.
Table 8-5 Read/modify/write instructions
Addressing modes
# Cycles
Opcode
# Bytes
# Cycles
Opcode
# Bytes
# Cycles
Opcode
# Bytes
# Cycles
Opcode
# Bytes
# Cycles
Indexed
(8-bit
offset)
# Bytes
Increment
Decrement
Clear
Complement
Negate (two’s complement)
Rotate left through carry
Rotate right through carry
Logical shift left
Logical shift right
Arithmetic shift right
Test for negative or zero
Multiply
Indexed
(no
offset)
Direct
Opcode
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Function
Inherent
(X)
Mnemonic
Inherent
(A)
INC
DEC
CLR
COM
NEG
ROL
ROR
LSL
LSR
ASR
TST
MUL
4C
4A
4F
43
40
49
46
48
44
47
4D
42
1
1
1
1
1
1
1
1
1
1
1
1
3 5C
3 5A
3 5F
3 53
3 50
3 59
3 56
3 58
3 54
3 57
3 5D
11
1
1
1
1
1
1
1
1
1
1
1
3
3
3
3
3
3
3
3
3
3
3
3C
3A
3F
33
30
39
36
38
34
37
3D
2
2
2
2
2
2
2
2
2
2
2
5
5
5
5
5
5
5
5
5
5
4
7C
7A
7F
73
70
79
76
78
74
77
7D
1
1
1
1
1
1
1
1
1
1
1
5
5
5
5
5
5
5
5
5
5
4
6C
6A
6F
63
60
69
66
68
64
67
6D
2
2
2
2
2
2
2
2
2
2
2
6
6
6
6
6
6
6
6
6
6
5
8
Table 8-6 Control instructions
Function
Transfer A to X
Transfer X to A
Set carry bit
Clear carry bit
Set interrupt mask bit
Clear interrupt mask bit
Software interrupt
Return from subroutine
Return from interrupt
Reset stack pointer
No-operation
Stop
Wait
Mnemonic
TAX
TXA
SEC
CLC
SEI
CLI
SWI
RTS
RTI
RSP
NOP
STOP
WAIT
Inherent addressing mode
Opcode # Bytes # Cycles
97
1
2
9F
1
2
99
1
2
98
1
2
9B
1
2
9A
1
2
83
1
10
81
1
6
80
1
9
9C
1
2
9D
1
2
8E
1
2
8F
1
2
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Table 8-7 Instruction set
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Mnemonic
8
INH
IMM
DIR
Addressing modes
EXT REL IX
IX1
IX2
BSC BTB
H
◊
◊
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
ADC
ADD
AND
ASL
ASR
BCC
BCLR
BCS
BEQ
BHCC
BHCS
BHI
BHS
BIH
BIL
BIT
BLO
BLS
BMC
BMI
BMS
BNE
BPL
BRA
BRN
BRCLR
BRSET
BSET
BSR
CLC
CLI
CLR
CMP
Address mode abbreviations
BSC Bit set/clear
IMM
Immediate
BTB
Bit test & branch
IX
Indexed (no offset)
DIR
Direct
IX1
EXT
Extended
IX2
INH
Inherent
REL
Relative
Condition codes
I
N Z
•
◊ ◊
•
◊ ◊
•
◊ ◊
•
◊ ◊
•
◊ ◊
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
◊ ◊
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
0
•
•
•
0 1
•
◊ ◊
C
◊
◊
•
◊
◊
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
◊
◊
•
•
0
•
•
◊
Condition code symbols
◊
Tested and set if true,
cleared otherwise
H
Half carry (from bit 3)
Indexed, 1 byte offset
I
Interrupt mask
•
Not affected
Indexed, 2 byte offset
N
Negate (sign bit)
?
Load CCR from stack
Z
Zero
0
Cleared
C
Carry/borrow
1
Set
Not implemented
TPG
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Table 8-7 Instruction set (Continued)
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Mnemonic
INH
IMM
DIR
Addressing modes
EXT REL IX
IX1
IX2
BSC BTB
COM
CPX
DEC
EOR
INC
JMP
JSR
LDA
LDX
LSL
LSR
MUL
NEG
NOP
ORA
ROL
ROR
RSP
RTI
RTS
SBC
SEC
SEI
STA
STOP
STX
SUB
SWI
TAX
TST
TXA
WAIT
Address mode abbreviations
BSC Bit set/clear
IMM
Immediate
BTB
Bit test & branch
IX
Indexed (no offset)
DIR
Direct
IX1
EXT
Extended
IX2
INH
Inherent
REL
Relative
Condition codes
I
N Z
•
◊ ◊
•
◊ ◊
•
◊ ◊
•
◊ ◊
•
◊ ◊
•
•
•
•
•
•
•
◊ ◊
•
◊ ◊
•
◊ ◊
•
0 ◊
•
•
•
•
◊ ◊
•
•
•
•
◊ ◊
•
◊ ◊
•
◊ ◊
•
•
•
? ? ?
•
•
•
•
◊ ◊
•
•
•
1
•
•
•
◊ ◊
0
•
•
•
◊ ◊
•
◊ ◊
1
•
•
•
•
•
•
◊ ◊
•
•
•
0
•
•
H
•
•
•
•
•
•
•
•
•
•
•
0
•
•
•
•
•
•
?
•
•
•
•
•
•
•
•
•
•
•
•
•
C
1
◊
•
•
•
•
•
•
•
◊
◊
0
◊
•
•
◊
◊
•
?
•
◊
1
•
•
•
•
◊
•
•
•
•
•
8
Condition code symbols
◊
Tested and set if true,
cleared otherwise
H
Half carry (from bit 3)
Indexed, 1 byte offset
I
Interrupt mask
•
Not affected
Indexed, 2 byte offset
N
Negate (sign bit)
?
Load CCR from stack
Z
Zero
0
Cleared
C
Carry/borrow
1
Set
Not implemented
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MOTOROLA
8-9
61
MOTOROLA
8-10
BTB 2
5
BTB 2
5
BTB 2
5
3
3
BTB 2
5
BTB 2
5
BTB 2
5
BTB 2
5
BTB 2
5
BTB 2
5
BTB 2
5
BTB 2
5
BTB 2
5
BTB 2
5
BTB 2
3
3
3
3
3
3
3
3
3
3
BRCLR7
BRSET7
BRCLR6
BRSET6
BRCLR5
BRSET5
BRCLR4
BRSET4
BRCLR3
BRSET3
BTB 2
5
3
BRCLR2
3
BRSET2
BRCLR1
BRSET1
BTB 2
5
3
BRCLR0
3
BRSET0
5
BSC 2
BSC 2
5
BCLR7
BSET7
BSC 2
5
BSC 2
5
BCLR6
BSET6
BSC 2
5
BSC 2
5
BCLR5
BSET5
BSC 2
5
BCLR4
BSC 2
5
BSET4
BSC 2
5
BSC 2
5
BCLR3
BSET3
BSC 2
5
BSC 2
5
BCLR2
BSET2
BSC 2
5
BSC 2
5
BCLR1
BSET1
BSC 2
5
BSC 2
5
BCLR0
BSET0
5
BIH
BIL
BMS
BMC
BMI
BPL
REL 2
REL
3
REL 2
3
REL 2
3
REL
3
REL 2
3
REL 2
3
BHCS
REL 2
3
REL 2
3
REL 2
3
REL
3
REL 2
3
REL 2
3
REL
3
REL
3
REL 2
3
BHCC
BEQ
BNE
BCS
BCC
BLS
BHI
BRN
BRA
3
BSC
BTB
DIR
EXT
INH
IMM
Bit set/clear
Bit test and branch
Direct
Extended
Inherent
Immediate
IX
IX1
IX2
REL
A
X
Abbreviations for address modes and registers
0
0000
1
0001
2
0010
3
0011
4
0100
5
0101
6
0110
7
0111
8
1000
9
1001
A
1010
B
1011
C
1100
D
1101
E
1110
F
1111
Low
High
Branch
REL
2
0010
CLR
TST
INC
DEC
ROL
LSL
ASR
ROR
LSR
COM
NEG
DIR
3
0011
1
CLRA
TSTA
INCA
DECA
ROLA
LSLA
ASRA
RORA
LSRA
COMA
MUL
NEGA
INH 1
3
INH 1
INH 1
3
3
INH 1
INH 1
3
INH 1
3
INH 1
3
INH 1
3
3
INH 1
INH 1
3
INH
3
11
INH 1
3
CLRX
TSTX
INCX
DECX
ROLX
LSLX
ASRX
RORX
LSRX
COMX
NEGX
INH 2
3
INH 2
INH 2
3
3
INH 2
INH 2
3
INH 2
3
INH 2
3
INH 2
3
3
INH 2
INH 2
3
3
INH 2
3
CLR
TST
INC
DEC
ROL
LSL
ASR
ROR
LSR
COM
NEG
Read/modify/write
INH
IX1
5
6
0101
0110
Indexed (no offset)
Indexed, 1 byte (8-bit) offset
Indexed, 2 byte (16-bit) offset
Relative
Accumulator
Index register
DIR 1
5
DIR 1
DIR 1
4
5
DIR 1
DIR 1
5
DIR 1
5
DIR 1
5
DIR 1
5
5
DIR 1
DIR 1
5
5
DIR 1
5
INH
4
0100
IX1 1
6
IX1 1
IX1 1
5
6
IX1 1
IX1 1
6
IX1 1
6
IX1 1
6
IX1 1
6
6
IX1 1
IX1 1
6
6
IX1 1
6
CLR
TST
INC
DEC
ROL
LSL
ASR
ROR
LSR
COM
NEG
IX
7
0111
5
1
WAIT
STOP
SWI
RTS
RTI
1
1
1
1
1
1
1
INH 1
INH
2
2
INH
10
INH
INH
6
9
TXA
NOP
RSP
SEI
CLI
SEC
CLC
TAX
INH
9
1001
Control
Not implemented
IX 1
5
IX
IX
4
5
IX
IX
5
IX
5
IX
5
IX
5
5
IX
IX 1
5
1
IX 1
5
INH
8
1000
8
Bit manipulation
BTB
BSC
0
1
0000
0001
2
2
INH
2
2
INH 2
INH
2
INH 2
2
INH 2
2
INH 2
2
INH 2
2
INH
2
2
2
2
2
2
2
LDX
BSR
ADD
ORA
ADC
EOR
LDA
BIT
AND
CPX
SBC
CMP
SUB
IMM
A
1010
2
2
STX
LDX
JSR
JMP
ADD
ORA
ADC
EOR
STA
LDA
BIT
AND
CPX
SBC
CMP
SUB
3
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Bytes
1
STX
LDX
JSR
JMP
ADD
ORA
ADC
EOR
STA
LDA
BIT
AND
CPX
SBC
CMP
SUB
SUB
F
1111
EXT 3
EXT 3
5
EXT 3
4
EXT 3
6
EXT 3
3
EXT 3
4
EXT 3
4
EXT 3
4
EXT 3
4
EXT 3
5
EXT 3
4
EXT 3
4
EXT 3
4
EXT 3
4
EXT 3
4
EXT 3
4
4
IX
3
0
0000
IX2 2
IX2 2
6
IX2 2
5
IX2 2
7
IX2 2
4
IX2 2
5
IX2 2
5
IX2 2
5
IX2 2
5
IX2 2
6
IX2 2
5
IX2 2
5
IX2 2
5
IX2 2
5
IX2 2
5
IX2 2
5
5
STX
LDX
JSR
JMP
ADD
ORA
ADC
EOR
STA
LDA
BIT
AND
CPX
SBC
CMP
SUB
IX1
E
1110
Address mode
STX
LDX
JSR
JMP
ADD
ORA
ADC
EOR
STA
LDA
BIT
AND
CPX
SBC
CMP
SUB
Register/memory
EXT
IX2
C
D
1100
1101
Cycles
DIR 3
DIR 3
4
DIR 3
3
DIR 3
5
DIR 3
2
DIR 3
3
DIR 3
3
DIR 3
3
DIR 3
3
DIR 3
4
DIR 3
3
DIR 3
3
DIR 3
3
DIR 3
3
DIR 3
3
DIR 3
3
Mnemonic
Legend
2
IMM 2
REL 2
2
6
IMM 2
IMM 2
2
IMM 2
2
IMM 2
2
2
IMM 2
IMM 2
2
IMM 2
2
IMM 2
2
IMM 2
2
IMM 2
2
IMM 2
2
2
DIR
B
1011
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STX
LDX
JSR
JMP
ADD
ORA
ADC
EOR
STA
LDA
BIT
AND
CPX
SBC
CMP
SUB
IX
IX
4
IX
3
IX
5
IX
2
IX
3
IX
3
IX
3
IX
3
IX
4
IX
3
IX
3
IX
3
IX
3
IX
3
IX
3
3
Low
0
0000
1
0001
2
0010
3
0011
4
0100
5
0101
6
0110
7
0111
8
1000
9
1001
A
1010
B
1011
C
1100
D
1101
E
1110
F
1111
High
Opcode in binary
Opcode in hexadecimal
IX1 1
IX1 1
5
IX1 1
4
IX1 1
6
IX1 1
3
IX1 1
4
IX1 1
4
IX1 1
4
IX1 1
4
IX1 1
5
IX1 1
4
IX1 1
4
IX1 1
4
IX1 1
4
IX1 1
4
IX1 1
4
4
IX
F
1111
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Table 8-8 M68HC05 opcode map
MC68HC05SR3
TPG
62
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8.3
Addressing modes
Ten different addressing modes provide programmers with the flexibility to optimize their code for
all situations. The various indexed addressing modes make it possible to locate data tables, code
conversion tables and scaling tables anywhere in the memory space. Short indexed accesses are
single byte instructions; the longest instructions (three bytes) enable access to tables throughout
memory. Short absolute (direct) and long absolute (extended) addressing are also included. One
or two byte direct addressing instructions access all data bytes in most applications. Extended
addressing permits jump instructions to reach all memory locations.
The term ‘effective address’ (EA) is used in describing the various addressing modes. The
effective address is defined as the address from which the argument for an instruction is fetched
or stored. The ten addressing modes of the processor are described below. Parentheses are used
to indicate ‘contents of’ the location or register referred to. For example, (PC) indicates the
contents of the location pointed to by the PC (program counter). An arrow indicates ‘is replaced
by’ and a colon indicates concatenation of two bytes. For additional details and graphical
illustrations, refer to the M6805 HMOS/M146805 CMOS Family Microcomputer/
Microprocessor User's Manual or to the M68HC05 Applications Guide.
8.3.1
Inherent
In the inherent addressing mode, all the information necessary to execute the instruction is
contained in the opcode. Operations specifying only the index register or accumulator, as well as
the control instruction, with no other arguments are included in this mode. These instructions are
one byte long.
8.3.2
8
Immediate
In the immediate addressing mode, the operand is contained in the byte immediately following the
opcode. The immediate addressing mode is used to access constants that do not change during
program execution (e.g. a constant used to initialize a loop counter).
EA = PC+1; PC ← PC+2
8.3.3
Direct
In the direct addressing mode, the effective address of the argument is contained in a single byte
following the opcode byte. Direct addressing allows the user to directly address the lowest 256
bytes in memory with a single two-byte instruction.
EA = (PC+1); PC ← PC+2
Address bus high ← 0; Address bus low ← (PC+1)
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8.3.4
Extended
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In the extended addressing mode, the effective address of the argument is contained in the two
bytes following the opcode byte. Instructions with extended addressing mode are capable of
referencing arguments anywhere in memory with a single three-byte instruction. When using the
Motorola assembler, the user need not specify whether an instruction uses direct or extended
addressing. The assembler automatically selects the short form of the instruction.
8
EA = (PC+1):(PC+2); PC ← PC+3
Address bus high ← (PC+1); Address bus low ← (PC+2)
8.3.5
Indexed, no offset
In the indexed, no offset addressing mode, the effective address of the argument is contained in
the 8-bit index register. This addressing mode can access the first 256 memory locations. These
instructions are only one byte long. This mode is often used to move a pointer through a table or
to hold the address of a frequently referenced RAM or I/O location.
EA = X; PC ← PC+1
Address bus high ← 0; Address bus low ← X
8.3.6
Indexed, 8-bit offset
In the indexed, 8-bit offset addressing mode, the effective address is the sum of the contents of
the unsigned 8-bit index register and the unsigned byte following the opcode. Therefore the
operand can be located anywhere within the lowest 511 memory locations. This addressing mode
is useful for selecting the mth element in an n element table.
EA = X+(PC+1); PC ← PC+2
Address bus high ← K; Address bus low ← X+(PC+1)
where K = the carry from the addition of X and (PC+1)
8.3.7
Indexed, 16-bit offset
In the indexed, 16-bit offset addressing mode, the effective address is the sum of the contents of
the unsigned 8-bit index register and the two unsigned bytes following the opcode. This address
mode can be used in a manner similar to indexed, 8-bit offset except that this three-byte instruction
allows tables to be anywhere in memory. As with direct and extended addressing, the Motorola
assembler determines the shortest form of indexed addressing.
EA = X+[(PC+1):(PC+2)]; PC ← PC+3
Address bus high ← (PC+1)+K; Address bus low ← X+(PC+2)
where K = the carry from the addition of X and (PC+2)
TPG
MOTOROLA
8-12
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8.3.8
Relative
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The relative addressing mode is only used in branch instructions. In relative addressing, the
contents of the 8-bit signed byte (the offset) following the opcode are added to the PC if, and only
if, the branch conditions are true. Otherwise, control proceeds to the next instruction. The span of
relative addressing is from –126 to +129 from the opcode address. The programmer need not
calculate the offset when using the Motorola assembler, since it calculates the proper offset and
checks to see that it is within the span of the branch.
EA = PC+2+(PC+1); PC ← EA if branch taken;
otherwise EA = PC ← PC+2
8.3.9
Bit set/clear
In the bit set/clear addressing mode, the bit to be set or cleared is part of the opcode. The byte
following the opcode specifies the address of the byte in which the specified bit is to be set or
cleared. Any read/write bit in the first 256 locations of memory, including I/O, can be selectively
set or cleared with a single two-byte instruction.
EA = (PC+1); PC ← PC+2
Address bus high ← 0; Address bus low ← (PC+1)
8.3.10
8
Bit test and branch
The bit test and branch addressing mode is a combination of direct addressing and relative
addressing. The bit to be tested and its condition (set or clear) is included in the opcode. The
address of the byte to be tested is in the single byte immediately following the opcode byte (EA1).
The signed relative 8-bit offset in the third byte (EA2) is added to the PC if the specified bit is set
or cleared in the specified memory location. This single three-byte instruction allows the program
to branch based on the condition of any readable bit in the first 256 locations of memory. The span
of branch is from –125 to +130 from the opcode address. The state of the tested bit is also
transferred to the carry bit of the condition code register.
EA1 = (PC+1); PC ← PC+2
Address bus high ← 0; Address bus low ← (PC+1)
EA2 = PC+3+(PC+2); PC ← EA2 if branch taken;
otherwise PC ← PC+3
TPG
MC68HC05SR3
CPU CORE AND INSTRUCTION SET
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CPU CORE AND INSTRUCTION SET
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9
LOW POWER MODES
The MC68HC05SR3 has three low-power operating modes. The WAIT and STOP instructions
provide two modes that reduce the power required for the MCU by stopping various internal clocks
and/or the on-chip oscillator. The flow of the STOP and WAIT modes is shown in Figure 9-1. The
third low-power operating mode is the SLOW mode.
9.1
STOP Mode
Execution of the STOP instruction places the MCU in its lowest power consumption mode. In the
STOP mode the internal oscillator is turned off, halting all internal processing.
When the CPU enters STOP mode the I-bit in the Condition Code Register is cleared
automatically, so that any hardware interrupts (IRQ, IRQ2 and KBI) can “wake” the MCU. All other
registers and memory contents remain unaltered. All input/output lines remain unchanged.
The MCU can be brought out of the STOP mode only by a hardware interrupt or an externally
generated reset. When exiting the STOP mode the internal oscillator will resume after a
pre-defined number of internal processor clock cycles, due to oscillator stabilization.
9.2
9
WAIT Mode
The WAIT instruction places the MCU in a low-power mode, but consumes more power than the
STOP mode. In the WAIT mode the internal processor clock is halted, suspending all processor
and internal bus activities. Other Internal clocks remain active, permitting interrupts to be
generated from the Timer. The Timer may be used to generate a periodic exit from the WAIT mode
or, in conjunction with the external Timer pin, on the occurrence of external events. Execution of
the WAIT instruction automatically clears the I-bit in the Condition Code Register, so that any
hardware interrupt can “wake” the MCU. All other registers, memory, and input/output lines remain
in their previous states.
TPG
MC68HC05SR3
LOW POWER MODES
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STOP
WAIT
Stop External Oscillator,
Stop Internal Timer Clock,
and Reset Start-Up Delay
External Oscillator Active,
and Internal
Timer Clock Active
Stop Internal Processor Clock,
Clear I-Bit in CCR
Stop Internal Processor Clock,
Clear I-Bit in CCR
Y
External
RESET?
External
RESET?
Y
N
N
N
External Hardware
Interrupt?
Y
Reset External Oscillator,
and Stabilization Delay
Y
External Hardware
Interrupt?
N
9
N
End of Start-Up
Delay?
Y
Timer
Interrupt?
N
Y
Restart
Internal Processor Clock
Y
Keyboard
Interrupt?
N
Fetch Reset Vector
or
Service Interrupt
(a) Stack
(b) Set I-Bit
(c) Vector to Interrupt
Routine
Figure 9-1 STOP and WAIT Mode Flowcharts
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LOW POWER MODES
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9.3
SLOW Mode
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The SLOW mode function is controlled by the SM bit in the Miscellaneous Control Register. When
the SM bit is set, the internal bus clock is divided by 16, resulting to a frequency equal to the
oscillator frequency divide by 32. This feature permits a slow down of all the internal operations
and thus reduces power consumption — particularly useful while in WAIT mode. The SM bit is
automatically cleared while going to STOP mode.
Miscellaneous Control Register
Address bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
KBIE
KBIC
INTO
INTE
LVRE
SM
$0C
bit 1
bit 0
State
on reset
IRQ2F IRQ2E 0001 0000
SM — Slow Mode
1 (set)
–
0 (clear) –
9.4
Slow mode enabled. Internal bus frequency fOP =fOSC ÷ 32.
Slow mode disabled. Internal bus frequency fOP =fOSC ÷ 2.
Data-Retention Mode
If the Low Voltage Reset function is not enabled, the contents of RAM and CPU registers are
retained at supply voltages as low as 2Vdc. This is called the data-retention mode where the data
is held, but the device is not guaranteed to operate. The RESET pin must be held low during
data-retention mode.
The Low Voltage Reset Function is enabled/disabled by the LVRE bit in the Miscellaneous Control
Register ($0C).
Address bit 7
Miscellaneous Control Register
$0C
KBIE
bit 6
bit 5
bit 4
bit 3
bit 2
KBIC
INTO
INTE
LVRE
SM
bit 1
bit 0
9
State
on reset
IRQ2F IRQ2E 0001 0000
LVRE — Low Voltage Reset Enable
1 (set)
–
Low Voltage Reset function enabled.
0 (clear) –
Low Voltage Reset function disabled.
TPG
MC68HC05SR3
LOW POWER MODES
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LOW POWER MODES
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10
OPERATING MODES
The MC68HC05SR3/MC68HC705SR3 has two modes of operation: the User Mode and the
Self-Check/Bootstrap Mode. Table 10-1 shows the conditions required for entering the two
operating modes.
Table 10-1 Mode Selection
RESET
5V
VPP
VSS to VDD
PB1
VSS to VDD
MODE
USER
VTST
VDD
SELF-CHECK/BOOTSTRAP
VTST =2×VDD
10.1
User Mode
The normal operating mode of the MC68HC05SR3/MC68HC705SR3 is the User mode. This
mode is entered on the rising edge of RESET when the VPP and PB1 pins are between VSS and
VDD.
10.2
10
Self-Check Mode
The Self-check mode is provided on the MC68HC05SR3 for the user to check device functions
with an on-chip self-check program masked at location $1F00 to $1FEF under minimum hardware
support. The self-check schematic is shown in Figure 10-1. Self-check mode is entered on the
rising edge of RESET when the VPP pin is at VTST (2×VDD) and PB1 pin is at VDD. Once in the
self-check mode, PB1 can then be used for other purposes. After entering the self-check mode,
CPU branches to the self-check program and carries out the self-check. Self-check is a repetitive
test, i.e. if all parts are checked to be good, the CPU will repeat the self-check again. Therefore,
the LEDs attached to Port A will be flashing if the device is good; else the combination of LEDs’
on-off pattern can show what part of the device is suspected to be bad. Table 10-2 lists the LEDs’
on-off patterns and their corresponding indications.
TPG
MC68HC05SR3
OPERATING MODES
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MC68HC05SR3
OUT
Crystal OSC
4MHz
OSC1
OSC2
PD0/AN0
PD1/AN1
PD2/AN2
PD3/AN3
PD4/VRL
PD5/VRH
PD6/IRQ2
PD7
+5V
4K7
RESET
RESET
1µF
+5V
+
10K
+5V
330
D1
PB0
PB4
330
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
D2
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
IRQ
TIMER
PB1
PB5
10
330
330
D3
D4
VPP
PB2
PB6
VPP
+5V
PB3
VDD
+
PB7
VSS
47µF
0.1µF
Figure 10-1 MC68HC05SR3 Self-Check Circuit
TPG
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OPERATING MODES
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Table 10-2 Self-Check Report
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D4
D3
D2
Flashing
1
1
1
1
1
1
1
1
0
1
1
0
1
0
1
1
0
1
1
0
0
0
1
1
1=LED on, 0=LED off
10.3
D1
1
0
1
0
1
0
0
1
REMARKS
O.K. (self-check is on-going)
Bad port A
Bad port B
Bad port C
Bad port D
Bad RAM
Bad ROM
Bad SWI
Bad IRQ
Bootstrap Mode
The Bootstrap mode is provided in the EPROM part (MC68HC705SR3) as a mean of
self-programming its EPROM with minimal circuitry. Bootstrap mode will be entered on the rising
edge of RESET when the VPP pin is at VTST (2×VDD) and PB1 pin is at VDD. Once in the bootstrap
mode, PB1 can then be used for other purposes. After entering the bootstrap mode, CPU
branches to the bootstrap program and carries out the EPROM programming routine. The user
EPROM consists of 3840 bytes, from location $1000 to $1EFF.
Refer to Appendix A for further details on MC68HC705SR3.
10
TPG
MC68HC05SR3
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11
ELECTRICAL SPECIFICATIONS
This section contains the electrical specifications for MC68HC05SR3.
11.1
Maximum Ratings
(Voltages referenced to VSS)
RATINGS
Supply Voltage
Input Voltage
VPP Pin
Current Drain per pin excluding VDD and VSS
Operating Temperature
Standard
Extended
Storage Temperature Range
SYMBOL
VDD
VIN
VIN
ID
TA
TSTG
VALUE
–0.3 to +7.0
VSS –0.3 to VDD +0.3
VSS –0.3 to 2xVDD +0.3
25
TL to TH
0 to +70
–40 to +85
–65 to +150
UNIT
V
V
V
mA
°C
°C
This device contains circuitry to protect the inputs against damage due to high static voltages or
electric fields. However, it is advised that normal precautions should be taken to avoid application
of any voltage higher than the maximum rated voltages to this high impedance circuit. For proper
operation it is recommended that Vin and Vout be constrained to the range VSS ≤(Vin or Vout)≤VDD.
Reliability of operation is enhanced if unused inputs are connected to an appropriate logic voltage
level (e.g. either VSS or VDD).
11.2
11
Thermal Characteristics
CHARACTERISTICS
Thermal resistance
DIP
SOIC
QFP
SYMBOL
VALUE
UNIT
θJA
θJA
θJA
60
60
60
°C/W
°C/W
°C/W
TPG
MC68HC05SR3
ELECTRICAL SPECIFICATIONS
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11.3
DC Electrical Characteristics
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Table 11-1 DC Electrical Characteristics for 5V Operation
11
(VDD =5.0Vdc ±10%, VSS =0Vdc, temperature range=0 to 70°C)
CHARACTERISTICS
SYMBOL
MINIMUM
Output voltage
ILOAD = –10µA
VOH
VDD–0.1
ILOAD = +10µA
VOL
—
Output high voltage (ILOAD=–0.8mA)
VOH
VDD–0.8
All Ports
Output low voltage (ILOAD=+1.6mA)
VOL
—
All Ports
Output high current
(VOL=2.5V) All ports
IOH
10
(VOL=3.0V) PB5-PB7 in low-current mode
IOH
2
Output low current
(VOL=2.5V) All ports
IOL
10
(VOL=3.0V) PB5-PB7 in low-current mode
IOL
2
Total I/O port current
IPORT
—
Either source or sink
Input high voltage
VIH
0.7×VDD
PA0-PA7, PB0, PB1, IRQ, RESET, OSC1
Input low voltage
VIL
VSS
PA0-PA7, PB0, PB1, IRQ, RESET, OSC1
Supply current:
Run
—
Wait
—
IDD
Stop 25°C
—
0°C to +70°C (Standard)
—
–40°C to +85°C (Extended)
—
I/O ports high-Z leakage current
—
IIL
PA0-PA7, PB0-PB7, PC0-PC7, PD0-PD7
Input current
IIN
—
RESET, IRQ, OSC1
Capacitance
Ports (as input or output)
COUT
—
RESET, IRQ, OSC1, OSC2
CIN
—
Low voltage reset threshold
VLVR
2.8
Pull-up resistor
PA0-PA7, PB0-PB7, PC0-PC7, PD0-PD7
RPU
14
RESET, IRQ
85
TYPICAL
MAXIMUM
UNIT
—
—
—
0.1
V
V
—
—
V
0.1
0.4
V
—
—
—
—
mA
mA
—
—
—
—
mA
mA
100
—
mA
—
VDD
V
—
0.2×VDD
V
5.0
1.3
—
—
—
7.0
2.5
20
30
40
mA
mA
µA
µA
µA
—
±10
µA
—
±1
µA
—
—
3.5
12
8
4.2
pF
pF
V
36
100
50
176
KΩ
KΩ
Notes:
(1) All values shown reflect average measurements.
(2) Typical values at midpoint of voltage range, 25°C only.
(3) Wait IDD: Only timer system active.
(4) Wait, Stop IDD: All ports configured as inputs, VIL=0.2Vdc, VIH=VDD–0.2Vdc.
(5) Run (operating) IDD, Wait IDD: Measured using external square wave clock source to OSC1 (fOSC =2.0MHz), all inputs 0.2Vdc
from rail; no DC loads, less than 50pF on all outputs, CL=20pF on OSC2.
(6) Stop IDD measured with OSC1=VSS.
(7) Wait IDD is affected linearly by the OSC2 capacitance.
TPG
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Table 11-2 DC Electrical Characteristics for 3V Operation
(VDD =3.0Vdc ±10%, VSS =0Vdc, temperature range=0 to 70°C)
CHARACTERISTICS
SYMBOL
MINIMUM
Output voltage
ILOAD = –10µA
VOH
VDD–0.1
ILOAD = +10µA
VOL
—
Output high voltage (ILOAD=–0.8mA)
VOH
VDD–0.3
All Ports
Output low voltage (ILOAD=+1.6mA)
VOL
—
All Ports
Output high current
(VOH=1.0V) All ports
IOH
2.7
Output low current
(VOL=2.0V) All ports
IOL
3.0
Total I/O port current
IPORT
—
Either source or sink
Input high voltage
VIH
0.7×VDD
PA0-PA7, PB0, PB1, IRQ, RESET, OSC1
Input low voltage
VIL
VSS
PA0-PA7, PB0, PB1, IRQ, RESET, OSC1
Supply current:
Run
—
Wait
—
IDD
Stop 25°C
—
0°C to +70°C (Standard)
—
–40°C to +85°C (Extended)
—
I/O ports high-Z leakage current
—
IIL
PA0-PA7, PB0-PB7, PC0-PC7, PD0-PD7
Input current
IIN
—
RESET, IRQ, OSC1
Capacitance
Ports (as input or output)
COUT
—
RESET, IRQ, OSC1, OSC2
CIN
—
Pull-up resistor
PA0-PA7, PB0-PB7, PC0-PC7, PD0-PD7
RPU
14
RESET, IRQ
85
TYPICAL
MAXIMUM
UNIT
—
—
—
0.1
V
V
—
—
V
0.1
0.3
V
3.5
4.7
mA
4.0
5.2
100
—
mA
—
VDD
V
—
0.2×VDD
V
2.4
0.75
—
—
—
3.5
1.5
20
30
40
mA
mA
µA
µA
µA
—
±10
µA
—
±1
µA
—
—
12
8
pF
pF
36
100
50
176
KΩ
KΩ
mA
11
Notes:
(1) All values shown reflect average measurements.
(2) Typical values at midpoint of voltage range, 25°C only.
(3) Wait IDD: Only timer system active.
(4) Wait, Stop IDD: All ports configured as inputs, VIL=0.2Vdc, VIH=VDD–0.2Vdc.
(5) Run (operating) IDD, Wait IDD: Measured using external square wave clock source to OSC1 (fOSC =2.0MHz), all inputs 0.2Vdc
from rail; no DC loads, less than 50pF on all outputs, CL=20pF on OSC2.
(6) Stop IDD measured with OSC1=VSS.
(7) Wait IDD is affected linearly by the OSC2 capacitance.
TPG
MC68HC05SR3
ELECTRICAL SPECIFICATIONS
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11.4
ADC Electrical Characteristics
Table 11-3 ADC Electrical Characteristics for 5V and 3V Operation
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CHARACTERISTICS
Resolution
Absolute accuracy
Conversion range
Power-up time
VRH
VRL
Conversion time
Monotonicity
Zero-input reading
Full-scale reading
Sample acquisition time
Input capacitance
Input leakage
PARAMETER
Number of bits resolved by the ADC
Difference between the actual input voltage and the
full-scale equivalent of the binary code output code for all
errors.(1)
Analog input voltage range
ADC power-up time delay, tADON
Maximum analog reference voltage
Minimum analog reference voltage
Total time to perform a single analog to digital conversion
(a) External clock (OSC1, OSC2)
(b) Internal RC oscillator
Conversion result never decreases with an increase in
input voltage and has no missing codes
Conversion result when VIN=VRL
Conversion result when VIN=VRH
Analog input acquisition sampling(2)
(a) External clock (OSC1, OSC2)
(b) Internal RC oscillator
Input capacitance on AN0-AN3
Input leakage on ADC pins(3)
AN0, AN1, AN2, AN3, VRL, VRH
MINIMUM
8
MAXIMUM
8
UNIT
bits
—
—
±1.5 (VDD =5V)
±2 (VDD =3.3V)
LSB
LSB
VRL
—
VRL
VSS–0.1
VRH
500
VDD+0.1
VRH
V
µs
V
V
—
—
32
32
tCYC
tCYC
Inherent (within total error)
00
—
—
FF
hex
hex
—
—
—
12
12
8
tCYC
µs
pF
—
±400
nA
Notes:
(1) Error includes quantization. ADC accuracy may decrease proportionately as VDD is reduced below 3.0V.
(2) Source impedances greater than 10KΩ adversely affect internal RC charging time during input sampling.
(3) The external system error caused by input leakage current is approximately equal to the product of R source and input current.
11
TPG
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11.5
Control Timing
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Table 11-4 Control Timing for 5V Operation
(VDD =5.0Vdc ±10%, VSS =0Vdc, temperature range=0 to 70°C)
CHARACTERISTICS
SYMBOL
Frequency of operation
RC oscillator Option
fOSC
Crystal option
External clock option
Internal operating frequency (fOSC/2)
RC oscillator
fOP
Crystal
External clock
Processor cycle time (1/fOP)
tCYC
RC oscillator stabilization time
tRCON
Crystal oscillator start-up time (crystal oscillator)
tOXOV
Stop recovery start-up time (crystal oscillator)
tILCH
RESET pulse width low
tRL
Timer resolution(2)
tRESL
Interrupt pulse width low (edge-triggered)
tILIH
Interrupt pulse period
tILIL
PA0-PA7 interrupt pulse width high (edge-triggered)
tIHIL
PA0-PA7 interrupt pulse period
tIHIH
OSC1 pulse width
t
RC oscillator frequency combined stability(4)
∆fOSC
fOSC=2.0MHz, VDD=5.0Vdc±10%, tA=-40°C to +85°C
∆fOSC
fOSC=2.0MHz, VDD=5.0Vdc±10%, tA=0°C to +40°C
MINIMUM
MAXIMUM
UNIT
0.1
0.1
dc
4.0
4.0
4.0
MHz
MHz
MHz
—
—
dc
500
—
—
—
1.5
See note (2)
125
See note (3)
125
See note (3)
90
2.0
2.0
2.0
—
1
100
100
—
—
—
—
—
—
—
MHz
MHz
MHz
ns
ms
ms
ms
tCYC
tCYC
ns
tCYC
ns
tCYC
ns
–
–
±25
±15
%
%
Notes:
(1) VDD=5.0Vdc±10%, VSS=0Vdc, tA=tL to tH
(2) The TIMER input pin is the limiting factor in determining timer resolution.
(3) The minimum period tILIL or tIHIH should not be less than the number of cycles it takes to execute the interrupt
service routine plus 19 tCYC.
(4) Effects of processing, temperature, and supply voltage (excluding tolerances of external R and C).
11
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ELECTRICAL SPECIFICATIONS
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Table 11-5 Control Timing for 3V Operation
(VDD =3.0Vdc ±10%, VSS =0Vdc, temperature range=0 to 70°C)
CHARACTERISTICS
SYMBOL
Frequency of operation
RC oscillator Option
fOSC
Crystal option
External clock option
Internal operating frequency (fOSC/2)
RC oscillator
fOP
Crystal
External clock
Processor cycle time (1/fOP)
tCYC
RC oscillator stabilization time
tRCON
Crystal oscillator start-up time (crystal oscillator)
tOXOV
Stop recovery start-up time (crystal oscillator)
tILCH
RESET pulse width low
tRL
Timer resolution(2)
tRESL
Interrupt pulse width low (edge-triggered)
tILIH
Interrupt pulse period
tILIL
PA0-PA7 interrupt pulse width high (edge-triggered)
tIHIL
PA0-PA7 interrupt pulse period
tIHIH
OSC1 pulse width
t
RC oscillator frequency combined stability(4)
∆fOSC
fOSC=2.0MHz, VDD=3.0Vdc±10%, tA=–40°C to +85°C
∆fOSC
fOSC=2.0MHz, VDD=3.0Vdc±10%, tA=0°C to +40°C
MINIMUM
MAXIMUM
UNIT
0.1
0.1
dc
2.0
2.0
2.0
MHz
MHz
MHz
—
—
dc
1000
—
—
—
1.5
See note (2)
250
See note (3)
250
See note (3)
180
1.0
1.0
1.0
—
2
200
200
—
—
—
—
—
—
—
MHz
MHz
MHz
ns
ms
ms
ms
tCYC
tCYC
ns
tCYC
ns
tCYC
ns
—
—
±35
±20
%
%
Notes:
(1) VDD=3.0Vdc±10%, VSS=0Vdc, tA=tL to tH
(2) The TIMER input pin is the limiting factor in determining timer resolution.
(3) The minimum period tILIL or tIHIH should not be less than the number of cycles it takes to execute the interrupt
service routine plus 19 tCYC.
(4) Effects of processing, temperature, and supply voltage (excluding tolerances of external R and C).
11
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ELECTRICAL SPECIFICATIONS
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12
MECHANICAL SPECIFICATIONS
This section provides the mechanical dimensions for the 40-pin DIP, 42-pin SDIP and 44-pin QFP
packages for the MC68HC05SR3.
12
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MC68HC05SR3
MECHANICAL SPECIFICATIONS
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12.1
40-Pin DIP Package (Case 711-03)
40
! ! ! #! %% ! $"
! ! ! ! !
!
! ! #
! " 21
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B
1
20
A
L
C
N
J
H
G
F
K
D
M
°
°
°
°
Figure 12-1 40-pin DIP Package
12.2
42-Pin SDIP Package (Case 858-01)
-A42
! ! %
! ! ! #
! " $" 22
-B1
21
L
H
C
-T
G
F
D 42 PL
12
N
K
! M
J 42 PL
°
°
°
°
! Figure 12-2 42-pin SDIP Package
TPG
MOTOROLA
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MECHANICAL SPECIFICATIONS
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12.3
44-pin QFP Package (Case 824A-01)
L
33
23
B
DETAIL A
S
S
D
D
S
V
H A-B
L
-A,B,DB
M
-B-
B
0.20 (0.008)
-A-
S
22
0.20 (0.008) M C A-B
0.05 (0.002) A-B
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34
DETAIL A
44
12
1
11
F
-DA
0.20 (0.008) M C A-B
0.05 (0.002) A-B
S
0.20 (0.008) M H A-B
BASE METAL
S
D
S
S
D
S
N
J
D
M
DETAIL C
0.20 (0.008)
M
C A-B
S
D
S
SECTION B–B
C E
-H-
0.01 (0.004)
-CSEATING
PLANE
H
M
G
M
T
DATUM
PLANE
DATUM
PLANE
-H-
R
K
W
X
DETAIL C
Q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE ĆHĆ IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS ĆAĆ, ĆBĆ AND ĆDĆ TO BE DETERMINED AT
DATUM PLANE ĆHĆ.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE ĆCĆ.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE ĆHĆ.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
Q
R
S
T
U
V
W
X
MILLIMETERS
MIN
MAX
9.90 10.10
9.90 10.10
2.45
2.10
0.45
0.30
2.10
2.00
0.40
0.30
0.80 BSC
0.25
Ċ
0.23
0.13
0.95
0.65
8.00 REF
10°
5°
0.17
0.13
7°
0°
0.30
0.13
12.95 13.45
Ċ
0.13
Ċ
0°
12.95 13.45
Ċ
0.40
1.6 REF
INCHES
MIN
MAX
0.390 0.398
0.390 0.398
0.083 0.096
0.012 0.018
0.079 0.083
0.012 0.016
0.031 BSC
0.010
Ċ
0.005 0.009
0.026 0.037
0.315 REF
10°
5°
0.005 0.007
7°
0°
0.005 0.012
0.510 0.530
Ċ
0.005
Ċ
0°
0.510 0.530
Ċ
0.016
0.063 REF
12
Figure 12-3 44-pin QFP Package
TPG
MC68HC05SR3
MECHANICAL SPECIFICATIONS
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MECHANICAL SPECIFICATIONS
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A
MC68HC705SR3
This appendix summarizes the differences between the MC68HC05SR3 and MC68HC705SR3.
The same information can also be found in appropriate sections of the book.
The MC68HC705SR3 is an EPROM version of the MC68HC05SR3. The 3840 bytes of user ROM
in the MC68HC05SR3 are replaced by 3840 bytes of user EPROM.
A.1
Features
•
Functionally equivalent to MC68HC05SR3
•
3840 bytes of user EPROM
•
EPROM bootstrap mode replaces Self-Check mode on the MC68HC05SR3
•
Available in the following packages: OTP 40-pin PDIP, windowed EPROM 40-pin Ceramic DIP,
OTP 42-pin SDIP, and 44-pin QFP
A
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MC68HC05SR3
MC68HC705SR3
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A.2
Modes of Operation
The MC68HC705SR3 has two modes of operation – user mode and EPROM bootstrap mode.
Table A-1 shows the conditions required to enter each mode on the rising edge of RESET.
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Table A-1 MC68HC705SR3 Operating Mode Entry Conditions
RESET
5V
VPP
VSS to VDD
PB1
VSS to VDD
MODE
USER
VTST
VDD
BOOTSTRAP
VTST =2×VDD
A.3
User Mode
The normal operating mode of the MC68HC705SR3 is the user mode. User mode will be entered
on the rising edge of RESET when the VPP and PB1 pins are between VSS and VDD.
Warning: In the MC68HC705SR3, all vectors are fetched from EPROM in user mode; therefore,
the EPROM must be programmed (via the bootstrap mode) before the device is
powered up in user mode.
A.4
Bootstrap Mode
The bootstrap mode is provided as a mean of self-programming MC68HC705SR3 EPROM with
minimal circuitry, and can only run in the crystal oscillator mode. Bootstrap mode will be entered
on the rising edge of RESET when the VPP pin is at VTST (2×VDD) and PB1 pin is at VDD. Once in
the bootstrap mode, PB1 can then be used for other purposes. After entering the bootstrap mode,
CPU branches to the bootstrap program and carries out the EPROM programming routine. The
user EPROM consists of 3840 bytes, from location $1000 to $1EFF.
This program handles copying of user code from an external EPROM into the on-chip EPROM.
The bootstrap function does not have to be done from an external EPROM, but it may be done
from a host.
A
The user code must be a one-to-one correspondence with the internal EPROM addresses.
TPG
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A-2
MC68HC705SR3
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A.4.1
EPROM Programming
Programming boards are available from Motorola for programming the on-chip EPROM. Please
contact your Motorola Representative.
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The Programming Control register (PCR) is provided for EPROM programming. The function of
the EPROM depends on the device operating mode.
A.4.2
Program Control Register (PCR)
Address
bit 7
bit 6
$0D
bit 5
bit 4
bit 3
bit 2
RESERVED
bit 1
bit 0
State
on reset
ELAT
PGM
---- --00
ELAT - EPROM Latch Control
1 (set)
–
0 (clear) –
EPROM address and data bus configured for programming (writes to
EPROM cause address data to be latched). EPROM is in
programming mode and cannot be read if ELATA is 1. This bit should
not be set unless a programming voltage is applied to the VPP pin.
EPROM address and data bus configured for normal reads.
PGM - EPROM Program Command
1 (set)
–
0 (clear) –
A.4.3
Programming power connected to the EPROM array. If ELAT ≠ 1 then
PGM = 0.
Programming power disconnected from the EPROM array.
EPROM Programming Sequence
Programming the EPROM of the MC68HC705SR3 is as follows:
1) Set the ELAT bit.
2) Write the data to be programmed to the address to be programmed.
3) Set the PGM bit.
4) Delay for 1ms.
5) Clear the PGM and the ELAT bits.
The last action may be carried out in a single CPU write operation. It is important to remember
that an external programming voltage must be applied to the VPP pin while programming, but
should be equal to VDD during normal operation.
A
Example shows address $1900 is programmed with $00.
TPG
MC68HC05SR3
MC68HC705SR3
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CLR
LDX
BSET
LDA
STA
BSET
JSR
CLR
PCR
#$00
1,PCR
#$00
$1900,X
0,PCR
DELAY
PCR
A.5
;reset PCR
;load index register with 00
;set ELAT bit
;load data=00 in to A
;latch data and address
;program
;call delay subroutine for 1ms
;reset PCR
Mask Option Register (MOR)
The Mask Option Register (MOR) contains programmable EPROM bits to control mask options,
and cannot be changed in User mode. The erased state are zeros. This register is latched upon
reset going away.
Address bit 7
Mask Option Register (MOR)
bit 6
$0FFF
bit 5
bit 4
bit 3
bit 1
bit 0
State
on reset
SMD
SEC
TMR2 TMR1 TMR0
RC
unaffected
bit 2
SMD — SLOW Mode at Power-on
When programmed to “1”, this bit enables SLOW mode at power-up. Operating frequency,
fOP =fOSC ÷2÷16=fOSC ÷32.
SEC — EPROM Security
When programmed to “1”, this bit disables some functions of the Bootstrap mode, preventing
external reading of EPROM content.
TMR2:TMR0 — Power-on Reset Delay
The amount Power-On Reset delay is set by programming these three bits. The delay is selected
as follows:
TMR2
0
0
0
0
1
1
1
1
A
TMR1
0
0
1
1
0
0
1
1
TMR0
0
1
0
1
0
1
0
1
Delay (Instruction Cycles)
256
512
1024
2048
4096
8192
16384
32768
TPG
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MC68HC705SR3
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RC — RC or Crystal Oscillator Option
1 (set)
–
0 (clear) –
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A.6
Resistor option selected.
Crystal option selected.
Pin Assignments
See Section 2.3 for pin assignments for the available packages.
A
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MC68HC05SR3
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MC68HC705SR3
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GENERAL DESCRIPTION
1
PIN DESCRIPTIONS
2
INPUT/OUTPUT PORTS
3
MEMORY AND REGISTERS
4
RESETS AND INTERRUPTS
5
TIMER
6
ANALOG TO DIGITAL CONVERTER
7
CPU CORE AND INSTRUCTION SET
8
LOW POWER MODES
9
OPERATING MODES
10
ELECTRICAL SPECIFICATIONS
11
MECHANICAL SPECIFICATIONS
12
MC68HC705SR3
A
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1
GENERAL DESCRIPTION
2
PIN DESCRIPTIONS
3
INPUT/OUTPUT PORTS
4
MEMORY AND REGISTERS
5
RESETS AND INTERRUPTS
6
TIMER
7
ANALOG TO DIGITAL CONVERTER
8
CPU CORE AND INSTRUCTION SET
9
LOW POWER MODES
10
OPERATING MODES
11
ELECTRICAL SPECIFICATIONS
12
MECHANICAL SPECIFICATIONS
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MC68HC705SR3
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2
4
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5
6
7
8
9
10
11
12
13
14
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13
14
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