MOTOROLA MC74HC7266AD

SEMICONDUCTOR TECHNICAL DATA
High–Performance Silicon–Gate CMOS
The MC74HC7266A is identical in pinout to the LS266 and the HC266.
The HC7266 has standard CMOS outputs instead of open–drain outputs.
The device inputs are compatible with standard CMOS outputs; with
pullup resistors, they are compatible with LSTTL outputs.
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
14
1
•
•
•
•
•
•
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2 to 6 V
Low Input Current: 1 µA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 56 FETs or 14 Equivalent Gates
D SUFFIX
SOIC PACKAGE
CASE 751A–03
14
1
DT SUFFIX
TSSOP PACKAGE
CASE 948G–01
14
1
ORDERING INFORMATION
MC74HCXXXXAN
MC74HCXXXXAD
MC74HCXXXXADT
LOGIC DIAGRAM
A1
B1
A2
B2
A3
B3
A4
B4
Plastic
SOIC
TSSOP
1
3
2
Y1
PIN ASSIGNMENT
5
4
6
Y2
A1
1
14
VCC
B1
2
13
B4
Y1
3
12
A4
Y2
4
11
Y4
A2
5
10
Y3
B2
6
9
B3
GND
7
8
A3
Y=A B
Y = AB + A B
8
10
9
Y3
12
11
13
Y4
PIN 14 = VCC
PIN 7 = GND
FUNCTION TABLE
Inputs
3/97
 Motorola, Inc. 1997
3–1
REV 1
Output
A
B
Y
L
L
H
H
L
H
L
H
H
L
L
H
MC74HC7266A
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MAXIMUM RATINGS*
Symbol
VCC
Parameter
DC Supply Voltage (Referenced to GND)
Value
Unit
– 0.5 to + 7.0
V
V
Vin
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
Vout
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 25
mA
ICC
DC Supply Current, VCC and GND Pins
± 50
mA
PD
Power Dissipation in Still Air
750
500
450
mW
Tstg
Storage Temperature
– 65 to + 150
_C
Iin
TL
Plastic DIP†
SOIC Package†
TSSOP Package†
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND (Vin or Vout) VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
v
v
_C
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, SOIC or TSSOP Package)
260
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
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RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin, Vout
Parameter
Min
Max
Unit
2.0
6.0
V
0
VCC
V
– 55
+ 125
_C
0
0
0
1000
500
400
ns
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time
(Figure 1)
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
S b l
Symbol
P
Parameter
T
Test
C
Conditions
di i
VCC
V
– 55 to
25_C
85_C
125_C
U i
Unit
VIH
Minimum High–Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20 µA
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
V
VIL
Maximum Low–Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20 µA
2.0
3.0
4.5
6.0
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
V
Minimum High–Level Output
Voltage
Vin = VIH or VIL
|Iout|
20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.20
3.70
5.20
VOH
Vin = VIH or VIL |Iout|
|Iout|
|Iout|
MOTOROLA
3–2
2.4 mA
4.0 mA
5.2 mA
High–Speed CMOS Logic Data
DL129 — Rev 6
MC74HC7266A
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DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
VOL
Parameter
Test Conditions
Maximum Low–Level Output
Voltage
Vin = VIH or VIL
|Iout|
20 µA
Vin = VIH or VIL |Iout|
|Iout|
|Iout|
Iin
ICC
2.4 mA
4.0 mA
5.2 mA
VCC
V
– 55 to
25_C
85_C
125_C
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.40
0.40
0.40
Unit
V
Maximum Input Leakage Current
Vin = VCC or GND
6.0
± 0.1
± 1.0
± 1.0
µA
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
Iout = 0 µA
6.0
1
10
40
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
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AC ELECTRICAL CHARACTERISTICS ( CL = 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
S b l
Symbol
P
Parameter
VCC
V
– 55 to
25_C
85_C
125_C
U i
Unit
tPLH,
tPHL
Maximum Propagation Delay, Input A or B to Output Y
(Figures 1 and 2)
2.0
3.0
4.5
6.0
100
80
20
17
125
90
25
21
150
110
25
19
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 1 and 2)
2.0
3.0
4.5
6.0
75
30
15
13
95
40
19
16
110
55
22
19
ns
Maximum Input Capacitance
—
10
10
10
pF
Cin
NOTES:
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
CPD
P
Power
Dissipation
Di i i C
Capacitance
i
(P
(Per G
Gate)*
)*
pF
F
33
* Used to determine the no–load dynamic power consumption: P D = C PD V CC 2 f + I CC V CC . For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
tr
tf
VCC
90%
50%
INPUT
A OR B
TEST POINT
10%
tPLH
GND
90%
OUTPUT Y
OUTPUT
DEVICE
UNDER
TEST
tPHL
CL*
50%
10%
tTLH
tTHL
* Includes all probe and jig capacitance
Figure 1. Switching Waveforms
High–Speed CMOS Logic Data
DL129 — Rev 6
Figure 2. Test Circuit
3–3
MOTOROLA
MC74HC7266A
LOGIC DETAIL
(1/4 of Device)
A
Y
B
APPLICATION INFORMATION
Bi φ–L is defined as biphase–level code. Also known as
Manchester Code, this technique utilizes binary phase shift
keying (PSK). The Bi φ–L output shown in Figure 3 carries
both data and synchronization information; therefore, separate data and clock lines are not required to transfer information. A positive–going transition in the middle of the bit
interval indicates a logic zero; a negative–going transition in-
dicates a logic one (see Figure 4).
NRZ–L shown in Figure 3 is non–return–to–zero level
code. This is simply serial data out of a shift register, such as
the HC597.
The Bi φ–L signal must be phase coherent (i.e., no
glitches). Therefore, NRZ–L and clock transitions must be
coincident.
1/4
HC7266A
NRZ–L
BI φ–L
CLOCK
Figure 3. Biphase–Level Encoder (Manchester Encoder)
NRZ–L
CLOCK
BI φ–L
POSITIVE
LOGIC DATA
1
0
1
1
0
0
BIT
INTERVAL
Figure 4. Timing Diagram
MOTOROLA
3–4
High–Speed CMOS Logic Data
DL129 — Rev 6
MC74HC7266A
OUTLINE DIMENSIONS
N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
14
8
1
7
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
B
A
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
L
C
J
N
H
G
D
SEATING
PLANE
K
M
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
14
8
P 7 PL
–B–
1
0.25 (0.010)
7
G
D
0.25 (0.010)
High–Speed CMOS Logic Data
DL129 — Rev 6
M
T
B
S
M
F
M
K
14 PL
B
R X 45°
C
SEATING
PLANE
M
A
S
3–5
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.75
8.55
4.00
3.80
1.75
1.35
0.49
0.35
1.25
0.40
1.27 BSC
0.25
0.19
0.25
0.10
7°
0°
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
7°
0°
0.228 0.244
0.010 0.019
MOTOROLA
MC74HC7266A
OUTLINE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
–U–
L
PIN 1
IDENT.
F
7
1
0.15 (0.006) T U
N
S
DETAIL E
K
A
–V–
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÇÇÇ
K1
J J1
SECTION N–N
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
D
H
G
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.020
0.024
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
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MOTOROLA
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3–6
MC74HC7266A/D
High–Speed CMOS Logic Data
DL129 — Rev 6