MOTOROLA MMDF3207

Order this document
by MMDF3207/D
SEMICONDUCTOR TECHNICAL DATA
Medium Power Surface Mount Products
Motorola Preferred Device

DUAL TMOS
POWER MOSFET
7.8 AMPERES
20 VOLTS
RDS(on) = 33 mW
WaveFET devices are an advanced series of power MOSFETs which utilize Motorola’s
latest MOSFET technology process to achieve the lowest possible on–resistance per silicon
area. They are capable of withstanding high energy in the avalanche and commutation
modes and the drain–to–source diode has a very low reverse recovery time. WaveFET
devices are designed for use in low voltage, high speed switching applications where power
efficiency is important. Typical applications are dc–dc converters, and power management
in portable and battery powered products such as computers, printers, cellular and cordless
phones. They can also be used for low voltage motor controls in mass storage products
such as disk drives and tape drives. The avalanche energy is specified to eliminate the
guesswork in designs where inductive loads are switched and offer additional safety margin
against unexpected voltage transients.
• Ultra Low RDS(on) Provides Higher Efficiency and
Extends Battery Life in Portable Applications
• Characterized Over a Wide Range of Power Ratings
• Logic Level Gate Drive — Can Be Driven by
Logic ICs
• Diode Is Characterized for Use In Bridge Circuits
• Diode Exhibits High Speed, with Soft Recovery
• IDSS Specified at Elevated Temperature
• Miniature SO–8 Surface Mount Package —
Saves Board Space
DEVICE MARKING
D3207
CASE 751–06, Style 13
SO–8
S
SOURCE 1
1
8
DRAIN 1
GATE 1
2
7
DRAIN 1
SOURCE 2
3
6
DRAIN 2
GATE 2
4
5
DRAIN 2
G
TOP VIEW
D
ORDERING INFORMATION
Device
MMDF3207R2
Reel Size
Tape Width
Quantity
13″
12 mm embossed tape
2500 units
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
HDTMOS is a trademark of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Preferred devices are Motorola recommended choices for future use and best overall value.
TMOS
Motorola
Motorola, Inc.
1997 Power MOSFET Transistor Device Data
1
MMDF3207
MAXIMUM RATINGS (TJ = 25°C unless otherwise specified)
Characteristics
Drain–to–Source Voltage
Drain–to–Gate Voltage (RGS = 1.0 MW)
Gate–to–Source Voltage — Continuous
1 Inch Square @
10 seconds on
FR–4 or G–10 PCB
1 Inch Square @
Steady State on
FR–4 or G–10 PCB
Minimum Pad @
Steady State on
FR–4 or G–10 PCB
Thermal Resistance — Junction to Ambient
Total Power Dissipation @ TA = 25°C
Linear Derating Factor
Drain Current — Continuous @ TA = 25°C
Drain Current — Continuous @ TA = 70°C
Drain Current — Pulsed Drain Current (1)
Thermal Resistance — Junction to Ambient
Total Power Dissipation @ TA = 25°C
Linear Derating Factor
Drain Current — Continuous @ TA = 25°C
Drain Current — Continuous @ TA = 70°C
Drain Current — Pulsed Drain Current (1)
Thermal Resistance — Junction to Ambient
Total Power Dissipation @ TA = 25°C
Linear Derating Factor
Drain Current — Continuous @ TA = 25°C
Drain Current — Continuous @ TA = 70°C
Drain Current — Pulsed Drain Current (1)
Operating and Storage Temperature Range
Symbol
Maximum
Unit
VDSS
VDGR
VGS
RTHJA
PD
20
12
± 12
V
62.5
2.0
16
7.8
5.7
40
°C/W
Watts
mW/°C
A
A
A
98
1.28
10.2
6.2
4.6
35
°C/W
Watts
mW/°C
A
A
A
166
0.75
6.0
4.8
3.5
30
°C/W
Watts
mW/°C
A
A
A
–55 to 150
°C
ID
ID
IDM
RTHJA
PD
ID
ID
IDM
RTHJA
PD
ID
ID
IDM
TJ, Tstg
(1) Repetitive rating; pulse width limited by maximum junction temperature.
2
Motorola TMOS Power MOSFET Transistor Device Data
MMDF3207
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
20
—
—
TBD
—
—
—
—
—
—
1.0
5.0
—
—
100
0.6
—
—
TBD
—
—
—
—
TBD
TBD
33
50
gFS
—
TBD
—
Mhos
Ciss
—
TBD
TBD
pF
Coss
—
TBD
TBD
Crss
—
TBD
TBD
td(on)
—
TBD
TBD
tr
—
TBD
TBD
td(off)
—
TBD
TBD
tf
—
TBD
TBD
td(on)
—
TBD
TBD
tr
—
TBD
TBD
td(off)
—
TBD
TBD
tf
—
TBD
TBD
QT
—
TBD
TBD
Q1
—
TBD
—
Q2
—
TBD
—
Q3
—
TBD
—
VSD
—
—
TBD
TBD
1.2
—
Vdc
trr
—
TBD
—
ns
ta
—
TBD
—
tb
—
TBD
—
QRR
—
TBD
—
OFF CHARACTERISTICS
Drain–to–Source Breakdown Voltage(1)
(VGS = 0 Vdc, ID = 0.25 mAdc)
Temperature Coefficient (Positive)
V(BR)DSS
Zero Gate Voltage Drain Current
(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 55°C)
IDSS
Gate–Body Leakage Current (VGS = ± 12 Vdc, VDS = 0 Vdc)
IGSS
Vdc
mV/°C
µAdc
nAdc
ON CHARACTERISTICS(1)
Gate Threshold Voltage(1)
(VDS = VGS, ID = 0.25 mAdc)
Threshold Temperature Coefficient (Negative)
VGS(th)
Static Drain–to–Source On–Resistance(1)
(VGS = 4.5 Vdc, ID = 7.8 Adc)
(VGS = 2.5 Vdc, ID = 6.2 Adc)
RDS(on)
Forward Transconductance (VDS = 10 Vdc, ID = 7.8 Adc)(1)
Vdc
mV/°C
mΩ
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
(VDS = 15 Vdc,
Vdc VGS = 0 V,
V
f = 1.0 MHz)
Transfer Capacitance
SWITCHING CHARACTERISTICS(2)
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
(VDS = 10 Vdc,
Vd ID = 1.0
1 0 Adc,
Ad
VGS = 10 Vdc
Vdc,
RG = 6.0 Ω))(1)
Fall Time
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
(VDD = 10 Vdc,
Vd ID = 1.0
1 0 Adc,
Ad
VGS = 4.5
4 5 Vdc,
Vdc
RG = 6.0 Ω))(1)
Fall Time
Gate Charge
((VDS = 10 Vdc,
Vd , ID = 7.8
7 8 Adc,
Ad ,
VGS = 4.5 Vdc)(1)
ns
nC
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage
(IS = 1.7 Adc, VGS = 0 Vdc)(1)
(IS = 1.7 Adc, VGS = 0 Vdc, TJ = 125°C)
Reverse Recovery Time
1.7
7 Adc,
Ad , VGS = 0 Vdc,
Vd ,
((IS = 1
dIS/dt = 100 A/µs)(1)
Reverse Recovery Stored Charge
µC
(1) Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
(2) Switching characteristics are independent of operating junction temperatures.
(3) Repetitive rating; pulse width limited by max. junction temperature.
Motorola TMOS Power MOSFET Transistor Device Data
3
MMDF3207
PACKAGE DIMENSIONS
D
A
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
C
5
0.25
H
E
M
B
M
1
4
h
B
e
X 45 _
q
A
C
SEATING
PLANE
L
0.10
A1
B
0.25
M
C B
S
A
S
DIM
A
A1
B
C
D
E
e
H
h
L
q
CASE 751–06
ISSUE T
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.19
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
STYLE 13:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
N.C.
SOURCE
SOURCE
GATE
DRAIN
DRAIN
DRAIN
DRAIN
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
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Mfax is a trademark of Motorola, Inc.
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4
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MMDF3207/D
Motorola TMOS Power MOSFET Transistor Device
Data