MAC4M, MAC4N Preferred Device Triacs Silicon Bidirectional Thyristors Designed for high performance full-wave ac control applications where high noise immunity and high commutating di/dt are required. • Blocking Voltage to 800 Volts • On-State Current Rating of 4.0 Amperes RMS at 100°C • Uniform Gate Trigger Currents in Three Modes • High Immunity to dv/dt — 500 V/µs minimum at 125°C • Minimizes Snubber Networks for Protection • High Surge Current Capability – 40 Amperes • Industry Standard TO-220AB Package • High Commutating di/dt — 6.0 A/ms minimum at 125°C • Operational in Three Quadrants: Q1, Q2, and Q3 • Device Marking: Logo, Device Type, e.g., MAC4M, Date Code http://onsemi.com TRIACS 4 AMPERES RMS 600 thru 800 VOLTS MT2 MT1 G MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Peak Repetitive Off–State Voltage(1) (TJ = –40 to 125°C, Sine Wave, 50 to 60 Hz, Gate Open) MAC4M MAC4N VDRM, VRRM On-State RMS Current (Full Cycle Sine Wave, 60 Hz, TC = 100°C) IT(RMS) Peak Non-Repetitive Surge Current (One Full Cycle Sine Wave, 60 Hz, TJ = 125°C) Circuit Fusing Consideration (t = 8.33 ms) Peak Gate Power (Pulse Width ≤ 1.0 µs, TC = 100°C) Average Gate Power (t = 8.3 ms, TC = 100°C) Operating Junction Temperature Range Storage Temperature Range Value Unit 4 Volts 600 800 4.0 Amps ITSM 40 Amps I2t 6.6 A2sec PGM 0.5 Watt PG(AV) 0.1 Watt TJ – 40 to +125 °C Tstg – 40 to +150 °C 1 3 TO–220AB CASE 221A STYLE 4 PIN ASSIGNMENT 1 Main Terminal 1 2 Main Terminal 2 3 Gate 4 Main Terminal 2 ORDERING INFORMATION Device (1) VDRM and VRRM for all types can be applied on a continuous basis. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. 2 Package Shipping MAC4M TO220AB 50 Units/Rail MAC4N TO220AB 50 Units/Rail Preferred devices are recommended choices for future use and best overall value. Semiconductor Components Industries, LLC, 1999 February, 2000 – Rev. 1 1 Publication Order Number: MAC4M/D MAC4M, MAC4N THERMAL CHARACTERISTICS Characteristic Thermal Resistance — Junction to Case — Junction to Ambient Symbol Value Unit RθJC RθJA 2.2 62.5 °C/W TL 260 °C Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted; Electricals apply in both directions) Characteristic Symbol Min Typ Max Unit — — — — 0.01 2.0 — 1.3 1.6 8.0 8.0 8.0 12 16 21 35 35 35 6.0 20 35 — — — 25 40 20 60 80 60 0.5 0.5 0.5 0.8 0.8 0.8 1.3 1.3 1.3 (di/dt)c 6.0 8.4 — A/ms Critical Rate of Rise of Off-State Voltage (VD = 0.67 x Rated VDRM, Exponential Waveform, Gate Open, TJ = 125°C) dv/dt 500 1500 — V/µs Repetitive Critical Rate of Rise of On-State Current IPK = 50 A; PW = 40 µsec; diG/dt = 200 mA/µsec; f = 60 Hz di/dt — — 10 A/µs OFF CHARACTERISTICS Peak Repetitive Blocking Current (VD = Rated VDRM, VRRM; Gate Open) TJ = 25°C TJ = 125°C IDRM, IRRM mA ON CHARACTERISTICS Peak On-State Voltage(1) (ITM = ± 6.0 A) VTM Gate Trigger Current (Continuous dc) (VD = 12 V, RL = 100 Ω) MT2(+), G(+) MT2(+), G(–) MT2(–), G(–) IGT Holding Current (VD = 12 V, Gate Open, Initiating Current = ±200 mA) IH Latching Current (VD = 12 V, IG = 35 mA) MT2(+), G(+) MT2(+), G(–) MT2(–), G(–) IL Gate Trigger Voltage (Continuous dc) (VD = 12 V, RL = 100 Ω) MT2(+), G(+) MT2(+), G(–) MT2(–), G(–) V mA mA mA VGT V DYNAMIC CHARACTERISTICS Rate of Change of Commutating Current (VD = 400 V, ITM = 4.0 A, Commutating dv/dt = 18 V/µs, Gate Open, TJ = 125°C, f = 250 Hz, CL = 5.0 µF, LL = 20 mH, No Snubber) (1) Pulse Test: Pulse Width ≤ 2.0 ms, Duty Cycle ≤ 2%. http://onsemi.com 2 MAC4M, MAC4N Voltage Current Characteristic of Triacs (Bidirectional Device) + Current Symbol Parameter VDRM IDRM Peak Forward Blocking Current VRRM IRRM VTM IH VTM Peak Repetitive Forward Off State Voltage Quadrant 1 MainTerminal 2 + on state IH IRRM at VRRM Peak Repetitive Reverse Off State Voltage Peak Reverse Blocking Current Maximum On State Voltage off state IH Holding Current Quadrant 3 VTM MainTerminal 2 – Quadrant Definitions for a Triac MT2 POSITIVE (Positive Half Cycle) + (+) MT2 Quadrant II (+) MT2 Quadrant I (+) IGT GATE (–) IGT GATE MT1 MT1 REF REF IGT – + IGT (–) MT2 (–) MT2 Quadrant III Quadrant IV (+) IGT GATE (–) IGT GATE MT1 MT1 REF REF – MT2 NEGATIVE (Negative Half Cycle) All polarities are referenced to MT1. With in–phase signals (using standard AC lines) quadrants I and III are used. http://onsemi.com 3 + Voltage IDRM at VDRM MAC4M, MAC4N 1.1 VGT, GATE TRIGGER VOLTAGE (VOLTS) IGT, GATE TRIGGER CURRENT (mA) 100 Q2 Q3 Q1 10 1 – 40 – 25 – 10 5 20 35 50 65 80 95 110 125 TJ, JUNCTION TEMPERATURE (°C) 1.0 Q3 0.9 Q2 0.8 Q1 0.7 0.6 0.5 0.4 – 40 – 25 – 10 5 20 35 50 65 80 95 110 125 TJ, JUNCTION TEMPERATURE (°C) Figure 2. Typical Gate Trigger Voltage versus Junction Temperature Figure 1. Typical Gate Trigger Current versus Junction Temperature 100 Q2 IH, HOLDING CURRENT (mA) IL , LATCHING CURRENT (mA) 100 Q1 Q3 10 MT2 Positive MT2 Negative 10 1 – 40 – 25 – 10 5 20 35 50 65 80 95 110 125 TJ, JUNCTION TEMPERATURE (°C) 1 – 40 – 25 – 10 5 20 35 50 65 80 95 110 125 TJ, JUNCTION TEMPERATURE (°C) Figure 4. Typical Holding Current versus Junction Temperature P(AV), AVERAGE POWER DISSIPATION (WATTS) Figure 3. Typical Latching Current versus Junction Temperature TC , CASE TEMPERATURE (°C) 125 120 30° 115 60° 90° 120° 110 180° 105 DC 0 0.5 1 1.5 2 2.5 3 3.5 IT(RMS), RMS ON-STATE CURRENT (AMPS) 4 6 DC 5 180° 120° 4 90° 60° 3 30° 2 1 0 0 Figure 5. Typical RMS Current Derating 1 2 3 0.5 1.5 2.5 3.5 IT(AV), AVERAGE ON-STATE CURRENT (AMPS) Figure 6. On-State Power Dissipation http://onsemi.com 4 4 IT, INSTANTANEOUS ON-STATE CURRENT (AMPS) 100 Maximum @ TJ = 25°C Typical @ TJ = 25°C Maximum @ TJ = 125°C 10 1 r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) MAC4M, MAC4N 1 0.1 0.01 0.1 1 10 100 t, TIME (ms) 1000 Figure 8. Typical Thermal Response 0.1 0 1 2 3 4 VT, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS) Figure 7. Typical On-State Characteristics http://onsemi.com 5 10000 MAC4M, MAC4N PACKAGE DIMENSIONS TO–220AB CASE 221A–09 ISSUE Z –T– SEATING PLANE C T S 4 DIM A B C D F G H J K L N Q R S T U V Z A Q 1 2 3 U H K Z L R V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. J G D N INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.095 0.105 0.110 0.155 0.018 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 0.045 ––– ––– 0.080 STYLE 4: PIN 1. 2. 3. 4. http://onsemi.com 6 MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.46 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 1.15 1.39 5.97 6.47 0.00 1.27 1.15 ––– ––– 2.04 MAIN TERMINAL 1 MAIN TERMINAL 2 GATE MAIN TERMINAL 2 MAC4M, MAC4N Notes http://onsemi.com 7 MAC4M, MAC4N ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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