TFA9841J 1-channel audio amplifier (SE: 1 W to 7.5 W) Rev. 01 — 06 February 2004 Preliminary data 1. General description The TFA9841J contains one audio power amplifier. The TFA9841J can be used as one Single-Ended (SE) channel with a fixed gain of 26 dB. The TFA9841J comes in a 9-pin DIL-bent-SIL (DBS9P) power package. The TFA9841J is pin compatible with the TFA9842J and TFA9843J. The TFA9841J contains a unique protection circuit that is solely based on multiple temperature measurements inside the chip. This gives maximum output power for all supply voltages and load conditions with no unnecessary audio holes. Almost any supply voltage and load impedance combination can be made as long as thermal boundary conditions (external heatsink and ambient temperature) allow it. 2. Features ■ ■ ■ ■ ■ ■ ■ ■ ■ SE: 1 W to 7.5 W (into 4 Ω), up to 9 W into (into 8 Ω) Soft clipping Standby and mute mode No on/off switching plops Low standby current High supply voltage ripple rejection Outputs short-circuit protected to ground, supply and across the load Thermally protected Pin compatible with the TFA9842J and TFA9843J. ■ ■ ■ ■ Television PC speakers Boom box Mini and micro audio receivers. 3. Applications TFA9841J Philips Semiconductors 1-channel audio amplifier (1 x SE) 4. Quick reference data Table 1: Quick reference data Symbol Parameter VCC supply voltage Conditions Min Typ Max Unit operating 9 17 26 V no signal - - 28 V Iq quiescent supply current VCC = 18 V; RL = ∞ - 60 100 mA Istb standby supply current - - 10 µA Po output power 7 7.5 - W THD total harmonic distortion Po = 1 W - 0.1 0.5 % Gv voltage gain SVRR supply voltage ripple rejection VCC = 17 V; RL = 4 Ω; THD = 10 % f = 1 kHz 25 26 27 dB - 60 - dB 5. Ordering information Table 2: Ordering information Type number Package Name Description Version TFA9841J DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad SOT523 -1 6. Block diagram VCC 9 IN1− CIV 1 2 3 VREF OUT1− SHORT-CIRCUIT AND TEMPERATURE PROTECTION VCC MODE STANDBY MUTE ON 7 TFA9841J 4, 8 6 0.5VCC SVR 5 MDB795 n.c. GND Fig 1. Block diagram. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 12014 Preliminary data Rev. 01 — 06 February 2004 2 of 17 TFA9841J Philips Semiconductors 1-channel audio amplifier (1 x SE) 7. Pinning information 7.1 Pinning IN1− 1 OUT1− 2 CIV 3 n.c. 4 GND 5 SVR 6 MODE 7 n.c. 8 VCC 9 TFA9841J MDB796 Fig 2. Pin configuration. 7.2 Pin description Table 3: Pin description Symbol Pin Description IN1− 1 input 1 OUT1− 2 inverted loudspeaker terminal 1 CIV 3 common input voltage decoupling n.c. 4 not connected GND 5 ground SVR 6 half supply voltage decoupling (ripple rejection) MODE 7 mode selection input (standby, mute and operating) n.c. 8 not connected VCC 9 supply voltage TAB - back side tab or heats spreader has to be connected to ground 8. Functional description 8.1 Input configuration The input cut-off frequency is: 1 f i ( cut – off ) = ----------------------------2π ( R i × C i ) (1) SE application: Ri = 60 kΩ and Ci = 220 nF: 1 f i ( cut – off ) = ---------------------------------------------------------------- = 12 Hz 3 –9 2π ( 60 × 10 × 220 × 10 ) © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 12014 Preliminary data (2) Rev. 01 — 06 February 2004 3 of 17 TFA9841J Philips Semiconductors 1-channel audio amplifier (1 x SE) As shown in Equation 2, large capacitor values for the inputs are not necessary, so the switch-on delay during charging of the input capacitors can be minimized. This results in a good low frequency response and good switch-on behavior. 8.2 Power amplifier The power amplifier is a Single-Ended (SE) amplifier with an all-NPN output stage, capable of delivering a peak output current of 3 A. 8.2.1 Output power measurement The output power as a function of the supply voltage is measured on the output pins at THD = 10 %; see Figure 5. The maximum output power is limited by the supply voltage of 26 V and the maximum available output current is 3 A (repetitive peak current). A minimum load of 4 Ω is required for VCC > 22 V; see Figure 6 8.2.2 Headroom Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom, compared to the average power output, for transferring the loudest parts without distortion. At VCC = 18 V and Po = 5 W (RL = 4 Ω) at THD = 0.2 % (see Figure 7), the Average Listening Level (ALL) music power without any distortion yields: 3 5 ⋅ 10 P o ( ALL ) = --------------- = 315 mW 15.85 (3) The power dissipation can be derived from Figure 9 for a headroom of 0 dB and 12 dB, respectively (see Table 4). Table 4: Power rating as function of headroom Headroom Power output (THD = 0.2 %) Power dissipation 0 dB Po = 5 W PD = 4.4 W 12 dB Po(ALL) = 315 mW PD = 2.2 W For the average listening level a power dissipation of 2.2 W can be used for a heatsink calculation. 8.3 Mode selection The TFA9841J has three functional modes, which can be selected by applying the proper DC voltage to pin MODE (see Table 5 and Figure 3). Table 5: Mode selection VMODE Amplifier 0 to 0.8 V standby 4.5 V to (VCC − 3.5 V) mute (VCC − 2.0 V) to VCC on © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 12014 Preliminary data Rev. 01 — 06 February 2004 4 of 17 TFA9841J Philips Semiconductors 1-channel audio amplifier (1 x SE) Standby — The current consumption is very low and the output is floating. The device is in standby mode when VMODE < 0.8 V, or when pin MODE is grounded. Mute — The amplifier is DC-biased but not operational (no audio output). This allows the input coupling capacitors to be charged to avoid pop-noise. The device is in mute mode when 4.5 V < VMODE < (VCC − 3.5 V). On — The amplifier is operating normally. The operating mode is activated at VMODE > (VCC − 2.0 V). standby 0.8 mute 4.5 on VCC−3.5 VCC−2.0 VCC VMODE (V) MDB797 Fig 3. Mode selection. 8.4 Supply voltage ripple rejection The supply voltage ripple rejection (SVRR) is measured with an electrolytic capacitor of 150 µF on pin SVR using a bandwidth of 20 Hz to 22 kHz. Figure 10 illustrates the SVRR as function of the frequency. A larger capacitor value on pin SVR improves the ripple rejection behavior at the lower frequencies. 8.5 Built-in protection circuits The TFA9841J contains two types of temperature sensors; one measures local temperatures of the power stage and one measures the global chip temperature. At a local temperature of the power stage of approximately 185 oC or a global temperature of approximately 150 oC, this detection circuit switches off the power stage for 2 ms. High impedance of the output is the result. After this time period, the power stage switches on automatically and the detection will take place again; still a too high temperature switches off the power stage immediately. This protects the TFA9841J against shorts to ground, to the supply voltage, across the load and too high chip temperatures. The protection will only be activated when necessary, so even during a short-circuit condition, a certain amount of (pulsed) current will still be flowing through the short, just as much as the power stage can handle without exceeding the critical temperature level. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 12014 Preliminary data Rev. 01 — 06 February 2004 5 of 17 TFA9841J Philips Semiconductors 1-channel audio amplifier (1 x SE) 9. Limiting values Table 6: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCC supply voltage operating −0.3 +26 V no signal −0.3 +28 V VI input voltage −0.3 VCC + 0.3 V IORM repetitive peak output current - 3 A Tstg storage temperature non-operating −55 +150 °C Tamb ambient temperature operating −40 +85 °C Ptot total power dissipation - 8 W VCC(sc) supply voltage to guarantee short-circuit protection - 24 V 10. Thermal characteristics Table 7: Thermal characteristics Symbol Parameter Conditions Value Unit Rth(j-a) thermal resistance from junction to ambient in free air 40 K/W Rth(j-c) thermal resistance from junction to case channel driven 4.0 K/W 11. Static characteristics Table 8: Static characteristics VCC = 17 V; Tamb = 25 °C; RL = 4 Ω; VMODE = VCC; Vi = 0 V; measured in test circuit Figure 11; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VCC supply voltage operating [1] 9 17 26 V Iq quiescent supply current RL = ∞ [2] - 60 100 mA Istb standby supply current VMODE = 0 - - 10 µA VO DC output voltage VMODE mode selection input voltage IMODE [1] [2] [3] input current on pin MODE [3] - 9 - V on mode VCC − 2.0 - VCC V mute mode 4.5 - VCC − 3.5 V standby mode 0 - 0.8 V 0 < VMODE < VCC − 3.5 - - 20 µA A minimum load of 4 Ω is required at VCC > 22 V. With a load connected at the outputs the quiescent supply current will increase. The DC output voltage with respect to ground is approximately 0.5VCC. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 12014 Preliminary data Rev. 01 — 06 February 2004 6 of 17 TFA9841J Philips Semiconductors 1-channel audio amplifier (1 x SE) 12. Dynamic characteristics Table 9: Dynamic characteristics VCC = 17 V; Tamb = 25 °C; RL = 4 Ω; f = 1 kHz; VMODE = VCC; measured in test circuit Figure 11; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Po output power RL = 4 Ω; see Figure 6 THD = 10 % - 7.5 - W THD = 0.5 % - 6.1 - W THD total harmonic distortion Po = 1 W; see Figure 7 and Figure 8 - 0.1 0.5 % Gv SE voltage gain 25 26 27 dB Zi input impedance Vn(o) noise output voltage SVRR supply voltage ripple rejection Vo(mute) [1] [2] [3] 40 60 - kΩ [1] - 150 - µV fripple = 1 kHz [2] - 60 - dB fripple = 100 Hz to 20 kHz [2] - 60 - dB [3] - - 150 µV see Figure 10 output voltage in mute mode The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance Rsource = 0 Ω at the input. Supply voltage ripple rejection is measured at the output, with a source impedance Rsource = 0 Ω at the input and with a frequency range from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which is applied to the positive supply rail. Output voltage in mute mode (VMODE = 7 V) is measured with an input voltage of 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz, including noise. MDB798 107 Vo (µV) 106 105 104 103 102 10 1 0 4 8 12 16 20 VMODE (V) Vi = 50 mV; VCC = 18 V. Fig 4. AC output voltage as function of mode selection voltage. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 12014 Preliminary data Rev. 01 — 06 February 2004 7 of 17 TFA9841J Philips Semiconductors 1-channel audio amplifier (1 x SE) mdb806 MDB809 15 40 Po (W) Po (W) 12 30 9 20 2Ω 3Ω 4Ω 6 RL = 1 Ω 10 8Ω 3 0 8 10 12 14 16 18 VCC (V) THD = 10 %; RL = 4 Ω; f = 1 kHz. 0 8 12 16 20 24 28 VCC (V) THD = 10 %. Fig 5. Output power as function of supply voltage. Fig 6. Output power as function of supply voltage for various SE loads. MCE488 102 MCE489 10 THD+N (%) THD+N (%) 10 1 1 10−1 10−1 10−2 10−1 1 10 Po (W) VCC = 18 V; f = 1 kHz; RL = 4 Ω. 102 10−2 10 103 104 f (Hz) 105 VCC = 17 V; Po = 1 W; RL = 4 Ω. Fig 7. Total harmonic distortion-plus-noise as function of output power. Fig 8. Total harmonic distortion-plus-noise as function of frequency. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 12014 Preliminary data 102 Rev. 01 — 06 February 2004 8 of 17 TFA9841J Philips Semiconductors 1-channel audio amplifier (1 x SE) MDB799 5 PD (W) MCE497 0 SVRR (dB) 4 −20 3 −40 2 −60 1 0 0 2 4 6 8 Po (W) 10 −80 10 103 104 f (Hz) 105 VCC = 17 V; Rsource = 0 Ω; Vripple = 300 mV (RMS); a bandpass filter of 20 Hz to 22 kHz has been applied input short-circuited. VCC = 18 V; RL = 4 Ω. Fig 9. Total power dissipation as function of channel output power. Fig 10. Supply voltage ripple rejection as function of frequency. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 12014 Preliminary data 102 Rev. 01 — 06 February 2004 9 of 17 TFA9841J Philips Semiconductors 1-channel audio amplifier (1 x SE) 13. Application information VCC VCC 1000 µF 100 nF 9 220 nF IN1− 1 2 OUT1− 470 µF Vi CIV 3 VREF − + SHORT-CIRCUIT AND TEMPERATURE PROTECTION RL 4Ω VCC MODE 7 VCC 10 kΩ 50 kΩ 100 kΩ 7.5 V microcontroller 22 µF 270 Ω BC547 BC547 STANDBY MUTE ON 0.5VCC SVR 6 TFA9841J 2.2 µF 47 µF 5 1.5 kΩ mdb794 GND Fig 11. Typical SE application diagram. Remark: Because of switching inductive loads, the output voltage can rise beyond the maximum supply voltage of 28 V. At high supply voltages, it is recommended to use (Schottky) diodes to the supply voltage and ground. 13.1 Printed-circuit board 13.1.1 Layout and grounding To obtain a high-level system performance, certain grounding techniques are essential. The input reference grounds have to be tied with their respective source grounds and must have separate tracks from the power ground tracks; this will prevent the large (output) signal currents from interfering with the small AC input signals. The small-signal ground tracks should be physically located as far as possible from the power ground tracks. Supply and output tracks should be as wide as possible for delivering maximum output power. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 12014 Preliminary data Rev. 01 — 06 February 2004 10 of 17 TFA9841J Philips Semiconductors 1-channel audio amplifier (1 x SE) AUDIO POWER CS NIJMEGEN PF / 3002 .naJ 72 TVA TFA9843J 1000 µF 1 BTL1/2 100 nF −SE1+ 1000 µF 1000 µF 220 nF SVR 150 µF SVR −SE2+ 220 nF CIV 22 µF MODE 10 kΩ SGND +VP 10 kΩ CIV IN2+ SB ON MUTE IN1+ MCE506 Fig 12. Printed-circuit board layout (single-sided); components view. 13.1.2 Power supply decoupling Proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. The respective capacitor location should be as close as possible to the device and grounded to the power ground. Proper power supply decoupling also prevents oscillations. For suppressing higher frequency transients (spikes) on the supply line a capacitor with low ESR, typical 100 nF, has to be placed as close as possible to the device. For suppressing lower frequency noise and ripple signals, a large electrolytic capacitor, e.g. 1000 µF or greater, must be placed close to the device. The bypass capacitor on pin SVR reduces the noise and ripple on the mid rail voltage. For good THD and noise performance a low ESR capacitor is recommended. 13.2 Thermal behavior and heatsink calculation The measured maximum thermal resistance of the IC package, Rth(j-mb), is 4.0 K/W. A calculation for the heatsink can be made, with the following parameters: Tamb(max) = 60 °C (example) VCC = 18 V and RL = 4 Ω Tj(max) = 150 °C (specification) Rth(tot) is the total thermal resistance between the junction and the ambient including the heatsink. This can be calculated using the maximum temperature increase divided by the power dissipation: Rth(tot) = (Tj(max) − Tamb(max))/PD © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 12014 Preliminary data Rev. 01 — 06 February 2004 11 of 17 TFA9841J Philips Semiconductors 1-channel audio amplifier (1 x SE) At VCC = 18 V and RL = 4 Ω the measured worst-case sine-wave dissipation is 4.4 W; see Figure 9. For Tj(max) = 150 °C the temperature raise, caused by the power dissipation, is: 150 − 60 = 90 °C: P × Rth(tot) = 90 °C Rth(tot) = 90/4.4 = 20.5 K/W Rth(h-a) = Rth(tot) − Rth(j-mb) = 20.5 − 4.0 = 16.5 K/W. This calculation is for an application at worst-case sine-wave output signals. In practice music signals will be applied, which decreases the maximum power dissipation to approximately half of the sine-wave power dissipation (see Section 8.2.2). This allows for the use of a smaller heatsink: P × Rth(tot) = 90 °C Rth(tot) = 90/2.2 = 40.9 K/W Rth(h-a) = Rth(tot) − Rth(j-mb) = 40.9 − 4.0 = 36.9 K/W. MDB800 150 RL = 1 Ω Tj (°C) 2Ω 3Ω 4Ω 8Ω 100 50 0 8 12 16 20 24 28 VCC (V) External heatsink of 10 K/W; with music signals; Tamb = 25 °C. Fig 13. Junction temperature as function of supply voltage for various loads. 14. Test information 14.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 12014 Preliminary data Rev. 01 — 06 February 2004 12 of 17 TFA9841J Philips Semiconductors 1-channel audio amplifier (1 x SE) 15. Package outline DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad SOT523-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 9 e1 Z e Q w M bp 0 5 scale DIMENSIONS (mm are the original dimensions) UNIT A2(2) bp mm c D(1) D1(2) Dh E(1) Eh 2.7 0.80 0.58 13.2 2.3 0.65 0.48 12.8 10 mm v M c e2 m e e1 e2 6.2 14.7 3.5 2.54 1.27 5.08 3.5 5.8 14.3 L k 3 2 L1 L2 L3 m 12.4 11.4 6.7 11.0 10.0 5.5 4.5 3.7 2.8 P Q q q1 q2 3.4 1.15 17.5 4.85 3.8 3.1 0.85 16.3 3.6 v w x 0.8 0.3 0.02 Z(1) 1.65 1.10 Notes 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 2. Plastic surface within circle area D1 may protrude 0.04 mm maximum. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 00-07-03 03-03-12 SOT523-1 Fig 14. DBS9P package outline. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 12014 Preliminary data Rev. 01 — 06 February 2004 13 of 17 TFA9841J Philips Semiconductors 1-channel audio amplifier (1 x SE) 16. Soldering 16.1 Introduction to soldering through-hole mount packages This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 16.2 Soldering by dipping or by solder wave Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 16.3 Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. 16.4 Package related soldering information Table 10: Suitability of through-hole mount IC packages for dipping and wave soldering methods Package Soldering method Dipping Wave DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable[1] PMFP[2] − not suitable [1] [2] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. For PMFP packages hot bar soldering or manual soldering is suitable. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 12014 Preliminary data Rev. 01 — 06 February 2004 14 of 17 TFA9841J Philips Semiconductors 1-channel audio amplifier (1 x SE) 17. Revision history Table 11: Revision history Rev Date 01 20040206 CPCN Description - Preliminary data (9397 750 12014) © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 12014 Preliminary data Rev. 01 — 06 February 2004 15 of 17 TFA9841J Philips Semiconductors 1-channel audio amplifier (1 x SE) 18. Data sheet status Level Data sheet status[1] Product status[2][3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 19. Definitions 20. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Contact information For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: [email protected]. Preliminary data Fax: +31 40 27 24825 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 12014 Rev. 01 — 06 February 2004 16 of 17 Philips Semiconductors TFA9841J 1-channel audio amplifier (1 x SE) Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.2.1 8.2.2 8.3 8.4 8.5 9 10 11 12 13 13.1 13.1.1 13.1.2 13.2 14 14.1 15 16 16.1 16.2 16.3 16.4 17 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Input configuration . . . . . . . . . . . . . . . . . . . . . . 3 Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 4 Output power measurement . . . . . . . . . . . . . . . 4 Headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 4 Supply voltage ripple rejection . . . . . . . . . . . . . 5 Built-in protection circuits . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . 10 Printed-circuit board . . . . . . . . . . . . . . . . . . . . 10 Layout and grounding . . . . . . . . . . . . . . . . . . . 10 Power supply decoupling . . . . . . . . . . . . . . . . 11 Thermal behavior and heatsink calculation . . 11 Test information . . . . . . . . . . . . . . . . . . . . . . . . 12 Quality information . . . . . . . . . . . . . . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . 14 Soldering by dipping or by solder wave . . . . . 14 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14 Package related soldering information . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 © Koninklijke Philips Electronics N.V. 2004. Printed in The Netherlands All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 06 February 2004 Document order number: 9397 750 12014