SANYO LC66566A

CMOS LSI
LC66P5316
No. 5489
Four-Bit Single-Chip Microcontroller
with 16 KB of On-Chip OTP PROM
Preriminary
Overview
Package Dimensions
The LC66P5316 is an on-chip OTP PROM version of the
LC6653XX Series CMOS 4-bit single-chip microcontrollers. The LC66P5316 is appropriate for program
development and product evaluation since it provides
identical functionality and pin compatibility with the
LC665316A.
unit: mm
3149-DIP48S
0.25
[LC66P5316]
48
25
1
24
2.53
1.78
5.1max
4.25
1.05
3.8
0.48
0.51min
46.0
SANYO: DIP48S
SANYO DIP48
unit: mm
3156-QFP48E
[LC66P5316]
1.5
1.5
36
1.0
14.0
1.6
1.5
25
0.15
24
37
1.5
1.0
17.2
14.0
1.6
17.2
48
13
12
1
0.1
2.70
(STAND OFF)
0.35
3.0max
• On-chip OTP ROM capacity of 16 kilobytes, and an onchip RAM capacity of 512 × 4 bits.
• Fully supports the LC66000 Series common instruction
set (128 instructions).
• I/O ports: 42 pins
• A sub-oscillator circuit can be used (option)
This circuit allows power dissipation to be reduced by
operating at lower speeds.
• 8-bit serial interface: two circuits (can be connected in
cascade to form a 16-bit interface)
• Instruction cycle time: 0.95 to 10 µs (at 4.0 to 5.5 V)
• Powerful timer functions and prescalers
— Time limit timer, event counter, pulse width
measurement, and square wave output using a 12-bit
timer.
— Time limit timer, event counter, PWM output, and
square wave output using an 8-bit timer.
— Time base function using a 12-bit prescaler
• Powerful interrupt system with 8 interrupt factors and 8
interrupt vector locations.
— External interrupts: 3 factors/3 vector locations
— Internal interrupts: 5 factors/5 vector locations
• Flexible I/O functions
16-value comparator inputs, 20-mA drive outputs,
inverter circuits, pull-up and open-drain circuits
selectable as options.
• Optional runaway detection function (watchdog timer)
• 8-bit I/O functions
• Power saving functions using halt and hold modes.
• Packages: DIP48S, QIP48E (QFP48E)
• Evaluation LSIs: LC66599 (evaluation chip) +
EVA800/850-TB662YXX2
15.24
13.8
Features and Functions
0.8
15.6
SANYO: QFP48E
SANYO Electric Co.,Ltd. Semiconductor Bussiness Headquarters
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110 JAPAN
22897HA (OT) No. 5489-1/28
LC66P5316
Series Organization
Type No.
No. of
pins
ROM capacity
RAM
capacity
Package
LC66304A/306A/308A
42
4 K/6 K/8 KB
512 W
DIP42S
QFP48E
LC66404A/406A/408A
42
4 K/6 K/8 KB
512 W
DIP42S
QFP48E
LC66506B/508B/512B/516B
64
6 K/8 K/12 K/16 KB
512 W
DIP64S
QFP64A
LC66354A/356A/358A
42
4 K/6 K/8 KB
512 W
DIP42S
QFP48E
LC66354S/356S/358S
42
4 K/6 K/8 KB
512 W
QFP44M
Features
Normal versions
4.0 to 6.0 V/0.92 µs
Low-voltage versions
2.2 to 5.5 V/3.92 µs
LC66556A/558A/562A/566A
64
6 K/8 K/12 K/16 KB
512 W
DIP64S
QFP64E
LC66354B/356B/358B
42
4 K/6 K/8 KB
512 W
DIP42S
QFP48E
LC66556B/558B/562B/566B
64
6 K/8 K/12 K/16 KB
512 W
DIP64S
QFP64E
Low-voltage high-speed versions
3.0 to 5.5 V/0.92 µs
LC66354C/356C/358C
42
4 K/6 K/8 KB
512 W
DIP42S
QFP48E
2.5 to 5.5 V/0.92 µs
LC662104A/06A/08A
30
4 K/6 K/8 KB
384 W
DIP30SD
MFP30S
LC662304A/06A/08A/12A/16A
42
4 K/6 K/8 K/12 K/16 KB 512 W
DIP42S
QFP48E
LC662508A/12A/16A
64
8 K/12 K/16 KB
512 W
DIP64S
QFP64E
LC665304A/06A/08A/12A/16A
48
4 K/6 K/8 K/12 K/16 KB 512 W
DIP48S
QFP48E
LC66E308
42
EPROM 8 KB
512 W
DIC42S
with window
QFC48
with window
LC66P308
42
OTPROM 8 KB
512 W
DIP42S
QFP48E
DIC42S
with window
QFC48
with window
LC66E408
42
EPROM 8 KB
512 W
LC66P408
42
OTPROM 8 KB
512 W
DIP42S
QFP48E
QFC64
with window
LC66E516
64
EPROM 16 KB
512 W
DIC64S
with window
LC66P516
64
OTPROM 16 KB
512 W
DIP64S
QFP64E
LC66E2108*
30
EPROM 8 KB
384 W
LC66E2316
42
EPROM 16 KB
512 W
DIC42S
with window
QFC48
with window
LC66E2516
64
EPROM 16 KB
512 W
DIC64S
with window
QFC64
with window
LC66E5316
52/48
EPROM 16 KB
512 W
DIC52S
with window
QFC48
with window
LC66P2108*
30
OTPROM 8 KB
384 W
DIP30SD
MFP30S
LC66P2316*
42
OTPROM 16 KB
512 W
DIP42S
QFP48E
LC66P2516
64
OTPROM 16 KB
512 W
DIP64S
QFP64E
LC66P5316
48
OTPROM 16 KB
512 W
DIP48S
QFP48E
On-chip DTMF generator versions
3.0 to 5.5 V/0.95 µs
Dual oscillator support
3.0 to 5.5 V/0.95 µs
Window and OTP evaluation versions
4.5 to 5.5 V/0.92 µs
Window evaluation versions
4.5 to 5.5 V/0.92 µs
OTP
4.0 to 5.5 V/0.95 µs
Note: * Under development
No. 5489-2/28
LC66P5316
Pin Assignments
DIP48S
P20/SI0/A0
P21/SO0/A1
P22/SCK0/A2
P23/INT0/A3
P30/INT1/A4
P31/POUT0/A5
P32/POUT1/A6
VSS
OSC1
OSC2
VDD
RES/VPP/OE
PE0/XT1
PE1/XT2
TEST/EPMOD
P33/HOLD
P40/INV0I/A7
P41/INV0O/A8
P42/INV1I/A9
P43/INV1O/A10
P50/A11
P51/A12
P52/A13
P53/INT2/TA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
LC66P5316
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
P13/D7
P12/D6
P11/D5
P10/D4
P03/D3
P02/D2
P01/D1
P00/D0
PD3/AN4/INV4O
PD2/AN3/INV4I
PD1/AN2/INV3O
PD0/AN1/INV3I
PC3/INV2O/DASEC
PC2/INV2I/CE
PC1
PC0
P83
P82
P81/DS1
P80/DS0
P63/PIN1
P62/SCK1
P61/SO1
P60/SI1
P01/D1
P00/D0
PD3/AN4/INV4O
PD2/AN3/INV4I
PD1/AN2/INV3O
PD0/AN1/INV3I
PC3/INV2O/DASEC
PC2/INV2I/CE
PC1
PC0
P83
P82
QFP48E
36 35 34 33 32 31 30 29 28 27 26 25
37
24
38
23
39
22
40
21
LC66P5316
41
20
42
19
43
18
44
17
45
16
46
15
47
14
48
13
1 2 3 4 5 6 7 8 9 10 11 12
P32/POUT1/A6
VSS
OSC1
OSC2
VDD
RES/VPP/OE
PE0/XT1
PE1/XT2
TEST/EPMOD
P33/HOLD
P40/INV0I/A7
P41/INV0O/A8
P02/D2
P03/D3
P10/D4
P11/D5
P12/D6
P13/D7
P20/SI0/A0
P21/SO0/A1
P22/SCK0/A2
P23/INT0/A3
P30/INT1/A4
P31/POUT0/A5
P81/DS1
P80/DS0
P63/PIN1
P62/SCK1
P61/SO1
P60/SI1
P53/INT2/TA
P52/A13
P51/A12
P50/A11
P43/INV1O/A10
P42/INV1I/A9
Top view
We recommend the use of reflow soldering techniques to solder-mount QFP packages.
Please consult with your Sanyo representative for details on process conditions if the package itself is to be directly
immersed in a dip-soldering bath (dip-soldering techniques).
No. 5489-3/28
LC66P5316
Usage Notes
The LC66P5316 was created for program development, product evaluation, and prototype development for products
based on the LC6653XX Series microcontrollers. Keep the following points in mind when using this product.
1. After a reset
The RES pin must be held low for an additional 3 instruction cycles after the oscillator stabilization period has
elapsed. Also, the port output circuit types are set up during the 9 instruction cycles immediately after RES is set
high. Only then is the program counter set to 0 and program execution started from that location. (The port output
circuits all revert to the open-drain type during periods when RES is low.)
VDDmin
VDD
OSC
RES
At least 10 ms
Oscillator
stabilization
At least 3
instruction
Location Location
0
1
Program execution (PC)
Port output type
Open drain
Option switching
Option specification
period
9 instruction
cycles
2. Notes on LC6653XX evaluation
The high end of the EPROM area (locations 3FF0H to 3FFFH) are the option specification area. Option specification
data must be programmed for and loaded into this area. The Sanyo specified cross assembler for this product is the
program LC66S.EXE. Also, insert JMP instructions so that user programs do not attempt to execute addresses that
exceed the capacity of the mask ROM, and write zeros (00H) to areas (other than 3FF0H to 3FFFH) that exceed the
actual capacity of the mask ROM.
3. Mounting notes
Due to structural considerations, Sanyo is unable to fully test one-time programmable products. Therefore, the user
must apply the screening procedure described on page 20 to these products.
4. Use the following procedure when ordering ROM through the Sanyo PROM writing service. (Note that this is a forfee service.)
• If ordering one-time programmable and mask ROM versions at the same time:
The customer must provide the EPROM for the mask ROM version, the order forms for the mask ROM version,
and the order forms for the one-time programmable version.
• If ordering only the one-time programmable version:
The customer must provide the EPROM and the order forms for the one-time programmable version. The last
section of the EPROM (locations 3FF0H to 3FFFH) is the option specification area, and the option specification
data must be written to this area. The Sanyo specified cross assembler for this product is the program LC66S.EXE.
Also, insert JMP instructions so that user programs do not attempt to execute addresses that exceed the capacity of
the mask ROM, and write zeros (00H) to areas (other than 3FF0H to 3FFFH) that exceed the actual capacity of the
mask ROM.
5. Differences between this product and the mask ROM version:
Carefully read the sections on the following pages that describe these differences.
No. 5489-4/28
LC66P5316
Main differences between the LC66E5316, LC66P5316, and LC6653XX Series
Item
LC6653XX Series (mask version)
LC66E5316
LC66P5316
Differences in the main
characteristics
• Operating temperature range
–30 to +70°C
+10 to +40°C
–30 to +70°C
• Operating supply voltage/operating
frequency (cycle time)
3.0 to 5.5 V/0.95 to 10 µs
(When the main oscillator is
operating)
3.0 to 5.5 V/25 to 127 µs
(When the sub-oscillator is operating)
4.5 to 5.5 V/0.95 to 10 µs
(When the main oscillator is
operating)
4.5 to 5.5 V/25 to 127 µs
(When the sub-oscillator is operating)
4.0 to 5.5 V/0.92 to 10 µs
(When the main oscillator is
operating)
4.0 to 5.5 V/25 to 127 µs
(When the sub-oscillator is operating)
• Input high-level current (RES)
Maximum: 1 µA
Typical: 10 µA
(normal operation and halt mode)
Hold mode: 1 µA maximum
Typical: 10 µA
(normal operation and halt mode)
Hold mode: 1 µA maximum
• Input low-level current (RES)
Maximum: 1 µA
Typical: 100 µA
Typical: 100 µA
• Current drain
(Operating at 4 MHz)
(Operating at 32 kHz)
(Halt mode at 4 MHz)
(Halt mode at 32 kHz)
(Hold mode)
Typical: 10 nA, maximum: 10 µA
Larger than that for the mask versions
Typical: 10 nA, maximum: 10 µA*
Larger than that for the mask versions
Typical: 10 nA, maximum: 10 µA*
Port output types at reset
The output type specified in
the options
Open-drain outputs
Open-drain outputs
Package
• DIP48S
• QFP48E
• DIC52S window package
• QFC48 window package
• DIP48S
• QFP48E
Note: * Although the microcontroller will remain in hold mode if the RES pin is set low while it is in hold mode, always use the reset start sequence (after
switching HOLD from low to high, switch RES from low to high) when clearing hold mode. Also a current of about 100 µA flows from the RES pin
when it is low. This increases the hold mode current drain by about 100 µA.
See the data sheets for the individual products for details on other differences.
System Block Diagram
RAM STACK
(512W)
RES
TEST
OSC1
OTP ROM
C
FLAG
SYSTEM
CONTROL
E DD DD
SP M P P P P
R HL XY
OSC2
HOLD
E
ALU
A
ADC
PE
PD
MPX
PRESCALER
A0 to A13
D0 to D7
Z
CE
DASEC
VPP/OE
EPMOD
TA
PC
XT1
XT2
AN1 to 4
PROM
control
(16KB)
TIMER0
POUT0
SI0
SO0
SCK0
INT0
SERIAL I/O 0
MPX
INT1, INT2
INTERRUPT
CONTROL
MPX
SI1
SO1
SCK1
PIN1, POUT1
SERIAL I/O 1
TIMER1
PC
INVxO
P0
P1
P2
P3
P4
P5
P6
INVxI
(x=0 to 4)
P8
DS1
DS0
No. 5489-5/28
LC66P5316
Pin Function Overview
Pin
P00/D0
P01/D1
P02/D2
P03/D3
P10/D4
P11/D5
P12/D6
P13/D7
P20/SI0/A0
P21/SO0/A1
P22/SCK0/
A2
P23/INT0/A3
P30/INT1/A4
P31/POUT0/
A5
P32/POUT1/
A6
P33/HOLD
P40/INV0I/
A7
P41/INV0O/
A8
P42/INV1I/
A9
P43/INV1O/
A10
I/O
I/O
I/O
I/O
I/O
Overview
Output driver type
Options
I/O ports P00 to P03
• Input or output in 4-bit or 1-bit units
• P00 to P03 support the halt mode
control function (This function can be
specified in bit units.)
• Used as data pins in EPROM mode
• Pch: Pull-up MOS type
• Nch: Intermediate sink current
type
• Pull-up MOS or
Nch OD output
• Output level on
reset
I/O ports P10 to P13
• Input or output in 4-bit or 1-bit units
• Used as data pins in EPROM mode
• Pch: Pull-up MOS type
• Nch: Intermediate sink current
type
• Pull-up MOS or
Nch OD output
• Output level on
reset
I/O ports P20 to P23
• Input or output in 4-bit or 1-bit units
• P20 is also used as the serial input SI0
pin.
• P21 is also used as the serial output
SO0 pin.
• P22 is also used as the serial clock
SCK0 pin.
• P23 is also used as the INT0 interrupt
request pin, and also as the timer 0
event counting and pulse width
measurement input.
• Used as address pins in EPROM mode
I/O ports P30 to P32
• Input or output in 3-bit or 1-bit units
• P30 is also used as the INT1 interrupt
request.
• P31 is also used for the square wave
output from timer 0.
• P32 is also used for the square wave
and PWM output from timer 1.
• P31 and P32 also support 3-state
outputs.
• Used as address pins in EPROM mode
I
Hold mode control input
• Hold mode is set up by the HOLD
instruction when HOLD is low.
• In hold mode, the CPU is restarted by
setting HOLD to the high level.
• This pin can be used as input port P33
along with P30 to P32.
• When the P33/HOLD pin is at the low
level, the CPU will not be reset by a
low level on the RES pin. Therefore,
applications must not set P33/HOLD
low when power is first applied.
I/O
I/O ports P40 to P43
• Input or output in 4-bit or 1-bit units
• Input or output in 8-bit units when used
in conjunction with P50 to P53.
• Can be used for output of 8-bit ROM
data when used in conjunction with
P50 to P53.
• Dedicated inverter circuit (option)
• Used as address pins in EPROM mode
State after a Standby mode
reset
operation
Hold mode:
Output off
High or low
(option)
Halt mode:
Output
retained
Hold mode:
Output off
High or low
(option)
Halt mode:
Output
retained
Hold mode:
Output off
• Pch: CMOS type
• Nch: Intermediate sink current
type
CMOS or Nch OD
output
H
Hold mode:
Output off
Hold mode:
Output off
• Pch: CMOS type
• Nch: Intermediate sink current
type
CMOS or Nch OD
output
H
Halt mode:
Output
retained
• Pch: Pull-up MOS type
• CMOS type when the inverter
circuit option is selected
• Nch: Intermediate sink current
type
• Pull-up MOS or
Nch OD output
• Output level on
reset
• Inverter circuit
• High or
low
(option)
• Inverter
I/O is set
to the
output off
state.
Hold mode:
Port output
off, inverter
output off
Halt mode:
Port output
retained,
inverter
output
continues
Continued on next page.
No. 5489-6/28
LC66P5316
Continued from preceding page.
Pin
P50/A11
P51/A12
P52/A13
P53/INT2/TA
P60/SI1
P61/SO1
P62/SCK1
P63/PIN1
P80/DS0
P81/DS1
P82
P83
PC0
PC1
PC2/INV2I/
CE
PC3/INV2O/
DASEC
I/O
Overview
I/O
I/O ports P50 to P53
• Input or output in 4-bit or 1-bit units
• Input or output in 8-bit units when used
in conjunction with P40 to P43.
• Can be used for output of 8-bit ROM
data when used in conjunction with
P40 to P43.
• P53 is also used as the INT2 interrupt
request.
• Used as address pins in EPROM mode
Options
• Pch: Pull-up MOS type
• Nch: Intermediate sink current
type
• Pull-up MOS or
Nch OD output
• Output level on
reset
• Pch: CMOS type
• Nch: Intermediate sink current
type
O
Dedicated output ports P80 to P83
• Output in 4-bit or 1-bit units
• The contents of the output latch are
input using input instructions.
• P80 is a data shaper input (options)
• P81 is a data shaper output (options)
• Pch: CMOS type
• Nch: Intermediate sink current
type
• CMOS or Nch OD
output
• Output level at
reset
• Data shaper
circuit
I/O
I/O ports PC0 to PC3
• Output in 4-bit or 1-bit units
• Dedicated inverter circuits (option)
• Used as the control CE and DASEC
pin in EPROM mode.
• Pch: CMOS type
• Nch: Intermediate sink current
type
• CMOS or Nch OD
output
• Inverter circuits
• Only when the inverter circuit
option is selected:
• Pch: CMOS type
• Nch: Intermediate sink current
type
I/O
I
Dedicated input ports PD0 to PD3
• Can be switched in software to function
as 16-value analog inputs.
• Dedicated inverter circuits (option)
PE0/XT1
PE1/XT2
I
Dedicated input ports and sub-oscillator
connections
OSC1
I
System clock oscillator connections
OSC2
O
When an external clock is used, leave
OSC2 open and connect the clock signal
to OSC1.
RES/VPP/
OE
I
System reset input
• When the P33/HOLD pin is at the high
level, a low level input to the RES pin
will initialize the CPU.
• Used as the VPP/OE pin in EPROM
mode.
TEST/
EPMOD
I
CPU test pin
This pin must be connected to VSS
during normal operation.
State after a Standby mode
reset
operation
Hold mode:
Output off
I/O ports P60 to P63
• Input or output in 4-bit or 1-bit units
• P60 is also used as the serial input SI1
pin.
• P61 is also used as the serial output
SO1 pin.
• P62 is also used as the serial clock
SCK1 pin.
• P63 is also used for the event count
input to timer 1.
PD0/AN1/
INV3I
PD1/AN2/
INV3O
PD2/AN3/
INV4I
PD3/AN4/
INV4O
VDD
VSS
Output driver type
High or low
(option)
Halt mode:
Output
retained
Hold mode:
Output off
• CMOS or Nch OD
output
H
Halt mode:
Output
retained
Hold mode:
Output off
High or low
(option)
Hold mode:
Output off
H
Inverter circuits
Normal
input
Sub-oscillator/port
PE selection
Option
selection
Ceramic oscillator
or external clock
selection
Halt mode:
Output
retained
Option
selection
Halt mode:
Output
retained
Inverter
• Hold mode:
Output off
• Halt mode:
Output
continues
Hold mode:
Oscillator stops
Halt mode:
Oscillator
continues
Power supply pins
Note: Pull-up MOS type: The output circuit includes a MOS transistor that pulls the pin up to VDD.
CMOS output: Complementary output.
OD output: Open-drain output.
No. 5489-7/28
LC66P5316
User Options
1. Port 0, 1, 4, 5, and 8 output level at reset option
The output levels at reset for I/O ports 0, 1, 4, 5, and 8, in independent 4-bit groups, can be selected from the
following two options.
Option
Conditions and notes
1. Output high at reset
The four bits of ports 0, 1, 4, 5, or 8 are set in a group
2. Output low at reset
The four bits of ports 0, 1, 4, 5, or 8 are set in a group
2. Oscillator circuit options
• Main clock
Option
Circuit
OSC1
1. External clock
2. Ceramic oscillator
Conditions and notes
The input has Schmitt characteristics
C1
OSC1
Ceramic oscillator
C2
OSC2
Note: There is no RC oscillator option.
• Sub-clock
Option
Circuit
Conditions and notes
DSB
1. Ports PE0 and PE1
Input data
2 Sub-oscillator
(crystal oscillator)
C1
XT1
Crystal oscillator
C2
XT2
3. Watchdog timer option
A runaway detection function (watchdog timer) can be selected as an option.
4. Port output type options
• The output type of each bit (pin) in ports P0, P1, P2, P3 (except for the P33/HOLD pin), P4, P5, P6, and PC can be
Option
Circuit
Conditions and notes
Output data
1. Open-drain output
Input data
The port P2, P3, P5, and P6 inputs have Schmitt
characteristics.
DSB
Output data
2. Output with built-in pull-up
resistor
Input data
The port P2, P3, P5, and P6 inputs have Schmitt
characteristics.
The CMOS outputs (ports P2, P3, P6, and PC)
and the pull-up MOS outputs (P0, P1, P4, and
P5) are distinguished by the drive capacity of the
p-channel transistor.
DSB
No. 5489-8/28
LC66P5316
• One of the following two options can be selected for P8, in bit units.
Option
Circuit
Conditions and notes
Output data
1. Open-drain output
DSB
Output data
2. Output with built-in pulldown resistor
(CMOS output)
DSB
5. Inverter array circuit option
One of the following options can be selected for each of the following port sets: P40/P41, P42/P43, PC2/PC3,
PD0/PD1, and PD2/PD3. (PDs do not use option 1 because they are dedicated to inputs.)
Option
Circuit
Conditions and notes
Output data
Input data
When the open-drain output type is selected
DSB
1. Normal port I/O circuit
Output data
Input data
When the built-in pull-up resistor output type is
selected
The CMOS outputs (PC) and the pull-up MOS
outputs (P4) are distinguished by the drive
capacity of the p-channel transistor.
DSB
Output data
high
Input data
DSB
2. Inverter I/O circuit
Output data
high
If this option is selected, the I/O circuit is disabled
by the DSB signal.
Also note that the open-drain port output type
option and the high level at reset option must be
selected.
Input data
DSB
No. 5489-9/28
LC66P5316
6. Buffer array circuit option
In addition to normal port output, one of the following two options may also be selected for P80 and P81.
Option
Circuit
Conditions and notes
Output data
DSB
1. Normal port output
When the open-drain output type is selected
Output data
When the built-in pull-down resistor output type is
selected (CMOS output)
DSB
Output data
low
P80
2. Buffer input (P80) and
buffer output (P81) circuits
Output data
low
P81
If this option is selected, the I/O circuit is disabled
by the DSB signal.
Also note that the open-drain port output type
option and the high level at reset option must be
selected.
DSB
Output data
low
P80
If this option is selected, the I/O circuit is disabled
by the DSB signal.
Also note that the open-drain port output type
option and the high level at reset option must be
selected.
3. Buffer input (P80) and
buffer output (P81) circuits
with built-in zero-cross
detection circuits
P81
DSB
Output data
low
No. 5489-10/28
LC66P5316
LC665316 Series Option Data Area and Definitions
ROM area
3FF0H
Bit
P5
6
P4
Sub-oscillator option
0 = port PE, 1 = crystal oscillator
Oscillator option
0 = external clock, 1 = ceramic oscillator
3
P8
2
P1
1
P0
Output level at reset
Watchdog timer option
7
P13
6
P12
5
P11
4
P10
3
P03
2
P02
1
P01
7
3FF3H
0 = high level, 1 = low level
4
0
3FF2H
Output level at reset
Option/data relationship
5
0
3FF1H
Option specified
7
0 = low level, 1 = high level
0 = none, 1 = yes (present)
Output type
0 = OD, 1 = PU
Output type
0 = OD, 1 = PU
P00
Unused
6
P32
5
P31
4
P30
3
P23
2
P22
1
P21
0
P20
7
P53
6
P52
5
P51
4
P50
3
P43
2
P42
1
P41
0
P40
This bit must be set to 0.
Output type
0 = OD, 1 = PU
Output type
0 = OD, 1 = PU
Output type
0 = OD, 1 = PU
Output type
0 = OD, 1 = PU
7
6
5
3FF4H
Unused
This bit must be set to 0.
4
3
P63
2
P62
1
P61
0
P60
Output type
0 = OD, 1 = PU
7
6
5
3FF5H
Unused
This bit must be set to 0.
4
3
P83
2
P82
1
P81
0
P80
Output type
0 = OD, 1 = PD
7
6
5
3FF6H
Unused
This bit must be set to 0.
Unused
This bit must be set to 0.
4
3
2
1
0
Continued on next page.
LC66P5316
Continued from preceding page.
ROM area
Bit
Option specified
Option/data relationship
7
6
5
3FF7H
This bit must be set to 0.
4
3
PC3
2
PC2
1
PC1
0
3FF8H
Unused
Output type
0 = OD, 1 = PU
PC0
7
Unused
This bit must be set to 1.
6
Buffer output
0 = used, 1 = none
5
Buffer output with zero-cross bias input
0 = used, 1 = none
4
PD3
3
PD1
2
PC3
1
P43
0
P41
Inverter output
0 = inverter output, 1 = none
7
6
5
3FF9H
Unused
This bit must be set to 0.
Unused
This bit must be set to 0.
Unused
This bit must be set to 0.
Unused
This bit must be set to 0.
Unused
This bit must be set to 0.
Unused
This bit must be set to 0.
Unused
This bit must be set to 0.
Unused
This bit must be set to 0.
4
3
2
1
0
7
6
5
3FFAH
4
3
2
1
0
7
6
5
3FFBH
4
3
2
1
0
7
6
5
3FFCH
4
3
2
1
0
7
6
5
3FFDH
4
3
Reserved. Must be set to predefined data values.
This data is generated by the assembler.
If the assembler is not used, set this data to ‘00’.
2
1
0
Continued on next page.
No. 5489-12/28
LC66P5316
Continued from preceding page.
ROM area
Bit
Option specified
Option/data relationship
7
6
5
4
3FFEH
3
Reserved. Must be set to predefined data values.
This data is generated by the assembler.
If the assembler is not used, set this data to ‘00’.
Reserved. Must be set to predefined data values.
This data is generated by the assembler.
If the assembler is not used, set this data to ‘00’.
2
1
0
7
6
5
4
3FFFH
3
2
1
0
Usage Notes
1. Option specification
When using a Sanyo cross assembler with the LC66P5316, use the version called “LC66S.EXE” and specify the
actual microcontroller to be evaluated with the CPU pseudoinstruction in the source file. The port options must be
specified in the source file. The cross assembler will create an options code list in the option specification area
(locations 3FF0H to 3FFFH). It is also possible to directly set up data in the option specification area. If this is done,
the options must be specified according to the option code creation table shown on the following page.
2. Writing the EPROM
Use a special-purpose writing conversion board (the W66EP5316D for the DIP package, and the W66EP5316Q for
the QFP package) to allow the EPROM programmers listed below to be used when writing the data created by the
cross assembler to the LC66P5316.
• The EPROM programmers listed below can be used.
Manufacturer
Models that can be used
Advantest
R4945, R4944A, R4943, or equivalent products
Ando
AF9704
AVAL
Minato Electronics
—
MODEL1890A
• The “27512 (VPP 12.5 V) Intel high-speed write” technique must be used to write the EPROM. Set the address
range to location 0 to 3FFFH. The DASEC jumper must be off.
3. Using the data security function
The data security function sets up the microcontroller in advance so that data that was written to the microcontroller
EPROM cannot be read out.
Use the following procedure to enable the LC66P5316 data security function.
• Set the write conversion board DASEC jumper to the on position.
• Write the data to the EPROM once again.
At this time, since this function will operate, the EPROM programmer will issue an error. However, this error does
not indicate that there was a problem in either the programmer or the LSI.
Notes: 1. If the data at all addresses was “FF” at step 2, the data security function will not be activated.
Notes: 2. The data security function will not be activated at step 2 if the “blank → program → verify” operation
sequence is used.
Notes: 3. Always return the jumper to the off position after the data security function has been activated.
No. 5489-13/28
LC66P5316
LC66P5316 (DIP)
LC66P5316 (QFP)
Cut corner
Pin 1
SW
DASEC
Pin 1
Aligned to the top
SW DASEC
Pin 1
O
Write board (W66EP5316D)
Write board (W66EP5316Q)
Specifications
Absolute Maximum Ratings at Ta = 25°C, VSS = 0 V
Parameter
Maximum supply voltage
Input voltage
Symbol
VDD max
VIN1
VIN2
Output voltage
Output current per pin
Total pin current
Allowable power dissipation
Conditions
Ratings
Unit
Note
VDD
–0.3 to +7.0
V
P2, P3 (except for the P33/HOLD pin),
P61, and P63
–0.3 to +7.0
V
1
–0.3 to VDD + 0.3
V
2
–0.3 to +7.0
V
1
–0.3 to VDD + 0.3
V
2
20
mA
3
All other inputs
VOUT1
P2, P3 (except for the P33/HOLD pin),
P61, and P63
VOUT2
All other inputs
ION1
P0, P1, P2, P3 (except for the P33/HOLD pin),
P4, P5, P6, P8, PC, PD1, PD3
–IOP1
P0, P1, P4, P5
2
mA
4
–IOP2
P2, P3 (except for the P33/HOLD pin),
P6,P8, and PC
4
mA
4
–IOP3
P41, P43, PC3, PD1, PD3, P81
10
mA
4
Σ ION1
P4, P5, P6, P8, PC
75
mA
3
Σ ION2
P0, P1, P2, P3 (except for the P33/HOLD pin),
PD1, PD3
75
mA
3
Σ IOP1
P4, P5, P6, P8, PC
25
mA
4
Σ IOP2
P0, P1, P2, P3 (except for the P33/HOLD pin),
PD1, PD3
25
mA
4
Pd max
Ta = –30 to +70°C: DIP48S (QFP48E)
5
600 (430)
mW
Operating temperature
Topr
–30 to +70
°C
Storage temperature
Tstg
–55 to +125
°C
Note: 1. Applies to pins with open-drain output specifications. For pins with other than open-drain output specifications, the ratings in the pin column for that
pin apply.
2. For the oscillator input and output pins, levels up to the free-running oscillation level are allowed.
3. Sink current (Applies to P8 and PD when either the CMOS output specifications or the inverter array specifications have been selected.)
4. Source current (Applies to all pins except P8 and PD for which the pull-up output specifications, the CMOS output specifications, or the inverter
array specifications have been selected. Applies to PD pins for which the inverter array specifications have been selected.) Contact your Sanyo
representative for the electrical characteristics when the inverter array or buffer array options are specified.
5. We recommend the use of reflow soldering techniques to solder mount QFP packages.
Please consult with your Sanyo representative for details on process conditions if the package itself is to be directly immersed in a solder dip bath
(solder dip or spray techniques).
LC66P5316
Allowable Operating Ranges at Ta = –30 to +70°C, VSS = 0 V, VDD = 4.0 to 5.5 V, unless otherwise specified.
Parameter
Operating supply voltage
Memory retention supply voltage
Input high-level voltage
Input low-level voltage
Operating frequency
(instruction cycle time)
Symbol
VDD
Conditions
min
typ
max
Unit
VDD
4.0
5.5
V
VDDH
VDD: During hold mode
1.8
5.5
V
VIH1
P2, P3 (except for the P33/HOLD pin),
P61, and P63: N-channel output transistor off
0.8 VDD
+7.0
V
VIH2
P33/HOLD, RES, OSC1:
N-channel output transistor off
0.8 VDD
VDD
V
VIH3
P0, P1, P4, P5, PC, PD, PE:
N-channel output transistor off
0.8 VDD
VDD
V
VIL1
P2, P3 (except for the P33/HOLD pin), P6,
RES, and OSC1: N-channel output transistor off
VSS
0.2 VDD
V
VIL2
P33/HOLD: VDD = 1.8 to 5.5 V
VSS
0.2 VDD
V
VIL3
P0, P1, P4, P5, PC, PD, PE, TEST:
N-channel output transistor off
VSS
0.2 VDD
V
When the main oscillator is operating
0.4
(10)
4.20
(0.95)
MHz
(µs)
100
(40)
kHz
(µs)
4.20
MHz
fop
(Tcyc)
When the sub-oscillator is operating
30
(133.2)
32.768
(122)
Note
1
2
2
[External clock input conditions]
Frequency
fext
OSC1: Defined by Figure 1. Input the clock
signal to OSC1 and leave OSC2 open.
(External clock input must be selected as the
oscillator circuit option.)
Pulse width
textH, textL
OSC1: Defined by Figure 1. Input the clock
signal to OSC1 and leave OSC2 open.
(External clock input must be selected as the
oscillator circuit option.)
Rise and fall times
textR, textF
OSC1: Defined by Figure 1. Input the clock
signal to OSC1 and leave OSC2 open.
(External clock input must be selected as the
oscillator circuit option.)
0.4
100
ns
30
ns
Note: 1. Applies to pins with open-drain specifications. However, VIH2 applies to the P33/HOLD pin.
When ports P2, P3, and P6 have CMOS output specifications they cannot be used as input pins.
2. PC port pins with CMOS output specifications cannot be used as input pins.
Contact your Sanyo representative for the allowable operating ranges for P4, PC, and PD when the inverter array is used, and for P8 when the
buffer array is used.
3. Applies to pins with open-drain specifications. However, VIL2 applies to the P33/HOLD pin.
P2, P3, and P6 port pins with CMOS output specifications cannot be used as input pins.
No. 5489-15/28
LC66P5316
Electrical Characteristics at Ta = –30 to +70°C, VSS = 0 V, VDD = 4.0 to 5.5 V unless otherwise specified.
Parameter
Symbol
Unit
Note
5.0
µA
1
P0, P1, P4, P5, P6, PC, OSC1, and P33/HOLD
(Does not apply to PD, PE, PC2, and PC3):
VIN = VDD, with the output Nch transistor off
1.0
µA
1
IIH3
PD, PC2, PC3, PE0, (When used as a port; does
not apply when the sub-oscillator option is
selected.): VIN = VDD, with the output Nch
transistor off
1.0
µA
1
IIH1
IIH2
Input high-level current
Input low-level current
Value of the output pull-up resistor
typ
max
IIH4
RES: VIN = VDD, operating, halt mode
µA
1
RES: VIN = VDD, hold mode
1.0
µA
1
IIH6
PE1 (When used as a port; does not apply when
the sub-oscillator option is selected.) : VIN = VDD
1.0
µA
1
IIL1
Input ports other than PD, PE, PC2, and PC3:
VIN = VSS, with the output Nch transistor off
–1.0
µA
2
IIL2
PD, PC2, PC3, PE0: VIN = VSS,
with the output Nch transistor off
–1.0
µA
2
IIL3
RES: VIN = VSS
100
µA
1
IIL4
PE1 (When used as a port; does not apply
when the sub-oscillator option is selected.):
VIN = VSS
20
µA
1
V
3
10
P2, P3 (except for the P33/HOLD pin),
P6, P8, and PC: IOH = –1 mA
VDD – 1.0
P2, P3 (except for the P33/HOLD pin),
P6, P8, and PC: IOH = –0.1 mA
VDD – 0.5
RPO
P0, P1, P4, P5
150
kΩ
VOL1
P0, P1, P2, P3, P4, P5, P6, P8, and PC
(except for the P33/HOLD pin): IOL = 1.6 mA
0.4
V
VOL2
P0, P1, P2, P3, P4, P5, P6, P8, and PC
(except for the P33/HOLD pin): IOL = 8 mA
1.5
V
IOFF1
P2, P3, P61, P63: VIN = +7.0 V
5.0
µA
6
IOFF2
Does not apply to P2, P3, P61, P63, and P8.:
VIN = VDD
1.0
µA
6
IOFF3
P8: VIN = VSS
µA
7
Output low-level voltage
Output off leakage current
min
IIH5
VOH1
Output high-level voltage
Conditions
P2, P3 (except for the P33/HOLD pin),
P61, and P63: VIN = +10.0 V, with the output
Nch transistor off
30
100
–1.0
4
5
[Schmitt characteristics]
Hysteresis voltage
VHYS
High-level threshold voltage
Vt H
Low-level threshold voltage
Vt L
0.1 VDD
P2, P3, P5, P6, OSC1 (EXT), RES
V
0.5 VDD
0.8 VDD
V
0.2 VDD
0.5 VDD
V
[Ceramic oscillator]
Oscillator frequency
fCF
OSC1, OSC2: Figure 2, 4 MHz
Oscillator stabilization time
fCFS
Figure 3, 4 MHz
4.0
MHz
10.0
ms
[Crystal oscillator]
Oscillator frequency
fXT
XT1, XT2: Figure 2, when the sub-oscillator
option is selected, 32 kHz
Oscillator stabilization time
fXTS
Figure 3, when the sub-oscillator option is
selected, 32 kHz
32.768
1.0
kHz
5.0
s
[Serial clock]
Cycle time
Input
Output
Low-level and high-level Input
pulse widths
Output
Rise an fall times
Output
tCKCY
tCKL
SCK0, SCK1: With the timing of Figure 4 and
the test load of Figure 5.
tCKH
0.9
µs
2.0
Tcyc
0.4
µs
1.0
Tcyc
tCKR, tCKF
0.1
µs
[Serial input]
Data setup time
tICK
Data hold time
tCKI
SI0, SI1: With the timing of Figure 4.
Stipulated with respect to the rising edge (↑) of
SCK0 or SCK1.
0.3
µs
0.3
µs
[Serial output]
Output delay time
tCKO
SO0, SO1: With the timing of Figure 5 and
the test load of Figure 5. Stipulated with respect
to the falling edge (↓) of SCK0 or SCK1.
0.3
µs
Continued on next page.
LC66P5316
Continued from preceding page.
Parameter
Symbol
Conditions
min
typ
max
Unit
tIOH, tIOL
INT0: Figure 6, conditions under which the INT0
interrupt can be accepted, conditions under
which the timer 0 event counter or pulse width
measurement input can be accepted
2
Tcyc
tIIH, tIIL
INT1, INT2: Figure 6, conditions under which
the corresponding interrupt can be accepted
2
Tcyc
PIN1 high and low-level
pulse widths
tPINH, tPINL
PIN1: Figure 6, conditions under which the
timer 1 event counter input can be accepted
2
Tcyc
RES high and low-level
pulse widths
tRSH, tRSL
RES: Figure 6, conditions under which reset
can be applied.
3
Tcyc
Operating current drain
IDD OP
VDD: 4-MHz ceramic clock
Halt mode current drain
IDDHALT
VDD: 32 kHz (main oscillator stopped),
sub-oscillator: crystal
Hold mode current drain
IDDHOLD
VDD: VDD = 1.8 to 5.5 V
0.01
Note
[Pulse conditions]
INT0 high and low-level
High and low-level pulse widths
for interrupt inputs other than INT0
VDD: 4-MHz ceramic oscillator
6.0
12
mA
VDD: 4-MHz external clock
6.0
12
mA
4.0
8
mA
100
500
µA
10
µA
8
Note: 1. With the output Nch transistor off in shared I/O ports with the open-drain output specifications. These pins cannot be used as input pins if the
CMOS output specifications are selected.When the port option is selected for PE.
2. With the output Nch transistor off in shared I/O ports with the open-drain output specifications. The rating for the pull-up output specification pins is
stipulated in terms of the output pull-up current IPO. These pins cannot be used as input pins if the CMOS output specifications are selected.
3. With the output Nch transistor off for CMOS output specification pins. (Also applies when the Pch open-drain option is selected for P8.)
4. With the output Nch transistor off for pull-up output specification pins.
5. When CMOS output specifications are selected for P8.
6. With the output Nch transistor off for open-drain output specification pins.
7. With the output Pch transistor off for open-drain output specification pins.
8. Reset state
Comparator Characteristics at Ta = –30 to +70°C, VSS = 0 V
Parameter
Symbol
Conditions
min
typ
max
Unit
Note
±1/2
±1
LSB
1
Absolute precision
VCECM
AN1 to AN4: VDD = 4.0 to 5.5 V
Threshold voltage
VTHCM
VDD = 4.0 to 5.5 V
VSS
VDD
Input voltage
VINCM
AN1 to AN4: VDD = 4.0 to 5.5 V
VSS
VDD
V
Conversion time
TCCM
VDD = 4.0 to 5.5 V
30
µs
V
Note: 1. Does not include the quantization error.
VDD
0.8VDD
OSC1
0.2VDD
(OSC2)
VSS
textL
External clock OPEN
textF
textH
textR
1/fext
Figure 1 External Clock Input Waveform
No. 5489-17/28
LC66P5316
VDD
OSC1
C1
XT1
OSC2
Rd
Ceramic
oscillator
Operating VDD
minimum value
0V
OSC
XT2
Rd
C2
Crystal
oscillator
C1
Stable oscillation
C2
Oscillator
unstable period
tCFS
Figure 3 Oscillator Stabilization Period
Figure 2 Ceramic Oscillator Circuit
Table 1 Guaranteed Ceramic Oscillator Constants External capacitor type
External capacitor type
4 MHz
(Murata Mfg. Co., Ltd.)
CSA4.00MG
C1 = 33 pF ± 10%
4 MHz
(Kyocera Corporation)
KBR4.0MS
C1 = 33 pF ± 10%
Built-in capacitor type
4 MHz
(Murata Mfg. Co., Ltd.)
CST4.00MG
C2 = 33 pF ± 10%
Rd = 220 Ω ± 5%
Rd = 220 Ω ± 5%
4 MHz
(Kyocera Corporation)
KBR4.0MES
C2 = 33 pF ± 10%
Rd = 0 Ω
Table 2 Guaranteed Crystal Oscillator Constants
C1 = 18 pF ± 10%
32 kHz
(Seiko Epson)
C-002RX
C2 = 18 pF ± 10%
Rd = 470 kΩ ± 5%
tCKCY
tCKL
SCK0
SCK1
0.2VDD (input)
0.4VDD (output)
tCKR
tCKH
tCKF
0.8VDD (input)
VDD-1 (output)
tICK tCKI
SI0
0.8VDD
0.2VDD
SI1
R=1kΩ
tCK0
SO0
SO1
TEST
point
VDD-1
0.4VDD
Figure 4 Serial I/O Timing
C=50pF
Figure 5 Timing Load
tI0H
tI1H
tPINH
tRSH
0.8VDD
0.2VDD
tI0L
tI1L
tPINL
tRSL
Figure 6 Input Timing for the INT0, INT1, INT2, PIN1, and RES pins
No. 5489-18/28
LC66P5316
Preconditions for mounting one-time programmable microprocessors
Usage Notes
Due to inherent structural considerations, it is impossible to fully test one-time programmable microprocessors before
the PROM has been programmed, i.e. before shipment from the factory. We recommend that users screen products
whose PROM has been written according to the following procedure to improve the reliability of these products.
• Due to the nature of the product, it is not possible to test write operations to all bits in one-time programmable
microprocessors whose PROM has not been written. Therefore it may be impossible to guarantee a 100% yield on
writing to these products. Please understand that no such guarantee may be made.
• Storage of products in the moisture-proof packed (unopened) state
• Store products in moisture-proof packages in an environment in which the temperature is no higher than 30°C and
the relative humidity is no higher than 70%.
• Storage of products after opening the moisture-proof packaging
• After opening products that were packed in moisture-proof packaging, mount (solder) those products as soon as
possible. Store products for no more than 96 hours after opening the moisture-proof packaging in an environment
in which the temperature is no higher than 30°C and the relative humidity is no higher than 70%.
a. Preconditions for mounting products that were programmed by the user
DIP/QFP product
b. Preconditions for mounting products that were programmed by Sanyo
DIP/QFP product
Programming and verification
Recommended screening conditions
High-temperature bake (disconnected)
+1HR
150°C ±5°C, 24 HR
–0HR
Program data verification
Mounting
Mounting
Sanyo ROM writing service
Sanyo provides a for-fee ROM writing service that includes writing the one-time programmable ROM, printing,
screening, and read-out verification. Contact your Sanyo sales representative for details.
No. 5489-19/28
LC66P5316
LC66XXXX Series Instruction Table (by function)
Abbreviations:
AC:
Accumulator
E:
E register
CF:
Carry flag
ZF:
Zero flag
HL:
Data pointer DPH, DPL
XY:
Data pointer DPX, DPY
M:
Data memory
M (HL): Data memory pointed to by the DPH, DPL data pointer
M (XY): Data memory pointed to by the DPX, DPY auxiliary data pointer
M2 (HL): Two words of data memory (starting on an even address) pointed to by the DPH, DPL data pointer
SP:
Stack pointer
M2 (SP): Two words of data memory pointed to by the stack pointer
M4 (SP): Four words of data memory pointed to by the stack pointer
in:
n bits of immediate data
t2:
Bit specification
PCh:
PCm:
PCl:
Fn:
TIMER0:
TIMER1:
SIO:
P:
P (i4):
INT:
( ), [ ]:
←:
:
:
:
+:
–:
—:
t2
11
10
01
00
Bit
23
22
21
20
Bits 8 to 11 in the PC
Bits 4 to 7 in the PC
Bits 0 to 3 in the PC
User flag, n = 0 to 15
Timer 0
Timer 1
Serial register
Port
Port indicated by 4 bits of immediate data
Interrupt enable flag
Indicates the contents of a location
Transfer direction, result
Exclusive or
Logical and
Logical or
Addition
Subtraction
Taking the one's complement
No. 5489-20/28
Instruction code
Mnemonic
D 7 D6 D5 D4 D3 D2 D1 D0
Number of
bytes
Number of
cycles
LC66P5316
Operation
Description
Affected
status
bits
Note
[Accumulator manipulation instructions]
CLA
Clear AC
1 0 0 0
0 0 0 0
1
1
AC ← 0
Clear AC to 0.
(Equivalent to LAI 0.)
ZF
DAA
Decimal adjust AC
in addition
1 1 0 0
0 0 1 0
1 1 1 1
0 1 1 0
2
2
AC ← (AC) + 6
Add six to AC.
(Equivalent to ADI 6.)
ZF
DAS
Decimal adjust AC
in subtraction
1 1 0 0
0 0 1 0
1 1 1 1
1 0 1 0
2
2
AC ← (AC) + 10
(Equivalent to
ADI 0AH.)
Add 10 to AC.
ZF
CLC
Clear CF
0 0 0 1
1 1 1 0
1
1
CF ← 0
Clear CF to 0.
CF
STC
Set CF
0 0 0 1
1 1 1 1
1
1
CF ← 1
Set CF to 1.
CF
ZF
Has a vertical
skip function.
CMA
Complement AC
0 0 0 1
1 0 0 0
1
1
AC ← (AC)
Take the one’s complement
of AC.
IA
Increment AC
0 0 0 1
0 1 0 0
1
1
AC ← (AC) + 1
Increment AC.
ZF, CF
DA
Decrement AC
0 0 1 0
0 1 0 0
1
1
AC ← (AC) – 1
Decrement AC.
ZF, CF
Shift AC (including CF) right.
CF
CF, ZF
RAR
Rotate AC right
through CF
0 0 0 1
0 0 0 0
1
1
AC3 ← (CF),
ACn ← (ACn + 1),
CF ← (AC0)
RAL
Rotate AC left
through CF
0 0 0 0
0 0 0 1
1
1
AC0 ← (CF),
ACn + 1 ← (ACn),
CF ← (AC3)
Shift AC (including CF) left.
TAE
Transfer AC to E
0 1 0 0
0 1 0 1
1
1
E ← (AC)
Transfer the contents of AC to E.
TEA
Transfer E to AC
0 1 0 0
0 1 1 0
1
1
AC ← (E)
Transfer the contents of E to AC. ZF
XAE
Exchange AC with E
0 1 0 0
0 1 0 0
1
1
(AC) ↔ (E)
Exchange the contents of
AC and E.
[Memory manipulation instructions]
IM
Increment M
0 0 0 1
0 0 1 0
1
1
M (HL) ←
[M (HL)] + 1
Increment M (HL).
ZF, CF
DM
Decrement M
0 0 1 0
0 0 1 0
1
1
M (HL) ←
[M (HL)] – 1
Decrement M (HL).
ZF, CF
IMDR i8
Increment M direct
1 1 0 0
I7 I6 I5 I4
0 1 1 1
I3 I2 I1 I0
2
2
M (i8) ← [M (i8)] + 1
Increment M (i8).
ZF, CF
DMDR i8 Decrement M direct
1 1 0 0
I7 I6 I5 I4
0 0 1 1
I3 I2 I1 I0
2
2
M (i8) ← [M (i8)] – 1
Decrement M (i8).
ZF, CF
SMB t2
Set M data bit
0 0 0 0
1 1 t1 t0
1
1
[M (HL), t2] ← 1
Set the bit in M (HL) specified
by t0 and t1 to 1.
RMB t2
Reset M data bit
0 0 1 0
1 1 t1 t0
1
1
[M (HL), t2] ← 0
Clear the bit in M (HL)
specified by t0 and t1 to 0.
ZF
0 0 0 0
0 1 1 0
1
1
AC ← (AC) +
[M (HL)]
Add the contents of AC and
M (HL) as two’s complement
values and store the result
in AC.
ZF, CF
1 1 0 0
I7 I6 I5 I4
1 0 0 1
I3 I2 I1 I0
2
Add the contents of AC and
M (i8) as two’s complement
AC ← (AC) + [M (i8)]
values and store the result
in AC.
Add the contents of AC,
M (HL) and C as two’s
complement values and
store the result in AC.
ZF, CF
[Arithmetic, logic and comparison instructions]
AD
Add M to AC
ADDR i8 Add M direct to AC
2
ZF, CF
ADC
Add M to AC with CF 0 0 0 0
0 0 1 0
1
1
AC ← (AC) +
[M (HL)] + (CF)
ADI i4
Add immediate data
to AC
1 1 0 0
0 0 1 0
1 1 1 1
I3 I2 I1 I0
2
2
AC ← (AC) +
I3, I2, I1, I0
Add the contents of AC and
the immediate data as two’s
complement values and store
the result in AC.
ZF
SUBC
Subtract AC from M
with CF
0 0 0 1
0 1 1 1
1
1
AC ← [M (HL)] –
(AC) – (CF)
Subtract the contents of AC
and CF from M (HL) as two’s
complement values and store
the result in AC.
ZF, CF
ANDA
And M with AC then
store AC
0 0 0 0
0 1 1 1
1
1
AC ← (AC)
[M (HL)]
Take the logical and of AC
and M (HL) and store the
result in AC.
ZF
ORA
Or M with AC then
store AC
0 0 0 0
0 1 0 1
1
1
AC ← (AC)
[M (HL)]
Take the logical or of AC and
M (HL) and store the result
in AC.
ZF
CF will be zero if
there was a
borrow and one
otherwise.
Continued on next page.
No. 5489-21/28
LC66P5316
Instruction code
Mnemonic
D 7 D6 D5 D4 D3 D2 D1 D0
Number of
bytes
Number of
cycles
Continued from preceding page.
Operation
Affected
status
bits
Description
Note
[Arithmetic, logic and comparison instructions]
EXL
Exclusive or M with
AC then store AC
0 0 0 1
0 1 0 1
1
1
AC ← (AC)
[M (HL)]
Take the logical exclusive or
of AC and M (HL) and store
the result in AC.
ZF
ANDM
And M with AC then
store M
0 0 0 0
0 0 1 1
1
1
M (HL) ← (AC)
[M (HL)]
Take the logical and of AC
and M (HL) and store the
result in M (HL).
ZF
ORM
Or M with AC then
store M
0 0 0 0
0 1 0 0
1
1
M (HL) ← (AC)
[M (HL)]
Take the logical or of AC and
M (HL) and store the result
in M (HL).
ZF
Compare the contents of AC
and M (HL) and set or clear CF
and ZF according to the result.
CM
Compare AC with M
0 0 0 1
0 1 1 0
1
1
[M (HL)] + (AC) + 1
Magnitude
comparison
[M (HL)] > (AC)
[M (HL)] = (AC)
[M (HL)] < (AC)
CF ZF
0
1
1
ZF, CF
0
1
0
Compare the contents of AC
and the immediate data
I3 I2 I1 I0 and set or clear CF
and ZF according to the result.
CI i4
Compare AC with
immediate data
1 1 0 0
1 0 1 0
1 1 1 1
I3 I2 I1 I0
2
2
I3 I2 I1 I0 + (AC) + 1
Magnitude
comparison
I3 I2 I1 I0 > AC
I3 I2 I1 I0 = AC
I3 I2 I1 I0 < AC
CLI i4
CMB t2
Compare DPL with
immediate data
Compare AC bit with
M data bit
1 1 0 0
1 0 1 1
1 1 1 1
I3 I2 I1 I0
2
CF ZF
0
1
1
ZF, CF
0
1
0
2
ZF ← 1
if (DPL) = I3 I2 I1 I0
ZF ← 0
if (DPL) ≠ I3 I2 I1 I0
Compare the contents of DPL
with the immediate data.
Set ZF if identical and clear
ZF if not.
ZF
Compare the corresponding
bits specified by t0 and t1 in
AC and M (HL). Set ZF if
identical and clear ZF if not.
ZF
1 1 0 0
1 1 0 1
1 1 1 1
0 0 t1 t0
2
2
ZF ← 1
if (AC, t2) = [M (HL),
t2]
ZF← 0
if (AC, t2) ≠ [M (HL),
t2]
[Load and store instructions]
LAE
Load AC and E from
M2 (HL)
0 1 0 1
1 1 0 0
1
1
AC ← M (HL),
E ← M (HL + 1)
Load the contents of M2 (HL)
into AC, E.
LAI i4
Load AC with
immediate data
1 0 0 0
I3 I2 I1 I0
1
1
AC ← I3 I2 I1 I0
Load the immediate data
into AC.
ZF
LADR i8
Load AC from M
direct
1 1 0 0
I7 I6 I5 I4
0 0 0 1
I3 I2 I1 I0
2
2
AC ← [M (i8)]
Load the contents of M (i8)
into AC.
ZF
S
Store AC to M
0 1 0 0
0 1 1 1
1
1
M (HL) ← (AC)
Store the contents of AC into
M (HL).
SAE
Store AC and E to
M2 (HL)
0 1 0 1
1 1 1 0
1
1
M (HL) ← (AC)
M (HL + 1) ← (E)
Store the contents of AC, E
into M2 (HL).
LA reg
Load AC from
M (reg)
0 1 0 0
1 0 t0 0
1
1
AC ← [M (reg)]
Has a vertical
skip function
Load the contents of M (reg)
into AC.
The reg is either HL or XY
depending on t0.
ZF
reg
T0
HL
XY
0
1
Continued on next page.
No. 5489-22/28
LC66P5316
Instruction code
Mnemonic
D 7 D6 D5 D4 D3 D2 D1 D0
Number of
bytes
Number of
cycles
Continued from preceding page.
Operation
Description
Affected
status
bits
Note
[Load and store instructions]
LA reg, I
Load AC from M (reg)
0 1 0 0
then increment reg
Load AC from M (reg)
LA reg, D
0 1 0 1
then decrement reg
XA reg
Exchange AC with
M (reg)
Exchange AC with
XA reg, I M (reg) then
increment reg
0 1 0 0
0 1 0 0
1 0 t0 1
1 0 t0 1
1 1 t0 0
1 1 t0 1
1
1
1
1
2
2
1
2
AC ← [M (reg)]
DPL ← (DPL) + 1
or DPY ← (DPY) + 1
Load the contents of M (reg)
into AC. (The reg is either HL
or XY.) Then increment the
contents of either DPL or DPY. ZF
The relationship between t0
and reg is the same as that
for the LA reg instruction.
ZF is set
according to the
result of
incrementing
DPL or DPY.
AC ← [M (reg)]
DPL ← (DPL) – 1
or DPY ← (DPY) – 1
Load the contents of M (reg)
into AC. (The reg is either HL
or XY.) Then decrement the
contents of either DPL or DPY. ZF
The relationship between t0
and reg is the same as that
for the LA reg instruction.
ZF is set
according to the
result of
decrementing
DPL or DPY.
(AC) ↔ [M (reg)]
Exchange the contents of
M (reg) and AC.
The reg is either HL or XY
depending on t0.
reg
T0
HL
XY
0
1
(AC) ↔ [M (reg)]
DPL ← (DPL) + 1
or DPY ← (DPY) + 1
Exchange the contents of
M (reg) and AC. (The reg is
either HL or XY.) Then
increment the contents of
either DPL or DPY. The
relationship between t0 and
reg is the same as that for
the XA reg instruction.
Exchange the contents of
M (reg) and AC. (The reg is
either HL or XY.) Then
decrement the contents of
either DPL or DPY. The
relationship between t0 and
reg is the same as that for
the XA reg instruction.
Exchange AC with
XA reg, D M (reg) then
decrement reg
0 1 0 1
1 1 t0 1
1
2
(AC) ↔ [M (reg)]
DPL ← (DPL) – 1
or DPY ← (DPY) – 1
XADR i8
Exchange AC with
M direct
1 1 0 0
I7 I6 I5 I4
1 0 0 0
I3 I2 I1 I0
2
2
(AC) ↔ [M (i8)]
Exchange the contents of AC
and M (i8).
LEAI i8
Load E & AC with
immediate data
1 1 0 0
I7 I6 I5 I4
0 1 1 0
I3 I2 I1 I0
2
2
E ← I7 I6 I5 I4
AC ← I3 I2 I1 I0
Load the immediate data i8
into E, AC.
RTBL
Read table data from
0 1 0 1
program ROM
2
E, AC ←
[ROM (PCh, E, AC)]
Load into E, AC the ROM data
at the location determined by
replacing the lower 8 bits of
the PC with E, AC.
RTBLP
Read table data from
program ROM then
0 1 0 1
output to P4, 5
Output from ports 4 and 5 the
ROM data at the location
determined by replacing the
lower 8 bits of the PC with
E, AC.
1 0 1 0
1
1 0 0 0
1
2
Port 4, 5 ←
[ROM (PCh, E, AC)]
ZF
ZF is set
according to the
result of
incrementing
DPL or DPY.
ZF
ZF is set
according to the
result of
decrementing
DPL or DPY.
[Data pointer manipulation instructions]
LDZ i4
Load DPH with zero
and DPL with
immediate data
respectively
0 1 1 0
I3 I2 I1 I0
1
1
DPH ← 0
DPL ← I3 I2 I1 I0
Load zero into DPH and the
immediate data i4 into DPL.
LHI i4
Load DPH with
immediate data
1 1 0 0
0 0 0 0
1 1 1 1
I3 I2 I1 I0
2
2
DPH ← I3 I2 I1 I0
Load the immediate data i4
into DPH.
LLI i4
Load DPL with
immediate data
1 1 0 0
0 0 0 1
1 1 1 1
I3 I2 I1 I0
2
2
DPL ← I3 I2 I1 I0
Load the immediate data i4
into DPL.
LHLI i8
Load DPH, DPL with
immediate data
1 1 0 0
I7 I6 I5 I4
0 0 0 0
I3 I2 I1 I0
2
2
DPH ← I7 I6 I5 I4
DPL ← I3 I2 I1 I0
Load the immediate data into
DLH, DPL.
LXYI i8
Load DPX, DPY with
immediate data
1 1 0 0
I7 I6 I5 I4
0 0 0 0
I3 I2 I1 I0
2
2
DPX ← I7 I6 I5 I4
DPY ← I3 I2 I1 I0
Load the immediate data into
DLX, DPY.
Continued on next page.
No. 5489-23/28
LC66P5316
Instruction code
Mnemonic
D 7 D6 D5 D4 D3 D2 D1 D0
Number of
bytes
Number of
cycles
Continued from preceding page.
Operation
Description
Affected
status
bits
Note
[Data pointer manipulation instructions]
IL
Increment DPL
0 0 0 1
0 0 0 1
1
1
DPL ← (DPL) + 1
Increment the contents
of DPL.
ZF
DL
Decrement DPL
0 0 1 0
0 0 0 1
1
1
DPL ← (DPL) – 1
Decrement the contents
of DPL.
ZF
IY
Increment DPY
0 0 0 1
0 0 1 1
1
1
DPY ← (DPY) + 1
Increment the contents
of DPY.
ZF
DY
Decrement DPY
0 0 1 0
0 0 1 1
1
1
DPY ← (DPY) – 1
Decrement the contents
of DPY.
ZF
TAH
Transfer AC to DPH
1 1 0 0
1 1 1 1
1 1 1 1
0 0 0 0
2
2
DPH ← (AC)
Transfer the contents of AC
to DPH.
THA
Transfer DPH to AC
1 1 0 0
1 1 1 0
1 1 1 1
0 0 0 0
2
2
AC ← (DPH)
Transfer the contents of DPH
to AC.
XAH
Exchange AC
with DPH
0 1 0 0
0 0 0 0
1
1
(AC) ↔ (DPH)
Exchange the contents of AC
and DPH.
TAL
Transfer AC to DPL
1 1 0 0
1 1 1 1
1 1 1 1
0 0 0 1
2
2
DPL ← (AC)
Transfer the contents of AC
to DPL.
TLA
Transfer DPL to AC
1 1 0 0
1 1 1 0
1 1 1 1
0 0 0 1
2
2
AC ← (DPL)
Transfer the contents of DPL
to AC.
XAL
Exchange AC
with DPL
0 1 0 0
0 0 0 1
1
1
(AC) ↔ (DPL)
Exchange the contents of AC
and DPL.
TAX
Transfer AC to DPX
1 1 0 0
1 1 1 1
1 1 1 1
0 0 1 0
2
2
DPX ← (AC)
Transfer the contents of AC
to DPX.
TXA
Transfer DPX to AC
1 1 0 0
1 1 1 0
1 1 1 1
0 0 1 0
2
2
AC ← (DPX)
Transfer the contents of DPX
to AC.
XAX
Exchange AC
with DPX
0 1 0 0
0 0 1 0
1
1
(AC) ↔ (DPX)
Exchange the contents of AC
and DPX.
TAY
Transfer AC to DPY
1 1 0 0
1 1 1 1
1 1 1 1
0 0 1 1
2
2
DPY ← (AC)
Transfer the contents of AC
to DPY.
TYA
Transfer DPY to AC
1 1 0 0
1 1 1 0
1 1 1 1
0 0 1 1
2
2
AC ← (DPY)
Transfer the contents of DPY
to AC.
XAY
Exchange AC
with DPY
0 1 0 0
0 0 1 1
1
1
(AC) ↔ (DPY)
Exchange the contents of AC
and DPY.
ZF
ZF
ZF
ZF
[Flag manipulation instructions]
SFB n4
Set flag bit
0 1 1 1
n 3 n2 n1 n0
1
1
Fn ← 1
Set the flag specified
by n4 to 1.
RFB n4
Reset flag bit
0 0 1 1
n 3 n2 n1 n0
1
1
Fn ← 0
Reset the flag specified
by n4 to 0.
Jump to the location in the
same bank specified by the
immediate data P12.
ZF
[Jump and subroutine instructions]
JMP
addr
Jump in the current
bank
1 1 1 0 P11P10P9 P8
P7 P6 P5 P4 P3 P2 P1 P0
2
2
PC13, 12 ←
PC13, 12
PC11 to 0 ←
P11 to P8
JPEA
Jump to the address
stored at E and AC
in the current page
0 0 1 0
1
1
PC13 to 8 ←
PC13 to 8,
PC7 to 4 ← (E),
PC3 to 0 ← (AC)
Jump to the location
determined by replacing the
lower 8 bits of the PC
by E, AC.
2
PC13 to 11 ← 0,
PC10 to 0 ←
P10 to P0,
M4 (SP) ←
(CF, ZF, PC13 to 0),
SP ← (SP)-4
Call a subroutine.
PC13 to 6,
PC10 ← 0,
PC5 to 2 ← P3 to P0, Call a subroutine on page 0
M4 (SP) ←
in bank 0.
(CF, ZF, PC12 to 0),
SP ← SP-4
CAL
addr
Call subroutine
0 1 1 1
0 1 0 1 0 P10 P9 P8
P7 P6 P5 P4 P3 P2 P1 P0
2
CZP
addr
Call subroutine in the
1 0 1 0
zero page
P3 P2 P1 P0
1
2
BANK
Change bank
1 0 1 1
1
1
0 0 0 1
This becomes
PC12 + (PC12)
immediately
following a BANK
instruction.
Change the memory bank
and register bank.
Continued on next page.
No. 5489-24/28
LC66P5316
Instruction code
Mnemonic
D 7 D6 D5 D4 D3 D2 D1 D0
Number of
bytes
Number of
cycles
Continued from preceding page.
Operation
Affected
status
bits
Description
Note
[Jump and subroutine instructions]
Store the contents of reg in
M2 (SP). Subtract 2 from SP
after the store.
PUSH
reg
Push reg on M2 (SP)
1 1 0 0
1 1 1 1
1 1 1 1
1 i 1 i0 0
2
2
M2 (SP) ← (reg)
SP ← (SP) – 2
reg
i1
i0
HL
XY
AE
Illegal value
0
0
1
1
0
1
0
1
POP
reg
Pop reg off M2 (SP)
1 1 0 0
1 1 1 0
1 1 1 1
1 i 1 i0 0
2
2
SP ← (SP) + 2
reg ← [M2 (SP)]
Add 2 to SP and then load the
contents of M2(SP) into reg.
The relation between i1i0 and
reg is the same as that for the
PUSH reg instruction.
RT
Return from
subroutine
0 0 0 1
1 1 0 0
1
2
SP ← (SP) + 4
PC ← [M4 (SP)]
Return from a subroutine or
interrupt handling routine. ZF
and CF are not restored.
RTI
Return from interrupt
routine
0 0 0 1
1 1 0 1
1
2
SP ← (SP) + 4
PC ← [M4 (SP)]
CF, ZF ← [M4 (SP)]
Return from a subroutine or
interrupt handling routine. ZF
and CF are restored.
2
PC7 to 0 ←
P7 P6 P5 P4
P3 P2 P1 P0
if (AC, t2) = 1
Branch to the location in the
same page specified by P7 to
P0 if the bit in AC specified by
the immediate data t1 t0 is one.
2
PC7 to 0 ←
P7 P6 P5 P4
P3 P2 P1 P0
if (AC, t2) = 0
Branch to the location in the
same page specified by P7 to
P0 if the bit in AC specified by
the immediate data t1 t0 is zero.
2
PC7 to 0 ←
P7 P6 P5 P4
P3 P2 P1 P0
if [M (HL),t2]
=1
Branch to the location in the
same page specified by P7 to
P0 if the bit in M (HL) specified
by the immediate data t1 t0
is one.
2
PC7 to 0 ←
P7 P6 P5 P4
P3 P2 P1 P0
if [M (HL),t2]
=0
Branch to the location in the
same page specified by P7 to
P0 if the bit in M (HL) specified
by the immediate data t1 t0
is zero.
ZF, CF
[Branch instructions]
BAt2
addr
BNAt2
addr
BMt2
addr
BNMt2
addr
BPt2
addr
BNPt2
addr
Branch on AC bit
1 1 0 1 0 0 t1 t0
P7 P6 P5 P4 P3 P2 P1 P0
Branch on no AC bit
1 0 0 1 0 0 t1 t0
P7 P6 P5 P4 P3 P2 P1 P0
Branch on M bit
1 1 0 1 0 1 t1 t0
P7 P6 P5 P4 P3 P2 P1 P0
Branch on no M bit
1 0 0 1 0 1 t1 t0
P7 P6 P5 P4 P3 P2 P1 P0
Branch on Port bit
1 1 0 1 1 0 t1 t0
P7 P6 P5 P4 P3 P2 P1 P0
1 0 0 1 1 0 t1 t0
Branch on no Port bit
P7 P6 P5 P4 P3 P2 P1 P0
2
2
2
2
2
2
2
2
PC7 to 0 ←
P7 P6 P5 P4
P3 P2 P1 P0
if [P (DPL), t2]
=1
PC7 to 0 ←
P7 P6 P5 P4
P3 P2 P1 P0
if [P (DPL), t2]
=0
Branch to the location in the
same page specified by P7 to
P0 if the bit in port (DPL)
specified by the immediate
data t1 t0 is one.
Internal control
registers can also
be tested by
executing this
instruction
immediately after
a BANK
instruction.
However, this is
limited to
registers that can
be read out.
Branch to the location in the
same page specified by P7 to
P0 if the bit in port (DPL)
specified by the immediate
data t1 t0 is zero.
Internal control
registers can also
be tested by
executing this
instruction
immediately after
a BANK
instruction.
However, this is
limited to
registers that can
be read out.
Continued on next page.
No. 5489-25/28
LC66P5316
Instruction code
Mnemonic
D 7 D6 D5 D4 D3 D2 D1 D0
Number of
bytes
Number of
cycles
Continued from preceding page.
Operation
Description
Affected
status
bits
Note
[Branch instructions]
2
PC7 to 0 ←
P7 P6 P5 P4
P3 P2 P1 P0
if (CF) = 1
Branch to the location in the
same page specified by P7 to
P0 if CF is one.
BC addr
Branch on CF
1 1 0 1 1 1 0 0
P7 P6 P5 P4 P3 P2 P1 P0
BNC
addr
Branch on no CF
1 0 0 1 1 1 0 0
P7 P6 P5 P4 P3 P2 P1 P0
2
2
PC7 to 0 ←
P7 P6 P5 P4
P3 P2 P1 P0
if (CF) = 0
Branch to the location in the
same page specified by P7 to
P0 if CF is zero.
BZ addr
Branch on ZF
1 1 0 1 1 1 0 1
P7 P6 P5 P4 P3 P2 P1 P0
2
2
PC7 to 0 ←
P7 P6 P5 P4
P3 P2 P1 P0
if (ZF) = 1
Branch to the location in the
same page specified by P7 to
P0 if ZF is one.
Branch on no ZF
1 0 0 1 1 1 0 1
P7 P6 P5 P4 P3 P2 P1 P0
2
PC7 to 0 ←
P7 P6 P5 P4
P3 P2 P1 P0
if (ZF) = 0
Branch to the location in the
same page specified by P7 to
P0 if ZF is zero.
2
PC7 to 0 ←
P7 P6 P5 P4
P3 P2 P1 P0
if (Fn) = 1
Branch to the location in the
same page specified by P0 to
P7 if the flag (of the 16 user
flags) specified by n3 n2 n1 n0
is one.
Branch to the location in the
same page specified by P0 to
P7 if the flag (of the 16 user
flags) specified by n3 n2 n1 n0
is zero.
BNZ
addr
BFn4
addr
BNFn4
addr
Branch on flag bit
Branch on no flag bit
1 1 1 1 n 3 n2 n1 n0
P7 P6 P5 P4 P3 P2 P1 P0
2
2
2
1 0 1 1 n 3 n2 n1 n0
P7 P6 P5 P4 P3 P2 P1 P0
2
2
PC7 to 0 ←
P7 P6 P5 P4
P3 P2 P1 P0
if (Fn) = 0
[I/O instructions]
IP0
Input port 0 to AC
0 0 1 0
0 0 0 0
1
1
AC ← (P0)
Input the contents of port
0 to AC.
ZF
IP
Input port to AC
0 0 1 0
0 1 1 0
1
1
AC ← [P (DPL)]
Input the contents of port
P (DPL) to AC.
ZF
IPM
Input port to M
0 0 0 1
1 0 0 1
1
1
M (HL) ← [P (DPL)]
Input the contents of port
P (DPL) to M (HL).
IPDR i4
Input port to
AC direct
1 1 0 0
0 1 1 0
1 1 1 1
I3 I2 I1 I0
2
2
AC ← [P (i4)]
Input the contents of
P (i4) to AC.
IP45
Input port 4, 5 to
E, AC respectively
1 1 0 0
1 1 0 1
1 1 1 1
0 1 0 0
2
2
E ← [P (4)]
AC ← [P (5)]
Input the contents of ports
P (4) and P (5) to E and AC
respectively.
OP
Output AC to port
0 0 1 0
0 1 0 1
1
1
P (DPL) ← (AC)
Output the contents of AC to
port P (DPL).
OPM
Output M to port
0 0 0 1
1 0 1 0
1
1
P (DPL) ← [M (HL)]
Output the contents of M (HL)
to port P (DPL).
OPDR i4
Output AC to
port direct
1 1 0 0
0 1 1 1
1 1 1 1
I3 I2 I1 I0
2
2
P (i4) ← (AC)
Output the contents of AC
to P (i4).
OP45
Output E, AC to port
4, 5 respectively
1 1 0 0
1 1 0 1
1 1 1 1
0 1 0 1
2
2
P (4) ← (E)
P (5) ← (AC)
Output the contents of E and
AC to ports P (4) and P (5)
respectively.
SPB t2
Set port bit
0 0 0 0
1 0 t1 t0
1
1
[P (DPL), t2] ← 1
Set to one the bit in port
P (DPL) specified by the
immediate data t1 t0.
RPB t2
Reset port bit
0 0 1 0
1 0 t1 t0
1
1
[P (DPL), t2] ← 0
Clear to zero the bit in port
P (DPL) specified by the
immediate data t1 t0.
And port with
ANDPDR
immediate data then
i4, p4
output
1 1 0 0 0 1 0 1
I3 I2 I1 I0 P3 P2 P1 P0
2
2
P (P3 to P0) ←
[P (P3 to P0)]
I3 to I0
Take the logical AND of P (P3
to P0) and the immediate data
ZF
I3 I2 I1 I0 and output the result
to P (P3 to P0).
Or port with
immediate data then
output
1 1 0 0 0 1 0 0
I3 I2 I1 I0 P3 P2 P1 P0
2
2
P (P3 to P0) ←
[P (P3 to P0)]
I3 to I0
Take the logical OR of P (P3
to P0) and the immediate data ZF
I3 I2 I1 I0 and output the result
to P (P3 to P0).
ORPDR
i4, p4
ZF
ZF
Continued on next page.
No. 5489-26/28
LC66P5316
Instruction code
Mnemonic
D 7 D6 D5 D4 D3 D2 D1 D0
Number of
bytes
Number of
cycles
Continued from preceding page.
Operation
Description
Affected
status
bits
Note
[Timer control instructions]
WTTM0
Write timer 0
1 1 0 0
1 0 1 0
1
2
Write the contents of M2 (HL),
TIMER0 ← [M2 (HL)],
AC into the timer 0 reload
(AC)
register.
WTTM1
Write timer 1
1 1 0 0
1 1 1 1
1 1 1 1
0 1 0 0
2
2
Write the contents of E, AC
TIMER1 ← (E), (AC) into the timer 1 reload
register A.
RTIM0
Read timer 0
1 1 0 0
1 0 1 1
1
2
M2 (HL),
AC ← (TIMER0)
Read out the contents of the
timer 0 counter into M2 (HL),
AC.
RTIM1
Read timer 1
1 1 0 0
1 1 1 1
1 1 1 1
0 1 0 1
2
2
E, AC ← (TIMER1)
Read out the contents of the
timer 1 counter into E, AC.
START0 Start timer 0
1 1 0 0
1 1 1 0
1 1 1 1
0 1 1 0
2
2
Start timer 0 counter
Start the timer 0 counter.
START1 Start timer 1
1 1 0 0
1 1 1 0
1 1 1 1
0 1 1 1
2
2
Start timer 1 counter
Start the timer 1 counter.
STOP0
Stop timer 0
1 1 0 0
1 1 1 1
1 1 1 1
0 1 1 0
2
2
Stop timer 0 counter
Stop the timer 0 counter.
STOP1
Stop timer 1
1 1 0 0
1 1 1 1
1 1 1 1
0 1 1 1
2
2
Stop timer 1 counter
Stop the timer 1 counter.
[Interrupt control instructions]
MSET
Set interrupt master
enable flag
1 1 0 0
0 1 0 1
1 1 0 1
0 0 0 0
2
2
MSE ← 1
Set the interrupt master
enable flag to one.
MRESET
Reset interrupt
master enable flag
1 1 0 0
1 0 0 1
1 1 0 1
0 0 0 0
2
2
MSE ← 0
Clear the interrupt master
enable flag to zero.
EIH i4
Enable interrupt high
1 1 0 0
0 1 0 1
1 1 0 1
I3 I2 I1 I0
2
2
EDIH ← (EDIH)
EIL i4
Enable interrupt low
1 1 0 0
0 1 0 0
1 1 0 1
I3 I2 I1 I0
2
2
EDIL ← (EDIL)
DIH i4
Disable interrupt high
1 1 0 0
1 0 0 1
1 1 0 1
I3 I2 I1 I0
2
2
EDIH ← (EDIH)
DIL i4
Disable interrupt low
1 1 0 0
1 0 0 0
1 1 0 1
I3 I2 I1 I0
2
2
EDIL ← (EDIL)
WTSP
Write SP
1 1 0 0
1 1 0 1
1 1 1 1
1 0 1 0
2
2
SP ← (E), (AC)
Transfer the contents of E,
AC to SP.
RSP
Read SP
1 1 0 0
1 1 0 1
1 1 1 1
1 0 1 1
2
2
E, AC ← (SP)
Transfer the contents of SP
to E, AC.
i4
i4
i4
i4
Set the interrupt enable flag
to one.
Set the interrupt enable flag
to one.
Clear the interrupt enable
flag to zero.
ZF
Clear the interrupt enable
flag to zero.
ZF
[Standby control instructions]
HALT
HALT
1 1 0 0
1 1 0 1
1 1 1 1
1 1 1 0
2
2
HALT
Enter halt mode.
HOLD
HOLD
1 1 0 0
1 1 0 1
1 1 1 1
1 1 1 1
2
2
HOLD
Enter hold mode.
STARTS Start serial I O
1 1 0 0
1 1 1 0
1 1 1 1
1 1 1 0
2
2
START SI O
Start SIO operation.
WTSIO
Write serial I O
1 1 0 0
1 1 1 0
1 1 1 1
1 1 1 1
2
2
SIO ← (E), (AC)
Write the contents of E,
AC to SIO.
RSIO
Read serial I O
1 1 0 0
1 1 1 1
1 1 1 1
1 1 1 1
2
2
E, AC ← (SIO)
Read out the contents of SIO
into E, AC.
[Serial I/O control instructions]
[Other instructions]
NOP
No operation
0 0 0 0
0 0 0 0
1
1
No operation
Consume one machine cycle
without performing any
operation.
SB i2
Select bank
1 1 0 0
1 1 0 0
1 1 1 1
0 0 I1 I0
2
2
PC13, PC12 ← I1 I0
Specify the memory bank.
No. 5489-27/28
LC66P5316
■ No products described or contained herein are intended for use in surgical implants, life-support systems, aerospace
equipment, nuclear power control systems, vehicles, disaster/crime-prevention equipment and the like, the failure of
which may directly or indirectly cause injury, death or property loss.
■ Anyone purchasing any products described or contained herein for an above-mentioned use shall:
➀ Accept full responsibility and indemnify and defend SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and
distributors and all their officers and employees, jointly and severally, against any and all claims and litigation and all
damages, cost and expenses associated with such use:
➁ Not impose any responsibility for any fault or negligence which may be cited in any such claim or litigation on
SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and distributors or any of their officers and employees
jointly or severally.
■ Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for
volume production. SANYO believes information herein is accurate and reliable, but no guarantees are made or implied
regarding its use or any infringements of intellectual property rights or other rights of third parties.
This catalog provides information as of February, 1997. Specifications and information herein are subject to
change without notice.
No. 5489-28/28