6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS H11N1-M H11N2-M H11N3-M PACKAGE SCHEMATIC 6 VCC ANODE 1 6 6 CATHODE 2 5 GND 1 1 4 VO 3 6 1 DESCRIPTION Truth Table The H11NX-M series has a high speed integrated circuit detector optically coupled to an AlGaAs infrared emitting diode. The output incorporates a Schmitt trigger, which provides hysteresis for noise immunity and pulse s haping. The detector circuit is optimized for simplicity of operation and utilizes an open collector output for maximum application flexibility. Input Output H L L H FEATURES • • • • • • • • • • High data rate, 5 MHz typical (NRZ) Free from latch up and oscilliation throughout voltage and temperature ranges. Microprocessor compatible drive Logic compatible output sinks 16 mA at 0.5 V maximum Guaranteed on/off threshold hysteresis Wide supply voltage capability, compatible with all popular logic systems High common mode transient immunity, 2000 V/µs minimum Fast switching t r = 7.5ns typical, t f = 12ns typical Underwriter Laboratory (UL) recognized—file #E90700 VDE recognized – File#102497 – Add option V (e.g., H11N1VM) APPLICATIONS • • • • • • Logic to logic isolator Programmable current level sensor Line receiver—eliminate noise and transient problems A.C. to TTL conversion—square wave shaping Interfaces computers with peripherals Isolated power MOS driver for power supplies © 2005 Fairchild Semiconductor Corporation Page 1 of 9 6/15/05 6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS H11N1-M H11N2-M H11N3-M ABSOLUTE MAXIMUM RATINGS Parameters Symbol Device Value Units Storage Temperature TSTG All -55 to +150 °C Operating Temperature TOPR All -40 to +85 °C Lead Solder Temperature TSOL All 260 for 10 sec °C PD All Continuous Forward Current IF Reverse Voltage TOTAL DEVICE Total Device Power Dissipation @ 25°C 250 mW 2.94 mW/°C All 30 mA VR All 6 V IF(pk) All 1.0 A PD All 120 mW 1.41 mW/°C PD All V45 Allowed Range VO V65 Allowed Range Derate Above 25°C EMITTER Forward Current - Peak (1 µs pulse, 300 pps) LED Power Dissipation 25°C Ambient Derate Linearly From 25°C DETECTOR 150 mW 1.76 mW/°C All 0 to 16 V VCC All 0 to 16 V IO All 50 mA Detector Power Dissipation @ 25°C Derate Linearly from 25°C I4 Output Current ELECTRICAL CHARACTERISTICS (TA = 0-70°C Unless otherwise specified.) INDIVIDUAL COMPONENT CHARACTERISTICS Parameters Test Conditions Symbol Device VF All Min Typ* Max 1.4 2 Units EMITTER Input Forward Voltage IF = 10 mA IF = 0.3 mA 0.75 1.25 V Reverse Current VR = 5 V IR All 10 µA Capacitance V = 0, f = 1.0 MHz CJ All 100 pF VCC All 15 V ICC(off) All 10 mA IOH All 100 µA DETECTOR Operating Voltage Range Supply Current IF = 0, VCC = 5V Output Current, High IF = 0.3mA, VCC = VO = 15V 4 6 *Typical values at TA = 25°C © 2005 Fairchild Semiconductor Corporation Page 2 of 9 6/15/05 6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS H11N1-M H11N2-M H11N3-M TRANSFER CHARACTERISTICS DC Characteristics Test Conditions Symbol Device ICC(on) All All Supply Current IF = 10mA, VCC = 5V Output Voltage, low RL=270Ω,VCC=5V, IF=IF(on) max. VOL Turn-On Threshold Current RL=270Ω, VCC = 5V note 1 IF(on) Min Units 6.5 10 mA 0.5 V 0.8 3.2 H11N2-M 2.3 5 H11N3-M 4.1 10 RL=270Ω, VCC = 5V IF(off) All 0.3 Hysteresis Ratio RL=270Ω, VCC = 5V IF(off)/IF(on) All 0.65 Symbol Device Min Test Conditions Max H11N1-M Turn-Off Threshold Current AC Characteristics Typ* mA mA 0.95 Typ Max Units 330 ns SWITCHING SPEED Propagation delay time High to Low C=120pF, tP=1µs, RE: Note 2 Fig. 1 tPHL All 100 Rise Time C=120pF, tP=1µs, RE: Note 2 Fig. 1 tr All 7.5 Propagation delay time Low to High C=120pF, tP=1µs, RE: Note 2 Fig. 1 tPLH All 150 Fall time C=120pF, tP=1µs, RE: Note 2 Fig. 1 tf All 12 ns All 5 MHz Data Rate ns 330 ns ISOLATION CHARACTERISTICS Parameters Test Conditions Symbol Min 7500 Input-Output Isolation Voltage f = 60 Hz, t =1 sec. VISO Isolation Capacitance VI-O = 0V, f = 1 MHz CISO Isolation Resistance VI-O = ±500 VDC RISO Typ* Units VPEAK 0.4 1011 Max 0.6 pF Ω *Typical values at TA = 25°C NOTES: 1. Maximum IF(ON) is the maximum current required to trigger the output. For example, a 3.2mA maximum trigger current would require the LED to be driven at a current greater than 3.2mA to guarantee the device will turn on. A 10% guard band is recommended to account for degradation of the LED over its lifetime. The maximum allowable LED drive current is 30mA. 2. H11N1: RE = 910Ω H11N2: RE = 560Ω H11N3: RE = 240Ω © 2005 Fairchild Semiconductor Corporation Page 3 of 9 6/15/05 6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS H11N1-M H11N2-M C I6 6 RL 270Ω 4 VIN tr = tf ≤ 0.01µS Z = 50Ω 50% 0 1 H11N1-M RE VIN 5V 5V IF H11N3-M 5 2 VO toff ton 0.1µF 10% VO 90% tf tr Figure 1. Switching Test Circuit and Waveforms Figure 2. Transfer Characteristics Figure 3. Threshold Current vs. Supply Voltage 1.4 VOH 5 VO - OUTPUT VOLTAGE (V) IF - NORMALIZED THRESHOLD CURRENT 6 VCC = 5V RL = 270Ω TA = 25°C 4 3 IF(OFF) IF(ON) 2 Hysteresis area shaded for illustration 1 VOL 1 2 1.0 0.8 TURN OFF THRESHOLD 0.6 0.4 NORMALIZED TO:: TURN ON THRESHOLD AT VCC = 5V, TA = 25°C 0.2 0.0 0 0 TURN ON THRESHOLD D 1.2 3 0 4 2 4 6 8 10 12 14 16 VCC - SUPPLY VOLTAGE (V) IF - INPUT CURRENT (mA) Figure 4. Threshold Current vs. Temperature Figure 5. Load Current vs. Output Voltage 100 1.0 IF(On) IO - LOAD CURRENT (mA) NORMALIZED THRESHOLD CURRENT IF(On), IF(Off) 1.2 IF(Off) 0.8 0.6 0.4 NORMALIZED TO : VCC = 5V TA = 25°C 0.2 0.0 0 10 20 30 40 50 60 1 0.0 70 TA - TEMPERATURE (°C) © 2005 Fairchild Semiconductor Corporation IF = IF(ON) VCC = 5V 10 0.2 0.4 0.6 0.8 1.0 VO - OUTPUT VOLTAGE, LOW (V) Page 4 of 9 6/15/05 6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS H11N1-M H11N2-M H11N3-M Figure 6. Supply Current vs. Supply Voltage Figure 7. LED Forward Voltage vs. Forward Current 100 12 IC - SUPPLY CURRENT (mA) IF - FORWARD CURRENT (mA) TA = -25°C 10 8 TA = 25°C 6 TA = 85°C 4 TA = 85°C TA = -25°C TA = 25°C 10 ON STATE I F = 10mA 2 OFF STATE I F = 0 1 0 2 4 6 8 10 12 14 16 1.2 1.4 1.6 1.8 2.0 VF - FORWARD VOLTAGE (V) VCC - SUPPLY VOLTAGE (V) © 2005 Fairchild Semiconductor Corporation 1.0 Page 5 of 9 6/15/05 6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS H11N1-M H11N2-M Package Dimensions (Through Hole) H11N3-M Package Dimensions (Surface Mount) 0.350 (8.89) 0.320 (8.13) 0.350 (8.89) 0.320 (8.13) 0.260 (6.60) 0.240 (6.10) 0.070 (1.77) 0.040 (1.02) 0.260 (6.60) 0.240 (6.10) 0.390 (9.90) 0.332 (8.43) 0.070 (1.77) 0.040 (1.02) 0.320 (8.13) 0.014 (0.36) 0.010 (0.25) 0.320 (8.13) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.200 (5.08) 0.115 (2.93) 0.100 (2.54) 0.015 (0.38) 0.012 (0.30) 0.008 (0.20) 0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41) 0.100 (2.54) 0.100 [2.54] 15° 0.035 (0.88) 0.006 (0.16) 0.020 (0.50) 0.016 (0.41) 0.012 (0.30) Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for Surface Mount Leadform 0.350 (8.89) 0.320 (8.13) 0.070 (1.78) 0.260 (6.60) 0.240 (6.10) 0.060 (1.52) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.425 (10.79) 0.100 (2.54) 0.305 (7.75) 0.200 (5.08) 0.115 (2.93) 0.030 (0.76) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.012 (0.30) 0.008 (0.21) 0.425 (10.80) 0.400 (10.16) © 2005 Fairchild Semiconductor Corporation Page 6 of 9 6/15/05 6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS H11N1-M H11N2-M H11N3-M ORDERING INFORMATION Option/Order Entry Identifier Description S Surface Mount Lead Bend SR2 Surface Mount; Tape and reel T 0.4" Lead Spacing V VDE 0884 TV VDE 0884, 0.4" Lead Spacing SV VDE 0884, Surface Mount SR2V VDE 0884, Surface Mount, Tape & Reel MARKING INFORMATION 1 V 3 H11N1 2 X YY Q 6 5 4 Definitions 1 Fairchild logo 2 Device number 3 VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) 4 One digit year code, e.g., ‘3’ 5 Two digit work week ranging from ‘01’ to ‘53’ 6 Assembly package code *Note – Parts that do not have the ‘V’ option (see definition 3 above) that are marked with date code ‘325’ or earlier are marked in portrait format. © 2005 Fairchild Semiconductor Corporation Page 7 of 9 6/15/05 6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS H11N1-M H11N2-M H11N3-M Carrier Tape Specifications 12.0 ± 0.1 4.5 ± 0.20 2.0 ± 0.05 0.30 ± 0.05 Ø1.5 MIN 4.0 ± 0.1 1.75 ± 0.10 11.5 ± 1.0 21.0 ± 0.1 9.1 ± 0.20 Ø1.5 ± 0.1/-0 10.1 ± 0.20 0.1 MAX 24.0 ± 0.3 User Direction of Feed NOTE All dimensions are in inches (millimeters) Reflow Profile (White Package, -M Suffix) 300 260°C 280 260 >245°C = 42 Sec 240 220 200 180 °C Time above 183°C = 90 Sec 160 140 120 1.822°C/Sec Ramp up rate 100 80 60 40 33 Sec 20 0 0 60 120 180 270 360 Time (s) © 2005 Fairchild Semiconductor Corporation Page 8 of 9 6/15/05 6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS H11N1-M H11N2-M H11N3-M DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. © 2005 Fairchild Semiconductor Corporation 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Page 9 of 9 6/15/05