ETC 4N40S

PHOTO SCR OPTOCOUPLERS
DESCRIPTION
4N39
4N40
The 4N39 and AN40 have a gallium-arsenide infrared
emitting diode optically coupled with a light activated silicon controlled rectifier in a dual in-line package.
FEATURES
•
•
•
•
10 A, T2L compatible, solid state relay
25 W logic indicator lamp driver
400 V symmetrical transistor coupler
Underwriters Laboratory (UL) recognized  File #E90700
6
1
6
SCHEMATIC
1
ANODE 1
6 GATE
APPLICATIONS
•
•
•
•
•
Low power logic circuits
6
Telecommunications equipment
Portable electronics
Solid state relays
Interfacing coupling systems of different potentials and impedances.
Parameter
CATHODE 2
1
5 ANODE
N/C 3
4 CATHODE
Symbol
Device
Value
Units
TSTG
All
-55 to +150
°C
*Operating Temperature
TOPR
All
-55 to +100
°C
*Lead Solder Temperature
TSOL
All
260 for 10 sec
°C
450
mW
9.0
mW/°C
TOTAL DEVICE
*Storage Temperature
*Total Device Power Dissipation (-55°C to 50 °C)
Derate above 50°C
EMITTER
*Continuous Forward Current
*Reverse Voltage
*Forward Current - Peak (300 µs, 2% Duty Cycle)
*LED Power Dissipation (-55°C to 50 °C)
Derate above 50°C
PD
All
IF
All
60
mA
VR
All
6
V
IF(pk)
All
PD
1.0
A
100
mW
2.0
mW/°C
4N39
200
V
4N40
400
V
All
DETECTOR
*Off-State And Reverse Voltage
*Peak Reverse Gate Voltage
6
V
*Direct On-State Current
300
mA
*Surge On-State Current (100 µs)
10
A
*Peak Gate Current
10
mA
*Detector Power Dissipation (-55°C to 50°C)
Derate above 50°C
PD
All
400
mW
8.0
mW/°C
Note
* Indicates JEDEC Registered Data
** Typical values at TA = 25°C
 2001 Fairchild Semiconductor Corporation
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4N39
ELECTRICAL CHARACTERISTICS
4N40
(TA = 25°C Unless otherwise specified.)
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter
Test Conditions
Symbol
Device
Min
Typ**
Max
Unit
IF = 10 mA
VR = 3 V
VF
All
1.1
1.5
10
V
µA
IR
All
VF = 0 V, f = 1.0 MHz
CJ
All
Peak Off-State Voltage
RGK = 10 kΩ, TA=100 °C
VDM
Peak Reverse Voltage
TA=100 °C
VRM
On-State Voltage
IT = 300 mA
VT
All
1.3
V
Off-State Current
VDM = 200 V, TA = 100 °C,
IDM
4N39
4N40
50
150
µA
Reverse Current
VR = 200 V, TA=100 °C, IF = 0 mA
IR
Holding Current
VFx = 50V, RGK = 27 kΩ
IH
EMITTER
Input Forward Voltage
Reverse Leakage Current
Capacitance
50
pF
DETECTOR
IF = 0 mA, RGK = 10 kΩ
TRANSFER CHARACTERISTICS
Characteristics
*Input Current to Trigger
*Turn-On Time
(input to output)
Test Conditions
Symbol
VAK = 100 V, RGK = 27 kΩ
VAK = 50 V, IF = 30 mA
RGK = 10 kΩ, RL = 200 Ω
f = 1 MHz
Input to Output Voltage = 0
Coupled dv/dt, input to output
(figure 13)
200
4N40
400
4N39
200
4N40
400
V
V
4N39
50
4N40
All
150
1.0
mA
Max
Units
µA
(TA = 25°C Unless otherwise specified.)
VAK = 50 V, RGK = 10 kΩ
Package Capacitance
4N39
Device
Min
Typ**
4N39
30
4N40
14
ton
ALL
50
µA
CI-O
ALL
2
pF
dV/dt
ALL
IFT
500
mA
V/µS
ISOLATION CHARACTERISTICS
Characteristic
Test Conditions
Symbol
Min
Typ**
Max
Units
( II-0 ≤ 1 µA, Vrms, t = 1 min.)
(VI-O = 500 VDC)
VISO
5300
Vac(rms)
*Isolation Resistance
RISO
1011
!
Isolation Capacitance
(VI-O = ∅, f = 1 MHz)
CISO
*Input-Output Isolation Voltage
0.8
pf
Note
* Indicates JEDEC Registered Data
** Typical values at TA = 25°C
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4N39
4N40
Figure 2. Input Current To Trigger vs. Temperature
Figure 1. Input Current To Trigger vs. Anode-Cathode Voltage
NORMALIZED TO
VAK = 50V
RGK = 10K
TA = 25˚C
50
10
IFT - NORMALIZED INPUT CURRENT TO TRIGGER
IFT - NORMALIZED INPUT CURRENT TO TRIGGER
12
RGK = 300Ω
5
1K
1
10K
.5
27K
56K
.1
1
5
10
50 100
200
400
10
8
6
RGK = 300Ω
4
1K
2
10K
1
.8
.6
27K
.4
56K
.1
-60
VAK - ANODE TO CATHODE VOLTAGE (VOLTS)
NORMALIZED TO
VAK = 50V
RGK = 10K
TA = 25˚C
.2
-40
-20
0
20
40
60
80
100
120
TA - AMBIENT TEMPERATURE (˚C)
Figure 4. Input Current To Trigger vs. Pluse Width
Figure 3. Input Current To Trigger Distribution vs. Temperature
100
10
IFT - NORMALIZED INPUT CURRENT TO TRIGGER
8
IFT - NORMALIZED INPUT CURRENT TO TRIGGER
6
4
2
NORMALIZED TO
VAK = 50V
RGK = 10K
TA = 25˚C
90 TH PERCENTILE
1
.8
.6
10 TH PERCENTILE
.4
NORMALIZED TO
VAK = 50V
RGK = 10K
TA = 25˚C
40
20
RGK = 300Ω
10
8
6
1K
4
2
10K
1
.8
.6
27K
.4
56K
.2
.1
1
.2
2
4
6 8 10
20
40 60 100 200
400
1000
PULSE WIDTH (MICRO SECONDS)
.1
-40
-20
0
20
40
60
80
Figure 6. Input Characteristics IF vs. VF
100
IF - FORWARD CURRENT (MILLIAMPERES)
TA - AMBIENT TEMPERATURE (˚C)
Figure 5. Turn-On Time vs. Input Current
ton - TURN ON TIME (MICROSECONDS)
24
22
20
18
16
14
VAK = 50V
ton = td + Ir
tr ≈ 1µS
RGK = 1K
12
10
10K
8
6
56K
4
1000
100
10
1
0
.01
2
10
20
30
40
50
60
70
80
90
100
.001
0.5
1.0
2.0
3.0
IF - INPUT CURRENT (MILLIAMPERES)
VAK - FORWARD VOLTAGE (VOLTS)
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Figure 7. Holding Current vs. Temperature
IM - HOLDING CURRENT (MICROAMPERES)
IFT - NORMALIZED INPUT CURRENT TO TRIGGER
10,000
5,000
RGK = 300Ω
1000
1K
500
10K
100
27K
50
56K
VAK = 50V
10
-40
-20
0
20
40
60
80
TRANSIENT THERMAL IMPEDANCE (˚C PER WATT)
4N39
4N40
Figure 8. Maximum Transient Thermal Impedance
1000
NOTE: (1) LEAD TEMPERATURE MEASURED AT THE WIDEST PORTION
OF THE SCR ANODE LEAD
(2) AMBIENT TEMPERATURE MEASURED AT A POINT
1/2" FROM THE DEVICE
600
400
200
JUNCTION TO AMBIENT
100
60
40
20
JUNCTION TO LEAD
10
6
4
2
1
.0001
.0004 .001 .002 .004 .01
.0002
100
.02 .04
1
2
4
10
20
40
100
TIME (SECONDS)
TA - AMBIENT TEMPERATURE (˚C)
Figure 9. Off-State Forward Current vs. Temperature
Figure 10. On-State Current vs. Maximum Allowable Temperature
100
10,000
MAXIMUM ALLOWABLE TEMPERATURE (˚C)
ID - NORMALIZED FORWARD CURRENT (OFF STATE)
5000
NORMALIZED TO
VAK +50V
TA +25˚C
1000
500
100
50
400V
10
50V
90
80
70
60
50
ANODE LEAD TEMP
DC CURRENT
40
30
AMBIENT TEMP
HALF-SINE
WAVE AVGERAGE
20
10
AMBIENT TEMP
DC CURRENT
5
0.2
ANODE LEAD TEMP
1/2 SINE WAVE AVERAGE
0.4
0.6
08
10
ON-STATE CURRENT (AMPERES)
1
0
25
50
75
100
TA - AMBIENT TEMPERATURE (˚C)
Figure 12. On-State Characteristics
2
1000
1
.8
.6
500
IT - ON-STATE CURRENT (AMPERES)
dV/dI - CRITICAL RATE OF RISE APPLIED FORWARD VOLTAGE ( Volt/µ sec)
Figure 11. dv/dt vs. Temperature
100
RGK = 300Ω
50
1K
10
5
.4
.2
.01
.08
.06
JUNCTION TEMPERATURE = 25˚C
.04
JUNCTION TEMPERATURE = 100˚C
.-2
.01
1.0
10K
.5
INCREASES TO FORWARD
BREAKOVER VOLTAGE
27K
0
10
20
30
40
56K
VT - ON-STATE VOLTAGE (VOLTS)
25
50
75
100
TA - AMBIENT TEMPERATURE (˚C)
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4N39
4N40
+100 V AC
Vp = 800 Volts
tp = .010 Seconds
f = 25 Hertz
TA = 25 °C
100 Ω
DUT
+
H
Vp
Vp
.63 Vp
10 KΩ
dV / dt
tp
EXPONENTIAL
RAMP GEN.
OSCILLOSCOPE
Fig. 13 Coupled dv/dt - Test Circuit
TYPICAL APPLICATIONS
10A, T2L COMPATIBLE, SOLID
STATE RELAY
Use of the 4N40 for high sensitivity, 5300 V isolation capability,
provides this highly reliable solid
state relay design. This design is
compatible with 74, 74S and 74H
series T2L logic systems inputs
and 220V AC loads up to 10A.
LOAD
47 Ω
470 Ω
100 Ω
+5V
"CONTACT"
220 V AC
4N40
"COIL"
SC1460
0.1 µF
56K
47 Ω
IN5060 (4)
INDICATER
LAMP
25W, LOGIC INDICATOR LAMP DRIVER
The high surge capability and non-reactive input
characteristics of the 4N40 allow it to directly couple,
without buffers, T2L and DTL logic to indicator alarm
devices, without danger of introducing noise and
logic glitches.
470 Ω
+5V
4N40
100 Ω
LOGIC
INPUT
220 V AC
56K
0.1 µF
400V SYMMETRICAL TRANSISTOR COUPLER
Use of the high voltage PNP portion of the 4N40 provides a 400V transistor
capable of conducting positive and negative signals with current transfer
ratios of over 1%. This function is useful in remote instrumentation, high voltage power supplies and test equipment. Care should be taken not to exceed
the 40mW power dissipation rating when used at high voltages.
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4N40
INPUT
OUTPUT
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4N39
Package Dimensions (Through Hole)
4N40
Package Dimensions (Surface Mount)
PIN 1
ID.
0.350 (8.89)
0.330 (8.38)
0.270 (6.86)
0.240 (6.10)
3
2
PIN 1
ID.
1
SEATING PLANE
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
5
4
0.070 (1.78)
0.045 (1.14)
6
0.300 (7.62)
TYP
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.200 (5.08)
0.165 (4.18)
0.016 (0.41)
0.008 (0.20)
0.020 (0.51)
MIN
0.154 (3.90)
0.100 (2.54)
0.016 (0.40)
0.008 (0.20)
0.022 (0.56)
0.016 (0.41)
0° to 15°
0.020 (0.51)
MIN
0.022 (0.56)
0.016 (0.41)
0.300 (7.62)
TYP
0.100 (2.54)
TYP
0.016 (0.40) MIN
0.315 (8.00)
MIN
0.405 (10.30)
MAX
0.100 (2.54)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
Package Dimensions (0.4”Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
0.070 (1.78)
0.270 (6.86)
0.240 (6.10)
0.060 (1.52)
SEATING PLANE
0.350 (8.89)
0.330 (8.38)
0.415 (10.54)
0.070 (1.78)
0.045 (1.14)
0.100 (2.54)
0.295 (7.49)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.004 (0.10)
MIN
0.030 (0.76)
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.022 (0.56)
0.016 (0.41)
0.100 (2.54) TYP
0.400 (10.16)
TYP
NOTE
All dimensions are in inches (millimeters)
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4N39
4N40
ORDERING INFORMATION
Order Entry Identifier
Option
Description
S
.S
Surface Mount Lead Bend
SD
.SD
Surface Mount; Tape and reel
W
.W
0.4” Lead Spacing
300
.300
VDE 0884
300W
.300W
VDE 0884, 0.4” Lead Spacing
3S
.3S
VDE 0884, Surface Mount
3SD
.3SD
VDE 0884, Surface Mount, Tape & Reel
Carrier Tape Specifications (“D” Taping Orientation)
12.0 ± 0.1
4.85 ± 0.20
4.0 ± 0.1
0.30 ± 0.05
4.0 ± 0.1
Ø1.55 ± 0.05
1.75 ± 0.10
7.5 ± 0.1
16.0 ± 0.3
13.2 ± 0.2
9.55 ± 0.20
0.1 MAX
10.30 ± 0.20
Ø1.6 ± 0.1
User Direction of Feed
NOTE
All dimensions are millimeters
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4N39
4N40
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Fax: 358.9.341.1292
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Fax: 82.331.205.3352
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Fax: 44.1793.856857
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4N39
4N40
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE
TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT
ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT
DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE
RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical
implant into the body,or (b) support or sustain life,
and (c) whose failure to perform when properly
used in accordance with instructions for use provided
in labeling, can be reasonably expected to result in a
significant injury of the user.
DS300381
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2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
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