STMICROELECTRONICS AM1011-075

AM1011-075
RF & MICROWAVE TRANSISTORS
L-BAND AVIONICS APPLICATIONS
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REFRACTORY/GOLD METALLIZATION
EMITTER SITE BALLASTED
10:1 VSWR CAPABILITY
LOW THERMAL RESISTANCE
INPUT/OUTPUT MATCHING
OVERLAY GEOMETRY
METAL/CERAMIC HERMETIC PACKAGE
POUT = 75 W MIN. WITH 9.2 dB GAIN
.400 x .400 2LFL (S036)
hermetically sealed
ORDER CODE
AM1011-075
DESCRIPTION
BRANDING
1011-75
PIN CONNECTION
The AM1011-075 device is a high power Class
C transistor specifically designed for L-Band
Avionics transponder/interrogator pulsed output
and driver applications.
This device is capable of operation over a wide
range of pulse widths, duty cycles, and temperatures and is capable of withstanding 10:1 output
VSWR at rated RF conditions. Low RF thermal
resistance and computerized automatic wire bonding techniques ensure high reliability and product
consistency.
The AM1011-075 is supplied in the AMPAC Hermetic M etal/Ceramic package with i nternal
Input/Output matching structures.
1. Collector
2. Base
3. Emitter
4. Base
ABSOLUTE MAXIMUM RATINGS (T case = 25 ° C)
Symbol
PDISS
IC
VCC
TJ
T STG
Parameter
Value
Unit
175
W
Device Current*
5.4
A
Collector-Supply Voltage*
55
V
Junction Temperature (Pulsed RF Operation)
250
°C
− 65 to +200
°C
0.86
°C/W
Power Dissipation*
(TC ≤ 100°C)
Storage Temperature
THERMAL DATA
RTH(j-c)
Junction-Case Thermal Resistance*
*Applies only to rated RF amplifier operation
September 1992
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AM1011-075
ELECTRICAL SPECIFICATIONS (T case = 25 ° C)
STATIC
Symbol
Valu e
Test Conditions
Min.
Typ.
Max.
Unit
BVCBO
IC = 10mA
IE = 0mA
65
—
—
V
BVEBO
IE = 4mA
IC = 0mA
3.5
—
—
V
BVCER
IC = 20mA
RBE = 10Ω
65
—
—
V
ICES
VCE = 50V
—
—
6
mA
hFE
VCE = 5V
10
—
—
—
IC = 1mA
DYNAMIC
Symbol
Value
Test Conditions
Min.
Typ.
Max.
POUT
ηc
f = 1090MHz
PIN = 9W Peak
VCC = 50V
75
84
—
W
f = 1090MHz
PIN = 9W Peak
VCC = 50V
48
56
—
%
GP
f = 1090MHz
PIN = 9W Peak
VCC = 50V
9.2
9.7
—
dB
Note:
Pul se Widt h
Duty Cycle
=
=
32 µ Sec
2%
TYPICAL PERFORMANCE
TYPICAL
POWER
OUTPUTOUTPUT
& COLLECTOR
TYPICAL
POWER
&
EFFICIENCY vs
POWER INPUT vs
COLLECTOR
EFFICIENCY
POWER INPUT
80
120
P
O
W
E
R
110
O
U
T
P
U
T
80
W
A
T
T
S
50
75
POUT
100
70
90
65
70
60
ηC
60
55
50
C
O
L
L
E
C
T
O
R
E
F
F
.
40
45
30
40
20
4
5
6
7
8
9
10
11
12
POWER INPUT (WATTS)
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Unit
13
14
15
16
%
AM1011-075
IMPEDANCE DATA
TYPICAL INPUT
IMPEDANCE
Z IN
Z IN
TYPICAL COLLECTOR
LOAD IMPEDANCE
L
H
Z CL
H
L
FREQ.
L = 1030 MHz
H = 1090 MHz
ZIN (Ω)
7.0 + j 3.0
ZCL (Ω)
12.5 − j 4.5
11.0 + j 1.5
13.0 − j 3.0
ZCL
PIN = 9.0 W
VCC = 50 V
Normalized to 50 ohms
TEST CIRCUIT
All dimensions are in inches.
Substrate material: .025 thick AI2O3
C1
C2
C3
: 0.8—8.0 pF Johanson Gigatrim Capacitor
: 100 pF Chip Capacitor
: 1500 pF Filtercon Feedthru
C4
: 1 µF, Ceramic Capacitor
C5
: 100 µF, Electrolytic Capacitor
RFC 1: Au Plated Ni Strap
0.280 Long x 0.035 Wide x 0.005 Thick
RFC 2: #26 Wire, 4 Turn 1/16 I.D.
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AM1011-075
PACKAGE MECHANICAL DATA
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.
 1994 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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