HCC/HCF4095B HCC/HCF4096B GATE J-K MASTER-SLAVE FLIP-FLOPS . .. .. .. 16 MHz TOGGLE RATE (typ.) AT VDD - VSS = 10V GATED INPUTS QUIESCENT CURRENT SPECIFIED TO 20v FOR HCC DEVICE 5V, 10V AND 15V PARAMETRIC RATINGS INPUT CURRENTOF 100 nA AT 18V AND 25oC FOR HCC DEVICE 100% TESTED FOR QUIESCENT CURRENT MEETS ALL REQUIREMENTS OF JEDEC TENTATIVE STANDARD No 13 A, ”STANDARD SPECIFICATIONS FOR DESCRIPTION OF B SERIES CMOS DEVICES” inputs is transferred to the Q and Q outputs on the positive edge of the clock pulse. SET and RESET inputs (active high) are provided for asynchronous operation. EY (Plastic Package) F (Ceramic Package) M1 (Micro Package) C1 (Chip Carrier) DESCRIPTION The HCC4095B/4096B (extended temperature range) and HCF4095B/4096B (intermediate temperature range) are monolithic integrated circuits, available in 14 lead dual in-line plastic or ceramic package and plastic micropackage. The HCC/HCF4095B and HCC/HCF4096B are J-K Master-Slave Flip-Flops featuring separate AND gating of multiple J and K inputs. The gated J-K input control transfer of information into the master section during clocked operation. Information on the J-K ORDER CODES : HCC40XXBF HCF40XXBM1 HCF40XXBEY HCF40XXBC1 PIN CONNECTIONS 4095B September 1988 4096B 1/13 HCC/HCF4095B HCC/HCF4096B FUNCTIONAL DIAGRAMS LOGIC DIAGRAM TRUTH TABLES SYNCHRONOUS OPERATION (S=0 R=0) Inputs Before Positive Clock Transition Outputs After Positive Clock Transition J* 0 K* 0 Q Q 0 1 0 1 1 1 0 1 1 0 No Change * For 4095B J = J1 • J2 •J3, K = K1 •K2 • K3 * For 4095B J = J1 • J2 •J3, K = K1 •K2 • K3 2/13 Toggles ASYNCHRONOUS OPERATION (J and K DON’T CARE) S R 0 0 0 1 0 1 1 1 0 1 1 0 0 0 0 = VSS, 1 = VDD Q Q No Change HCC/HCF4095B HCC/HCF4096B ABSOLUTE MAXIMUM RATING Symbol VDD * Parameter Value Unit -0.5 to +20 -0.5 to +18 -0.5 to VDD + 0.5 V V V Vi Supply Voltage: HCC Types HCF Types Input Voltage II DC Input Current (any one input) ± 10 mA Ptot Total Power Dissipation (per package) Dissipation per Output Transistor for Top = Full Package Temperature Range 200 mW 100 mW Top Operating Temperature: HCC Types HCF Types -55 to +125 -40 to +85 o Tstg Storage Temperature -65 to +150 o o C C C Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress ratingonly and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltage values are referred to VSS pin voltage. RECOMMENDED OPERATING CONDITIONS Symbol VDD VI Top Parameter Supply Voltage: HCC Types HCF Types Input Voltage Operating Temperature: HCC Types HCF Types Value 3 to 18 3 to 15 0 to VDD -55 to +125 -40 to +85 Unit V V V o o C C 3/13 HCC/HCF4095B HCC/HCF4096B STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions) Symbol IL V OH VOL VIH V IL IOH Parameter Quiescent Current 0/5 0/10 0/15 0/20 0/5 HCF 0/10 Types 0/15 Output High 0/5 Voltage 0/10 0/15 Output Low 5/0 Voltage 10/0 15/0 Input High Voltage Input Low Voltage Output Drive Current Output Sink Current HCC Types HCC Types HCF Types IIH, IIL CI Test Conditios VO |IO| VDD (V) (µA) (V) HCC Types HCF Types IOL VI (V) Input Leakage Current Input Capacitance 0/5 0/5 0/10 0/15 0/5 0/5 0/10 0/15 0/5 0/10 0/15 0/5 0/10 0/15 0/18 0/15 4.5 9 13.5 0.5 1 1.5 2.5 4.6 9.5 13.5 2.5 4.6 9.5 13.5 0.4 0.5 1.5 0.4 0.5 1.5 < < < < < < < < < < < < Any Input Any Input 1 1 1 1 1 1 1 1 1 1 1 1 5 10 15 20 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 5 10 15 5 5 10 15 5 10 15 5 10 15 18 15 TLOW * Min. Max. 1 2 4 20 4 8 16 4.95 9.95 14.95 0.05 0.05 0.05 3.5 7 11 1.5 3 4 -2 -0.64 -1.6 -4.2 -1.53 -0.52 -1.3 -3.6 0.64 1.6 4.2 0.52 1.3 3.6 ±0.1 ±0.3 Value 25 oC Min. Typ. Max. 0.02 1 0.02 2 0.02 4 0.04 20 0.02 4 0.02 8 0.02 16 4.95 9.95 14.95 0.05 0.05 0.05 3.5 7 11 1.5 3 4 -1.6 -3.2 -0.51 -1 -1.3 -2.6 -3.4 -6.8 -1.36 -3.2 -0.44 -1 -1.1 -2.6 -3.0 -6.8 0.51 1 1.3 2.6 3.4 6.8 0.44 1 1.1 2.6 3.0 6.8 ±10-5 ±0.1 ±10-5 ±0.3 5 7.5 THIGH * Min. Max. 30 60 120 600 30 60 120 4.95 9.95 14.95 0.05 0.05 0.05 3.5 7 11 1.5 3 4 -1.15 -0.36 -0.9 -2.4 -1.1 -0.36 -0.9 -2.4 0.36 0.9 2.4 0.36 0.9 2.4 ±1 ±1 * TLOW = -55 oC for HCC device: -40 oC for HCF device. * THIGH = +125 oC for HCC device: +85 oC for HCF device. The Noise Margin for both ”1” and ”0” level is: 1V min. with VDD = 5 V, 2 V min. with VDD = 10 V, 2.5 V min. with VDD = 15 V 4/13 Unit µA V V V V mA mA µA pF HCC/HCF4095B HCC/HCF4096B DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb = 25 o C, C L = 50 pF, RL = 200 KΩ, o typical temperature coefficent for all VDD values is 03 %/ C, all input rise and fall times= 20 ns) Symbol Parameter tPLH tPHL Propagation Delay Time tPLH tPHL Propagation Delay Time (Set or Reset) tTHL tTLH Transition Time fCL Maximum Clock Input Frequency tW tr tf tW tsetup Clock Pulse Width Clock Input Rise or Fall Time Set or Reset Pulse Width Data Setup Time Typical Output Low (sink) Current Characteristics Test Conditions VDD (V) 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 Min. 3.5 8 12 140 60 40 Value Typ. 250 100 75 150 75 50 100 50 40 7 16 24 70 30 20 Max. 500 200 150 300 150 100 200 100 80 100 50 25 200 80 50 ns ns ns MHz ns 15 5 5 200 100 50 400 160 100 Unit µs ns ns Minimum Output low (sink) Current Characteristics 5/13 HCC/HCF4095B HCC/HCF4096B Typical Output High (source) Current Characteristics Minimum Output High (source) Current Characteristics Typical Propagation Delay Time vs Load Capacitance Typical Transition Time vs Load Capacitance Typical Clock Frequency vs Supply Voltage (Toggle Mode) Typical Power Power Dissipation Vs. Input Clock Frequency 6/13 HCC/HCF4095B HCC/HCF4096B TYPICAL APPLICATIONS T-type Flip-Flop D-type Flip-Flop Synchronous Binary Divide by Ten Counter STATE QA QB QC QD 0 0 0 0 0 1 2 1 0 0 1 0 0 0 0 3 1 1 0 0 4 0 0 1 0 5 1 0 1 0 6 7 0 1 1 1 1 1 0 0 8 0 0 0 1 9 1 0 0 1 NOTE: In all 4095B units the Set and Reset are Connected to VSS 7/13 HCC/HCF4095B HCC/HCF4096B WAVEFORMS Propagation Delay, Transition and Setup Time Clock Pulse Rise and Fall Time TEST CIRCUITS Quiescent Device Current. Input Leakage Current. 8/13 Noise Immunity. HCC/HCF4095B HCC/HCF4096B Plastic DIP14 MECHANICAL DATA mm DIM. MIN. a1 0.51 B 1.39 TYP. inch MAX. MIN. TYP. MAX. 0.020 1.65 0.055 0.065 b 0.5 0.020 b1 0.25 0.010 D 20 0.787 E 8.5 0.335 e 2.54 0.100 e3 15.24 0.600 F 7.1 0.280 I 5.1 0.201 L Z 3.3 1.27 0.130 2.54 0.050 0.100 P001A 9/13 HCC/HCF4095B HCC/HCF4096B Ceramic DIP14/1 MECHANICAL DATA mm DIM. MIN. TYP. inch MAX. MIN. TYP. MAX. A 20 0.787 B 7.0 0.276 D E 3.3 0.130 0.38 e3 0.015 15.24 0.600 F 2.29 2.79 0.090 0.110 G 0.4 0.55 0.016 0.022 H 1.17 1.52 0.046 0.060 L 0.22 0.31 0.009 0.012 M 1.52 2.54 0.060 0.100 N P Q 10.3 7.8 8.05 5.08 0.406 0.307 0.317 0.200 P053C 10/13 HCC/HCF4095B HCC/HCF4096B SO14 MECHANICAL DATA mm DIM. MIN. TYP. A a1 inch MAX. MIN. TYP. 1.75 0.1 0.068 0.2 a2 MAX. 0.003 0.007 1.65 0.064 b 0.35 0.46 0.013 0.018 b1 0.19 0.25 0.007 0.010 C 0.5 0.019 c1 45° (typ.) D 8.55 E 5.8 8.75 0.336 6.2 0.228 0.344 0.244 e 1.27 0.050 e3 7.62 0.300 F 3.8 4.0 0.149 0.157 G 4.6 5.3 0.181 0.208 L 0.5 1.27 0.019 0.050 M S 0.68 0.026 8° (max.) P013G 11/13 HCC/HCF4095B HCC/HCF4096B PLCC20 MECHANICAL DATA mm DIM. MIN. TYP. inch MAX. MIN. TYP. MAX. A 9.78 10.03 0.385 0.395 B 8.89 9.04 0.350 0.356 D 4.2 4.57 0.165 0.180 d1 2.54 0.100 d2 0.56 0.022 E 7.37 8.38 0.290 0.330 e 1.27 0.050 e3 5.08 0.200 F 0.38 0.015 G 0.101 0.004 M 1.27 0.050 M1 1.14 0.045 P027A 12/13 HCC/HCF4095B HCC/HCF4096B Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics. 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 13/13