M27C320 32 Mbit (4Mb x8 or 2Mb x16) OTP EPROM PRELIMINARY DATA ■ 5V ± 10% SUPPLY VOLTAGE in READ OPERATION ■ FAST ACCESS TIME: 80ns ■ BYTE-WIDE or WORD-WIDE CONFIGURABLE ■ 32 Mbit MASK ROM REPLACEMENT ■ LOW POWER CONSUMPTION – Active Current 70mA at 8MHz – Stand-by Current 100mA ■ 44 1 SO44 (M) TSOP48 (N) 12 x 20 mm PROGRAMMING VOLTAGE: 12V ± 0.25V ■ PROGRAMMING TIME: 100µs/byte (typical)(PRESTO III Algorithm) ■ ELECTRONIC SIGNATURE: – Manufacturer Code 0020h Figure 1. Logic Diagram – Device Code: 0032h DESCRIPTION The M27C320 is a 32 Mbit EPROM offered in the OTP range (one time programmable). It is ideally suited for microprocessor systems requiring large data or program storage. It is organised as either 4 MWords of 8 bit or 2 MWords of 16 bit. The pinout is compatible with the 32 Mbit Mask ROM. The M27C320 is offered in TSOP48 (12 x 20mm) and SO44 packages. VCC 21 Q15A–1 A0-A20 15 Q0-Q14 E M27C320 Table 1. Signal Names A0-A20 Address Inputs Q0-Q7 Data Outputs Q8-Q14 Data Outputs Q15A–1 Data Output / Address Input E Chip Enable GVPP Output Enable / Program Supply BYTE Byte-Wide Select VCC Supply Voltage VSS Ground GVPP BYTE VSS AI02152 September 1998 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. 1/15 M27C320 Figure 2A. SO Pin Connections NC A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 E VSS GVPP Q0 Q8 Q1 Q9 Q2 Q10 Q3 Q11 1 44 2 43 3 42 4 41 5 40 6 39 7 38 8 37 9 36 10 35 11 34 M27C320 12 33 13 32 14 31 15 30 16 29 17 28 18 27 19 26 20 25 21 24 22 23 Figure 2B. TSOP Pin Connections A20 A19 A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE VSS Q15A–1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC AI02153 BYTE A16 A15 A14 A13 A12 A11 A10 A9 A8 A19 VSS A20 A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 E 1 12 13 48 37 36 M27C320 24 25 VSS VSS Q15A–1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC VCC VSS Q11 Q3 Q10 Q2 Q9 Q1 Q8 Q0 GVPP VSS VSS AI02154 Warning : NC = Not Connected. Table 2. Absolute Maximum Ratings (1) Symbol Value Unit Ambient Operating Temperature (3) –40 to 125 °C TBIAS Temperature Under Bias –50 to 125 °C TSTG Storage Temperature –65 to 150 °C VIO (2) Input or Output Voltage (except A9) –2 to 7 V Supply Voltage –2 to 7 V –2 to 13.5 V –2 to 14 V TA VCC VA9 (2) VPP Parameter A9 Voltage Program Supply Voltage Note: 1. Except for the rating ”Operating Temperature Range”, stresses above those listed in the Table ”Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. 2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than 20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than 20ns. 3. Depends on range. 2/15 M27C320 Table 3. Operating Modes Mode E GVPP BYTE A9 Q0-Q7 Q8-Q14 Q15A–1 Read Word-wide VIL VIL VIH X Data Out Data Out Data Out Read Byte-wide Upper VIL VIL V IL X Data Out Hi-Z V IH Read Byte-wide Lower VIL VIL V IL X Data Out Hi-Z VIL Output Disable VIL VIH X X Hi-Z Hi-Z Hi-Z VIL Pulse VPP VIH X Data In Data In Data In Program Inhibit VIH VPP VIH X Hi-Z Hi-Z Hi-Z Standby VIH X X X Hi-Z Hi-Z Hi-Z Electronic Signature VIL VIL VIH VID Codes Codes Code Program Note: X = VIH or VIL, VID = 12V ± 0.5V. Table 4. Electronic Signature Identifier A0 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Hex Data Manufacturer’s Code VIL 0 0 1 0 0 0 0 0 20h Device Code VIH 0 0 1 1 0 0 1 0 32h Note: Outputs Q8-Q15 are set to ’0’. DEVICE OPERATION The operating modes of the M27C320 are listed in the Operating Modes Table. A single power supply is required in the read mode. All inputs are TTL compatible except for VPP and 12V on A9 for the Electronic Signature. Read Mode The M27C320 has two organisations, Word-wide and Byte-wide. The organisation is selected by the signal level on the BYTE pin. When BYTE is at VIH the Word-wide organisation is selected and the Q15A–1 pin is used for Q15 Data Output. When the BYTE pin is at VIL the Byte-wide organisation is selected and the Q15A–1 pin is used for the Address Input A–1. When the memory is logically regarded as 16 bit wide, but read in the Byte-wide organisation, then with A–1 at VIL the lower 8 bits of the 16 bit data are selected and with A–1 at VIH the upper 8 bits of the 16 bit data are selected. The M27C320 has two control functions, both of which must be logically active in order to obtain data at the outputs. In addition the Word-wide or Byte-wide organisation must be selected. Chip Enable (E) is the power control and should be used for device selection. Output Enable (G) is the output control and should be used to gate data to the output pins independent of device selection. Assuming that the addresses are stable, the address access time (tAVQV) is equal to the delay from E to output (tELQV). Data is available at the output after a delay of tGLQV from the falling edge of G, assuming that E has been low and the addresses have been stable for at least tAVQV-tGLQV. Standby Mode The M27C320 has standby mode which reduces the supply current from 50mA to 100µA. The M27C320 is placed in the standby mode by applying a CMOS high signal to the E input. When in the standby mode, the outputs are in a high impedance state, independent of the G input. 3/15 M27C320 Table 5. AC Measurement Conditions High Speed Standard Input Rise and Fall Times ≤ 10ns ≤ 20ns Input Pulse Voltages 0 to 3V 0.4V to 2.4V 1.5V 0.8V and 2V Input and Output Timing Ref. Voltages Figure 3. Testing Input Output Waveform Figure 4. AC Testing Load Circuit 1.3V High Speed 1N914 3V 1.5V 3.3kΩ 0V DEVICE UNDER TEST Standard 2.4V OUT CL 2.0V 0.8V 0.4V CL = 30pF for High Speed CL = 100pF for Standard AI01822 CL includes JIG capacitance AI01823B Table 6. Capacitance (1) (TA = 25 °C, f = 1 MHz) Symbol C IN COUT Parameter Input Capacitance Output Capacitance Test Condition Min Max Unit V IN = 0V 10 pF VOUT = 0V 12 pF Note: 1. Sampled only, not 100% tested. Two Line Output Control Because EPROMs are usually used in larger memory arrays, this product features a 2 line control function which accommodates the use of multiple memory connection. The two line control function allows: a. the lowest possible memory power dissipation, b. complete assurance that output bus contention will not occur. 4/15 For the most efficient use of these two control lines, E should be decoded and used as the primary device selecting function, while G should be made a common connection to all devices in the array and connected to the READ line from the system control bus. This ensures that all deselected memory devices are in their low power standby mode and that the output pins are only active when data is required from a particular memory device. M27C320 Table 7. Read Mode DC Characteristics (1) (TA = 0 to 70 °C; VCC = 5V ± 10%) Symbol Parameter ILI Input Leakage Current ILO Output Leakage Current ICC Test Condition Min Max Unit 0V ≤ V IN ≤ VCC ±1 µA 0V ≤ VOUT ≤ V CC ±10 µA E = VIL , G = VIL, IOUT = 0mA, f = 8MHz 70 mA E = VIL , G = VIL, IOUT = 0mA, f = 5MHz 50 mA E = VIH 1 mA E > VCC – 0.2V 100 µA V PP = VCC 10 µA Supply Current ICC1 Supply Current (Standby) TTL ICC2 Supply Current (Standby) CMOS IPP Program Current VIL Input Low Voltage –0.3 0.8 V VIH (2) Input High Voltage 2 VCC + 1 V VOL Output Low Voltage 0.4 V VOH Output High Voltage TTL IOL = 2.1mA IOH = –400µA 2.4 V Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after V PP. 2. Maximum DC voltage on Output is VCC +0.5V. System Considerations The power switching characteristics of Advanced CMOS EPROMs require carefull decoupliing of the supplies to the devices. The supply current ICC has three segments of importance to the system designer: the standby current, the active current and the transient peaks that are produced by the falling and rising edges of E. The magnitude of the transient current peaks is dependant on the capacititive and inductive loading of the device outputs. The associated transient voltage peaks can be supressed by complying with the two line output control and by properly selected decoupling capacitors. It is recommended that a 0.1µF ceramic capacitor is used on every device between VCC and VSS. This should be a high frequency type of low inherent inductance and should be placed as close as possible to the device. In addition, a 4.7µF electrolytic capacitor should be used between VCC and VSS for every eight devices. This capacitor should be mounted near the power supply connection point. The purpose of this capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces. Programming When delivered, all bits of the M27C320 are in the ’1’ state. Data is introduced by selectively programming ’0’s into the desired bit locations. Although only ’0’s will be programmed, both ’1’s and ’0’s can be present in the data word. The M27C320 is in the programming mode when VPP input is at 12.5V, G is at VIH and E is pulsed to VIL. The data to be programmed is applied to 16 bits in parallel to the data output pins. The levels required for the address and data inputs are TTL. VCC is specified to be 6.25V ± 0.25V. 5/15 M27C320 Table 8. Read Mode AC Characteristics (1) (TA = 0 to 70 °C; VCC = 5V ± 10%) M27C320 Symbol Alt Parameter Test Condit ion -80 Min -100 Max Min Unit -120 Max Min Max Address Valid to Output Valid E = VIL, G = VIL 80 100 120 ns tST BYTE High to Output Valid E = VIL, G = VIL 80 100 120 ns tELQV tCE Chip Enable Low to Output Valid G = VIL 80 100 120 ns tGLQV tOE Output Enable Low to Output Valid E = VIL 40 50 60 ns tBLQZ (2) tSTD BYTE Low to Output Hi-Z E = VIL, G = VIL 40 40 50 ns tEHQZ (2) tDF Chip Enable High to Output Hi-Z G = VIL 0 40 0 40 0 50 ns tGHQZ (2) tDF Output Enable High to Output Hi-Z E = VIL 0 40 0 40 0 50 ns tAXQX tOH Address Transition to Output Transition E = VIL, G = VIL 5 5 5 ns tBLQX tOH BYTE Low to Output Transition E = VIL, G = VIL 5 5 5 ns tAVQV tACC tBHQV Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after V PP 2. Sampled only, not 100% tested. Figure 5. Word-Wide Read Mode AC Waveforms A0-A20 VALID tAVQV VALID tAXQX E tGLQV tEHQZ GVPP tELQV Q0-Q15 tGHQZ Hi-Z AI02207 Note: BYTE = VIH. 6/15 M27C320 Figure 6. Byte-Wide Read Mode AC Waveforms VALID A0-A20 VALID tAVQV tAXQX E tEHQZ tGLQV GVPP tGHQZ tELQV Hi-Z Q0-Q7 AI02218 Note: BYTE = VIH. Figure 7. BYTE Transition AC Waveforms VALID A0-A20 A–1 VALID tAVQV tAXQX BYTE tBHQV Q0-Q7 DATA OUT tBLQX Hi-Z Q8-Q15 DATA OUT tBLQZ AI02219 Note: Chip Enable (E) and Output Enable (G) = VIL. 7/15 M27C320 Table 9. Programming Mode DC Characteristics (1) (TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12V ± 0.25V) Symbol Parameter Test Conditio n Min VIL ≤ VIN ≤ VIH Max Unit ±10 µA 50 mA 50 mA ILI Input Leakage Current ICC Supply Current IPP Program Current V IL Input Low Voltage –0.3 0.8 V VIH Input High Voltage 2.4 VCC + 0.5 V VOL Output Low Voltage 0.4 V VOH Output High Voltage TTL VID A9 Voltage E = VIL IOL = 2.1mA IOH = –2.5mA 3.5 V 11.5 12.5 V Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after V PP. Table 10. MARGIN MODE AC Characteristics (1) (TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12V ± 0.25V) Symbol Alt Parameter Test Condition Min tA9HVPH t AS9 VA9 High to VPP High 2 µs tVPHEL tVPS VPP High to Chip Enable Low 2 µs tA10HEH tAS10 VA10 High to Chip Enable High (Set) 1 µs tA10LEH tAS10 VA10 Low to Chip Enable High (Reset) 1 µs tEXA10X tAH10 Chip Enable Transition to VA10 Transition 1 µs t EXVPX tVPH Chip Enable Transition to VPP Transition 2 µs tVPXA9X tAH9 VPP Transition to VA9 Transition 2 µs Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after V PP. 8/15 Max Unit M27C320 Table 11. Programming Mode AC Characteristics (1) (TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12V ± 0.25V) Symbol Alt Parameter Test Condition Min Max tAVEL tAS Address Valid to Chip Enable Low 1 µs tQVEL tDS Input Valid to Chip Enable Low 1 µs tVCHEL tVCS V CC High to Chip Enable Low 2 µs tVPHEL tOES V PP High to Chip Enable Low 1 µs tVPLVPH tPRT V PP Rise Time 50 ns tELEH tPW Chip Enable Program Pulse Width (Initial) 45 tEHQX tDH Chip Enable High to Input Transition 2 µs tEHVPX tOEH Chip Enable High to VPP Transition 2 µs tVPLEL tVR V PP Low to Chip Enable Low 1 µs tELQV tDV Chip Enable Low to Output Valid tEHQZ (2) tDFP Chip Enable High to Output Hi-Z 0 tEHAX tAH Chip Enable High to Address Transition 0 55 Unit µs 1 µs 130 ns ns Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after V PP. 2. Sampled only, not 100% tested. Figure 8. MARGIN MODE AC Waveforms VCC A8 A9 tA9HVPH tVPXA9X GVPP tVPHEL tEXVPX E tA10HEH tEXA10X A10 Set A10 Reset tA10LEH AI00736B Note: A8 High level = 5V; A9 High level = 12V. 9/15 M27C320 Figure 9. Programming and Verify Modes AC Waveforms VALID A0-A20 tAVEL Q0-Q15 tEHAX DATA IN DATA OUT tQVEL tEHQX tEHQZ VCC tVCHEL tEHVPX tELQV GVPP tVPHEL tVPLEL E tELEH PROGRAM VERIFY AI02205 Note: BYTE = VIH. Figure 10. Programming Flowchart VCC = 6.25V, VPP = 12V SET MARGIN MODE n=0 E = 50µs Pulse NO ++n = 25 YES FAIL NO VERIFY ++ Addr YES Last Addr NO YES CHECK ALL WORDS BYTE = VIH 1st: VCC = 6V 2nd: VCC = 4.2V AI02220 10/15 PRESTO III Programming Algorithm The PRESTO III Programming Algorithm allows the whole array to be programed with a guaranteed margin in a typical time of 100 seconds. Programming with PRESTO III consists of applying a sequence of 50µs program pulses to each word until a correct verify occurs (see Figure 10). During programing and verify operation a MARGIN MODE circuit is automatically activated to guarantee that each cell is programed with enough margin. No overprogram pulse is applied since the verify in MARGIN MODE provides the neccessary margin to each programmed cell. Program Inhibit Programming of multiple M27C320s in parallel with different data is also easily accomplished. Except for E, all like inputs including G of the parallel M27C320 may be common. A TTL low level pulse applied to a M27C320’s E input and VPP at 12V, will program that M27C320. A high level E input inhibits the other M27C320s from being programmed. Program Verify A verify (read) should be performed on the programmed bits to determine that they were correctly programmed. The verify is accomplished with G at V IL. Data should be verified with tELQV after the falling edge of E. M27C320 On-Board Programming The M27C320 can be directly programmed in the application circuit. See the relevant Application Note AN620. Electronic Signature The Electronic Signature (ES) mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and type. This mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C ambient temperature range that is required when pro- gramming the M27C320. To activate the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of the M27C320, with VPP=VCC=5V. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during Electronic Signature mode. Byte 0 (A0=VIL) represents the manufacturer code and byte 1 (A0=VIH) the device identifier code. For the STMicroelectronics M27C320, these two identifier bytes are given in Table 4 and can be readout on outputs Q0 to Q7. 11/15 M27C320 Table 12. Ordering Information Scheme Example: M27C320 -80 M 1 Device Type Operating Voltage C = 4.5V to 5.5V Speed -80 = 80 ns -100 = 100 ns -120 = 120 ns Package M = SO44 N = TSOP48: 12 x 20mm Temperature Range 1 = –0 to 70 °C For a list of available options (Speed, Package, etc...) or for further information on any aspect of this device, please contact the ST Sales Office nearest to you. 12/15 M27C320 Table 13. SO44 - 44 lead Plastic Small Outline, 525 mils body width, Package Mechanical Data mm Symb Typ inches Min Max A 2.42 A1 A2 Min Max 2.62 0.095 0.103 0.22 0.23 0.009 0.010 2.25 2.35 0.089 0.093 B Typ 0.50 0.020 C 0.10 0.25 0.004 0.010 D 28.10 28.30 1.106 1.114 E 13.20 13.40 0.520 0.528 – – – – 15.90 16.10 0.626 0.634 e 1.27 H 0.050 L 0.80 – – 0.031 – – α 3° – – 3° – – N 44 CP 44 0.10 0.004 Figure 11. SO44 - 44 lead Plastic Small Outline, 525 mils body width, Package Outline A2 A C B CP e D N E H 1 A1 α L SO-b Drawing is not to scale. 13/15 M27C320 Table 14. TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Mechanical Data mm Symb Typ inches Min Max A Typ Min 1.20 0.047 A1 0.05 0.15 0.002 0.006 A2 0.95 1.05 0.037 0.041 B 0.17 0.27 0.007 0.011 C 0.10 0.21 0.004 0.008 D 19.80 20.20 0.780 0.795 D1 18.30 18.50 0.720 0.728 E 11.90 12.10 0.469 0.476 - - - - L 0.50 0.70 0.020 0.028 α 0° 5° 0° 5° N 48 e 0.50 0.020 48 CP 0.10 0.004 Figure 12. TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, ackage Outline A2 1 N e E B N/2 D1 A CP D DIE C TSOP-a Drawing is not to scale. 14/15 Max A1 α L M27C320 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in lif e support devices or systems without express written approval of STMicroelectronics. The ST logo is registered trademark of STMicroelectronics 1998 STMicroelectronics - All Rights Reserved All other names are the property of their respective owners. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. http://w ww.st.com 15/15