Thermal Data POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue (silver filled) 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Charts enclosed : 1) Rth(j-a) vs on board heat sink 2) Zth(j-a) vs time width November 2000 1/2 Thermal Data POWER DIP 20+2+2 Rth(j-c) (ºC/W) 60 Test board with two " on board " square heat sink versus side l die pad = 152x160 sq.mils die size = 120x130 sq.mils Pd = 2 Watt 55 1) l 50 on board copper area thickness : 45 35 µm 40 70 µm 35 105 µm 30 25 0 1 2 3 side l ( cm ) on PCB heat sink 4 5 Transient Thermal Resistance (ºC/W) A 50 B SINGLE PULSE C Pd = 2 Watt, mounted on board die size = 120x130 sq.mils dissipating area = 2.000 sq.mils 2) 10 A = 35 µm thick, no heat sink B = 35 µm thick 4x4 sq.cm on board Cu area C = 105 µm thick 4x4 sq.cm on board Cu area 1 0.001 2/2 0.01 0.1 1 10 Time or pulse width ( s ) 100 1,000