RHR1K160
Data Sheet
January 2000
File Number
4789
1A, 600V Hyperfast Diode
Features
The RHR1K160 is a hyperfast diode with soft recovery
characteristics (t rr < 25ns). It has half the recovery time of
ultrafast diodes and is silicon nitride passivated ionimplanted epitaxial planar construction.
• Hyperfast with Soft Recovery . . . . . . . . . . . . . . . . . . <25ns
This device is intended for use as freewheeling/clamping
diodes and rectifiers in a variety of switching power supplies
and other power switching applications. Its low stored charge
and hyperfast soft recovery minimize ringing and electrical
noise in many power switching circuits reducing power loss
in the switching transistors.
• Thermal Impedance SPICE Model
Formerly developmental type TA49185.
• Operating Temperature. . . . . . . . . . . . . . . . . . . . . . .150oC
• Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . .600V
• Thermal Impedance SABER™ Model
• Avalanche Energy Rated
• Planar Construction
• Related Literature
- TB334, “Guidelines for Soldering Surface Mount
Components to PC Boards”
Ordering Information
PART NUMBER
RHR1K160
PACKAGE
MS-012AA
BRAND
RHR1K160
Applications
• Switching Power Supplies
NOTE: When ordering, use the entire part number. For ordering in tape
and reel, add the suffix 96 to the part number, i.e. RHR1K16096.
• Power Switching Circuits
Symbol
Packaging
• General Purpose
JEDEC MS-012AA
NC (1)
CATHODE (8)
ANODE (2)
CATHODE (7)
ANODE (3)
CATHODE (6)
NC (4)
CATHODE (5)
Absolute Maximum Ratings
BRANDING DASH
5
1
2
3
4
TA = 25oC, Unless Otherwise Specified
Peak Repetitive Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VRRM
Working Peak Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VRWM
DC Blocking Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VR
Average Rectified Forward Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IF(AV)
TA = 65oC
Repetitive Peak Surge Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IFRM
Square Wave, 20kHz
Nonrepetitive Peak Surge Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IFSM
Halfwave, 1 Phase, 60Hz
Maximum Power Dissipation (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Avalanche Energy (See Figures 11 and 12) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .EAVL
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TSTG,TJ
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, See Tech brief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg
RHR1K160
600
600
600
1
UNITS
V
V
V
A
2
A
10
A
2.5
5
-55 to 150
W
mJ
oC
300
260
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
3-1
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 2000
SABER™ is a Copyright of Analogy, Inc.
RHR1K160
Electrical Specifications
TA = 25oC, Unless Otherwise Specified
SYMBOL
MIN
TYP
MAX
UNITS
IF = 1A
-
-
2.1
V
IF = 1A, TA = 150oC
-
-
1.7
V
VR = 600V
-
-
100
µA
VR = 600V, TA = 150oC
-
-
500
µA
trr
IF = 1A, dIF/dt = 200A/µs
-
-
25
ns
ta
IF = 1A, dIF/dt = 200A/µs
-
10.5
-
ns
tb
IF = 1A, dIF/dt = 200A/µs
-
5
-
ns
QRR
IF = 1A, dIF/dt = 200A/µs
-
20
-
nC
VR = 10V, IF = 0A
-
10
-
pF
VF
IR
CJ
RθJA
TEST CONDITION
Pad Area = 0.769 in2 (Note 1)
-
-
50
oC/W
Pad Area = 0.054 in2 (Note 2) (Figure 13)
-
-
177
oC/W
Pad Area = 0.0115 in2 (Note 2) (Figure 13)
-
-
217
oC/W
DEFINITIONS
VF = Instantaneous forward voltage (pw = 300µs, D = 2%).
IR = Instantaneous reverse current.
trr = Reverse recovery time (See Figure 10), summation of ta + tb .
ta = Time to reach peak reverse current (See Figure 10).
tb = Time from peak IRM to projected zero crossing of IRM based on a straight line from peak IRM through 25% of IRM (See Figure 10).
Qrr = Reverse recovery charge.
CJ = Junction Capacitance.
RθJA = Thermal resistance junction to ambient.
pw = Pulse width.
D = Duty cycle.
NOTES:
1. Measured using FR-4 copper board at 3.2 seconds.
2. Measured using FR-4 copper board at 1000 seconds.
3-2
RHR1K160
Typical Performance Curves
10
IR, REVERSE CURRENT (µA)
IF, FORWARD CURRENT (A)
10
100oC
25oC
150oC
1
0.1
150oC
1
100oC
0.1
0.01
25oC
0.001
0
0.5
1
1.5
2
2.5
3
3.5
4
0
100
200
300
500
400
600
VR , REVERSE VOLTAGE (V)
VF, FORWARD VOLTAGE (V)
FIGURE 1. FORWARD CURRENT vs FORWARD VOLTAGE
FIGURE 2. REVERSE CURRENT vs REVERSE VOLTAGE
20
35
oC,
oC,dIdI/dt
TA
TA= =2525
200A/ s
F F/dt= =200A/µs
TA = 100oC, dIF/dt = 200A/µs
t, RECOVERY TIMES (ns)
t, RECOVERY TIMES (ns)
30
16
tr
12
ta
8
tb
4
trr
25
20
tb
15
ta
10
5
0
0.1
0.5
0
0.1
1
IF, FORWARD CURRENT (A)
IF, FORWARD CURRENT (A)
t, RECOVERY TIMES (ns)
TA = 150oC, dIF/dt = 200A/µs
40
trr
30
tb
20
ta
10
0
0.1
0.5
1
IF, FORWARD CURRENT (A)
FIGURE 5. trr, ta AND tb CURVES vs FORWARD CURRENT
3-3
FIGURE 4. trr, ta AND tb CURVES vs FORWARD CURRENT
IF(AV), AVERAGE FORWARD CURRENT (A)
FIGURE 3. trr, ta AND tb CURVES vs FORWARD CURRENT
50
1
0.5
1.0
RθJA = 50oC/W
DC
0.8
SQ. WAVE
0.6
0.4
0.2
0
25
50
75
100
125
TA, AMBIENT TEMPERATURE (oC)
FIGURE 6. CURRENT DERATING CURVE
150
RHR1K160
Typical Performance Curves
(Continued)
CJ , JUNCTION CAPACITANCE (pF)
50
40
30
20
10
0
0
20
40
60
80
100
VR , REVERSE VOLTAGE (V)
FIGURE 7. JUNCTION CAPACITANCE vs REVERSE VOLTAGE
ZθJA, NORMALIZED
THERMAL IMPEDANCE
10
1
RθJA = 50oC/W
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
0.02
0.01
PDM
0.1
t1
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJA x RθJA + TA
SINGLE PULSE
0.01
10-5
10-4
10-3
10-2
10-1
100
101
102
103
t, RECTANGULAR PULSE DURATION (s)
FIGURE 8. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
Test Circuits and Waveforms
VGE AMPLITUDE AND
RG CONTROL dIF/dt
t1 AND t2 CONTROL IF
L
DUT
RG
CURRENT
SENSE
+
IGBT
VGE
t1
-
IF
VDD
dIF
dt
trr
ta
tb
0
0.25 IRM
t2
IRM
FIGURE 9. trr TEST CIRCUIT
3-4
FIGURE 10. trr WAVEFORMS AND DEFINITIONS
RHR1K160
Test Circuits and Waveforms
(Continued)
L = 20mH
R < 0.1Ω
EAVL = 1/2LI2 [VR(AVL) /(VR(AVL) - VDD)]
Q1 = IGBT (BVCES > DUT VR(AVL))
L
R
VAVL
CURRENT
SENSE
+
VDD
Q1
IL
IL
I V
DUT
VDD
-
t0
FIGURE 11. AVALANCHE ENERGY TEST CIRCUIT
t1
t2
t
FIGURE 12. AVALANCHE CURRENT AND VOLTAGE
WAVEFORMS
Thermal Resistance vs Mounting Pad Area
(EQ. 1)
In using surface mount devices such as the SO-8 package,
the environment in which it is applied will have a significant
influence on the part’s current and maximum power
dissipation ratings. Precise determination of the PDM is
complex and influenced by many factors:
1. Mounting pad area onto which the device is attached and
whether there is copper on one side or both sides of the
board.
2. The number of copper layers and the thickness of the
board.
3. The use of external heat sinks.
4. The use of thermal vias.
5. Air flow and board orientation.
6. For non steady state applications, the pulse width, the
duty cycle and the transient thermal response of the part,
the board and the environment they are in.
Intersil provides thermal information to assist the designer’s
preliminary application evaluation. Figure 13 defines the
RθJA for the device as a function of the top copper
(component side) area. This is for a horizontally positioned
FR-4 board with 2 oz. copper after 1000 seconds of steady
state power with no air flow. This graph provides the
necessary information for calculation of the steady state
3-5
350
RθJA = 101.6 - 25.82 x ln(AREA)
RθJA, THERMAL IMPEDANCE
( T JM – T A )
P DM = ----------------------------Z θJA
junction temperature or power dissipation. Pulse
applications can be evaluated using the Intersil device Spice
thermal model or manually utilizing the normalized maximum
transient thermal impedance curve.
JUNCTION TO AMBIENT (oC/W)
The maximum rated junction temperature, TJM, and the
thermal resistance of the heat dissipating path determines
the maximum allowable device power dissipation, PDM, in an
application. Therefore the application’s ambient temperature,
TA (oC), and thermal resistance RθJA (oC/W) must be
reviewed to ensure that TJM is never exceeded. Equation 1
mathematically represents the relationship and serves as
the basis for establishing the rating of the part.
300
250
177oC/W - 0.054in2
200
217oC/W - 0.0123in2
150
100
50
0.001
0.01
0.1
1.0
CATHODE MOUNTING AREA, TOP COPPER AREA (in2)
FIGURE 13. THERMAL RESISTANCE vs MOUNTING PAD
AREA
Displayed on the curve are RθJA values listed in the
Electrical Specifications table. These points were chosen to
depict the compromise between the copper board area, the
thermal resistance and ultimately the power dissipation,
PDM. Thermal resistances corresponding to other
component side copper areas can be obtained from Figure
13 or by calculation using Equation 2. The area, in square
inches is the top copper area including the cathode pad
area.
R θJA = 101.6 – 25.82 ×
ln ( Area )
(EQ. 2)
RHR1K160
The transient thermal impedance (ZθJA) is also effected by
various top copper board areas. Figure 14 shows the effect
of copper pad area on the single pulse transient thermal
impedance. Each trace represents a copper pad area in
square inches corresponding to the descending list in the
graph. Spice and SABER thermal models are provided for
each of the listed pad areas.
Copper pad area has no perceivable effect on transient
thermal impedance for pulse widths less than 100ms. For
pulse widths less than 100ms the transient thermal
impedance is determined by the die and package. Therefore,
CTHERM1 through CTHERM5 and RTHERM1 through
RTHERM4 remain constant for each of the thermal models.
A listing of the model component values is available in
Table 1.
ZθJA, THERMAL
IMPEDANCE (oC/W)
150
COPPER BOARD AREA - DESCENDING ORDER
0.049 in2
0.296 in2
0.523 in2
100 0.769 in2
1.000 in2
50
0
10-1
100
101
102
t, RECTANGULAR PULSE DURATION (s)
FIGURE 14. TRANSIENT THERMAL IMPEDANCE vs MOUNTING PAD AREA
3-6
103
RHR1K160
SPICE Thermal Model
JUNCTION
th
REV August 1998
RHR1K160
Copper Area = 0.769 in2
CTHERM1 th 8 5e-6
CTHERM2 8 7 2.5e-5
CTHERM3 7 6 1.2e-4
CTHERM4 6 5 4.5e-4
CTHERM5 5 4 9e-3
CTHERM6 4 3 4.5e-2
CTHERM7 3 2 3.5e-1
CTHERM8 2 tl 2
RTHERM1
CTHERM1
8
RTHERM2
CTHERM2
7
RTHERM1 th 8 4e-2
RTHERM2 8 7 1.6e-1
RTHERM3 7 6 1
RTHERM4 6 5 3.2
RTHERM5 5 4 6
RTHERM6 4 3 19
RTHERM7 3 2 25
RTHERM8 2 tl 36
CTHERM3
RTHERM3
6
RTHERM4
CTHERM4
5
SABER Thermal Model
CTHERM5
RTHERM5
Copper Area = 0.769 in2
template thermal_model th tl
thermal_c th, tl
{
ctherm.ctherm1 th 8 = 5e-6
ctherm.ctherm2 8 7 = 2.5e-5
ctherm.ctherm3 7 6 = 1.2e-4
ctherm.ctherm4 6 5 = 4.5e-4
ctherm.ctherm5 5 4 = 9e-3
ctherm.ctherm6 4 3 = 4.5e-2
ctherm.ctherm7 3 2 = 3.5e-1
ctherm.ctherm8 2 tl = 2
4
RTHERM6
CTHERM6
3
CTHERM7
RTHERM7
2
CTHERM8
RTHERM8
rtherm.rtherm1 th 8 = 4e-2
rtherm.rtherm2 8 7 = 1.6e-1
rtherm.rtherm3 7 6 = 1
rtherm.rtherm4 6 5 = 3.2
rtherm.rtherm5 5 4 = 6
rtherm.rtherm6 4 3 = 19
rtherm.rtherm7 3 2 = 25
rtherm.rtherm8 2 tl = 36
}
tl
AMBIENT
TABLE 1. THERMAL MODELS
0.049 in2
0.296 in2
0.523 in2
0.769 in2
1.0 in2
CTHERM6
5e-2
4.5e-2
4.5e-2
4.5e-2
4.5e-2
CTHERM7
2.5e-1
3.5e-1
3.5e-1
3.5e-1
3.5e-1
CTHERM8
1
2
2
2
2
RTHERM5
5
6
6
6
7
RTHERM6
22
19
19
19
19
RTHERM7
60
32
25
25
23
RTHERM8
55
49
42
36
28
COMPONENT
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
3-7
RHR1K160
MS-012AA
8 LEAD JEDEC MS-012AA SMALL OUTLINE PLASTIC PACKAGE
E
E1
INCHES
A
A1
1
e
2
6
D
5
b
MIN
MAX
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.004
0.0098
0.10
0.25
-
b
0.013
0.020
0.33
0.51
-
c
0.0075
0.0098
0.19
0.25
-
D
0.189
0.1968
4.80
5.00
2
E
0.2284
0.244
5.80
6.20
-
E1
0.1497
0.1574
3.80
4.00
3
e
h x 45o
c
0.004 IN
0.10 mm
L
0o-8o
0.060
1.52
0.050
1.27
0.024
0.6
0.155
4.0
0.275
7.0
MINIMUM RECOMMENDED FOOTPRINT FOR
SURFACE-MOUNTED APPLICATIONS
1.5mm
DIA. HOLE
MILLIMETERS
SYMBOL
0.050 BSC
1.27 BSC
-
H
0.0099
0.0196
0.25
0.50
-
L
0.016
0.050
0.40
1.27
4
NOTES:
1. All dimensions are within allowable dimensions of Rev. C of
JEDEC MS-012AA outline dated 5-90.
2. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.006 inches (0.15mm) per side.
3. Dimension “E1” does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 0.010 inches
(0.25mm) per side.
4. “L” is the length of terminal for soldering.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. Controlling dimension: Millimeter.
7. Revision 8 dated 5-99.
4.0mm
2.0mm
USER DIRECTION OF FEED
1.75mm
CL
MS-012AA
12mm
12mm TAPE AND REEL
8.0mm
40mm MIN.
ACCESS HOLE
18.4mm
COVER TAPE
13mm
330mm
GENERAL INFORMATION
1. 2500 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION “A” SPECIFICATIONS.
3-8
50mm
12.4mm