STMICROELECTRONICS DIP40

Thermal Data

DIP 40
40 leads
PACKAGE MATERIAL LIST
item #
material
thickness
thermal
conductivity
leadframe
copper
0.25 mm
2.61 W/cm°C
die attach
epoxy glue
( silver filler )
10-40 µm
0.01 W/cm°C
molding
compound
epoxy resin
3.8 mm
0.0063W/cm°C
Charts enclosed :
1) Rth(j-a) vs power dissipation
2) Zth(j-a) vs time
September 1999
1/2
Thermal Data
Dip 40
Rth(j-a) (ºC/W)
65
1)
die size 35000 sq. mils
dissipating area 2000 sq. mils
2 s 1 Oz. board
60
55
50
0
0.5
1
1.5
dissipated power ( Watt )
2
2.5
3
Zth( ºC/W)
2)
10
die size 35000 sq. mils
dissipating area 2000 sq. mils
2s 1Oz. board
2 w single square pulse
0.001
0.01
0.1
1
10
100
1,000
Time (s)
2/2
