STMICROELECTRONICS STGD7NB60H

STGD7NB60H
N-CHANNEL 7A - 600V - DPAK
PowerMESH™ IGBT
TYPE
STD7NB60H
■
■
■
■
■
■
■
■
■
VCES
VCE(sat)
IC
600 V
< 2.8 V
7A
HIGH INPUT IMPEDANCE
LOW ON-VOLTAGE DROP (Vcesat)
OFF LOSSES INCLUDE TAIL CURRENT
LOW GATE CHARGE
HIGH CURRENT CAPABILITY
VERY HIGH FREQUENCY OPERATION
CO-PACKAGED WITH TURBOSWITCHT
TYPICAL SHORT CIRCUIT WITHSTAND TIME
5MICROS S-family, 4 micro H family
ANTIPARALLEL DIODE
DESCRIPTION
Using the latest high voltage technology based on a
patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESH™ IGBTs, with outstanding perfomances.
The suffix "H" identifies a family optimized for high
frequency applications (up to 50kHz)in order to
achieve very high switching performances (reduced
tfall) mantaining a low voltage drop.
3
1
DPAK
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■ HIGH FREQUENCY MOTOR CONTROLS
■ SMPS and PFC IN BOTH HARD SWITCH AND
RESONANT TOPOLOGIES
ABSOLUTE MAXIMUM RATINGS
Symbol
Value
Unit
VCES
Collector-Emitter Voltage (VGS = 0)
Parameter
600
V
VECR
Emitter-Collector Voltage
20
V
VGE
Gate-Emitter Voltage
± 20
V
14
A
IC
Collector Current (continuos) at TC = 25°C
IC
Collector Current (continuos) at TC = 100°C
7
A
Collector Current (pulsed)
56
A
Total Dissipation at TC = 25°C
55
W
0.44
W/°C
ICM (■)
PTOT
Derating Factor
Tstg
Tj
July 2000
Storage Temperature
Max. Operating Junction Temperature
–65 to 150
°C
150
°C
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STGD7NB60H
THERMAL DATA
Rthj-case
Thermal Resistance Junction-case Max
2.27
°C/W
Rthj-amb
Thermal Resistance Junction-ambient Max
100
°C/W
Rthc-sink
Thermal Resistance Case-sink Typ
1.5
°C/W
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
Parameter
Test Conditions
Collectro-Emitter Breakdown
Voltage
IC = 250 µA, VGE = 0
ICES
Collector cut-off
(VGE = 0)
VCE = Max Rating, TC = 25 °C
IGES
Gate-Emitter Leakage
Current (VCE = 0)
VBR(CES)
Min.
Typ.
Max.
600
Unit
V
10
µA
VCE = Max Rating, TC = 125 °C
100
µA
VGE = ± 20V , VCE = 0
±100
nA
Typ.
Max.
Unit
5
V
2.8
V
ON (1)
Symbol
Parameter
Test Conditions
Min.
VGE(th)
Gate Threshold Voltage
VCE = VGE, IC = 250µA
VCE(sat)
Collector-Emitter Saturation
Voltage
VGE = 15V, IC = 7 A
2.3
VGE = 15V, IC = 7 A, Tj =125°C
1.9
3
V
DYNAMIC
Symbol
Parameter
gfs
Forward Transconductance
Cies
Input Capacitance
Coes
Test Conditions
VCE = 25 V , IC =3 A
Min.
3.5
Typ.
Max.
Unit
5
S
560
pF
Output Capacitance
68
pF
Cres
Reverse Transfer
Capacitance
15
pF
Qg
Qge
Qgc
Total Gate Charge
Gate-Emitter Charge
Gate-Collector Charge
VCE = 480V, IC = 7 A,
VGE = 15V
ICL
Latching Current
Vclamp = 480 V , Tj = 150°C
RG = 10 Ω
VCE = 25V, f = 1 MHz, VGE = 0
42
7.9
17.6
55
28
nC
nC
nC
A
SWITCHING ON
Symbol
td(on)
tr
(di/dt)on
Eon
2/9
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Turn-on Delay Time
Rise Time
VCC = 480 V, IC = 7 A
RG = 10Ω , VGE = 15 V
15
48
ns
ns
Turn-on Current Slope
Turn-on Switching Losses
VCC= 480 V, IC = 7 A RG=10Ω
VGE = 15 V,Tj = 125°C
160
70
A/µs
µJ
STGD7NB60H
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING OFF
Symbol
tc
Parameter
Cross-over Time
Test Conditions
Vcc = 480 V, IC = 7 A,
RGE = 10 Ω , VGE = 15 V
Min.
Typ.
Max.
Unit
85
ns
20
ns
tr(Voff)
Off Voltage Rise Time
td(off)
Delay Time
75
ns
Fall Time
70
ns
Turn-off Switching Loss
85
µJ
Total Switching Loss
130
µJ
150
ns
50
ns
110
ns
Fall Time
110
ns
Turn-off Switching Loss
220
µJ
Total Switching Loss
290
µJ
tf
Eoff(**)
Ets
tc
Cross-over Time
tr(Voff)
Off Voltage Rise Time
td(off)
Delay Time
tf
Eoff(**)
Ets
Vcc = 480 V, IC = 3 A,
RGE = 10 Ω , VGE = 15 V
Tj = 125 °C
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by max. junction temperature.
(**)Losses include Also the Tail (Jedec Standardization)
Thermal Impedance
3/9
STGD7NB60H
Output Characteristics
Transfer Characteristics
Transconductance
Collector-Emitter On Voltage vs Temperature
Collector-Emitter On Voltage vs Collettor Current
Gate Threshold vs Temperature
4/9
STGD7NB60H
Normalized Breakdown Voltage vs Temperature
Capacitance Variations
Gate Charge vs Gate-Emitter Voltage
Total Switching Losses vs Gate Resistance
Total Switching Losses vs Temperature
Total Switching Losses vs Collector Current
5/9
STGD7NB60H
Switching Off Safe Operating Area
6/9
STGD7NB60H
Fig. 1: Gate Charge test Circuit
Fig. 2: Test Circuit For Inductive Load Switching
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STGD7NB60H
TO-252 (DPAK) MECHANICAL DATA
mm
DIM.
MIN.
TYP.
inch
MAX.
MIN.
TYP.
MAX.
A
2.20
2.40
0.087
0.094
A1
0.90
1.10
0.035
0.043
A2
0.03
0.23
0.001
0.009
B
0.64
0.90
0.025
0.035
B2
5.20
5.40
0.204
0.213
C
0.45
0.60
0.018
0.024
C2
0.48
0.60
0.019
0.024
D
6.00
6.20
0.236
0.244
E
6.40
6.60
0.252
0.260
G
4.40
4.60
0.173
0.181
H
9.35
10.10
0.368
0.398
L2
0.8
0.031
L4
0.60
1.00
0.024
0.039
V2
0o
8o
0o
0o
P032P_B
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STGD7NB60H
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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