STMICROELECTRONICS STTH12R06FP

STTH12R06
®
TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER
Table 1: Main Product Characteristics
IF(AV)
12 A
VRRM
600 V
IRM (typ)
7A
Tj
175°C
VF (typ)
1.4 V
trr (max)
25 ns
K
K
TO-220AC
STTH12R06D
A
A
K
TO-220FPAC
STTH12R06FP
FEATURES AND BENEFITS
■
■
■
■
Ultrafast switching
Low reverse recovery current
Low thermal resistance
Reduces switching losses
K
A
NC
DESCRIPTION
The STTH12R06, which is using ST Turbo 2 600V
technology, is specially suited as boost diode in
continuous mode power factor corrections and
hard switching conditions.
This device is also intended for use as a free
wheeling diode in power supplies and other power
switching applications.
D2PAK
STTH12R06G
K
A
TO-220AC Insulated
STTH12R06DI
Table 2: Order Codes
Part Number
STTH12R06D
STTH12R06FP
STTH12R06G
STTH12R06G-TR
STTH12R06DI
STTH12R06DIRG
October 2004
Marking
STTH12R06D
STTH12R06FP
STTH12R06G
STTH12R06G
STTH12R06DI
STTH12R06DI
REV. 2
1/9
STTH12R06
Table 3: Absolute Ratings (limiting values)
Symbol
VRRM
IF(RMS)
Parameter
Value
Unit
Repetitive peak reverse voltage
600
V
RMS forward voltage
30
A
TO-220AC / TO-220FPAC / D2PAK
TO-220AC Ins.
IF(AV)
TO-220AC Ins.
IFSM
Surge non repetitive forward current
Tstg
Storage temperature range
Tj
24
Average forward current TO-220AC / D2PAK Tc = T125°C
δ = 0.5
TO-220FPAC
Tc = 50°C
12
A
100
A
-65 to + 175
°C
175
°C
Tc = 80°C
tp = 10ms sinusoidal
Maximum operating junction temperature
Table 4: Thermal Resistance
Symbol
Rth(j-c)
Parameter
Junction to case
Value (max).
Unit
TO-220AC / D2PAK
1.7
°C/W
TO-220FPAC
4.4
TO-220AC Ins.
3.3
Table 5: Static Electrical Characteristics
Symbol
IR
Parameter
Test conditions
Reverse leakage current Tj = 25°C
Min.
VR = VRRM
Tj = 125°C
VF
Forward voltage drop
Tj = 25°C
Typ
50
IF = 12A
Max.
Unit
45
µA
600
2.9
Tj = 125°C
1.4
V
1.8
2
To evaluate the conduction losses use the following equation: P = 1.16 x IF(AV) + 0.053 IF (RMS)
Table 6: Dynamic Characteristics
Symbol
Parameter
trr
Reverse recovery
time
Tj = 25°C
Reverse recovery
current
Tj = 125°C IF = 12A
VR = 400V
dIF/dt = -200 A/µs
IRM
Test conditions
IF = 0.5A Irr = 0.25A IR =1A
25
IF = 1A dIF/dt = -50 A/µs VR =30V
45
S factor Softness factor
2/9
Qrr
Reverse recovery
charges
tfr
Forward recovery
time
VFP
Forward recovery
voltage
Min. Typ Max. Unit
7.0
8.4
ns
A
0.2
180
Tj = 25°C
IF = 12A
dIF/dt = 96 A/µs
VFR = 1.1 x VFmax
nC
200
ns
5.5
V
STTH12R06
Figure 1: Conduction losses versus average
current
Figure 2: Forward voltage drop versus forward
current
P(W)
IFM(A)
30
δ = 0.05
δ = 0.1
120
δ = 0.2
δ = 0.5
110
25
Tj=125°C
(maximum values)
100
90
δ=1
20
80
Tj=125°C
(typical values)
70
15
60
Tj=25°C
(maximum values)
50
40
10
30
T
20
5
IF(AV)(A)
0
1
2
3
4
5
6
7
8
10
δ=tp/T
0
9
10
11
12
13
tp
14
VFM(V)
0
0
15
Figure 3: Relative variation of thermal
impedance junction to case versus pulse
duration (TO-220AC, TO-220AC Ins., D2PAK))
1
2
3
4
5
6
Figure 4: Relative variation of thermal
impedance junction to case versus pulse
duration (TO-220FPAC)
Zth(j-c)/Rth(j-c)
Zth(j-c)/Rth(j-c)
1.0
1.0
0.9
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
Single pulse
T
T
0.2
0.1
Single pulse
0.1
tp(s)
δ=tp/T
0.0
1.E-03
0.2
1.E-02
1.E-01
tp
δ=tp/T
tp(s)
0.0
1.E+00
Figure 5: Peak reverse recovery current versus
dIF/dt (typical values)
1.E-03
1.E-02
1.E-01
1.E+00
tp
1.E+01
Figure 6: Reverse recovery time versus dIF/dt
(typical values)
IRM(A)
trr(ns)
26
80
VR=400V
Tj=125°C
24
IF=2 x IF(AV)
20
IF=IF(AV)
18
VR=400V
Tj=125°C
70
22
60
IF=2 x IF(AV)
IF=0.5 x IF(AV)
IF=IF(AV)
50
16
IF=0.5 x IF(AV)
IF=0.25 x IF(AV)
14
40
12
10
30
8
20
6
4
10
2
dIF/dt(A/µs)
dIF/dt(A/µs)
0
0
0
200
400
600
800
1000
0
200
400
600
800
1000
3/9
STTH12R06
Figure 7: Reverse recovery charges versus
dIF/dt (typical values)
Figure 8: Softness factor versus dIF/dt (typical
values)
Qrr(nC)
S factor
500
0.50
VR=400V
Tj=125°C
450
IF≤2 x IF(AV)
VR=400V
Tj=125°C
0.45
400
IF=2 x IF(AV)
0.40
350
0.35
300
IF=IF(AV)
250
0.30
200
0.25
IF=0.5 x IF(AV)
150
0.20
100
0.15
50
dIF/dt(A/µs)
dIF/dt(A/µs)
0.10
0
0
200
400
600
800
0
1000
Figure 9: Relative variations of dynamic
parameters versus junction temperature
200
400
600
800
1000
Figure 10: Transient peak forward voltage
versus dIF/dt (typical values)
VFP(V)
12
2.50
11
2.25
IF=IF(AV)
Tj=125°C
10
2.00
9
S factor
1.75
8
1.50
7
1.25
6
5
1.00
4
0.75
IRM
3
0.50
QRR
0.25
2
IF=IF(AV)
VR=400V
Reference: Tj=125°C
Tj(°C)
1
0.00
dIF/dt(A/µs)
0
25
50
75
100
125
Figure 11: Forward recovery time versus dIF/dt
(typical values)
0
100
200
300
400
500
Figure 12: Junction capacitance versus
reverse voltage applied (typical values)
tfr(ns)
C(pF)
180
100
IF=IF(AV)
VFR=1.1 x VF max.
Tj=125°C
160
F=1MHz
VOSC=30mVRMS
Tj=25°C
140
120
100
80
60
40
20
VR(V)
dIF/dt(A/µs)
10
0
0
4/9
100
200
300
400
500
1
10
100
1000
STTH12R06
Figure 13: Thermal resistance junction to
ambient versus copper surface under tab
(epoxy FR4, eCU=35µm) (D2PAK)
Rth(j-a)(°C/W)
70
60
50
40
30
20
10
S(Cu)(cm²)
0
0
5
10
15
20
25
30
35
40
Figure 14: TO-220FPAC Package Mechanical Data
REF.
A
H
B
Dia
L6
L2
L7
L3
L5
D
F1
L4
F
G1
G
E
A
B
D
E
F
F1
F2
G
G1
H
L2
L3
L4
L6
L7
Dia.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.4
4.6
0.173
0.181
2.5
2.7
0.098
0.106
2.5
2.75
0.098
0.108
0.45
0.70
0.017
0.027
0.75
1
0.030
0.039
1.15
1.70
0.045
0.067
1.15
1.70
0.045
0.067
4.95
5.20
0.195
0.204
2.40
2.70
0.094
0.106
10
10.4
0.393
0.409
16 Typ.
0.63 Typ.
28.6
30.6
1.126
1.204
9.8
10.6
0.385
0.417
15.9
16.4
0.626
0.645
9.00
9.30
0.354
0.366
3
3.20
0.118
0.126
5/9
STTH12R06
Figure 15: D2PAK Package Mechanical Data
REF.
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESSTHAN 2mm
Figure 16: D2PAK Foot Print Dimensions
(in millimeters)
6.7
6.7
3
3
1.6
1.6
2.3
6/9
2.3
A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
M
R
V2
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
2.49
2.69
0.098
0.106
0.03
0.23
0.001
0.009
0.70
0.93
0.027
0.037
1.14
1.70
0.045
0.067
0.45
0.60
0.017
0.024
1.23
1.36
0.048
0.054
8.95
9.35
0.352
0.368
10.00
10.40
0.393
0.409
4.88
5.28
0.192
0.208
15.00
15.85
0.590
0.624
1.27
1.40
0.050
0.055
1.40
1.75
0.055
0.069
2.40
3.20
0.094
0.126
0.40 typ.
0.016 typ.
0°
8°
0°
8°
STTH12R06
Figure 17: TO-220AC Package Mechanical Data
REF.
H2
A
C
L5
L7
ØI
L6
L2
D
L9
F1
L4
M
F
E
G
A
C
D
E
F
F1
G
H2
L2
L4
L5
L6
L7
L9
M
Diam. I
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
1.23
1.32
0.048
0.051
2.40
2.72
0.094
0.107
0.49
0.70
0.019
0.027
0.61
0.88
0.024
0.034
1.14
1.70
0.044
0.066
4.95
5.15
0.194
0.202
10.00
10.40
0.393
0.409
16.40 typ.
0.645 typ.
13.00
14.00
0.511
0.551
2.65
2.95
0.104
0.116
15.25
15.75
0.600
0.620
6.20
6.60
0.244
0.259
3.50
3.93
0.137
0.154
2.6 typ.
0.102 typ.
3.75
3.85
0.147
0.151
Figure 18: TO-220AC Insulated Package Mechanical Data
REF.
H2
A
C
L5
L7
ØI
L6
L2
D
L9
F1
L4
M
F
E
G
A
C
D
E
F
F1
G
H2
L2
L4
L5
L6
L7
L9
M
Diam. I
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
1.23
1.32
0.048
0.051
2.40
2.72
0.094
0.107
0.49
0.70
0.019
0.027
0.61
0.88
0.024
0.034
1.14
1.70
0.044
0.066
4.95
5.15
0.194
0.202
10.00
10.40
0.393
0.409
16.40 typ.
0.645 typ.
13.00
14.00
0.511
0.551
2.65
2.95
0.104
0.116
15.25
15.75
0.600
0.620
6.20
6.60
0.244
0.259
3.50
3.93
0.137
0.154
2.6 typ.
0.102 typ.
3.75
3.85
0.147
0.151
7/9
STTH12R06
Table 7: Ordering Information
Ordering type
STTH12R06D
STTH12R06G
Marking
STTH12R06D
STTH12R06G
Package
TO-220AC
STTH12R066G-TR
STTH12R06FP
STTH12R06DI
STTH12R06DIRG
STTH12R06G
STTH12R06FP
STTH12R06DI
STTH12R06DI
■
■
■
■
D2PAK
Weight
1.90 g
1.48 g
Base qty
50
50
Delivery mode
Tube
Tube
D2PAK
TO-220FPAC
TO-220AC Ins.
TO-220AC Ins.
1.48 g
1.70 g
1.86 g
1.86 g
1000
50
250
50
Tape & reel
Tube
Box
Tube
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.8 m.N. (TO-220FPAC) / 0.55 m.N. (TO-220AC)
Maximum torque value: 1.0 m.N. (TO-220FPAC) / 0.70 m.N. (TO-220AC)
Table 8: Revision History
8/9
Date
Revision
Description of Changes
January-2002
1
First issue
18-Oct-2004
2
D2PAK and TO-220AC Insulated packages added
STTH12R06
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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All other names are the property of their respective owners
© 2004 STMicroelectronics - All rights reserved
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