STTH3R06 ® TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER Table 1: Main Product Characteristics IF(AV) 3A VRRM 600 V IR (max) 100 µA Tj 175°C VF (typ) 1.0 V trr (typ) 35 ns A FEATURES AND BENEFITS ■ ■ ■ ■ K DO-201AD STTH3R06 Ultrafast switching Low forward voltage drop Low thermal resistance Low leakage current (platinium doping) DESCRIPTION The STTH3R06, which is using ST Turbo 2 600V technology, is specially suited for use in switching power supplies, inverters and as a free wheeling diode. SMB STTH3R06U SMC STTH3R06S Table 2: Order Codes Part Number STTH3R06 STTH3R06RL STTH3R06U STTH3R06S September 2004 Marking STTH3R06 STTH3R06 R06U R6S REV. 2 1/9 STTH3R06 Table 3: Absolute Ratings (limiting values) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Unit 600 V 10 A 3 A 55 45 -65 to + 175 A °C 175 °C Maximum Unit 20 °C/W RMS forward voltage IF(AV) Average forward current δ = 0.5 IFSM Surge non repetitive forward current Tstg Storage temperature range Tj Value DO-201AD SMB SMC DO-201AD SMB / SMC Tl = 80°C Tl = 55°C Tl = 80°C tp = 10ms sinusoidal Maximum operating junction temperature Table 4: Thermal Parameters Symbol Rth(j-l) Rth(j-a) Parameter Junction to lead DO-201AD Junction to ambient (see fig. 13) L = 10 mm SMB 25 SMC 20 DO-201AD L = 10 mm 75 °C/W Table 5: Static Electrical Characteristics Symbol IR Parameter Reverse leakage current Test conditions Tj = 25°C Min. VR = VRRM Tj = 150°C VF Forward voltage drop Tj = 25°C Typ 15 Max. Unit 3 µA 100 IF = 3A 1.7 Tj = 150°C 1.0 V 1.25 2 To evaluate the conduction losses use the following equation: P = 1.03 x IF(AV) + 0.09 IF (RMS) Table 6: Dynamic Characteristics Symbol Parameter trr Reverse recovery time Tj = 25°C tfr Forward recovery time Tj = 25°C VFP Forward recovery voltage 2/9 Test conditions Min. Typ Max. Unit IF = 0.5A IRR = 0.25A IR = 1A 30 ns IF = 3A dIF/dt = 100 A/µs VFR = 1.1 x VFmax 100 ns IF = 3A 10 V IF = 1A dIF/dt = -50 A/µs VR =30V dIF/dt = 100 A/µs 35 STTH3R06 Figure 1: Conduction losses versus average current Figure 2: Forward voltage drop versus forward current IFM(A) P(W) 50 5.0 δ = 0.1 δ = 0.2 δ = 0.05 4.5 δ = 0.5 45 4.0 3.5 35 3.0 30 2.5 25 2.0 20 1.5 Tj=150°C (maximum values) 40 δ=1 Tj=150°C (typical values) Tj=25°C (maximum values) 15 T 1.0 10 0.5 δ=tp/T IF(AV)(A) 5 tp 0.0 VFM(V) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Figure 3: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy printed circuit FR4, Lleads = 10mm, SCU=1cm2) 0.0 0.5 1.0 1.5 2.0 2.5 Figure 4: Peak reverse recovery current versus dI F /dt (typical values) VR=400V Tj=125°C 12 IF=2 x IF(AV) 11 0.8 10 0.7 9 0.6 8 IF=IF(AV) IF=0.5 x IF(AV) 7 SMC SCu = 1cm2 6 IF=0.25 x IF(AV) 5 SMB SCu = 1cm2 0.3 4.0 13 0.9 0.4 3.5 IRM(A) Zth(j-a)/Rth(j-a) 1.0 0.5 3.0 4 DO-201AD Lleads = 10mm Single pulse 0.2 3 2 0.1 tp(s) 1 0.0 dIF/dt(A/µs) 0 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 5: Reverse recovery time versus dIF/dt (typical values) 0 50 100 150 200 250 300 350 400 450 500 Figure 6: Reverse recovery charges versus dIF/dt (typical values) Qrr(nC) trr(ns) 450 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 VR=400V Tj=125°C VR=400V Tj=125°C 400 IF=2 x IF(AV) 350 IF=2 x IF(AV) 300 IF=IF(AV) IF=0.5 x IF(AV) 250 IF=IF(AV) 200 IF=0.5 x IF(AV) 150 100 50 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 50 100 150 200 250 300 350 400 450 500 0 50 100 150 200 250 300 350 400 450 500 3/9 STTH3R06 Figure 7: Softness factor versus dIF/dt (typical values) S factor 1.0 3.0 S factor 0.9 IF=IF(AV) VR=400V Tj=125°C 2.5 Figure 8: Relative variations of dynamic parameters versus junction temperature IRM 0.8 0.7 2.0 0.6 QRR 0.5 1.5 0.4 0.3 1.0 IF=IF(AV) VR=400V Reference: Tj=125°C 0.2 0.5 0.1 dIF/dt(A/µs) 0.0 Tj(°C) 0.0 25 0 50 100 150 200 250 300 350 400 450 50 75 100 125 500 Figure 9: Transient peak forward voltage versus dIF/dt (typical values) Figure 10: Forward recovery time versus dIF/dt (typical values) tfr(ns) VFP(V) 200 20 IF=IF(AV) Tj=125°C 18 IF=IF(AV) VFR=1.1 x VF max. Tj=125°C 180 16 160 14 140 12 120 10 100 8 80 6 60 4 40 2 20 dIF/dt(A/µs) 0 dIF/dt(A/µs) 0 0 20 40 60 80 100 120 140 160 180 200 Figure 11: Junction capacitance versus reverse voltage applied (typical values) 0 20 40 60 80 100 120 140 160 180 200 Figure 12: Thermal resistance junction to ambient versus copper surface under lead (epoxy FR4, eCU=35µm) (DO-201AD) Rth(j-a)(°C/W) C(pF) 80 100 F=1MHz VOSC=30mVRMS Tj=25°C 70 60 DO-201AD 50 40 10 30 20 10 SCU(cm²) VR(V) 1 0 1 4/9 10 100 1000 0 1 2 3 4 5 6 7 8 9 10 STTH3R06 Figure 13: Thermal resistance junction to ambient versus copper surface under lead (epoxy FR4, eCU=35µm) (SMB / SMC) Figure 14: Thermal resistance versus lead length Rth(j-a)(°C/W) Rth(°C/W) 110 100 100 90 90 80 DO-201AD 80 Rth(j-a) 70 SMB 70 60 60 SMC 50 50 40 40 Rth(j-l) 30 30 20 20 10 10 SCU(cm²) Llead(mm) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5 10 15 20 25 5/9 STTH3R06 Figure 15: SMB Package Mechanical Data DIMENSIONS REF. E1 D E A1 A2 C L b Figure 16: SMB Foot Print Dimensions (in millimeters) 2.3 1.52 6/9 2.75 1.52 Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.60 0.030 0.063 STTH3R06 Figure 17: SMC Package Mechanical Data DIMENSIONS REF. E1 D Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 D 5.55 6.25 0.218 0.246 L 0.75 1.60 0.030 0.063 E A1 A2 C L b Figure 18: SMC Foot Print Dimensions (in millimeters) 3.3 2.0 4.2 2.0 7/9 STTH3R06 Figure 19: DO-201AD Package Mechanical Data DIMENSIONS B note 1 A E B E ØD ØC REF. Millimeters Min. note 1 A B C D E ØD Inches Max. Min. 9.50 25.40 Max. 0.374 1.000 5.30 1.30 1.25 0.209 0.051 0.049 1 - The lead diameter ø D is not controlled over zone E note 2 - The minimum axial length within which the device NOTES 2may be placed with its leads bent at right angles is 0.59"(15 mm) Table 7: Ordering Information ■ ■ ■ Ordering type Marking Package Weight Base qty STTH3R06 STTH3R06-RL STTH3R06U STTH3R06S STTH3R06 STTH3R06 3R6U R6S DO-201AD DO-201AD SMB SMC 1.12 g 1.12 g 0.11 g 0.243 g 600 1900 2500 2500 Epoxy meets UL94, V0 Band indicated cathode (DO-201AD) Bending method: see application note AN1471 (DO-201AD) Table 8: Revision History Date March-2003 07-Sep-2004 8/9 Revision 1 2 Description of Changes First issue SMB and SMC packages added Delivery mode Ammopack Tape & reel Tape & reel Tape & reel STTH3R06 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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