STTH1R06 ® TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER Table 1: Main Product Characteristics IF(AV) 1A VRRM 600 V IR (max) 75 µA Tj 175°C VF (typ) 1.0 V trr (max) 25 ns DO-41 STTH1R06 FEATURES AND BENEFITS ■ ■ ■ ■ SMA STTH1R06A Ultrafast switching Low reverse recovery current Low thermal resistance Reduces switching & conduction losses DESCRIPTION SMB STTH1R06U The STTH1R06, which is using ST Turbo 2 600V technology, is specially suited as boost diode in power factor correction circuitry. The device is also intended for use as a free wheeling diode in power supplies and other power switching applications. Table 2: Order Codes Part Number STTH1R06 STTH1R06RL Part Number STTH1R06A STTH1R06U Marking STTH1R06 STTH1R06 Marking HR6 BR6 Table 3: Absolute Ratings (limiting values) Symbol VRRM IF(RMS) Parameter Repetitive peak reverse voltage RMS forward voltage DO-41 Average forward current DO-41 Tc = 100°C δ = 0.5 SMA Tc = 125°C δ = 0.5 SMB Tc = 135°C δ = 0.5 SMA / SMB IF(AV) IFSM Tstg Tj Surge non repetitive forward current DO-41 SMA / SMB Storage temperature range Maximum operating junction temperature February 2005 REV. 3 Value Unit 600 V 10 A 7 tp = 10ms sinusoidal 1 A 25 A 20 -65 to + 175 °C 175 °C 1/9 STTH1R06 Table 4: Thermal Resistance Symbol Rth(j-l) Rth(j-a) Parameter Junction to lead L = 10mm L = 10mm Junction to ambient (1) Value (max). Unit DO-41 45 °C/W SMA 30 SMB 25 DO-41 70 °C/W 2 Note 1: Rth(j-a) is measured with a copper area S = Scm (see figure12). Table 5: Static Electrical Characteristics Symbol IR Parameter Test conditions Reverse leakage current Tj = 25°C Min. VR = VRRM Tj = 150°C VF Forward voltage drop Tj = 25°C Typ 10 IF = 1A Max. Unit 1 µA 75 1.7 Tj = 150°C 1.0 V 1.25 2 To evaluate the conduction losses use the following equation: P = 1.03 x IF(AV) + 0.27 IF (RMS) Table 6: Dynamic Characteristics Symbol Parameter trr Reverse recovery time Tj = 25°C tfr Forward recovery time Tj = 25°C IF = 1A dIF/dt = 100 A/µs VFR = 1.1 x VFmax 100 ns VFP Forward recovery voltage Tj = 25°C IF = 1A dIF/dt = 100 A/µs VFR = 1.1 x VFmax 10 V 2/9 Test conditions Min. Typ Max. Unit IF = 0.5A Irr = 0.25A IR =1A IF = 1A dIF/dt = -50 A/µs VR =30V 25 30 ns 45 STTH1R06 Figure 1: Conduction losses versus average forward current Figure 2: Forward voltage drop versus forward current IFM(A) P(W) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1.8 δ = 0.2 δ = 0.1 1.6 δ = 0.5 δ = 0.05 1.4 1.2 δ=1 1.0 0.8 0.6 T 0.4 0.2 IF(AV)(A) δ=tp/T tp 0.0 0.0 0.2 0.4 0.6 0.8 1.0 Tj=125°C (maximum values) Tj=25°C (maximum values) Tj=125°C (typical values) VFM(V) 1.2 Figure 3: Relative variation of thermal impedance junction to case versus pulse duration (DO-41) 0 1 2 3 4 5 Figure 4: Relative variation of thermal impedance junction to case versus pulse duration (SMA) Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 0.9 0.9 0.8 0.8 0.7 0.7 S = 1cm2 0.6 0.6 δ = 0.5 0.5 0.5 0.4 0.4 0.3 0.2 0.3 δ = 0.2 T δ = 0.1 0.1 Single pulse 1.E+00 tp(s) 1.E+01 0.1 δ=tp/T δ=tp/T tp(s) Single pulse tp tp 0.0 1.E+02 1.E+03 Figure 5: Relative variation of thermal impedance junction to case versus pulse duration (SMB) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 6: Peak reverse recovery current versus dI F /dt (typical values) Zth(j-c)/Rth(j-c) IRM(A) 9 1.0 S = 1cm2 0.9 8 0.8 7 VR=400V Tj=125°C IF=2 x IF(AV) IF=IF(AV) 0.7 0.6 T δ = 0.2 0.2 δ = 0.1 0.0 1.E-01 δ = 0.5 6 δ = 0.5 IF=0.5 x IF(AV) 5 0.5 4 IF=0.25 x IF(AV) 0.4 3 0.3 T δ = 0.2 0.2 0.1 2 δ = 0.1 tp(s) Single pulse δ=tp/T tp 1.E-01 1 dIF/dt(A/µs) 0 0.0 1.E+00 1.E+01 1.E+02 1.E+03 0 50 100 150 200 250 300 350 400 450 500 3/9 STTH1R06 Figure 7: Reverse recovery time versus dIF/dt (typical values) Figure 8: Reverse recovery charges versus dIF/dt (typical values) Qrr(nC) trr(ns) 250 140 VR=400V Tj=125°C 130 120 VR=400V Tj=125°C 225 IF=2 x IF(AV) IF=2 x IF(AV) 200 110 100 175 IF=IF(AV) 90 IF=0.5 x IF(AV) 80 150 IF=IF(AV) 125 70 60 100 IF=0.5 x IF(AV) 50 40 75 30 50 20 10 25 dIF/dt(A/µs) 0 dIF/dt(A/µs) 0 0 50 100 150 200 250 300 350 400 450 500 Figure 9: Reverse recovery softness factor versus dIF/dt (typical values) 0 50 100 150 200 250 300 350 400 450 500 Figure 10: Relative variations of dynamic parameters versus junction temperature S factor 6 IF=IF(AV) VR=400V Tj=125°C 5 1.0 S factor 0.9 0.8 IRM 4 0.7 0.6 3 0.5 QRR 0.4 2 0.3 0.2 1 0.1 dIF/dt(A/µs) 0 IF=IF(AV) VR=400V Reference: Tj=125°C Tj(°C) 0.0 0 50 100 150 200 250 300 350 400 450 500 Figure 11: Transient peak forward voltage versus dIF/dt (typical values) 25 50 75 100 125 Figure 12: Forward recovery time versus dIF/dt (typical values) VFP(V) tfr(ns) 200 25 IF=IF(AV) Tj=125°C IF=IF(AV) VFR=1.1 x VF max. Tj=125°C 180 160 20 140 120 15 100 80 10 60 40 5 dIF/dt(A/µs) 20 dIF/dt(A/µs) 0 0 0 4/9 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200 STTH1R06 Figure 13: Junction capacitance versus reverse voltage applied (typical values) Figure 14: Thermal resistance junction to ambient versus copper surface under each lead (epoxy FR4, eCU=35µm) (DO-41, SMB) Rth(j-a)(°C/W) C(pF) 110 100 100 F=1MHz VOSC=30mV Tj=25°C 90 DO-41 Lleads = 10mm 80 70 SMB 60 10 50 40 30 20 10 VR(V) 1 S(cm²) 0 1 10 100 1000 0 1 2 3 4 5 6 7 8 9 10 Figure 15: Thermal resistance junction to ambient versus copper surface under each lead (epoxy FR4, eCU=35µm) (SMA) Rth(j-a)(°C/W) 140 130 120 110 100 90 80 SMA 70 60 50 40 30 20 S(cm²) 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5/9 STTH1R06 Figure 16: SMA Package Mechanical Data DIMENSIONS E1 REF. D E A1 A2 C L b Figure 17: SMA Foot Print Dimensions (in millimeters) 2.30 1.50 2.30 1.75 6.10 6/9 Millimeters Inches Min. Max. Min. Max. A1 1.90 2.03 0.075 0.080 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 D 2.25 2.95 0.089 0.116 L 0.75 1.60 0.030 0.063 STTH1R06 Figure 18: SMB Package Mechanical Data DIMENSIONS E1 REF. D E A1 A2 C L Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.60 0.030 0.063 b Figure 19: SMB Foot Print Dimensions (in millimeters) 2.3 1.52 2.75 1.52 7/9 STTH1R06 Figure 20: DO-41 Package Mechanical Data C A C / B O O /D O /D DIMENSIONS REF. Millimeters Min. Max. 4.07 5.20 2.04 2.71 28 0.712 0.863 A B C D Inches Min. 0.160 0.080 1.102 0.028 Max. 0.205 0.107 0.034 Table 7: Ordering Information Ordering type STTH1R06 STTH1R06RL STTH1R06A STTH1R06B ■ Marking STTH1R06 STTH1R06 AR6 BR6 Package DO-41 DO-41 SMA SMB Weight 0.34 g 0.34 g 0.068 g 0.11 g Base qty 2000 5000 5000 2500 Delivery mode Ammopack Tape & reel Tape & reel Tape & reel Epoxy meets UL94, V0 Table 8: Revision History Date 8/9 Revision Description of Changes Apr-2003 1 First issue 07-Sep-2004 2 DO-41 and SMA packages added 24-Feb-2005 3 SMA package dimensions update. Reference A1 max. changed from 2.70mm (0.106inc.) to 2.03mm (0.080). STTH1R06 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9