TDA8177 VERTICAL DEFLECTION BOOSTER .. .. .. POWER AMPLIFIER FLYBACK GENERATOR THERMAL PROTECTION OUTPUT CURRENT UP TO 3.0APP FLYBACK VOLTAGE UP TO 70V (on Pin 5) SUITABLE FOR DC COUPLING APPLICATION DESCRIPTION HEPTAWATT (Plastic Package) Designed for monitors and high performance TVs, the TDA8177 vertical deflection booster delivers flyback voltages up to 70V. The TDA8177 operates with supplies up to 35V and provides up to 3APP output current to drive the yoke. The TDA8177 is offered in HEPTAWATT package. ORDER CODE : TDA8177 PIN CONNECTIONS 7 6 5 4 3 2 1 8177-01.EPS NON-INVERTING INPUT OUTPUT STAGE SUPPLY OUTPUT GROUND FLYBACK GENERATOR SUPPLY VOLTAGE INVERTING INPUT Tab connected to Pin 4 BLOCK DIAGRAM SUPPLY VOLTAGE OUTPUT STAGE SUPPLY FLYBACK GENERATOR 2 6 3 FLYBACK GENERATOR INVERTING INPUT 1 POWER AMPLIFIER NON-INVERTING INPUT 5 OUTPUT 7 THERMAL PROTECTION 8177-02.EPS TDA8177 4 GROUND December 1998 1/5 TDA8177 ABSOLUTE MAXIMUM RATINGS Parameter VS Supply Voltage (Pin 2) (see note 1) V6 Flyback Peak Voltage (Pin 6) (see note 1) V1 , V7 Amplifier Input Voltage (Pins 1-7) (see note 1) Value Unit 40 V 75 V - 0.3, + VS V 2.5 A IO Maximum Output Peak Current (see notes 2 and 3) I3 Maximum Sink Current (first part of flyback) (t < 1ms) 2.5 A I3 Maximum Source Current (t < 1ms) 2.5 A VESD Electrostatic Handling for all pins (see note 4) 2000 V Toper Operating Ambient Temperature - 20, + 75 o Tstg Storage Temperature - 40, + 150 o C Tj Junction Temperature +150 o C Notes : 1. 2. 3. 4. C 8177-01.TBL Symbol Versus Pin 4. The output current can reach 4A peak for t ≤ 10µs (up to 120Hz). Provided SOAR is respected (see Figures 1 and 2). Equivalent to discharging a 100pF capacitor through a 1.5kΩ series resistor. THERMAL DATA Parameter Value Unit o Rth (j-c) Junction-case Thermal Resistance Tt Temperature for Thermal Shutdown 150 o C Tjr Recommended Max. Junction Temperature 120 o C Max. 3 C/W 8177-02.TBL Symbol ELECTRICAL CHARACTERISTICS (VS = 35V, TA = 25oC, unless otherwise specified) Parameter Test Conditions VS Operating Supply Voltage Range I2 Pin 2 Quiescent Current I3 = 0, I5 = 0 I3 = 0, I5 = 0, V6 = 35V I6 Pin 6 Quiescent Current Max. Peak Output Current I1 Amplifier Bias Current V1 = 22V, V7 = 23V I7 Amplifier Bias Current V1 = 23V, V7 = 22V ∆VIO/dt Typ. 10 IO VIO Min. 9 8 15 GV Voltage Gain V5L Output Saturation Voltage to GND (Pin 4) V5H V 20 mA 30 mA A - 0.15 -1 µA - 0.15 -1 µA 7 mV µV/oC - 10 80 I5 = 1.5A Unit 35 1.5 Offset Voltage Offset Drift versus Temperature Max. dB 1 1.7 V Output Saturation Voltage to Supply (Pin 6) I5 = - 1.5A 1.8 2.3 V VD5 - 6 Diode Forward Voltage between Pins 5-6 I5 = 1.5A 1.8 2.3 V VD3 - 2 Diode Forward Voltage between Pins 3-2 I3 = 1.5A 1.6 2.2 V V3SL Saturation Voltage on Pin 3 I3 = 20mA 0.4 1 V V3SH Saturation Voltage to Pin 2 (2nd part of flyback) I3 = - 1.5A 2.1 2.8 V 2/5 8177-03.TBL Symbol TDA8177 APPLICATION CIRCUITS AC COUPLING + VS CF 2 6 3 FLYBACK GENERATOR R5 1 POWER AMPLIFIER TDA8177 4 R3 YOKE 0.47m F 1.5W THERMAL PROTECTION VREF 2.2V 330W 7 5 R4 CL R2 8177-03.EPS R1 DC COUPLING + VS CF 2 6 3 FLYBACK GENERATOR R5 1 THERMAL PROTECTION TDA8177 4 -VEE R2 R1 8177-04.EPS VREF- YOKE 7 5 330W Vertical Position Adjustment POWER AMPLIFIER 0.47m F 1.5W VREF+ 3/5 TDA8177 Figure 1 : Output Transistors SOA (for secondary breakdown) Figure 2 : Secondary Breakdown Temperature Derating Curve (ISB = secondary breakdown current) ISB (%) IC (A) 100 10 @ Tcase = 25°C 90 1 80 t = 1ms t = 10ms t = 100ms VCE (V) 10-2 1 4/5 10 102 Tcase (°C) 60 25 50 75 100 125 8177-06.EPS 70 8177-05.EPS 10-1 TDA8177 PM-HEPTV.EPS PACKAGE MECHANICAL DATA : HEPTAWATT A C D D1 E F F1 G G1 G2 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Dia. Min. Millimeters Typ. 2.4 1.2 0.35 0.6 2.41 4.91 7.49 2.54 5.08 7.62 10.05 Max. 4.8 1.37 2.8 1.35 0.55 08 0.9 2.67 5.21 7.8 10.4 10.4 Min. 0.094 0.047 0.014 0.024 0.095 0.193 0.295 Max. 0.189 0.054 0.110 0.053 0.022 0.031 0.035 0.105 0.205 0.307 0.409 0.409 0.668 0.587 0.848 0.891 3 15.8 6.6 0.102 0.594 0.236 2.8 5.08 3.65 0.100 0.200 0.300 0.396 16.97 14.92 21.54 22.62 2.6 15.1 6 Inches Typ. 0.118 0.622 0.260 0.110 0.200 3.85 0.144 HEPTV.TBL Dimensions 0.152 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 1998 STMicroelectronics - All Rights Reserved Purchase of I2C Components of STMicroelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to the I2C Standard Specifications as defined by Philips. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. http://www.st.com 5/5