TS4990 1W AUDIO POWER AMPLIFIER WITH ACTIVE LOW STANDBY MODE ADVANCE DATA ■ OPERATING FROM VCC = 2.2V to 5.5V PIN CONNECTIONS (top view) ■ 1W OUTPUT POWER @ Vcc=5V, THD=1%, f=1kHz, with 8Ω Load TS4990JT - FLIP CHIP ■ ULTRA LOW CONSUMPTION IN STANDBY MODE (10nA) ■ 62dB PSRR @ 217Hz @ Grounded mode ■ Zero POP & CLICK ■ ULTRA LOW DISTORTION (0.1%) ■ UNITY GAIN STABLE ■ AVAILABLE IN 9 BUMPS Flip Chip Package DESCRIPTION 6 The TS4990 has been designed for demanding audio applications such as mobile phones and to minimize the number of external components. 7 Vin- Vout1 GND GND BYPASS VOUT2 8 This Audio Power Amplifier is capable of delivering 1W of continuous RMS Ouput Power into an 8Ω load @ 5V. 1 9 Vin+ 5 VCC 4 STBY 3 2 An externally controlled standby mode control reduces the supply current to less than 10nA. It also includes an internal thermal shutdown protection. TYPICAL APPLICATION SCHEMATIC The unity-gain stable amplifier can be configured by external gain setting resistors. Rfeed Vcc 4 Cfeed + APPLICATIONS VCC Cs ■ Mobile Phones (Cellular / Cordless) Audio In Cin Rin ■ Laptop / Notebook Computers 7 Vin- - 5 Vin+ + Vout 1 6 Speaker 8 Ohms ■ PDAs ■ Portable Audio Devices AV = -1 TS4990IJT -40, +85°C 2 Bias GND Package Standby 8 Temperature Range Cb 3 Vout 2 + TS4990 9 Part Number Standby Control Bypass + ORDER CODE 1 J • J = Flip Chip Package - only available in Tape & Reel (JT) February 2003 This is a preliminary information on a new product now in development. Details are subject to change without notice. 1/6 TS4990 ABSOLUTE MAXIMUM RATINGS Symbol VCC Vi Parameter Supply voltage Input Voltage 1) 2) Value Unit 6 V GND to VCC V °C Toper Operating Free Air Temperature Range -40 to + 85 Tstg Storage Temperature Tj Rthja Pd ESD ESD -65 to +150 °C Maximum Junction Temperature 150 °C Thermal Resistance Junction to Ambient3) Flip Chip TBD Power Dissipation Human Body Model Machine Model Latch-up Immunity Lead Temperature (soldering, 10sec) Internally Limited 2 200 Class A (200mA) 250 °C/W kV V °C 1. All voltages values are measured with respect to the ground pin. 2. The magnitude of input signal must never exceed VCC + 0.3V / G ND - 0.3V 3. Device is protected in case of over temperature by a thermal shutdown active @ 150°C. OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VICM Common Mode Input Voltage Range VSTB Standby Voltage Input : Device ON Device OFF RL ROUT GND TSD Rthja Load Resistor Resistor Output to GND Thermal Shutdown Temperature Thermal Resistance Junction to Ambient1) 1. This thermal resistance can be reduced with a suitable PCB layout . 2/6 Value Unit 2.2 to 5.5 V 1.2V to VCC V 1.2 ≤ VSTB ≤ VCC GND ≤ VSTB ≤ 0.4 V 4 - 32 Ω >1 MΩ 150 min. °C TBD °C/W TS4990 ELECTRICAL CHARACTERISTICS VCC = +5V, GND = 0V, Tamb = 25°C (unless otherwise specified) Symbol ICC ISTANDBY Parameter Supply Current No input signal, no load Standby Current 1) No input signal, Vstdby = GND, RL = 8Ω Voo Output Offset Voltage No input signal, RL = 8Ω Po Output Power THD = 1% Max, f = 1kHz, RL = 8Ω THD + N PSRR TWU Min. 0.8 Total Harmonic Distortion + Noise Po = 250mW rms, Gv = 2, 20Hz < f < 20kHz, RL = 8Ω Power Supply Rejection Ratio2) RL = 8Ω, Gv = 2, Vripple = 200mVpp, Input Grounded F = 217Hz F = 1kHz 55 55 Wake-Up Time Typ. Max. 4 6 10 1000 5 20 Unit mA nA mV 1 W 0.15 % dB 62 66 100 TBD ms Typ. Max. Unit 4 6 10 1000 5 20 1. Standby mode is actived when Vstdby is tied to Gnd 2. Dynamic measurements - 20*log(rms(Vout)/rms(Vripple)). Vripple is the surimposed sinus signal to Vcc. VCC = +3.3V, GND = 0V, Tamb = 25°C (unless otherwise specified) Symbol ICC ISTANDBY Parameter Supply Current No input signal, no load Standby Current 1) No input signal, Vstdby = GND, RL = 8Ω Voo Output Offset Voltage No input signal, RL = 8Ω Po Output Power THD = 1% Max, f = 1kHz, RL = 8Ω THD + N PSRR TWU Min. 380 Total Harmonic Distortion + Noise Po = 250mW rms, Gv = 2, 20Hz < f < 20kHz, RL = 8Ω Power Supply Rejection Ratio2) RL = 8Ω, Gv = 2, Vripple = 200mVpp, Input Grounded F = 217Hz F = 1kHz 55 55 Wake-Up Time mA nA mV 450 mW 0.15 % dB 62 66 130 TBD ms 1. Standby mode is actived when Vstdby is tied to Vcc 2. Dynamic measurements - 20*log(rms(Vout)/rms(Vripple)). Vripple is the surimposed sinus signal to Vcc. 3/6 TS4990 ELECTRICAL CHARACTERISTICS VCC = 2.6V, GND = 0V, Tamb = 25°C (unless otherwise specified) Symbol ICC ISTANDBY Parameter Supply Current No input signal, no load Standby Current 1) No input signal, Vstdby = GND, RL = 8Ω Voo Output Offset Voltage No input signal, RL = 8Ω Po Output Power THD = 1% Max, f = 1kHz, RL = 8Ω THD + N PSRR TWU Min. 210 Total Harmonic Distortion + Noise Po = 200mW rms, Gv = 2, 20Hz < f < 20kHz, RL = 8Ω Power Supply Rejection Ratio2) RL = 8Ω, Gv = 2, Vripple = 200mVpp, Input Grounded F = 217Hz F = 1kHz 55 55 Wake-Up Time Typ. Max. 4 6 10 1000 5 20 Unit mA nA mV 260 mW 0.15 % dB 62 66 130 TBD ms 1. Standby mode is actived when Vstdby is tied to Vcc 2. Dynamic measurements - 20*log(rms(Vout)/rms(Vripple)). Vripple is the surimposed sinus signal to Vcc. Components Functional Description Rin Inverting input resistor which sets the closed loop gain in conjunction with Rfeed. This resistor also form a high pass filter with Cin (fc = 1 / (2 x Pi x Rin x Cin)) Cin Input coupling capacitor which blocks the DC voltage at the amplifier input terminal Rfeed Feed back resistor which sets the closed loop gain in conjunction with Rin Cs Supply Bypass capacitor which provides power supply filtering Cb Bypass pin capacitor which provides half supply filtering Cfeed Gv Low pass filter capacitor allowing to cut the high frequency (low pass filter cut-off frequency 1 / (2 x Pi x Rfeed x Cfeed)) Closed loop gain in BTL configuration = 2 x (Rfeed / Rin) REMARKS 1. All measurements, except PSRR measurements, are made with a supply bypass capacitor Cs = 1µF. 2. The standby response time is about 1µs. 4/6 TS4990 TS4990IJT PIN OUT (top view) MARKING (top view) 250µm 6 7 1 Vout1 GND GND BYPASS 9 VOUT2 Vin+ 5 VCC 4 STBY YWW 4990 500µm 8 Vin- 3 2 ■ ■ ■ ■ ■ Balls are underneath ST Logo Part number 4990 Three digits Datecode : YWW The dot is for marking pin 1 PACKAGE MECHANICAL DATA FLIP CHIP - 9 BUMPS 0.5mm 0.5mm 0.5mm ■ Die size : (1.6mm ±10%) x (1.6mm ±10%) ■ Die height (including bumps) : 600µm ±30µm ■ Bumps diameter : 315µm ±15µm ■ Pitch: 500µm ±10µm 1.6mm 0.5mm 1.6mm 600µm 5/6 TS4990 TAPE & REEL SPECIFICATION ( top view) User direction of feed 4990 4990 DEVICES ORIENTATION The devices are oriented in the carrier pocket with pin number 1A adjacent to the sprocket holes. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2003 STMicroelectronics - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom http://www.st.com 6/6