STMICROELECTRONICS VN330SP(8932)

VN330SP(8932)
QUAD HIGH SIDE SMART
POWER SOLID STATE RELAY
Figure 1. Package
Table 1. General Features
Type
Vdemag(*)
RDSon (*)
Iout (*)
Vcc
VN330SP(8932)
VCC-55V
0.32Ω (**)
1A
36V
(*) Per channel
(**) at Tj=85°C
■
OUTPUT CURRENT: 1A PER CHANNEL
■
DIGITAL INPUTS CLAMPED AT 32V MINIMUM
VOLTAGE
■
SHORTED LOAD AND OVERTEMPERATURE
PROTECTIONS
■
BUILT-IN CURRENT LIMITER
■
UNDERVOLTAGE SHUTDOWN
■
OPEN DRAIN DIAGNOSTIC OUTPUT
■
FAST DEMAGNETIZATION OF INDUCTIVE LOADS
10
1
PowerSO-10™
DESCRIPTION
The VN330SP(8932) is a monolithic device made
using
STMicroelectronics
VIPower
M0-3
Technology, intended for driving four indipendent
resistive or inductive loads with one side
connected to ground.
Active current limitation avoids dropping the
system power supply in case of shorted load.
Built-in thermal shut-down protects the chip from
overtemperature and short-circuit. The open drain
diagnostic output indicates short-circuit and
overtemperature conditions.
Table 2. Order Codes
Package
PowerSO-10
Tube
VN330SP(8932)
Tape and Reel
VN330SP(8932)TR
Rev. 1
September 2004
1/12
VN330SP(8932)
Figure 2. Block Diagram
Table 3. Absolute Maximum Ratings
Symbol
VCC
- VCC
IOUT
IR
IIN
IDIAG
VESD
EAS
Ptot
Tj
TSTG
Parameter
Power Supply Voltage
Reverse Supply Voltage
Output Current (cont.)
Reverse Output Current (per channel)
Input Current (per channel)
DIAG Pin Current
Electrostatic Discharge
(Human Body Model: R=1.5KΩ; C=100pF)
Single Pulse Avalanche Energy per Channel Not
Simultaneously (see figure 5)
Power Dissipation TC≤25°C
Junction Operating Temperature
Storage Temperature
Value
45
- 0.3
Internally Limited
-6
+/- 10
+/- 10
Unit
V
V
A
A
mA
mA
2000
V
400
mJ
Internally Limited
Internally limited
- 55 to 150
W
°C
°C
Figure 3. Configuration Diagram (Top View) & Suggested Connections for Unused and N.C. Pins
2/12
VN330SP(8932)
Figure 4. Current and Voltage Conventions
Table 4. Thermal Data
Symbol
Rthj-case
Rthj-amb
(1)
(2)
Parameter
Thermal Resistance Junction-case (1)
Thermal Resistance Junction-ambient (2)
Value
2
50
Max
Max
Unit
°C/W
°C/W
All channels ON.
When mounted using minimum recommended pad size on FR-4 board.
ELECTRICAL CHARACTERISTICS (10V<VCC<36V; -25°C<Tj<125°C unless otherwise specified)
Table 5. Power
Symbol
VCC
RON
IS
Vdemag
Parameter
Supply Voltage
On State Resistance
Supply Current
Test Conditions
IOUT=0.5A; Tj =125°C
Max
36
0.4
Unit
V
Ω
IOUT=10A
All channels Off; VIN=30V
0.32
1
Ω
mA
OnState; Tj=125°C; IOUT1...IOUT4=0
Output Voltage at Turn-Off IOUT=0.5A; LLOAD=1mH
Min
10
Typ
10
VCC-65 VCC-55 VCC-45
mA
V
Table 6. Logic Input (each channel)
Symbol
Parameter
VIL
Input Low Level Voltage
VIH
Input High Level Voltage
VI(hyst)
Input Hysteresis Voltage
IIN
ILGND
VICL
Input Current
Test Conditions
(See note 1)
Min
Typ
Max
Unit
2
V
3.5
V
0.5
600
VIN=0 to 30V
VIN=0 to 2V
Output Current in Ground
Disconnection
VCC=VINX=GND=DIAG=24V; Tj =25°C
Input Clamp Voltage
IIN= 1mA
(See note 1)
IIN= - 1mA
V
25
25
32
µA
µA
mA
36
V
-0.7
V
Note: 1. The input voltage is internally clamped at 32V minimum, it is possible to connect the input pins to an higher voltage via an external
resistor calculate to not exceed 10 mA.
3/12
VN330SP(8932)
ELECTRICAL CHARACTERISTICS (continued)
Table 7. Switching (VCC =24V)
Symbol
td(on)
Parameter
Turn-on Delay Time of
Output Current
Test Conditions
IOUT=0.5A; Resistive Load
Min
Typ
Max
Unit
30
40
µs
60
µs
100
µs
115
µs
30
µs
40
µs
15
µs
20
0.5
µs
A/µs
IOUT=Ilim; Tj =25°C
IOUT=0.5A
2
2
A/µs
A/µs
IOUT=Ilim; Tj =25°C
4
A/µs
Max
1
Unit
V
V
Input Rise Time < 0.1µs
Tj=25°C
Tj=125°C
IOUT=0.5A; Resistive Load
tr
Rise Time of Output
Current
Input Rise Time < 0.1µs
50
Tj=25°C
Tj=125°C
IOUT=0.5A; Resistive Load
td(off)
Turn-off Delay Time of
Output Current
Input Rise Time < 0.1µs
20
Tj=25°C
Tj=125°C
IOUT=0.5A; Resistive Load
tf
Fall Time of Output Current
(di/dt)on
Turn-on Current Slope
(di/dt)off
Turn-off Current Slope
Input Rise Time < 0.1µs
8
Tj=25°C
Tj=125°C
IOUT=0.5A
Table 8. Protections
Symbol
VSTAT (3)
VSCL (3)
VUSD
Ilim
IOVPK
IDIAGH
ILOAD
tSC
TTSD
TR
Parameter
Test Conditions
Status Voltage Output Low ISTAT=5mA (Fault condition)
ISTAT= 1mA
Status Clamp Voltage
ISTAT= - 1mA
Undervoltage Shut-down
DC Short Circuit Current
VCC=24V; RLOAD < 10mΩ
VCC=24V; VIN=30V;
Peak Short Circuit Current
RLOAD < 10mΩ (See figure 6)
Leakage on Diag Pin in
VDIAG=24V
High State
VCC=10 to 36V; VIN=0V;
Output Leakage Current
4 Channels In Parallel
Delay Time of Current
Limiter
Thermal Shut-Down
Temperature
Reset Temperature
Min
Typ
32
36
0.7
5
1
8
2.5
V
V
A
4
A
100
µA
25
µA
100
µs
150
170
°C
135
155
°C
Note: (3) Status determination > 100 ms after the switching edge.
Note: If INPUTn pin is left floating the corresponding channel will automatically switch off. If GND pin is disconnetted, all channels will switch
off provided VCC does not exceed 36V
4/12
VN330SP(8932)
Figure 5. Avalanche Energy Test Circuit
Figure 6. Peak Short Circuit Current Test Circuit
5/12
VN330SP(8932)
Table 9. Truth Table
CONDITIONS
INPUTn
OUTPUTn
DIAGNOSTIC
L
L
H
L
H
L
H
H
H
L
L
L
L
H
Shorted Load
H
L
L
L
H
H
(Current Limitation)
H
H
H
Normal operation
Overtemperature
Undervoltage
Figure 7. Switching Waveforms
6/12
H
VN330SP(8932)
Figure 8. Switching Parameters Test Conditions
Figure 9. Driving Circuit
7/12
VN330SP(8932)
PowerSO-10™ Thermal Data
Figure 10. PowerSO-10™ PC Board
Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm,
Cu thickness=35µm, Copper areas: from minimum pad lay-out to 8cm2).
Figure 11. Rthj-amb Vs PCB copper area in open box free air condition
RTHj_amb (°C/W)
55
Tj-Tamb=50°C
50
45
40
35
30
0
2
4
6
PCB Cu heatsink area (cm^2)
8/12
8
10
VN330SP(8932)
PACKAGE MECHANICAL
Table 10. PowerSO-10™ Mechanical Data
millimeters
Symbol
Min
A
A (*)
A1
B
B (*)
C
C (*)
D
D1
E
E2
E2 (*)
E4
E4 (*)
e
F
F (*)
H
H (*)
h
L
L (*)
a
α (*)
Typ
Max
3.35
3.4
0.00
0.40
0.37
0.35
0.23
9.40
7.40
9.30
7.20
7.30
5.90
5.90
3.65
3.6
0.10
0.60
0.53
0.55
0.32
9.60
7.60
9.50
7.60
7.50
6.10
6.30
1.27
1.25
1.20
13.80
13.85
1.35
1.40
14.40
14.35
0.50
1.20
0.80
0º
2º
1.80
1.10
8º
8º
Note: (*) Muar only POA P013P
Figure 12. PowerSO-10™ Package Dimensions
B
0.10 A B
10
H
E
E2
E4
1
SEATING
PLANE
e
B
DETAIL "A"
h
A
C
0.25
D
= D1 =
=
=
SEATING
PLANE
A
F
A1
A1
L
DETAIL "A"
α
P095A
9/12
VN330SP(8932)
Figure 13. PowerSO-10™ Suggested Pad Layout And Tube Shipment (No Suffix)
CASABLANCA
14.6 - 14.9
MUAR
B
10.8 - 11
C
6.30
C
A
A
B
0.67 - 0.73
1
9.5
2
3
4
5
10
9
8
7
0.54 - 0.6
All dimensions are in mm.
1.27
6
Base Q.ty Bulk Q.ty Tube length (± 0.5)
A
B
C (± 0.1)
Casablanca
50
1000
532
10.4 16.4
0.8
Muar
50
1000
532
4.9 17.2
0.8
Figure 14. Tape And Reel Shipment (suffix “TR”)
REEL DIMENSIONS
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
600
600
330
1.5
13
20.2
24.4
60
30.4
All dimensions are in mm.
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (± 0.1)
P
D (± 0.1/-0)
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
24
4
24
1.5
1.5
11.5
6.5
2
End
All dimensions are in mm.
Start
Top
No components
Components
No components
cover
tape
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
10/12
500mm min
VN330SP(8932)
REVISION HISTORY
Table 11. Revision History
Date
Revision
Sep-2004
1
Description of Changes
- First Issue
11/12
VN330SP(8932)
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2004 STMicroelectronics - All rights reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States
www.st.com
12/12