VN330SP(8932) QUAD HIGH SIDE SMART POWER SOLID STATE RELAY Figure 1. Package Table 1. General Features Type Vdemag(*) RDSon (*) Iout (*) Vcc VN330SP(8932) VCC-55V 0.32Ω (**) 1A 36V (*) Per channel (**) at Tj=85°C ■ OUTPUT CURRENT: 1A PER CHANNEL ■ DIGITAL INPUTS CLAMPED AT 32V MINIMUM VOLTAGE ■ SHORTED LOAD AND OVERTEMPERATURE PROTECTIONS ■ BUILT-IN CURRENT LIMITER ■ UNDERVOLTAGE SHUTDOWN ■ OPEN DRAIN DIAGNOSTIC OUTPUT ■ FAST DEMAGNETIZATION OF INDUCTIVE LOADS 10 1 PowerSO-10™ DESCRIPTION The VN330SP(8932) is a monolithic device made using STMicroelectronics VIPower M0-3 Technology, intended for driving four indipendent resistive or inductive loads with one side connected to ground. Active current limitation avoids dropping the system power supply in case of shorted load. Built-in thermal shut-down protects the chip from overtemperature and short-circuit. The open drain diagnostic output indicates short-circuit and overtemperature conditions. Table 2. Order Codes Package PowerSO-10 Tube VN330SP(8932) Tape and Reel VN330SP(8932)TR Rev. 1 September 2004 1/12 VN330SP(8932) Figure 2. Block Diagram Table 3. Absolute Maximum Ratings Symbol VCC - VCC IOUT IR IIN IDIAG VESD EAS Ptot Tj TSTG Parameter Power Supply Voltage Reverse Supply Voltage Output Current (cont.) Reverse Output Current (per channel) Input Current (per channel) DIAG Pin Current Electrostatic Discharge (Human Body Model: R=1.5KΩ; C=100pF) Single Pulse Avalanche Energy per Channel Not Simultaneously (see figure 5) Power Dissipation TC≤25°C Junction Operating Temperature Storage Temperature Value 45 - 0.3 Internally Limited -6 +/- 10 +/- 10 Unit V V A A mA mA 2000 V 400 mJ Internally Limited Internally limited - 55 to 150 W °C °C Figure 3. Configuration Diagram (Top View) & Suggested Connections for Unused and N.C. Pins 2/12 VN330SP(8932) Figure 4. Current and Voltage Conventions Table 4. Thermal Data Symbol Rthj-case Rthj-amb (1) (2) Parameter Thermal Resistance Junction-case (1) Thermal Resistance Junction-ambient (2) Value 2 50 Max Max Unit °C/W °C/W All channels ON. When mounted using minimum recommended pad size on FR-4 board. ELECTRICAL CHARACTERISTICS (10V<VCC<36V; -25°C<Tj<125°C unless otherwise specified) Table 5. Power Symbol VCC RON IS Vdemag Parameter Supply Voltage On State Resistance Supply Current Test Conditions IOUT=0.5A; Tj =125°C Max 36 0.4 Unit V Ω IOUT=10A All channels Off; VIN=30V 0.32 1 Ω mA OnState; Tj=125°C; IOUT1...IOUT4=0 Output Voltage at Turn-Off IOUT=0.5A; LLOAD=1mH Min 10 Typ 10 VCC-65 VCC-55 VCC-45 mA V Table 6. Logic Input (each channel) Symbol Parameter VIL Input Low Level Voltage VIH Input High Level Voltage VI(hyst) Input Hysteresis Voltage IIN ILGND VICL Input Current Test Conditions (See note 1) Min Typ Max Unit 2 V 3.5 V 0.5 600 VIN=0 to 30V VIN=0 to 2V Output Current in Ground Disconnection VCC=VINX=GND=DIAG=24V; Tj =25°C Input Clamp Voltage IIN= 1mA (See note 1) IIN= - 1mA V 25 25 32 µA µA mA 36 V -0.7 V Note: 1. The input voltage is internally clamped at 32V minimum, it is possible to connect the input pins to an higher voltage via an external resistor calculate to not exceed 10 mA. 3/12 VN330SP(8932) ELECTRICAL CHARACTERISTICS (continued) Table 7. Switching (VCC =24V) Symbol td(on) Parameter Turn-on Delay Time of Output Current Test Conditions IOUT=0.5A; Resistive Load Min Typ Max Unit 30 40 µs 60 µs 100 µs 115 µs 30 µs 40 µs 15 µs 20 0.5 µs A/µs IOUT=Ilim; Tj =25°C IOUT=0.5A 2 2 A/µs A/µs IOUT=Ilim; Tj =25°C 4 A/µs Max 1 Unit V V Input Rise Time < 0.1µs Tj=25°C Tj=125°C IOUT=0.5A; Resistive Load tr Rise Time of Output Current Input Rise Time < 0.1µs 50 Tj=25°C Tj=125°C IOUT=0.5A; Resistive Load td(off) Turn-off Delay Time of Output Current Input Rise Time < 0.1µs 20 Tj=25°C Tj=125°C IOUT=0.5A; Resistive Load tf Fall Time of Output Current (di/dt)on Turn-on Current Slope (di/dt)off Turn-off Current Slope Input Rise Time < 0.1µs 8 Tj=25°C Tj=125°C IOUT=0.5A Table 8. Protections Symbol VSTAT (3) VSCL (3) VUSD Ilim IOVPK IDIAGH ILOAD tSC TTSD TR Parameter Test Conditions Status Voltage Output Low ISTAT=5mA (Fault condition) ISTAT= 1mA Status Clamp Voltage ISTAT= - 1mA Undervoltage Shut-down DC Short Circuit Current VCC=24V; RLOAD < 10mΩ VCC=24V; VIN=30V; Peak Short Circuit Current RLOAD < 10mΩ (See figure 6) Leakage on Diag Pin in VDIAG=24V High State VCC=10 to 36V; VIN=0V; Output Leakage Current 4 Channels In Parallel Delay Time of Current Limiter Thermal Shut-Down Temperature Reset Temperature Min Typ 32 36 0.7 5 1 8 2.5 V V A 4 A 100 µA 25 µA 100 µs 150 170 °C 135 155 °C Note: (3) Status determination > 100 ms after the switching edge. Note: If INPUTn pin is left floating the corresponding channel will automatically switch off. If GND pin is disconnetted, all channels will switch off provided VCC does not exceed 36V 4/12 VN330SP(8932) Figure 5. Avalanche Energy Test Circuit Figure 6. Peak Short Circuit Current Test Circuit 5/12 VN330SP(8932) Table 9. Truth Table CONDITIONS INPUTn OUTPUTn DIAGNOSTIC L L H L H L H H H L L L L H Shorted Load H L L L H H (Current Limitation) H H H Normal operation Overtemperature Undervoltage Figure 7. Switching Waveforms 6/12 H VN330SP(8932) Figure 8. Switching Parameters Test Conditions Figure 9. Driving Circuit 7/12 VN330SP(8932) PowerSO-10™ Thermal Data Figure 10. PowerSO-10™ PC Board Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35µm, Copper areas: from minimum pad lay-out to 8cm2). Figure 11. Rthj-amb Vs PCB copper area in open box free air condition RTHj_amb (°C/W) 55 Tj-Tamb=50°C 50 45 40 35 30 0 2 4 6 PCB Cu heatsink area (cm^2) 8/12 8 10 VN330SP(8932) PACKAGE MECHANICAL Table 10. PowerSO-10™ Mechanical Data millimeters Symbol Min A A (*) A1 B B (*) C C (*) D D1 E E2 E2 (*) E4 E4 (*) e F F (*) H H (*) h L L (*) a α (*) Typ Max 3.35 3.4 0.00 0.40 0.37 0.35 0.23 9.40 7.40 9.30 7.20 7.30 5.90 5.90 3.65 3.6 0.10 0.60 0.53 0.55 0.32 9.60 7.60 9.50 7.60 7.50 6.10 6.30 1.27 1.25 1.20 13.80 13.85 1.35 1.40 14.40 14.35 0.50 1.20 0.80 0º 2º 1.80 1.10 8º 8º Note: (*) Muar only POA P013P Figure 12. PowerSO-10™ Package Dimensions B 0.10 A B 10 H E E2 E4 1 SEATING PLANE e B DETAIL "A" h A C 0.25 D = D1 = = = SEATING PLANE A F A1 A1 L DETAIL "A" α P095A 9/12 VN330SP(8932) Figure 13. PowerSO-10™ Suggested Pad Layout And Tube Shipment (No Suffix) CASABLANCA 14.6 - 14.9 MUAR B 10.8 - 11 C 6.30 C A A B 0.67 - 0.73 1 9.5 2 3 4 5 10 9 8 7 0.54 - 0.6 All dimensions are in mm. 1.27 6 Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1) Casablanca 50 1000 532 10.4 16.4 0.8 Muar 50 1000 532 4.9 17.2 0.8 Figure 14. Tape And Reel Shipment (suffix “TR”) REEL DIMENSIONS Base Q.ty Bulk Q.ty A (max) B (min) C (± 0.2) F G (+ 2 / -0) N (min) T (max) 600 600 330 1.5 13 20.2 24.4 60 30.4 All dimensions are in mm. TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 (± 0.1) P D (± 0.1/-0) D1 (min) F (± 0.05) K (max) P1 (± 0.1) 24 4 24 1.5 1.5 11.5 6.5 2 End All dimensions are in mm. Start Top No components Components No components cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 10/12 500mm min VN330SP(8932) REVISION HISTORY Table 11. Revision History Date Revision Sep-2004 1 Description of Changes - First Issue 11/12 VN330SP(8932) Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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